CN101919052B - 用于无线芯片到芯片通信的装置和方法 - Google Patents
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Abstract
本发明揭示无线芯片到芯片通信方法和装置。在一实例中,无线芯片到芯片通信装置包括多个芯片,所述多个芯片中的每一者具有至少一个天线且形成于多层结构上。所述多层结构包括第一和第二吸收层。所述第一和第二吸收层经配置以封闭具有给定介电常数的传播介质。所述多个芯片经配置以根据给定无线通信协议通过所述传播介质内的直接传播路径而经由所述相应天线彼此无线地通信。
Description
技术领域
本发明涉及用于无线通信的方法和装置,且更特定来说,涉及用于无线芯片到芯片通信的方法和装置。
背景技术
图1说明常规印制线路板(PWB)或印制电路板(PCB)10,其包括用于链接或连接安装于其上的半导体芯片的总线线路。每一半导体芯片12、14和16经由导线总线18耦合到PWB 10。通过将每一芯片的引脚永久地焊接到导线总线18而形成每一芯片与PWB 10之间的传导接点。此连接芯片的方法具有大量制造缺陷,尤其在焊料结合中,从而增加总制造成本且降低PWB 10的可靠性。虽然图1中未明确展示,但半导体芯片12、14和16可安装于PWB 10的表面层上,可经由导线连接到电源平面层(即,用于电源电压连接),且可经由导线进一步连接到接地平面层(即,用于接地电压连接)。每一层可经堆叠或安装于PWB 10的衬底上。
图2说明用于促进安装于上面的多个半导体芯片之间的无线通信的常规PWB 200的俯视图。如图2所示,PWB 200包括多个芯片20、22和24,其在PWB 200的表面层上物理上隔开。每一芯片20、22和24包括发射器30、接收器40和天线单元50。在PWB200的操作期间,由芯片20、22和/或24处理的信息由那个芯片的相应发射器30输出。耦合到天线单元50的发射器30将其芯片的以电磁能量形式处理的信息发射到芯片20、22和24周围的自由空间区域中。在给定芯片的给定发射器30发射无线信号后,一个或一个以上其它芯片处的接收器40经由天线单元50接收所发射的信息。由接收器40接收的信息接着传递到芯片中以供进一步处理。
为了实现图2的上述无线发射和接收,每一发射器30和接收器40(“收发器30/40”)根据例如在不同载波频率下操作的调幅(“AM”)方案的给定无线通信协议(或者称为无线通信信令)而操作。在AM方案下,每一不同载波频率可在操作射频频谱内。由收发器30/40使用的无线通信协议可替代地采用调频、相移键控调制、频移键控调制,或多相位频移键控调制。由收发器30/40使用的无线通信协议可替代地包括时分多路复用和/或编码方案(例如,沃尔什码(Walsh code))。
如所属领域的技术人员将了解,每一芯片的每一天线50处的无线发射可增加(i)PWB 200的其它芯片和(ii)PWB 200附近的电子装置两者处的干扰。常规上,整个PWB200可用金属外壳(未图示)屏蔽以便减少类型(ii)干扰。金属外壳减少杂散电磁辐射以及由其它系统(未图标)产生的能量的无意耦合干扰PWB 200的操作。然而,类型(i)干扰在常规无线芯片到芯片通信系统中仍可成为问题。
发明内容
本发明的一示范性实施例针对一种无线芯片到芯片通信装置,其包括多个芯片,所述多个芯片中的每一者具有至少一个天线且形成于多层结构上,且第一和第二吸收层包括于所述多层结构内,所述第一和第二吸收层形成具有给定介电常数的传播介质,其中所述多个芯片经配置以根据给定无线通信协议经由所述传播介质内的直接传播路径而经由所述相应天线彼此无线地通信。
本发明的另一示范性实施例针对一种无线芯片到芯片通信的方法,其包括根据给定无线通信协议在耦合到第一芯片的第一天线处从耦合到第二芯片的第二天线接收无线通信信号,所述第一和第二芯片形成于多层结构上,经由由所述多层结构的第一和第二吸收层形成的具有给定介电常数的传播介质内的直接传播路径发射所述无线通信信号。
本发明的另一示范性实施例针对一种无线芯片到芯片通信的方法,其包括根据给定无线通信协议将无线通信信号从耦合到第二芯片的第二天线发射到耦合到第一芯片的第一天线,所述第一和第二芯片形成于多层结构上,经由由所述多层结构的第一和第二吸收层形成的具有给定介电常数的传播介质内的直接传播路径发射所述无线通信信号。
