CN101363881A - Method for testing resistance - Google Patents
Method for testing resistance Download PDFInfo
- Publication number
- CN101363881A CN101363881A CNA2007100446934A CN200710044693A CN101363881A CN 101363881 A CN101363881 A CN 101363881A CN A2007100446934 A CNA2007100446934 A CN A2007100446934A CN 200710044693 A CN200710044693 A CN 200710044693A CN 101363881 A CN101363881 A CN 101363881A
- Authority
- CN
- China
- Prior art keywords
- test lead
- resistance
- test
- probe
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Measurement Of Resistance Or Impedance (AREA)
Abstract
By the resistance measurement method in the prior art, the measured resistance is the sum of a contact resistance and a structure resistance, and the structure resistance has a large error when the contact resistance is non-negligible relative to the structure resistance. The invention provides a resistance measurement method, which can precisely measure the contact resistance, and then obtain a precise value of the structure resistance by the contact resistance and the measured resistance, thereby greatly reducing the resistance measurement error and improving the measurement precision.
Description
Technical field
The present invention relates to a kind of method of testing, particularly a kind of method for testing resistance.
Background technology
Electronic product, particularly integrated circuit manufacture process in, often need resistance is tested.The method for testing resistance of prior art has two kinds of two ends method for testing resistance and three end method for testing resistance usually.
The two ends method for testing resistance uses two ends test structure as shown in Figure 1, and described two ends test structure comprises resistance 13 and lays respectively at the first test lead 11 and the tail test lead 12 at resistance 13 two ends.Apply voltage at first test lead 11 with tail test lead 12 by probe, measure the current value between two test leads, perhaps between two test leads, apply measuring current, and measure the voltage difference of two test leads by the probe pen.
By Ohm law, R=U/I can obtain the resistance value of the resistance 13 of 12 of described first test lead 11 and tail test leads.
But there is following problem in described two ends method for testing resistance:
What detect by probe in the actual test process as shown in Figure 2, is to be added in the probe 14 of first test lead and to be added in magnitude of voltage between the probe 15 of tail test lead 12 and the current value between two probes.
Therefore, as shown in Figure 3, by the measured measuring resistance Rm0 of two ends resistance test method is the resistance of 15 of probe 14 and probes, and this resistance R m0 is made of the first contact resistance Rc01 of structural resistance Rs0 intrinsic between first test lead 11 and the tail test lead 12 and probe 14 and first test lead 11 and the probe 15 tail contact resistance Rc02 with tail test lead 12.
When contact resistance Rc01 and contact resistance Rc02 were negligible, then measured measuring resistance Rm0 was approximately equal to the intrinsic resistance of 12 of first test lead 11 and tail test leads, i.e. structural resistance Rs0.
But in the actual measuring process, contact resistance resistance size is compared with the structural resistance resistance of measured resistance and be can not ignore often.
Therefore, adopting the resistance value of the measured measured resistance of two-point resistance measurement method is not the structural resistance resistance value of real measurand, but the resistance value of the resistance value of the structural resistance of this measurand and contact resistance with.
Because contact resistance can't record exactly, therefore, the resistance of the structural resistance of described measured resistance also can't accurately record.
And because the probe during each test is different with the contact situation of test lead, it is different that for example probe is pricked depth difference, probe bending at the test lead contact resistance that does not cause on an equal basis with contact area test lead that cause, makes each actual resistance value that records to fluctuate within the specific limits.
Particularly in the wafer level testing electrical property of high-precision integrated circuit, usually use probe to survey, because the resistance of integrated circuit is less relatively, therefore, (probe contact resistance PCR) can not ignore contact resistance of probe often.At this moment, the contact situation of the probe on the probe has directly influenced precision of test result.
Obtain the structural resistance of accurate measured resistance if desired, then need additionally to record the resistance value that probe and test lead get contact resistance.
At this situation, prior art has proposed a kind of three end resistance test methods again to obtain the resistance value of contact resistance.
