CN211982136U - Structure of dustproof and waterproof sound-transmitting film of matrix type micro-electromechanical sensor - Google Patents
Structure of dustproof and waterproof sound-transmitting film of matrix type micro-electromechanical sensor Download PDFInfo
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- CN211982136U CN211982136U CN202021060630.5U CN202021060630U CN211982136U CN 211982136 U CN211982136 U CN 211982136U CN 202021060630 U CN202021060630 U CN 202021060630U CN 211982136 U CN211982136 U CN 211982136U
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Abstract
The utility model discloses a structure of a matrix type dustproof and waterproof sound-transmitting film of a micro-electromechanical sensor, which comprises a supporting layer, the dustproof and waterproof sound-transmitting film, an adhesive, a PCB (printed circuit board) and an acoustic sensor, wherein one surface of the supporting layer is sticky and is stuck on one surface of the dustproof and waterproof sound-transmitting film, the other surface of the dustproof and waterproof sound-transmitting film is stuck on the upper surface of the PCB by the adhesive, and the acoustic sensor is arranged on the lower surface of the PCB; an acoustic channel is formed by the acoustic sensor, the sound hole of the supporting layer, the vibration area of the dustproof and waterproof sound-transmitting membrane, the sound hole of the adhesive and the sound hole of the PCB; the acoustic sensor is a plurality of, is the matrix and distributes at PCB board lower surface, and the dustproof and waterproof sound-permeable membrane structure of formation matrix that corresponds passes through the adhesive with the water proof membrane and glues on the PCB board, can once produce batch production. The utility model discloses an acoustic sensor is covered to the expanded polytetrafluoroethylene membrane that highly fibrosis ePTFE microstructure formed, has insert acoustics loss that is less than 5dB under 1kHz and the water pressure resistance more than 1 meter at least.
Description
Technical Field
The utility model relates to a consumer electronics product, in particular to micro electromechanical sensor dustproof and waterproof sound-permeable membrane's of matrix structure.
Background
In this rapidly growing network new age, various portable electronic devices are ubiquitous, with more and more devices utilizing MEMS microphones to accurately capture almost any sound, from wearable devices to home assistants. The apple cell phone opens the era of large-scale application of the MEMS microphone of the smart phone, and the goods output of the MEMS microphone is increased as the manufacturing process of the MEMS microphone is mature. However, during the high volume assembly of mobile phones, cameras and other device printed circuit boards, there are some technical issues that may compromise the integrity of the MEMS microphone, including pressure rise due to extreme high temperatures during reflow soldering, particulate contamination and solder, which may damage the MEMS microphone, resulting in reduced acoustic performance of the MEMS microphone, and significantly affecting yield and increased manufacturing costs. In order to reduce the influence of various uncontrollable factors on the MEMS microphone in a complicated manufacturing process flow, in recent years, a dustproof and waterproof sound-transmitting membrane technology is applied to the production process of the MEMS microphone by a global top-level consumer electronics brand, so that the pollution and pressure accumulation of particles can be prevented, the acoustic test in the flow is not influenced, the microphone can be seamlessly installed by using a high-speed Surface Mount Technology (SMT) chip mounter, and in the same year, another global top-level consumer electronics brand installs the dustproof and waterproof sound-transmitting membrane inside the MEMS microphone by using a semiconductor packaging process and can provide particle protection in a circuit board assembling process without any special treatment.
The technology of applying the dustproof and waterproof sound-transmitting membrane technology to the production process of the MEMS microphone is the most widely applied scheme at present, however, after the MEMS microphone is attached to the circuit board, the dustproof and waterproof sound-transmitting membrane is attached to the position of the sound hole of the MEMS microphone corresponding to the circuit board or the position of the sound hole of the housing of the MEMS microphone, the process of attaching the dustproof and waterproof sound-transmitting membrane is added once in the production process, and accordingly, multiple processes of acoustic detection, membrane yield detection, manual uncovering and the like are added synchronously in the follow-up process, so the cost is high. Compared with the former technology, the technology that the dustproof and waterproof sound-transmitting membrane is installed inside the MEMS microphone through a semiconductor packaging technology is high in quality stability, then, the technology is that products are made into a single body and delivered in a wafer format, a client needs to put the dustproof and waterproof sound-transmitting membrane into the MEMS microphone through high-speed chip mounting equipment, only one product can be produced at a time, and efficiency is low.