本发明的另一示范性实施例针对一种无线芯片到芯片通信装置,其包含用于在多层结构内无线地发射电磁信号的装置、用于在多层结构内无线地接收电磁信号的装置、用于吸收在多层结构内传播的电磁信号的装置,以及具有给定介电常数且被所述用于吸收的装置封闭的用于传播电磁信号的装置,且其中所述用于无线地发射的装置与所述用于无线地接收的装置经由所述用于传播的装置内的直接传播路径而根据给定无线通信协议彼此通信。
附图说明
呈现附图以辅助描述本发明的实施例,且仅为了说明实施例而非限制实施例的目的而提供附图。
图1说明常规印制线路板(PWB),其包含用于链接或连接安装于其上的半导体芯片的总线线路。
图2说明用于促进安装于上面的多个半导体芯片之间的无线通信的常规PWB的俯视图。
图3说明PWB的横截面。
图4说明图3的PWB的俯视图。
图5说明根据另一配置的横截面PWB。
图6说明图5的PWB的俯视图。
具体实施方式
在针对本发明的特定实施例的以下描述和相关图式中揭示本发明的若干方面。可在不偏离本发明的范围的情况下设计替代实施例。另外,将不会详细描述本发明的众所周知的元件,或将省略所述元件,以免混淆本发明的相关细节。
词语“示范性”在本文中用以意谓“充当一实例、例子或说明”。不必将本文中描述为“示范性”的任何实施例理解为比其它实施例优选或有利。同样,术语“本发明的实施例”并不要求本发明的所有实施例包括所论述的特征、优点或操作模式。
本文中所使用的术语仅出于描述特定实施例的目的且不意欲限制本发明的实施例。在本文中使用时,除非上下文清楚地另外指示,否则单数形式“一”和“所述”也意欲包括复数形式。将进一步了解,术语“包含”、“包括”用于本文中时指定所陈述特征、整体、步骤、操作、元件和/或组件的存在,但不排除存在或添加一个或一个以上其它特征、整体、步骤、操作、元件、组件,和/或其群组。
另外,依据将由(例如)计算装置的元件执行的动作的顺序来描述许多实施例。将认识到,可通过特定电路(例如,专用集成电路(ASIC)),通过正由一个或一个以上处理器执行的程序指令,或通过两者的组合来执行本文描述的各种动作。另外,可认为本文中描述的这些动作的序列完全实施于任何形式的计算机可读存储媒体内,所述计算机可读存储媒体中已存储一组对应的计算机指令,所述指令在被执行后将导致相关联的处理器执行本文中描述的功能性。因此,本发明的各方面可以若干不同形式来实施,预期所有所述形式均在所主张的标的物的范围内。另外,对于本文中所描述的实施例中的每一者来说,任何所述实施例的对应形式在本文中可被描述为(例如)“经配置以执行所描述的动作的逻辑”。
如“背景技术”部分中所论述,通过将收发器和天线定位于每一芯片的顶部上、经由天线在芯片之间发射无线信号并通过金属罩封闭整个系统以减少对PWB的外部干扰并减少芯片发射对外部系统的干扰,来执行在常规印制线路板(PWB)上相应芯片(例如,集成电路、半导体装置等)之间实施的无线通信。如现将更详细地描述,本发明的实施例针对封闭PWB的内部层内的吸收层内的传播介质,使得无需包括金属罩来防止干扰。
图3说明根据本发明的实施例的印制线路板(PWB)300的横截面。如图3所示,PWB 300包括半导体芯片305和310(每一者安装于表面层315上)、共同界定传播介质340的电源平面层320、接地平面325、上部吸收层330和下部吸收层335,以及衬底345。一般来说,半导体芯片305和310连接到电源平面层320以获取电源电压Vdd,并连接到接地平面层以获取接地电压Vgnd。表面层315可对应于任何类型的表面,且可使用任何众所周知的方法(例如,用粘附剂、螺钉等)来执行半导体芯片305和310到表面层315的安装。
参看图3,第一天线350相对于PWB 300从半导体芯片305向内延伸并至少部分突出到传播介质340中,且第二天线355相对于PWB 300从半导体芯片310向内延伸并至少部分突出到传播介质340中。在一实例中,第一和第二天线350和355可被至少屏蔽在天线的不处于传播介质340内的部分内,以减少传播介质340外部的干扰(例如,使得无线信号实质上包含于传播介质340内)。同样,以含有在传播介质340内传播的信号的材料配置上部和下部吸收层330和335。举例来说,可以Ni-Zn铁氧体材料实施上部和下部吸收层330和335。因此,在一实例中,联系上部或下部吸收层330和335的无线通信信号或射频(RF)信号被“吸收”,且不穿过相应层到达外部区域,或反射/反弹离开相应层(例如,其原本可在接收天线处导致多路径问题)。