Described three end method for testing resistance use one or three end test structures to measure.As shown in Figure 4, described three end test structures comprise the first test lead A and the 3rd test lead C that is positioned at the measured resistance two ends, and be positioned at measured resistance middle part the second test lead B.
Described three end method for testing resistance comprise following steps:
Step 1: on the first test lead A and the second test lead B, use above-mentioned two ends resistance test method to survey the resistance of the first test lead A and the second test lead B by probe.In like manner, the measured first test resistance Rm1 be the contact resistance Rc1 of structural resistance Rs1 and the probe 21 and the first test lead A between the first test lead A and the second test lead B and the probe 22 and the second test lead B contact resistance Rc2's and.
Step 2: on the second test lead B and the 3rd test lead C, use above-mentioned two ends resistance test method to survey the resistance of the second test lead B and the 3rd test lead C by probe.In like manner, the measured second test resistance Rm2 be the contact resistance Rc2 of structural resistance Rs2 and the probe 22 and the second test lead B between the second test lead B and the 3rd test lead C and probe 23 and the 3rd test lead C contact resistance Rc3's and.
Step 3: on the first test lead A and the 3rd test lead C, use above-mentioned two ends resistance test method to survey the resistance of the 3rd test lead A and the 3rd test lead C by probe.In like manner, measured the 3rd test resistance Rm3 be the contact resistance Rc1 of structural resistance Rs and the probe 21 and the first test lead A between the first test lead A and the 3rd test lead C and probe 23 and the 3rd test lead C contact resistance Rc3's and.
In sum: Rm1=Rc1+Rs1+Rc2;
Rm2＝Rc2+Rs2+Rc3；
Rm3＝Rc1+Rs+Rc3；
Again because the resistance between the first test lead A and the 3rd test lead C is to be in series by the resistance between the resistance between the first test lead A and the second test lead B and the 3rd test lead C and the second test lead B, so Rs=Rs1+Rs2.
In the contact resistance method of testing of prior art, think that Rc1, Rc2 and Rc3 are identical, represent Rc1=Rc2=Rc3=Rc with the contact resistance Rc of a test lead and probe.
In this case
Rm1+Rm2-Rm3＝(Rc1+Rs1+Rc2)+(Rc2+Rs2+Rc3)-(Rc1+Rs+Rc3)＝(Rc1+Rc2+Rc2+Rc3-Rc1-Rc3)＝2Rc
So, can obtain, contact resistance Rc is (Rm1+Rm2-Rm3)/2.
Pass through, contact deducts corresponding contact resistance with measuring resistance, can record the approximate value of corresponding construction resistance again.
But, in the actual measurement, each contact resistance is also inequality, particularly in the test of the wafer level of integrated circuit, because it is high that the degree of accuracy of the resistance test of integrated circuit requires, thus the difference between the contact resistance cannot ignore, in case the hypothesis that each contact resistance of employing as the same equates, there are the error of an increasing in each contact resistance surveyed and the resistance of structural resistance, have seriously lowered the accuracy of resistance test.
Summary of the invention
For testing contact resistance accurately, simultaneously also can be by the contact resistance of measuring probe to test structure, thereby detect the quality of probe contact indirectly and can further obtain the structural resistance of measured resistance, the invention provides a kind of method of measuring resistance.
According to a first aspect of the invention, a kind of method for testing resistance, the test structure of its use comprises first test lead, second test lead, the 3rd test lead and measured resistance, wherein said first test lead is positioned at the described second test lead both sides with described the 3rd test lead and is connected with described measured resistance, and described second test lead also is connected with described measured resistance, it is characterized in that described method for testing resistance comprises following steps:
A. making the electric current of second test lead to the, three test leads is 0A;
B. calculate the contact resistance of described second test lead.
Use the present invention can accurately test out the contact resistance that test lead and voltage or electric current apply end, wherein, described voltage or electric current apply end and comprise probe, and then obtain the structural resistance of measured resistance, thereby improve the precision of resistance measurement.