In the future, the application trend of the MEMS microphone for dust-proof, water-proof and sound-transmitting is to install the dust-proof, water-proof and sound-transmitting membrane inside the MEMS microphone by using a semiconductor packaging process, but the technology has the problem of low cost, high efficiency and low efficiency.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the purpose is: based on the problems, the structure of the matrix type dustproof and waterproof sound-transmitting film of the micro-electromechanical sensor is provided, so that the problem that only one product can be produced at one time is solved.
The technical scheme of the utility model is that:
a structure of a dustproof and waterproof sound-transmitting film of a matrix type micro-electromechanical sensor comprises a supporting layer, the dustproof and waterproof sound-transmitting film, an adhesive, a PCB and an acoustic sensor, wherein one surface of the supporting layer is sticky and is stuck to one surface of the dustproof and waterproof sound-transmitting film, the other surface of the dustproof and waterproof sound-transmitting film is stuck to the upper surface of the PCB through the adhesive, and the acoustic sensor is arranged on the lower surface of the PCB;
the positions of the supporting layer, the dustproof and waterproof sound-transmitting membrane, the adhesive and the PCB, which correspond to the acoustic sensor, are respectively provided with a supporting layer acoustic hole, a dustproof and waterproof sound-transmitting membrane vibration area, an adhesive acoustic hole and a PCB acoustic hole, and the acoustic sensor, the supporting layer acoustic hole, the dustproof and waterproof sound-transmitting membrane vibration area, the adhesive acoustic hole and the PCB acoustic hole form an acoustic channel;
the structure of the dustproof and waterproof sound-transmitting film of the micro electro mechanical sensor is bonded together in a plurality of structures in a matrix form, and a matrix acoustic channel is correspondingly formed.
Preferably, the dustproof and waterproof sound-transmitting membrane is a highly fibrous expanded polytetrafluoroethylene membrane.
Preferably, the adhesive is one of hot melt adhesive, hot-press adhesive and double-sided adhesive, and can resist 260 ℃ high temperature without denaturation.
Preferably, the adhesive sets the thickness value according to the size of the dustproof and waterproof sound-transmitting membrane, so that the dustproof and waterproof sound-transmitting membrane is prevented from touching the PCB in the vibration sound-transmitting process, and sound pressure deformation is avoided.
Preferably, the aperture of the sound hole of the support layer and the aperture of the sound hole of the adhesive are both larger than the sound hole of the PCB.
Alternative scheme: the PCB sound hole of the PCB is a step hole with a wide upper part and a narrow lower part.
Alternative scheme: the PCB sound hole of the PCB is a tapered hole with a wide upper part and a narrow lower part.
Preferably, the adhesive is one of a hot melt adhesive, a hot-press adhesive, a double-sided adhesive or a glue.
Alternative scheme: a structure of a dustproof and waterproof sound-transmitting film of a matrix micro-electromechanical sensor is characterized in that a supporting layer is omitted, the structure specifically comprises the dustproof and waterproof sound-transmitting film, an adhesive, a PCB and an acoustic sensor, wherein one side of the dustproof and waterproof sound-transmitting film is adhered to the upper surface of the PCB by the adhesive, and the acoustic sensor is arranged on the lower surface of the PCB;
the positions of the dustproof and waterproof sound-transmitting membrane, the adhesive and the PCB, which correspond to the acoustic sensor, are respectively provided with a dustproof and waterproof sound-transmitting membrane vibration area, an adhesive sound hole and a PCB sound hole, and the acoustic sensor, the dustproof and waterproof sound-transmitting membrane vibration area, the adhesive sound hole and the PCB sound hole form an acoustic channel; the structure of the dustproof and waterproof sound-transmitting film of the micro electro mechanical sensor is bonded together in a plurality of structures in a matrix form, and a matrix acoustic channel is correspondingly formed.