如上文所论述,上部和下部吸收层330和335共同界定传播介质340。传播介质340可包括任何众所周知的材料。举例来说,传播介质340可为空气。传播介质340确定在其中发射的无线通信信号的传播速度。换句话说,填充上部与下部吸收层330与335之间的区域的材料(即,传播介质340)基于材料的相关联介电常数确定在第一与第二天线350与355之间传递的无线通信信号的传播速度。举例来说,穿过电介质介质的传播速度可表达如下:
其中v表示传播介质340内无线通信信号或射频(RF)信号的传播速度,c表示光在真空中的速度,且εR表示传播介质340的相对介电常数。举例来说,如果特氟隆(εR=2.1)用于传播介质340,则在此介质340中传播的电磁波的速度v将为光在真空中的速度的约69%。
如所属领域的技术人员将了解,如由等式1界定的传播速度v是点对点传播速度,且在多路径信号或不采取从源天线到目的地天线的直线或直接传播路径的信号的情况下不一定传达信号从一个天线行进到另一天线的速度。然而,因为上部与下部吸收层330与335经配置以“吸收”RF信号,且不在传播介质340内反射/反弹信号,所以一般来说,在天线350与355之间的多路径信号可被忽略,使得形成直接传播路径,且如由上文等式1界定的传播速度v可用作在传播介质340内的天线350与355之间的信号传播速度的相对准确指示符。
虽然图3中未明确说明,但天线350和355可分别连接到半导体芯片305和310内的接收器与发射器对,或收发器。与图2相比而言,收发器无需定位于芯片305和310的“顶部上”,而是可定位于其下部部分上或芯片305和310内。
此外,虽然图3中将天线350和355说明为大致突出到为传播介质340界定的空间的一半,但将了解,在其它实施例中,天线350和355可以不同程度(例如,小于一半、大于一半等)突出到传播介质340中。而且,虽然将天线突出部说明为“笔直”进入传播介质340中,但可替代地以任何众所周知的方式配置天线突出部。举例来说,当进入传播介质340中后,天线可“折曲”或弯曲以便(对于给定长度)沿着上部吸收层340的下部部分(即,传播介质340的上部部分)定位。将了解,仅出于实例目的而提供上述天线配置,且任何天线配置方式均意欲包括在本发明实施例的范围内。
图4说明图3的PWB 300的俯视图。如图4所示,PWB 300包括芯片305和310,且可进一步包括芯片312。芯片305、310和312中的每一者包括天线,所述天线处于其至少部分突出到上部与下部吸收层330与335之间的传播介质340中的下部部分上。
芯片305、310和312中的每一芯片可通过经由传播介质340根据给定无线通信协议发射无线通信信号而与任何其它芯片通信。举例来说,给定无线通信协议(或信令)可包括(但不限于)调幅(AM)、调频(FM)、码分多址(CDMA)、超宽带(UWB)、直接序列UWB(DS-UWB)、频分多址(FDMA)、时分多址(TDMA)、正交频分多址(OFDMA)、混合CDMA/OFDMA协议、基于多带OFDM的超宽带(MB-OFDM-UWB)等。为了实施给定无线通信协议,可将芯片305、310和312中的给定芯片标示为PWB 300的“主控装置(master)”或调度器。因此,调度器可确定并散布用于PWB 300内不同芯片(例如,类似于常规无线蜂窝式通信系统内的基站控制器(BSC))的给定轮询调度表或发射调度表。或者,如在CDMA蜂窝式通信系统中,调度器可确定沃尔什(Walsh)码并向每一相应芯片散布沃尔什码,其中每一芯片以其所指派的沃尔什码发射无线信号。
虽然已说明并在上文描述了图3和图4,其中芯片定位成在PWB 300内彼此分开,但在替代实施例中,可在PWB内以“堆叠式”结构布置两个或两个以上芯片。因此,图5说明根据本发明的另一实施例的PWB 500的横截面。
