CN102110626B - Method for determining minimum measurable length of serpentine metal wires in wafer - Google Patents
Method for determining minimum measurable length of serpentine metal wires in wafer Download PDFInfo
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- CN102110626B CN102110626B CN 200910247324 CN200910247324A CN102110626B CN 102110626 B CN102110626 B CN 102110626B CN 200910247324 CN200910247324 CN 200910247324 CN 200910247324 A CN200910247324 A CN 200910247324A CN 102110626 B CN102110626 B CN 102110626B
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Abstract
The invention discloses a method for determining the minimum measurable length of serpentine metal wires in a wafer, and the method comprises the following steps: prearranging a test device comprising a plurality of test modules with the same structure on a wafer, wherein the test module comprises a plurality of serpentine metal wires with different lengths for providing a plurality of to-be-measured resistance values; measuring each test module in the test device according to the predetermined number of test groups and the corresponding to-be-measured resistance values of each group to obtain a plurality of groups of measurement results; determining a stably measurable resistance range according to the plurality of groups of measurement results and a preset threshold value; and determining the minimum measurable length of the serpentine metal wires in the wafer according to the determined stably measurable resistance range. Through the use of the method provided by the invention, the minimum measurable length of the serpentine metal wires in the wafer without reduction of the measurement accuracy can be determined, thereby effectively reducing the area of a region on the wafer for setting a detection circuit and reducing production cost.
Description
Technical field
The present invention relates to the manufacturing technology of semiconductor components and devices, the I that refers in particular to snakelike metal wire in a kind of definite wafer is surveyed the method for length.
Background technology
In the manufacturing technology of semiconductor device; Wafer is after making through complicated technology; Before encapsulating, also must carry out one time testing electrical property; Whether meet corresponding design standard to detect the wafer produced, or the wafer quality of being produced is carried out classification, and find out some defective in the manufacturing process of semiconductor device through this test.This test is referred to as wafer testing electrical property (WAT, Wafer Acceptence Test).In WAT, generally need test corresponding electrical parameter (for example, the resistance of corresponding construction), its test interface is generally some detection pad (probe pad) of reserving on the wafer.
In order to carry out above-mentioned wafer testing electrical property, generally need the relevant detection circuit be set in advance on wafer, be used for detecting in the production process of semiconductor device of wafer circuit defect whether occurs.For example, a plurality of detection pad with definite interval can be set on wafer in advance, and snakelike metal wire structure (serpent line structure) is set between above-mentioned liner.Then, can detect the electrology characteristic of the semiconductor device on the wafer through measurement to the resistance of above-mentioned snakelike metal wire structure.
In the prior art; It is crucial that the resistance of snakelike metal wire structure is measured for the quality that guarantees integrated circuit (IC); Therefore the resistance of snakelike metal wire structure (serpent line structure) being measured, is an important component part among the WAT of most of semiconductor device.In general, the method for measurement of snakelike metal wire resistance of the prior art is: the resistance of confirming two snakelike metal wires between the detection pad through two point measurement methods or four point measurement methods.Wherein, four point measurement methods are mainly used in measures the less snakelike metal wire structure of resistance, but implementation method is relatively complicated; And two point measurement rules are mainly used in the bigger snakelike metal wire structure of measurement resistance, but its implementation is fairly simple, so range of application is more extensive.
Fig. 1 is the sketch map of snakelike metal wire structure of the prior art.As shown in Figure 1, a plurality of liners can be set on wafer to be measured in advance, and snakelike metal wire is set between above-mentioned liner in advance.Easy for what narrate, be provided with the situation of snakelike metal wire 100 between only schematically illustrated two liners among Fig. 1 (being liner 101 and liner 102).In the case; Carry out the wafer testing electrical property if use two point measurement methods; Then can two probes of resistance measuring appliance be contacted with liner 102 with liner 101 respectively; Know the resistance of above-mentioned snakelike metal wire 100 then through the reading of resistance measuring appliance, thereby can be informed in some electrology characteristic of formed semiconductor device on this wafer.