The utility model has the advantages that:
1. the utility model discloses a dustproof and waterproof sound-permeable membrane of micro electromechanical sensor adopts matrix multilayer composite construction, passes through the adhesive with the water proof membrane and glues on the PCB board, can once produce batch production.
2. The utility model discloses an acoustic sensor is covered to the expanded polytetrafluoroethylene membrane that highly fibrosis ePTFE microstructure formed, both can dustproof and waterproof, can let sound pass through again. The expanded polytetrafluoroethylene membrane has an insertion loss of less than 5dB at 1kHz and a water pressure resistance of at least 1m or more.
3. The utility model discloses an adhesive adopts hot melt adhesive, hot-pressing glue or double faced adhesive tape, resists to live 260 ℃ high temperature and invariance, and the adhesive forms certain height, avoids dustproof and waterproof sound-transmitting membrane to touch PCB plate-shaped formation sound pressure deformation at the in-process of vibration transaudient.
4. The utility model discloses still increase the one deck supporting layer on dustproof and waterproof sound-transmitting membrane, have the effect of protection dustproof and waterproof sound-transmitting membrane, reduce the layering probability of dustproof and waterproof sound-transmitting membrane in the course of working simultaneously.
5. The utility model discloses a supporting layer phonic hole and adhesive phonic hole's aperture is greater than PCB board phonic hole, is favorable to the effective propagation of sound.
6. The utility model discloses a PCB board sound hole replacement of PCB board is narrow step hole or bell mouth under wide for last, and the glue that does not have thickness hardly can be adopted to the adhesive like this, because step hole or bell mouth can effectively avoid dustproof and waterproof sound-transmitting membrane to touch the PCB board at the in-process of vibration transaudient to it is out of shape to form the acoustic pressure.
Drawings
The invention will be further described with reference to the following drawings and examples:
fig. 1 is a schematic structural view of a dustproof and waterproof sound-transmitting membrane of a micro-electromechanical sensor according to embodiment 1;
FIG. 2 is a schematic matrix distribution diagram of the dustproof and waterproof sound-permeable membrane of the MEMS sensor in embodiment 1;
fig. 3 is a schematic structural view of the dustproof and waterproof sound-transmitting membrane of the micro-electromechanical sensor according to embodiment 2;
fig. 4 is a schematic structural view of a dustproof and waterproof sound-transmitting membrane of a micro-electromechanical sensor according to embodiment 3;
FIG. 5 is a schematic diagram of an acoustic testing apparatus according to the direct comparison method;
FIG. 6 is a graph comparing sensitivity curves for three configurations of examples 1-3;
FIG. 7 is a graph comparing the insertion sound loss curves for the three configurations of examples 1-3.
Detailed Description
Example 1
As shown in fig. 1, the structure of the matrix-type dustproof and waterproof sound-transmitting membrane of the mems sensor of this embodiment includes a supporting layer 1, a dustproof and waterproof sound-transmitting membrane 2, an adhesive 3, a PCB 4 and an acoustic sensor 5, wherein one surface of the supporting layer 1 has viscosity and is adhered to one surface of the dustproof and waterproof sound-transmitting membrane 2, the other surface of the dustproof and waterproof sound-transmitting membrane 2 is adhered to the upper surface of the PCB 4 by the adhesive 3, and the acoustic sensor 5 is mounted on the lower surface of the PCB 4; the positions of the supporting layer 1, the dustproof and waterproof sound-transmitting membrane 2, the adhesive 3 and the PCB 4 corresponding to the acoustic sensor 5 are respectively provided with a supporting layer sound hole 1a, a dustproof and waterproof sound-transmitting membrane vibration area 2a, an adhesive sound hole 3a and a PCB sound hole 4a, and the acoustic sensor 5, the supporting layer sound hole 1a, the dustproof and waterproof sound-transmitting membrane vibration area 2a, the adhesive sound hole 3a and the PCB sound hole 4a form an acoustic channel beta.
As shown in fig. 2, the acoustic sensors 5 are distributed on the lower surface of the PCB 4 in a matrix form, and correspondingly form a matrix acoustic channel β and a dustproof and waterproof sound-transmitting membrane structure, so that batch products can be produced at one time.