Description of drawings
Fig. 1 is the two ends test structure synoptic diagram of prior art;
Fig. 2 is the use synoptic diagram of the use two ends test structure of prior art;
Fig. 3 is the synoptic diagram that the resistance of the two ends test structure of prior art constitutes;
Fig. 4 is three end test structure synoptic diagram according to a specific embodiment of the present invention;
Fig. 5 is the synoptic diagram of three end resistance test method step 1 of prior art;
Fig. 6 is the synoptic diagram that three end resistance test method step 1 institute measuring resistances of prior art constitute;
Fig. 7 is the synoptic diagram of three end resistance test method step 2 of prior art;
Fig. 8 is the synoptic diagram that three end resistance test method step 2 institute measuring resistances of prior art constitute;
Fig. 9 is the synoptic diagram of three end resistance test method step 3 of prior art;
Figure 10 is the synoptic diagram that three end resistance test method step 3 institute measuring resistances of prior art constitute;
Figure 11 be according to specific embodiment according to the present invention use the synoptic diagram of three end test structures;
Figure 12 applies the synoptic diagram of probe for according to the measuring resistance of a specific embodiment of the present invention the time;
Figure 13 is the synoptic diagram according to the measuring resistance method of a specific embodiment of the present invention;
Figure 14 is the synoptic diagram according to the measuring resistance method of an end ground connection of a specific embodiment of the present invention;
Figure 15 is the synoptic diagram according to the method for the measuring resistance of a specific embodiment of the present invention;
Figure 16 is the five terminal test structure according to a specific embodiment of the present invention;
Figure 17 is the synoptic diagram that applies probe according to the five terminal test structure of a specific embodiment of the present invention.
Embodiment
The test structure that method for testing resistance of the present invention uses comprises the test structure of first test lead, second test lead, the 3rd test lead and measured resistance, wherein said first test lead is positioned at the described second test lead both sides with described the 3rd test lead and is connected with described measured resistance, and described second test lead is positioned in the middle of first test lead and the 3rd test lead, and is connected with described measured resistance.
Embodiment 1: present embodiment adopts three end test structures of prior art to describe, as shown in figure 11, at the measured resistance two ends, there is first test lead 31 to be connected with measured resistance respectively with the 3rd test lead 33, between described first test lead 31 and described the 3rd test lead 33, one second test lead 32 is set, and described second test lead 32 is connected with measured resistance.
Shown in Figure 12ly be to use described three end test structures to apply the synoptic diagram that probe is tested.Guarantee that for effective the contact resistance of each test lead and each probe is constant, present embodiment adopts probe to test, described probe applies one first probe 34 at first test lead 31, applies one second probe 35 at second test lead 32, applies one the 3rd probe 36 at the 3rd test lead 33.
As one embodiment of the present of invention, the synoptic diagram that is to use three end method for testing resistance of the present invention to carry out the contact resistance test shown in Figure 13.
The method for testing resistance of present embodiment comprises following steps:
A. force between second test lead 32 and the 3rd test lead 33 electric current promptly first electric current I 1 promptly apply the 0A electric current for 0A at described the 3rd test lead 33;
Wherein apply on the path that 0A electric current purpose is assurance second test lead to the three test leads and do not have current path at the 3rd test lead.
Because existing tester table is for example pacified the board of prompt logical sequence 4072 series, the function that applies 0 electric current at certain test lead promptly is provided, therefore can have used existing test machine for example to pacify prompt logical sequence 4072 serial boards apply 0A at the 3rd test lead by connecting line and test probe electric current.And test machine is fed back by measuring, and its Automatic Network Matching has guaranteed output accuracy.The 3rd test lead applies its error magnitude of 0A and is far smaller than in second measuring current that test lead adds, thereby does not influence the calculating of final resistance
B. described first test lead is connected a predetermined potential, apply second a predetermined electric current I 2 at second test lead 35;
C. measure the magnitude of voltage V2 of second test lead 35 and the magnitude of voltage V3 of the 3rd test lead 36;
Because described first electric current I 1 is 0, and the resistance of D point and described the 3rd test lead is a finite value, so the electric potential difference of described D point and described the 3rd test lead is 0, the electromotive force that then described D is ordered is identical with the electromotive force of described the 3rd test lead;
D. calculate the resistance value of the contact resistance of second test lead 32 and second probe 35:
This contact resistance can be considered the resistance of 32 of second probe 35 and second test leads, is 0 first electric current I 1 because the 3rd test lead 36 has applied its value, so the electric current that flows to test lead from probe equals described second electric current I 2.