When using two above-mentioned point measurement methods that the resistance of snakelike metal wire structure is measured; Because detection pad also has certain impedance (being generally about 1 ohm) with the probe self that is used to detect, therefore if guarantee certain certainty of measurement, the resistance of then measured snakelike metal wire can not be too little; Otherwise; Detection pad will produce bigger interference to certainty of measurement with the impedance of the probe self that is used to detect, thereby form bigger measure error, influence certainty of measurement.In general, when using two point measurement methods of the prior art that the resistance of snakelike metal wire structure is measured, the resistance of said snakelike metal wire structure generally need be greater than 100 ohm, otherwise, can't measure accurately the resistance of snakelike metal wire.
But along with the develop rapidly of semiconductor device processing technology, the critical size of semiconductor device (CD) reduces day by day, with making that the zone that is used to be provided with above-mentioned testing circuit on the wafer is also more and more littler.In the prior art, can reduce the area in above-mentioned testing circuit shared zone on wafer, for example, reduce the interval between above-mentioned preset each liner, reduce length that is arranged at the snakelike metal wire between each liner etc. through multiple means.But when the length that is arranged at the snakelike metal wire between each liner reduces, the resistance of this snakelike metal wire also will diminish thereupon.And can know according to foregoing description; When the resistance of snakelike metal wire too hour; If use two point measurement methods to carry out the wafer testing electrical property, then bigger error will appear in the measurement result for the resistance of above-mentioned snakelike metal wire structure, thereby can't guarantee higher certainty of measurement.So; When the mode of the length through reducing to be arranged at the snakelike metal wire between each liner reduces the area in above-mentioned testing circuit shared zone on wafer; In order to ensure when the two point measurement methods of use are carried out the wafer testing electrical property; Can also under the situation that does not reduce certainty of measurement, record the resistance of this snakelike metal wire, must confirm that then the I of snakelike metal wire in the wafer is surveyed length.
At present, also occurring as yet in the prior art can be under the situation that does not reduce certainty of measurement, confirms that the I of snakelike metal wire in the wafer surveys the method for length.
Summary of the invention
In view of this, main purpose of the present invention is to provide the I of snakelike metal wire in a kind of definite wafer to survey the method for length, thereby can confirm that snakelike metal wire in the wafer I when not reducing certainty of measurement surveys length.
For achieving the above object, the technical scheme among the present invention is achieved in that
The I of snakelike metal wire is surveyed the method for length in a kind of definite wafer, and this method comprises:
The testing apparatus that comprises the test module that a plurality of structures are identical is set on wafer in advance; The snakelike metal wire that comprises multiple length in the said test module is used to provide multiple resistance to be measured;
Pairing resistance to be measured during according to predetermined measurement group number and every group of measurement is measured each test module in the testing apparatus, obtains many group measurement results;
But confirm the Standard resistance range of stably measured according to the threshold value of many groups measurement result that is obtained and setting in advance;
But, confirm that the I of snakelike metal wire in the wafer is surveyed length according to the Standard resistance range of determined stably measured;
Wherein, but said according to the many groups measurement result that is obtained and the threshold value that is provided with in advance confirm that the Standard resistance range of stably measured comprises:
According to each measured value and the average measurement value in the threshold value that is provided with in advance, the every group of measurement result, but confirm whether every group of pairing resistance to be measured of measurement result is the resistance of stably measured;
But but confirm the Standard resistance range of stably measured according to the resistance of each stably measured.
Each measured value and average measurement value in the threshold value that said basis is provided with in advance, the every group of measurement result, but confirm that whether every group of pairing resistance to be measured of measurement result be that the resistance of stably measured comprises:
Calculate each measured value and the mean square deviation between the average measurement value in this group measurement result in every group of measurement result;
When the maximum mean square deviation between the average measurement value in each measured value in one group of measurement result and this group measurement result is less than or equal to predetermined threshold value, but then with the corresponding resistance to be measured of this group measurement result resistance that is stably measured;
When the maximum mean square deviation between the average measurement value in each measured value in one group of measurement result and this group measurement result during greater than predetermined threshold value, but then with corresponding this resistance to be measured of this group measurement result resistance that is not stably measured.