The dustproof and waterproof sound-transmitting membrane 2 is a highly fibrous expanded polytetrafluoroethylene (ePTFE) membrane, and the dustproof and waterproof sound-transmitting membrane 2 covers the acoustic sensor 5, so that the acoustic sensor can be prevented from being polluted by water or dust, and meanwhile, sound can pass through. The waterproof sound-transmitting membrane 2 has a water pressure resistance level of 1m or more, and an insertion acoustic loss of less than 5dB at 1 kHz.
The adhesive 3 is a material which can resist the high temperature of 260 ℃ without denaturation, such as hot melt adhesive, hot-pressing adhesive, double-sided adhesive and the like. The thickness value is set for according to the size of dustproof and waterproof sound-transmitting membrane 2 to adhesive 3, avoids dustproof and waterproof sound-transmitting membrane 2 to touch PCB board 4 at the in-process of vibration transaudient to cause the acoustic pressure to warp.
The surface of the supporting layer 1 is sticky and is stuck with the dustproof and waterproof sound-transmitting membrane 2, so that the fragile dustproof and waterproof sound-transmitting membrane 2 can be protected from being damaged in a complex process, and the layering probability of the dustproof and waterproof sound-transmitting membrane 2 in the processing process is reduced. The aperture of the support layer sound hole 1a and the aperture of the adhesive sound hole 3a are larger than that of the PCB sound hole 4a, so that effective transmission of sound is facilitated.
Example 2
As shown in fig. 3, the structure of the matrix-type mems sensor dustproof and waterproof sound-transmitting membrane of this embodiment includes a supporting layer 1, a dustproof and waterproof sound-transmitting membrane 2, an adhesive 3 ', a PCB 4' and an acoustic sensor 5, which is similar to the solution of embodiment 1 shown in fig. 1 and 2, and is different in that the PCB sound hole 4a 'of the PCB 4' is a stepped hole with a wide top and a narrow bottom. The adhesive 3' is made of materials which can resist the high temperature of 260 ℃ and can not be deformed, such as hot melt adhesive, hot-pressing adhesive, double-sided adhesive and the like, and can also be made of glue. When the adhesive 3 ' adopts glue with almost no thickness, the PCB sound hole 4a ' is a step hole, so that a certain height is provided, and the dustproof and waterproof sound-transmitting film 2 is effectively prevented from touching the PCB 4 ' in the vibration sound transmission process, thereby forming sound pressure deformation.
The PCB sound hole 4a 'of the PCB 4' may also be a tapered hole with a wide top and a narrow bottom, which has a similar effect to a step hole, and is not illustrated in the drawings.
Example 3
As shown in fig. 4, the structure of the matrix-type mems sensor dustproof and waterproof sound-transmitting membrane of this embodiment is similar to the solution of embodiment 1 shown in fig. 1 and 2, except that the supporting layer 1 is eliminated, and only the dustproof and waterproof sound-transmitting membrane 2, the adhesive 3, the PCB 4 and the acoustic sensor 5 are included, one side of the dustproof and waterproof sound-transmitting membrane 2 is adhered to the upper surface of the PCB 4 by the adhesive 3, and the acoustic sensor 5 is installed on the lower surface of the PCB 4. The acoustic sensor 5 and the dustproof and waterproof sound-transmitting membrane vibration area 2a, the adhesive sound hole 3a and the PCB sound hole 4a form an acoustic channel beta.
The following acoustic test and water pressure resistance test were performed on the structural schemes of the matrix-type mems acoustic membrane of examples 1 to 3, the test method is "direct comparison method", and the specific implementation is as follows:
fig. 5 is a schematic diagram of an acoustic testing apparatus according to the direct comparison method, which includes an acoustic source signal generator 201, a power amplifier 202, an acoustic source 203, a waterproof film 204, a microphone to be tested 205, a power amplifier 206 of the microphone to be tested, a reference microphone 205', a power amplifier 206 of the reference microphone, an analyzer 207, and a anechoic chamber 208.