The magnitude of voltage of second probe 35 is measured and can be got by probe.
Again because, first electric current I 1 is 0, so the electromotive force that D is ordered equals the electromotive force of the 3rd test lead 33.
Because the voltage that described second test lead is ordered to D, therefore, described relatively second probe 35 of structural resistance that test lead is ordered to D and the contact resistance between described second test lead 32 are compared minimum, so can think that described second probe 35 equals the resistance value that described second probe 35 to D is ordered to the contact resistance of described second test 32.
Wherein, be connected to the interconnection structure resistance of this a bit of transition of test lead from test structure, we is defined as Ri.Because Ri is very little and fix, so we still can observe the variation of Rc by the variation of detecting R '.2) because the structural resistance Rs that records does not at last comprise Ri, therefore finally will obtain Rs removes Rc and Ri (interconnection resistance) always.So Ri can not influence the measuring accuracy of this method of testing.In order to discuss conveniently, the calculating of ignoring Ri is discussed below.
The electric potential difference that the resistance R c2 of described second probe 35 and described second test lead 32 equals second probe 35 and D arrives D point electric current divided by second probe 35.
Because described D point electromotive force equals the electromotive force of described the 3rd probe, so the electric potential difference of second probe 35 and D equals the voltage difference=V2-V3 of 36 of described second probe 35 and described the 3rd probes.
Because described the 3rd electric current is 0, thus shown in second probe electric current of ordering to described D equal the electric current I 2 that described second probe 35 flows to described first probe 33.
So, contact resistance Rc2=(V2-V3)/I2 that described second probe 35 and described second test lead are 32.
Embodiment 2: it is that example describes that present embodiment adopts three end test structures of prior art.
Shown in Figure 15ly be to use described three end test structures to apply the synoptic diagram that probe is tested.Guarantee that for effective the contact resistance of each test lead and each probe is constant, present embodiment adopts probe to test, described probe applies one first probe 34 at first test lead 31, applies one second probe 35 at second test lead 32, applies one the 3rd probe 36 at the 3rd test lead 33.
As one embodiment of the present of invention, shown in Figure 15 is the another kind of synoptic diagram that uses three end method for testing resistance to carry out the contact resistance test of the present invention.
The method for testing resistance of present embodiment comprises following steps:
A1. on described the 3rd test lead, 33 apply one the 3rd electric current I 3;
B1. on described second test lead, 32 apply one the 4th voltage U 4, and on described first test lead 31, apply a tertiary voltage U3;
C1. measure by the 4th current value I 4 of described first test lead 31 and the magnitude of voltage U5 on described the 3rd test lead 33;
D1. calculate described second test lead, 32 contact resistances;
Wherein, described the 3rd current value I 3 is 0.
Because described the 3rd electric current I 3 is 0, and the resistance of D point and described the 3rd test lead 33 is a finite value, so the electric potential difference of described D point and described the 3rd test lead 33 is 0, the electromotive force that then described D is ordered is identical with the electromotive force of described the 3rd test lead 33;
The contact resistance of second test lead 32 and second probe 35 can be considered the resistance of 32 of second probe 35 and second test leads.
Because it is 0 the 3rd electric current I 3 that the 3rd test lead 33 has applied its value, so the electric current that flows to second test lead from second probe equals described the 4th electric current I 4.
The electromotive force of second probe 35 equals to be applied to the magnitude of voltage on second probe 35.
Again because, the 3rd electric current I 3 is 0, so the electromotive force that D is ordered equals the electromotive force U5 of the 3rd test lead 36.