如图5所示,PWB 500包括处于“堆叠式”配置的半导体芯片505、510和515,其中芯片505安装于芯片510上,芯片510安装于芯片515上,且整个堆叠式芯片结构安装于表面层520上。PWB 500进一步包括共同界定传播介质545的电源平面层525、接地平面530、上部吸收层535和下部吸收层540,以及衬底550。半导体芯片505、510和515物理上堆叠,且共享到电源平面层525和接地平面层530的有线连接,如此项技术中已知的。
参看图5,第一天线555相对于PWB 500从半导体芯片505向内延伸并至少部分突出到传播介质545中,第二天线560相对于PWB 500从半导体芯片510向内延伸并至少部分突出到传播介质545中,且第三天线565相对于PWB 500从半导体芯片515向内延伸并突起到传播介质545中。在一实例中,第一、第二和第三天线555、560和565可被至少屏蔽在天线的不处于传播介质545内的部分内,以减少传播介质545外部的干扰(例如,使得无线信号被包含于传播介质545内)。同样,以含有在传播介质545内传播的信号的材料配置上部和下部吸收层535和540。举例来说,可以Ni-Zn铁氧体材料实施上部和下部吸收层535和540。因此,在一实例中,联系上部或下部吸收层535和540的无线通信信号被“吸收”,且不穿过相应层到达外部区域,或反射/反弹离开相应层(例如,其原本可在接收天线处导致多路径问题)。一般来说,传播介质545对应于上文参看图3论述的传播介质340,且为了简明起见将不进一步描述。
此外,虽然在图5中将天线555、560和565说明为大致突出到为传播介质545界定的空间的一半,但将了解,在其它实施例中,天线555、560和565可以不同程度(例如,小于一半、大于一半等)突出到传播介质545中。而且,虽然将天线突出部说明为“笔直”进入传播介质545中,但可替代地以任何众所周知的方式配置天线突出部。举例来说,当进入传播介质545中后,天线可“折曲”或弯曲以便(对于给定长度)沿着上部吸收层535的下部部分定位。将了解,仅出于实例目的而提供上述天线配置,且任何天线配置的方式均意欲包括在本发明实施例的范围内。
图6说明图5的PWB 500的俯视图。如图6所示,PWB 500包括包括芯片505、510和515的芯片堆叠,且进一步包括单一(即,非堆叠的)芯片517。芯片505、510和515中的每一者均在其下部部分上包括天线,所述天线至少部分突出到上部与下部吸收层535与540之间的传播介质545中,如图5中所说明。而且,不必为堆叠式芯片的芯片517包括至少部分突出到传播介质545中的天线。
如将了解,可将芯片505、510、515和517中的任一者标示为用于促进不同芯片之间的无线通信的“主控装置”或调度器。可以与上文参看图3和图4描述的相同方式执行芯片505、510、515与517之间的无线通信,且因而为了简明起见将不进一步描述。
虽然上文将本发明的实施例描述为促进PWB上的芯片之间的无线芯片到芯片通信,但将了解,本发明的其它实施例可针对任何类型的多层结构上(且不必为PWB上)的任何类型的“内部”无线芯片间通信。举例来说,其它实施例可针对芯片之间经由任何封闭传播介质(例如,在PWB或任何其它类型的装置上)的无线通信,且因而实施例不限于形成于PWB的吸收层内的传播介质。
如从对本发明实施例的以上描述中将了解,通过配置芯片以在沟槽或隔离区域(即,传播介质340/545)内无线地通信,可减少与常规芯片/集成电路(IC)的有线连接相关联的引脚或焊球的数目。而且,可增加PWB的输入/输出(I/O)效率。此外,PWB的简化结构可降低制造成本和复杂性(例如,因为无需设计和/或制造芯片之间的有线连接)。
所属领域的技术人员将了解,可使用多种不同技艺和技术中的任一者来表示信息和信号。举例来说,可通过电压、电流、电磁波、磁场或磁性粒子、光场或光学粒子或其任何组合来表示可在整个以上描述中参考的数据、指令、命令、信息、信号、位、符号和码片。
另外,所属领域的技术人员将了解,结合本文中所揭示的实施例而描述的各种说明性逻辑块、模块、电路和算法步骤可实施为电子硬件、计算机软件或两者的组合。为了清楚地说明硬件与软件的此可互换性,上文已大体上就其功能性而描述了各种说明性组件、块、模块、电路和步骤。此类功能性是实施为硬件还是软件视特定应用和强加于整个系统的设计约束而定。所属领域的技术人员可针对每一特定应用以不同方式实施所描述的功能性,但此些实施决策不应被解释为会导致偏离本发明的范围。