The resistance of measured value in said every group of measurement result on each test module, directly recording.
The square resistance that measured value in said every group of measurement result obtains through conversion for the resistance that will on each test module, directly record.
The conversion method of said square resistance is:
To obtain and the corresponding square resistance of this resistance that directly records in the equivalent length of the resistance that directly records on each test module this snakelike metal wire on the test module when measuring this resistance.
But said resistance according to each stably measured confirms that but the Standard resistance range of stably measured comprises:
All resistances to be measured are pressed smooth arrangement from small to large;
But but with the lower limit of the resistance minimum to be measured in the resistance to be measured of continuous a plurality of adjacent stably measureds, but but with the upper limit of the resistance maximum to be measured in the resistance to be measured of continuous a plurality of adjacent stably measureds as the Standard resistance range of stably measured as the Standard resistance range of stably measured.
But said Standard resistance range according to determined stably measured, the I of confirming snakelike metal wire in the wafer is surveyed length and is comprised:
But the minimum resistance in the Standard resistance range of the above-mentioned stably measured that is determined is surveyed resistance as I, survey resistance according to above-mentioned I then and confirm that the I of snakelike metal wire in the wafer surveys length.
To sum up can know, provide the I of snakelike metal wire in a kind of definite wafer to survey the method for length among the present invention.The I of snakelike metal wire is surveyed in the method for length in said definite wafer; Because the testing apparatus that comprises the test module that a plurality of structures are identical is set on wafer in advance; And pairing resistance to be measured when measuring according to predetermined measurement group number and every group; Each test module in the testing apparatus is measured, and obtains many group measurement results, but and then confirm the Standard resistance range of stably measured according to the many groups measurement result that is obtained and the threshold value that is provided with in advance; And the I of finally confirming snakelike metal wire in the wafer surveys length, thereby can confirm that snakelike metal wire in the wafer I when not reducing certainty of measurement surveys length.
Description of drawings
Fig. 1 is the sketch map of snakelike metal wire structure of the prior art.
Fig. 2 surveys the method flow diagram of length for confirming the I of snakelike metal wire in the wafer among the present invention.
Fig. 3 is the structural representation of the test module in the netted testing apparatus among the present invention.
But Fig. 4 is the method flow diagram of the Standard resistance range of confirming stably measured among the present invention.
Embodiment
For making the object of the invention, technical scheme and advantage express clearlyer, the present invention is remake further detailed explanation below in conjunction with accompanying drawing and specific embodiment.
Fig. 2 surveys the method flow diagram of length for confirming the I of snakelike metal wire in the wafer among the present invention.As shown in Figure 2, the method that the I of confirming snakelike metal wire in the wafer among the present invention is surveyed length comprises the step that is described below:
When not reducing certainty of measurement, confirm that the I of snakelike metal wire in the wafer is surveyed length, in an embodiment of the present invention, a kind of netted testing apparatus (netlike test structure) will be set in advance on wafer in order to be implemented in.In this netted testing apparatus, comprise M the test module that structure is identical, and independently of one another between each test module.Wherein, said M is the natural number greater than 2.In an embodiment of the present invention, the value of said M can be 65～75, and is preferable, and the value of M is 69.In addition, also comprise the snakelike metal wire of multiple length in the said test module, be used to provide multiple resistance to be measured.In an embodiment of the present invention, the structure of said test module can have a variety of implementations.For technical scheme of the present invention is introduced, below will be that example describes with a certain implementation in the multiple implementation.