Because described relatively second probe 35 of voltage that described second test lead is ordered to D and the contact resistance between described second test lead 32 compares minimum and lower end interconnecting construction resistance is fixed, so can think that described second probe 35 equals described second probe 35 to the contact resistance of test structure and arrives the resistance value that D is ordered.
The electric potential difference that described second probe 35 equals second probe 35 and D to the resistance R c2 of test structure divided by second probe 35 to D point electric current.
Because described D point electromotive force equals the electromotive force of described the 3rd probe, so the electric potential difference of second probe 35 and D equals the voltage difference=U4-U5 of 36 of described second probe 35 and described the 3rd probes.
Because described the 3rd electric current is 0, thus shown in second probe electric current of ordering to described D equal the electric current I 4 that described second probe 35 flows to described first probe 33.
So, contact resistance Rc2=(U4-U5)/I4 that described second probe 35 and described second test lead are 32.
In addition, the present invention also is suitable for multiport test structure (the test lead number is greater than 3) except being applicable to three above-mentioned end test structures.
Test structure shown in Figure 16 comprises the 4th test lead 51, the five test leads 52, the six test leads 53, the 7th test lead 54 and 55, five test leads of the 8th test lead.
As shown in figure 17, on the 4th test lead 51 of described test structure shown in Figure 16, apply four point probe 56, on the 5th test lead 52, apply the 5th probe 57, on the 6th test lead 53, apply the 6th probe 58.
With the 4th test lead 51, the 5th test lead 52, the 6th test lead 53 with and the resistance of 53 of the 4th test lead 51 to the 6th test leads be one or three end test structures, use the foregoing description 1 or implement the contact resistance Rc5 that 2 three end method of testings can measure described the 5th test lead 52 and the 5th probe 57.
In like manner, on the 5th test lead 52, apply the 5th probe 57, on the 6th test lead 53, apply the 6th probe 58, on the 7th test lead 54, apply the 7th probe 59; And be the contact resistance Rc6 that three end test structures can record the 6th test lead 53 and the 6th probe 58 with the 5th test lead 52, the 6th test lead 53, the 7th test lead 54.
Further, for by the two ends test structure that resistance constituted between the 5th test lead 52 and the 6th test lead 53 and this two test lead, adopt the two ends method for testing resistance of prior art to obtain a resistance measurement value Rm3 by the 5th probe 57 and the 6th probe 58.
Because this measured value Rm3 is made of contact resistance between the structural resistance Rs3 between described the 5th test lead and described the 6th test lead and described the 5th test lead and described the 5th probe and the contact resistance between described the 6th test lead and described the 6th probe.
Therefore, Rm3=Rc6+Rc5+Rs3;
Structural resistance Rs3=Rm3-Rc6-Rc5 between described the 5th test lead and described the 6th test lead, thus precision architecture resistance value between described the 5th test lead and described the 6th test lead obtained.
In like manner, the present invention can also extend in the test structure of a plurality of test leads, obtains their accurate structural resistance value.And be not limited only to above-mentioned three end test structures or five terminal test structure.
More than specific embodiments of the invention are described.It will be appreciated that the present invention is not limited to above-mentioned specific implementations, those skilled in the art can make various distortion or modification within the scope of the appended claims.
Claims (6)
1. method of using a kind of test structure to come measuring resistance, wherein, described test structure comprises first test lead, second test lead, the 3rd test lead and measured resistance, wherein said first test lead and described the 3rd test lead are positioned at the described second test lead both sides, and described first test lead, second test lead and the 3rd test lead all are connected with described measured resistance, it is characterized in that described method for testing resistance comprises following steps:
A. making the electric current of described second test lead to the, three test leads is 0A;
B. calculate the contact resistance of described second test lead.
2. method for testing resistance as claimed in claim 2 is characterized in that the described first test lead ground connection.
3. method for testing resistance as claimed in claim 1 is characterized in that described step B comprises following substep:
B. apply one second electric current at described second test lead;
C. measure the magnitude of voltage of described second test lead and the magnitude of voltage of described the 3rd test lead;
D. according to the magnitude of voltage of described second electric current, described second test lead and the magnitude of voltage of described the 3rd test lead, calculate second contact resistance of described second test lead.