When the sound source 203, the microphone under test 205 and the reference microphone 205' are placed in the anechoic chamber 208, and a standard microphone of known sensitivity is used as the reference microphone, and the microphone under test are alternately exposed to the same planar free sound field at the same time, the ratio of their sensitivities is equal to the ratio of their open circuit output voltages. Thus, the plane free sound field sensitivity of the microphone 205 'to be tested can be deduced by referring to the plane free sound field sensitivity of the microphone 205',
in the formula (1), etest and eref are respectively the open circuit output voltages of the microphone to be tested and the reference microphone, and M is the plane free sound field sensitivity of the reference microphone.
The microphone 205 to be measured and the reference microphone 205' are then placed in the free acoustic field region of the acoustic source 203 with a horizontal separation of 1 m. The microphone 205 to be tested and the reference microphone 205' are opposite to the sound source 203, symmetrically arranged on two sides of a reference axis of the sound source, and the reference axes of the reference microphones are parallel to the reference axis of the sound source. The distance between the microphone 205 to be tested and the reference microphone 205' is 10cm so that their mutual influence is minimal (< ± 1 dB). Measured with the reference microphone 205' such that the difference in sound pressure level at which the two sensors are located does not exceed 1 dB. The signal generator 201 gives an acoustic signal with the frequency of 100Hz to 10kHz to the sound source 203 through the power amplifier 202, then the open circuit voltage of the two microphones is measured through the two power amplifiers and the analyzer 207, and then the plane free sound field sensitivity of the microphone to be measured can be obtained through the formula. In addition, in order to reduce the sound pressure inconsistency of the positions of the two microphones caused by some asymmetry, the positions of the two sensors are exchanged and measured again, and the average value of the output voltages of the two microphones is calculated.
The utility model discloses the dustproof and waterproof sound-transmitting membrane 2 of structure has good sound transmissivity, but inevitable reduction that produces the volume and the deformation of tone quality. The sound permeability of the dustproof and waterproof sound-transmitting membrane 2 is expressed by insertion loss. The insertion loss is expressed as a difference (unit: dB) in sensitivity before and after the sound passes through the dustproof and waterproof sound-transmitting membrane 2, and the formula is as follows.
Insertion loss (dB) ═ Wtest1-W test2|……(2)
Wtest1: sensitivity without the structure of the utility model (dB)
Wtest2: sensitivity (dB) with the structure of the utility model
If the sound is attenuated when passing through the dustproof and waterproof sound-transmitting membrane 2, the sound after passing becomes smaller; in addition, if sound is distorted due to resonance or the like, sound passing through a certain frequency is larger than the original sound. In either case, when the insertion loss is large, the sound deviates from the original sound and becomes unclear.
The three structures of embodiments 1 to 3 of the present invention were first measured according to the water pressure resistance test method described in GB 4208-2008. And (3) before testing, testing the surface of the dustproof and waterproof sound-transmitting film with water test cream, observing whether the water test cream on the surface of the dustproof and waterproof sound-transmitting film changes color after testing, and if the water test cream changes color, judging that the water pressure resistance can not reach a set value. And observing whether the surface structure of the dustproof and waterproof sound-transmitting membrane is damaged or not. The detailed water pressure resistance results are shown in table 1.
TABLE 1 Water pressure resistance tester
Next, the sensitivity and insertion sound loss of the three structures according to examples 1 to 3 of the present invention were measured by the acoustic testing apparatus according to the direct comparison method as mentioned above, and the detailed results are shown in fig. 6 and 7.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All modifications made according to the spirit of the main technical scheme of the present invention shall be covered within the protection scope of the present invention.