Fig. 3 is the structural representation of the test module in the netted testing apparatus among the present invention.As shown in Figure 3, comprise in the test module in the netted testing apparatus among the present invention: n liner, a n switch, (n-1) individual first resistance, (n-1) individual second resistance; Wherein, a said n switch is corresponding one by one with a said n liner, and an end of each switch all links to each other with corresponding liner; Connect through one first resistance between the link of per two adjacent switches and its corresponding liner; Connect through one second resistance between the other end of per two adjacent switches.
In an embodiment of the present invention, said n is the natural number more than or equal to 2.For example, described n can be 20,22,25 or 27 etc.Therefore, as shown in Figure 2, can be respectively with the 1st liner, the 2nd liner ..., an expression said n liner such as a n liner, with K
1, K
2, K
3..., K
nOn an expression said n switch, with R
11, R
21, R
31..., R
(n-1) 1Deng expression above-mentioned (n-1) individual first resistance, with R
12, R
22, R
32..., R
(n-1) 2Deng expression above-mentioned (n-1) individual second resistance; Wherein, can establish first resistance R
11Pairing second resistance is R
12, first resistance R
21Pairing second resistance is R
22..., first resistance R
(n-1) 1Pairing second resistance is R
(n-1) 2
In addition, in an embodiment of the present invention, can preestablish the resistance of each first resistance and second resistance; The resistance of second resistance that each first resistance is corresponding with it can be set to equate, also can be set to unequal.Wherein, in an embodiment of the present invention, described first resistance and second resistance are length might be different but snakelike metal wire that width is identical.Therefore, can learn the resistance of this snakelike metal wire according to the length of a certain snakelike metal wire, vice versa.
In addition; Switch in the above-mentioned test module can be the various switching devices that are used for connecting and disconnecting of the circuit commonly used; For example; Above-mentioned switch can be Metal-Oxide Semiconductor (MOS) FET, for example, and N channel metal-oxide semiconductor (NMOS) FET or P channel metal-oxide semiconductor (PMOS) FET etc.When stating test module in the use, can control the on off operating mode of above-mentioned each switch according to the needs of practical application, to obtain the different combinations resistance.In general, can control the on off operating mode of above-mentioned each switch through manual mode or voltage system.For example, when above-mentioned switch is the NMOS FET, can control the on off operating mode of above-mentioned switch through loading on voltage on this NMOS FET.For example, when the voltage on loading on this NMOS FET is positive voltage, will make this NMOS FET be in conducting state; And the voltage on loading on this NMOS FET then can make this NMOS FET be in off-state when being positive voltage.
Therefore, will have the resistance measuring appliance of two probes and contact, can obtain the resistance between two liners that this resistance measuring appliance contacted through this resistance measuring appliance with two liners in the said n liner.Hence one can see that, in an embodiment of the present invention, on off operating mode that can be through each switch in the above-mentioned test module is set and when measuring the position of employed two substrates, make this test module can be the external world different resistances to be measured be provided.For example; When from n liner, selecting two liners; Multiple possible selection mode can be arranged;
can be arranged at most in the ideal case, plant selection mode.And the on off operating mode of each switch in n switch has two kinds: conducting state and off-state therefore for a described n switch, also can have the combination of multiple on off operating mode.In the ideal case, can have 2 at most
nPlant the combination of on off operating mode.Therefore, under ideal state,, can obtain [2 at most through to the setting of the on off operating mode of each switch and to the selection of liner
N-1N (n-1)] individual different resistance measurement result.Concrete set-up mode repeats no more at this.
In an embodiment of the present invention, only after confirm measuring the accuracy rating that can reach, could confirm the I survey length of snakelike metal wire in the wafer.For example, if when using two point measurement methods that the resistance of the snakelike metal wire in the wafer is measured, but the Standard resistance range of stably measured is r
1～r
2Ohm (Ω), but then expression can be carried out the accurate measurement of coincidence measurement accuracy standard to the resistance of this snakelike metal wire when in the Standard resistance range of resistance at above-mentioned stably measured of snakelike metal wire.Therefore, but can confirm that it is r that the I of snakelike metal wire in the wafer is surveyed length according to the Standard resistance range of above-mentioned stably measured
1Ohm.