4. the described method for testing resistance of claim 1 is characterized in that described step B comprises following substep:
B1. apply one the 4th voltage at described second test lead;
C1. measure by the current value of described first test lead and the magnitude of voltage between described the 3rd test lead;
D1. according to described the 4th voltage, the magnitude of voltage between the current value of described first test lead and described the 3rd test lead calculates second contact resistance of described second test lead.
5. method for testing resistance as claimed in claim 1, it is characterized in that described test structure also comprises the 4th test lead, described the 4th test lead is positioned at described the 3rd test lead both sides with described second test lead and described the 4th test lead also links to each other with described measured resistance, and described method for testing resistance is further comprising the steps of:
E. being the first new test lead with second test lead, is the second new test lead with the 3rd test lead, is the 3rd new test lead with the 4th test lead, and repeating step A and step B calculate the 3rd contact resistance of described second test lead newly;
F. use the two ends method for testing resistance to measure resistance between described new first test lead and new second test lead;
G. according to the resistance between described second contact resistance and described the 3rd contact resistance and described new first test lead and new second test lead, calculate described newly first test lead and the structural resistance between new second test lead.
6. as any described method for testing resistance in the claim 1～5, it is characterized in that steps A may further comprise the steps:
The use test machine applies the electric current of 0A at the 3rd test lead by connecting line and test probe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100446934A CN101363881B (en) | 2007-08-08 | 2007-08-08 | Method for testing resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100446934A CN101363881B (en) | 2007-08-08 | 2007-08-08 | Method for testing resistance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101363881A true CN101363881A (en) | 2009-02-11 |
| CN101363881B CN101363881B (en) | 2012-07-04 |
Family
ID=40390358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100446934A Expired - Fee Related CN101363881B (en) | 2007-08-08 | 2007-08-08 | Method for testing resistance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101363881B (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101907657A (en) * | 2010-06-11 | 2010-12-08 | 上海宏力半导体制造有限公司 | Detection method for probe resistance |
| CN101937021A (en) * | 2010-06-30 | 2011-01-05 | 上海华岭集成电路技术有限责任公司 | Online measurement method of contact resistance of probe |
| CN102207523A (en) * | 2011-03-17 | 2011-10-05 | 郑峻 | Ohm contact imitation resistor test apparatus and test method |
| CN102590630A (en) * | 2012-03-01 | 2012-07-18 | 上海宏力半导体制造有限公司 | Resistance test method for test probe of semiconductor parameter tester |
| CN102110626B (en) * | 2009-12-29 | 2012-12-26 | 中芯国际集成电路制造(上海)有限公司 | Method for determining minimum measurable length of serpentine metal wires in wafer |
| CN102890736A (en) * | 2012-09-25 | 2013-01-23 | 东南大学 | Measuring method for resistance of three-terminal resistors used for integrated circuits |
| CN108089054A (en) * | 2016-11-22 | 2018-05-29 | 北京铁路信号有限公司 | A kind of method for the contact resistance for measuring the forced connection of solderless |
| CN108603904A (en) * | 2016-04-29 | 2018-09-28 | 惠普深蓝有限责任公司 | Monitor circuit |
| CN111796148A (en) * | 2020-07-31 | 2020-10-20 | 上海华力微电子有限公司 | Resistance test structure |
| WO2023168542A1 (en) * | 2022-03-09 | 2023-09-14 | 宁德时代新能源科技股份有限公司 | Method and device for calibrating contact resistance of battery connecting piece, and electric device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4876515A (en) * | 1987-05-08 | 1989-10-24 | The Boeing Company | Self-checking ohmmeter that checks for contact resistance of its probes |