Claims (9)
1. A structure of a dustproof and waterproof sound-transmitting membrane of a matrix type micro-electromechanical sensor is characterized by comprising a supporting layer (1), a dustproof and waterproof sound-transmitting membrane (2), an adhesive (3), a PCB (4) and an acoustic sensor (5), wherein one surface of the supporting layer (1) is sticky and is stuck to one surface of the dustproof and waterproof sound-transmitting membrane (2), the other surface of the dustproof and waterproof sound-transmitting membrane (2) is stuck to the upper surface of the PCB (4) through the adhesive (3), and the acoustic sensor (5) is arranged on the lower surface of the PCB (4);
the positions of the supporting layer (1), the dustproof and waterproof sound-transmitting membrane (2), the adhesive (3) and the PCB (4) corresponding to the acoustic sensor (5) are respectively provided with a supporting layer sound hole (1a), a dustproof and waterproof sound-transmitting membrane vibration area (2a), an adhesive sound hole (3a) and a PCB sound hole (4a), and the acoustic sensor (5), the supporting layer sound hole (1a), the dustproof and waterproof sound-transmitting membrane vibration area (2a), the adhesive sound hole (3a) and the PCB sound hole (4a) form an acoustic channel (beta);
the dustproof and waterproof sound-transmitting film of the micro-electromechanical sensor is adhered together in a plurality of matrix structures to correspondingly form a matrix acoustic channel (beta).
2. The structure of the dustproof and waterproof sound-transmitting membrane of the microelectromechanical sensor of claim 1, characterized in that the dustproof and waterproof sound-transmitting membrane (2) is a highly fibrous expanded polytetrafluoroethylene membrane.
3. The structure of the dustproof and waterproof sound-transmitting membrane of the micro-electromechanical sensor according to claim 1, wherein the adhesive (3) is one of a hot melt adhesive, a hot press adhesive and a double-sided adhesive, and can resist the high temperature of 260 ℃ without degeneration.
4. The structure of the dustproof and waterproof sound-transmitting membrane of the micro-electromechanical sensor according to claim 3, wherein the thickness of the adhesive (3) is set according to the size of the dustproof and waterproof sound-transmitting membrane (2), so that the dustproof and waterproof sound-transmitting membrane (2) is prevented from touching the PCB (4) in the vibration sound transmission process, and sound pressure deformation is avoided.
5. The structure of the dustproof and waterproof sound-transmitting membrane of the micro-electromechanical sensor according to claim 1, wherein the support layer sound hole (1a) and the adhesive sound hole (3a) have larger pore diameters than the PCB sound hole (4 a).
6. The structure of the dustproof and waterproof sound-transmitting membrane of the microelectromechanical sensor of claim 1, characterized in that the PCB board sound hole (4a) of the PCB board (4) is a stepped hole with a wide top and a narrow bottom.
7. The structure of the dustproof and waterproof sound-transmitting membrane of the micro-electromechanical sensor according to claim 1, wherein the PCB sound hole (4a) of the PCB (4) is a tapered hole with a wide top and a narrow bottom.
8. The structure of the dustproof and waterproof sound-transmitting membrane of the micro-electromechanical sensor according to claim 6 or 7, wherein the adhesive (3) is one of a hot melt adhesive, a hot press adhesive, a double-sided adhesive or a glue.
9. A structure of a matrix type dustproof and waterproof sound-transmitting film of a micro-electromechanical sensor is characterized by comprising a dustproof and waterproof sound-transmitting film (2), an adhesive (3), a PCB (4) and an acoustic sensor (5), wherein one surface of the dustproof and waterproof sound-transmitting film (2) is adhered to the upper surface of the PCB (4) through the adhesive (3), and the acoustic sensor (5) is arranged on the lower surface of the PCB (4);
the positions of the dustproof and waterproof sound-transmitting membrane (2), the adhesive (3) and the PCB (4) corresponding to the acoustic sensor (5) are respectively provided with a dustproof and waterproof sound-transmitting membrane vibration area (2a), an adhesive sound hole (3a) and a PCB sound hole (4a), and the acoustic sensor (5), the dustproof and waterproof sound-transmitting membrane vibration area (2a), the adhesive sound hole (3a) and the PCB sound hole (4a) form an acoustic channel (beta);
the dustproof and waterproof sound-transmitting film of the micro-electromechanical sensor is adhered together in a plurality of matrix structures to correspondingly form a matrix acoustic channel (beta).
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| CN113473321A (en) * | 2021-05-31 | 2021-10-01 | 杭州安普鲁薄膜科技有限公司 | Waterproof sound-transmitting membrane assembly and electronic equipment with same |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113473321A (en) * | 2021-05-31 | 2021-10-01 | 杭州安普鲁薄膜科技有限公司 | Waterproof sound-transmitting membrane assembly and electronic equipment with same |
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