Therefore, in an embodiment of the present invention, can take multiple measurements respectively, but and then confirm the Standard resistance range of stably measured according to the distribution situation of all measurement results a plurality of different resistances.So, in this step, pairing resistance to be measured during the at first definite in advance required measurement group number of needs, and every group of measurement.Specifically, can confirm required measurement group number according to the Standard resistance range of required measurement, and every group of pairing resistance to be measured when measuring.At this moment, can establish required measurement group number is C, pairing resistance C to be measured during every group of measurement
jWherein, C is a natural number, j=1, and 2 ..., C.For example, when the Standard resistance range of required measurement is 1～200 Ω, then can from 1～200 Ω, select 10 resistances as resistance to be measured, at this moment, required measurement group be counted C=10.
Then, pairing resistance to be measured in the time of can measuring according to predetermined measurement group number and every group is measured each test module in the testing apparatus, obtains many group measurement results.Specifically, when definite measurement group number and every group of measurement, after the pairing resistance to be measured, can measure each test module in the testing apparatus according to the measuring sequence of confirming.For example, when required measurement group number is 10, can successively each test module in the testing apparatus be measured according to 10 determined resistances to be measured order from small to large.
Since each test module in the above-mentioned testing apparatus all can be through switch be set on off operating mode and when measuring the position of employed two liners multiple resistance to be measured is provided; Therefore; When each test module in the testing apparatus being carried out one group of measurement according to determined resistance to be measured; Can confirm the on off operating mode of each switch in each test module and the position of employed two substrates when measuring according to above-mentioned resistance to be measured; And two probes of resistance measuring appliance are contacted with above-mentioned determined two substrates, thereby resistance to be measured is measured.Because the structure of each test module in the testing apparatus is identical, therefore, can all carry out above-mentioned measurement to each test module, to obtain corresponding measurement result.Owing in the testing apparatus M test module arranged, therefore, after a certain resistance to be measured being accomplished one group of measurement, can obtain M the measured value relevant with this resistance to be measured; At this moment, can be with the M that an is obtained measured value as the one group measurement result corresponding with this resistance to be measured.Because measurement group number is C, therefore can obtain C group measurement result altogether, correspond respectively to C resistance to be measured, and all have M measured value in every group of measurement result.
In this step, but can be according to the Standard resistance range of all group measurement results that obtained and the definite stably measured of threshold value that is provided with in advance.For example, but Fig. 4 is the method flow diagram of the Standard resistance range of confirming stably measured among the present invention.As shown in Figure 4, in an embodiment of the present invention, but can confirm the Standard resistance range of stably measured according to the step that is described below:
In actual measurement; Because the influence of various factors; Each measured value in same group of measurement result maybe and unequal, the difference between each measured value in every group of measurement result and the mean value (i.e. average measurement value in this group measurement result) of each measured value in this group measurement result has certain fluctuation.
Therefore, in an embodiment of the present invention, can obtain the average measurement value in every group of measurement result at first according to each measured value in every group of measurement result; Then, again according to each measured value and average measurement value in the threshold value that is provided with in advance, the every group of measurement result, but confirm whether every group of pairing resistance to be measured of measurement result is the resistance of stably measured.
For example, after the average measurement value in obtaining every group of measurement result, can calculate each measured value and the mean square deviation between the average measurement value in this group measurement result in every group of measurement result; When the maximum mean square deviation between the average measurement value in each measured value in one group of measurement result and this group measurement result is less than or equal to predetermined threshold value; Then can think the requirement of this group measurement result coincidence measurement precision, but with the corresponding resistance to be measured of this group measurement result resistance that is stably measured; And when the maximum mean square deviation between the average measurement value in each measured value in one group of measurement result and this group measurement result during greater than predetermined threshold value; Then can think the requirement that this group measurement result is not met certainty of measurement, but with corresponding this resistance to be measured of this group measurement result resistance that is not stably measured.