| CN1493880A (en) * | 2003-07-16 | 2004-05-05 | 武汉大学 | Method of quick measuring power transformer winding D.C. resistance and equipment |
| JP2006038599A (en) * | 2004-07-26 | 2006-02-09 | Nec Electronics Corp | Contact resistance measuring method, contact resistance measuring device and semiconductor wafer |
-
2007
- 2007-08-08 CN CN2007100446934A patent/CN101363881B/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102110626B (en) * | 2009-12-29 | 2012-12-26 | 中芯国际集成电路制造(上海)有限公司 | Method for determining minimum measurable length of serpentine metal wires in wafer |
| CN101907657A (en) * | 2010-06-11 | 2010-12-08 | 上海宏力半导体制造有限公司 | Detection method for probe resistance |
| CN101937021A (en) * | 2010-06-30 | 2011-01-05 | 上海华岭集成电路技术有限责任公司 | Online measurement method of contact resistance of probe |
| CN102207523A (en) * | 2011-03-17 | 2011-10-05 | 郑峻 | Ohm contact imitation resistor test apparatus and test method |
| CN102590630A (en) * | 2012-03-01 | 2012-07-18 | 上海宏力半导体制造有限公司 | Resistance test method for test probe of semiconductor parameter tester |
| CN102890736A (en) * | 2012-09-25 | 2013-01-23 | 东南大学 | Measuring method for resistance of three-terminal resistors used for integrated circuits |
| CN108603904A (en) * | 2016-04-29 | 2018-09-28 | 惠普深蓝有限责任公司 | Monitor circuit |
| US11686752B2 (en) | 2016-04-29 | 2023-06-27 | Hp Indigo B.V. | Monitoring circuitry |
| CN108089054A (en) * | 2016-11-22 | 2018-05-29 | 北京铁路信号有限公司 | A kind of method for the contact resistance for measuring the forced connection of solderless |
| CN111796148A (en) * | 2020-07-31 | 2020-10-20 | 上海华力微电子有限公司 | Resistance test structure |
| WO2023168542A1 (en) * | 2022-03-09 | 2023-09-14 | 宁德时代新能源科技股份有限公司 | Method and device for calibrating contact resistance of battery connecting piece, and electric device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101363881B (en) | 2012-07-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101363881B (en) | Method for testing resistance | |
| DE10296904B4 (en) | Method for calibrating a semiconductor tester | |
| CN100489549C (en) | Wire short /open circuit test set | |
| CN1892246B (en) | Systems, methods and device for calibrating an automated circuit test system | |
| CN104991214B (en) | Digital integrated electronic circuit DC parameter standard reproducing method and standard set-up | |
| CN1828322A (en) | Method for non-contact testing of fixed and inaccessible connections without using a sensor plate | |
| US10345421B2 (en) | Measurement accessory device | |
| CN112731241B (en) | Calibration tool and calibration method for wafer test machine | |
| CN110716120B (en) | Calibration method for channel delay deviation of automatic chip test equipment | |
| CN104345248B (en) | Identifying defective cables | |
| US20150212186A1 (en) | Method of calibrating and operating testing system | |
| CN105425094B (en) | A kind of PCBA short dots detection method and device | |
| CN103605063B (en) | The port error value feedback system of test multiport device and method | |
| US20150204962A1 (en) | Method of operating testing system | |
| CN101539608A (en) | Method for inspecting insulation property of capacitor | |
| CN109270429B (en) | Method for measuring noise of multi-channel high-low temperature interface circuit board | |
| US6828797B2 (en) | Alternative method for VOD testing of linear differential line drivers | |
| CN111007319A (en) | Detection circuit and method for socket probe yield | |
| KR100795691B1 (en) | Probe sheet for testing flexible printed circuit board and method using which | |
| JP4670549B2 (en) | Measurement error correction method | |
| CN204649843U (en) | A kind of circuit board carbon ink device for testing resistance | |
| JP5988557B2 (en) | Circuit board inspection apparatus and circuit board inspection method | |
| CN211042540U (en) | Testing device | |
| CN220773466U (en) | Differential pressure compensation circuit of automatic test equipment and automatic test equipment | |
| CN211042539U (en) | Testing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120704 Termination date: 20180808 |