In addition, in semiconductor fabrication process, use square resistance to represent the resistance of snakelike metal wire usually.So-called square resistance is the resistance that the surface is appeared when the sense of current is parallel to foursquare limit for foursquare semiconductor lamella.For the layer material of rectangle, all-in resistance is that square resistance multiply by the square number on the sense of current.So under the certain situation of width, the resistance of snakelike metal wire is the product of the length of square resistance and this snakelike metal wire.Therefore, the measured value in this step in above-mentioned every group of measurement result can be the resistance that on each test module, directly records, and also can be the square resistance that the resistance that on each test module, directly records is obtained through conversion.The conversion method of said square resistance is: will be in the equivalent length of the resistance that directly records on each test module this snakelike metal wire on the test module when measuring this resistance, thus obtain and the corresponding square resistance of this resistance that directly records.For example, as shown in Figure 2, when two probes with the resistance measuring appliance contact with the 1st shown in Fig. 2,2 liners, and K switch
1And K
2When all being in conducting state, can record resistance R
11And R
12Parallelly connected resistance.Because R
11And R
12Being the identical but length of width might different snakelike metal wire, therefore according to R
11, R
12Length L
11, L
12Can obtain one with the above-mentioned measured corresponding equivalent length L of parallelly connected resistance
1, for example, L
1=(L
11* L
12)/(L
11+ L
12).With above-mentioned measured parallelly connected resistance divided by above-mentioned equivalent length L
1, can obtain corresponding square resistance.
Because in step 401, but can confirm whether every group of pairing resistance to be measured of measurement result is the resistance of stably measured, therefore, in this step, but but can confirm the Standard resistance range of stably measured according to the resistance of determined each stably measured.For example; Earlier all (for example, C) resistances to be measured are pressed smooth arrangement from small to large, if in above-mentioned resistance to be measured; Have continuously a plurality of (for example; D, but the resistance to be measured that wherein d≤C) is adjacent is the resistance of stably measured, but but the resistance minimum to be measured in the resistance to be measured of then can above-mentioned continuous d individual adjacent stably measured as the lower limit of the Standard resistance range of stably measured; But but the resistance maximum to be measured in the resistance to be measured of the stably measured that above-mentioned continuous d is adjacent as the upper limit of the Standard resistance range of stably measured, thereby but confirmed the Standard resistance range of stably measured.
Confirm that according to above-mentioned but the method for the Standard resistance range of stably measured can know, but but each resistance in the Standard resistance range of the above-mentioned stably measured that is determined all is resistances of stably measured.Therefore; When but the minimum resistance of snakelike metal wire in certain wafer is in the Standard resistance range of above-mentioned stably measured; Just can be in the accuracy rating of confirming to this wafer in the resistance of snakelike metal wire measure accurately, thereby obtain the measured value of the requirement of coincidence measurement precision.
For the snakelike metal wire in the wafer, under the situation that width is confirmed, the length of snakelike metal wire is directly proportional with the resistance of this snakelike metal wire.Therefore, in this step, but can the minimum resistance in the Standard resistance range of the above-mentioned stably measured that is determined be surveyed resistance as I, survey resistance according to above-mentioned I then and confirm that the I of snakelike metal wire in the wafer surveys length.For example, can resistance be equaled above-mentioned I surveys the length of the snakelike metal wire of resistance and surveys length as the I of the snakelike metal wire in this wafer.
Can know that to sum up the I that has proposed snakelike metal wire in above-mentioned definite wafer is in an embodiment of the present invention surveyed the method for length.Survey the method for length through the I of using snakelike metal wire in above-mentioned definite wafer; Can confirm that snakelike metal wire in the wafer I when not reducing certainty of measurement surveys length; Thereby can reduce the area in the zone that is used to be provided with testing circuit on the wafer effectively, reduce production costs.
The above is merely preferred embodiment of the present invention, is not to be used to limit protection scope of the present invention.All within spirit of the present invention and principle, any modification of being done, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. the I of snakelike metal wire is surveyed the method for length in the definite wafer, and this method comprises:
The testing apparatus that comprises the test module that a plurality of structures are identical is set on wafer in advance; The snakelike metal wire that comprises multiple length in the said test module is used to provide multiple resistance to be measured;
Pairing resistance to be measured during according to predetermined measurement group number and every group of measurement is measured each test module in the testing apparatus, obtains many group measurement results;
But confirm the Standard resistance range of stably measured according to the threshold value of many groups measurement result that is obtained and setting in advance;
But, confirm that the I of snakelike metal wire in the wafer is surveyed length according to the Standard resistance range of determined stably measured;
Wherein, but said according to the many groups measurement result that is obtained and the threshold value that is provided with in advance confirm that the Standard resistance range of stably measured comprises:
According to each measured value and the average measurement value in the threshold value that is provided with in advance, the every group of measurement result, but confirm whether every group of pairing resistance to be measured of measurement result is the resistance of stably measured;
But but confirm the Standard resistance range of stably measured according to the resistance of each stably measured.
2. method according to claim 1; It is characterized in that; Each measured value and average measurement value in the threshold value that said basis is provided with in advance, the every group of measurement result, but confirm that whether every group of pairing resistance to be measured of measurement result be that the resistance of stably measured comprises:
Calculate each measured value and the mean square deviation between the average measurement value in this group measurement result in every group of measurement result;
When the maximum mean square deviation between the average measurement value in each measured value in one group of measurement result and this group measurement result is less than or equal to predetermined threshold value, but then with the corresponding resistance to be measured of this group measurement result resistance that is stably measured;
When the maximum mean square deviation between the average measurement value in each measured value in one group of measurement result and this group measurement result during greater than predetermined threshold value, but then with corresponding this resistance to be measured of this group measurement result resistance that is not stably measured.
3. method according to claim 2 is characterized in that:
The resistance of measured value in said every group of measurement result on each test module, directly recording.
4. method according to claim 2 is characterized in that:
The square resistance that measured value in said every group of measurement result obtains through conversion for the resistance that will on each test module, directly record.
5. method according to claim 4 is characterized in that, the conversion method of said square resistance is:
To obtain and the corresponding square resistance of this resistance that directly records in the equivalent length of the resistance that directly records on each test module this snakelike metal wire on the test module when measuring this resistance.
6. method according to claim 1 is characterized in that, but said resistance according to each stably measured confirms that but the Standard resistance range of stably measured comprises:
All resistances to be measured are pressed smooth arrangement from small to large;
But but with the lower limit of the resistance minimum to be measured in the resistance to be measured of continuous a plurality of adjacent stably measureds, but but with the upper limit of the resistance maximum to be measured in the resistance to be measured of continuous a plurality of adjacent stably measureds as the Standard resistance range of stably measured as the Standard resistance range of stably measured.
7. method according to claim 1 is characterized in that, but said Standard resistance range according to determined stably measured, and the I of confirming snakelike metal wire in the wafer is surveyed length and is comprised:
But the minimum resistance in the Standard resistance range of the above-mentioned stably measured that is determined is surveyed resistance as I, survey resistance according to above-mentioned I then and confirm that the I of snakelike metal wire in the wafer surveys length.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4876515A (en) * | 1987-05-08 | 1989-10-24 | The Boeing Company | Self-checking ohmmeter that checks for contact resistance of its probes |
| CN1482468A (en) * | 2002-09-13 | 2004-03-17 | 中芯国际集成电路制造（上海）有限公 | Structure and method for testing contact resistance of detecting probe |
| CN101363881A (en) * | 2007-08-08 | 2009-02-11 | 中芯国际集成电路制造(上海)有限公司 | Method for testing resistance |
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| CN102110626A (en) | 2011-06-29 |
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