结合本文中所揭示的实施例而描述的方法、序列和/或算法可直接实施于硬件、由处理器执行的软件模块或两者的组合中。软件模块可常驻在RAM存储器、快闪存储器、ROM存储器、EPROM存储器、EEPROM存储器、寄存器、硬盘、可装卸磁盘、CD-ROM或此项技术中已知的任何其它形式的存储媒体中。示范性存储媒体耦合到处理器,使得处理器可从存储媒体读取信息且将信息写入到存储媒体。在替代方案中,存储媒体可整合到处理器。
因此,本发明的实施例可包括一种包含代码的计算机可读媒体,所述代码致使处理器执行以下方法:根据给定无线通信协议在耦合到第一芯片的第一天线处从耦合到第二芯片的第二天线接收无线通信信号,所述第一和第二芯片形成于多层结构上,经由由所述多层结构的第一和第二吸收层形成的具有给定介电常数的传播介质内的直接传播路径发射所述无线通信信号。因此,本发明不限于所说明的实例,且用于执行本文中所描述的功能性的任何装置包括于本发明的实施例中。
虽然上述揭示内容展示本发明的说明性实施例,但应注意,在不偏离由所附权利要求书界定的本发明的范围的情况下,可在本文中进行各种改变和修改。无需以任何特定次序执行根据本文中所描述的本发明的实施例的方法项的功能、步骤和/或动作。此外,虽然可以单数形式描述或主张本发明的元件,但除非明确陈述限于单数形式,否则还预期复数形式。
Claims (25)
1.一种无线芯片到芯片通信装置,其包含:
多个芯片,所述多个芯片中的每一者具有至少一个天线且形成于多层结构上;以及
第一和第二吸收层,其包括于所述多层结构内,所述第一和第二吸收层形成具有给定介电常数的传播介质,其中所述多个芯片经配置以根据给定无线通信协议通过所述传播介质内的直接传播路径而经由相应所述天线彼此无线地通信。
2.根据权利要求1所述的通信装置,其中所述多层结构是印制线路板(PWB)。
3.根据权利要求1所述的通信装置,其中所述多个芯片中的给定芯片对所述多个芯片之间的通信进行调度。
4.根据权利要求1所述的通信装置,其中所述传播介质包括空气。
5.根据权利要求1所述的通信装置,其中所述传播介质对应于所述第一与第二吸收层之间的区域。
6.根据权利要求1所述的通信装置,其中每一芯片的所述至少一个天线至少部分突出到所述传播介质中。
7.根据权利要求6所述的通信装置,其中每一芯片的所述至少一个天线在所述至少一个天线的除所述突出部分之外的部分中被屏蔽。
8.根据权利要求1所述的通信装置,其中所述多个芯片中的两者或两者以上以堆叠式配置布置。
9.根据权利要求1所述的通信装置,其中所述第一和第二吸收层由Ni-Zn铁氧体材料形成。
10.根据权利要求1所述的通信装置,其中所述给定无线通信协议对应于调幅(AM)、调频(FM)、码分多址(CDMA)、超宽带(UWB)、直接序列UWB(DS-UWB)、频分多址(FDMA)、时分多址(TDMA)、正交频分多址(OFDMA)、混合CDMA/OFDMA协议或基于多带OFDM的超宽带(MB-OFDM-UWB)中的一者。
11.根据权利要求1所述的通信装置,其中所述多层结构包括表面层、电源平面层、接地平面层、所述第一和第二吸收层,以及衬底。
12.根据权利要求11所述的通信装置,其中所述多个芯片中的至少一者安装于所述表面层上,包括到所述电源平面层的有线连接,且包括到所述接地平面层的有线连接。
13.一种无线芯片到芯片通信的方法,其包含:
根据给定无线通信协议在耦合到第一芯片的第一天线处从耦合到第二芯片的第二天线接收无线通信信号,所述第一和第二芯片形成于多层结构上,且经由由所述多层结构的第一和第二吸收层形成的具有给定介电常数的传播介质内的直接传播路径发射所述无线通信信号。
14.根据权利要求13所述的方法,其中所述多层结构是印制线路板(PWB)。
15.根据权利要求13所述的方法,其中所述传播介质包括空气。
16.根据权利要求13所述的方法,其中每一芯片的所述第一和第二天线至少部分突出到所述传播介质中。
17.根据权利要求13所述的方法,其中堆叠所述第一和第二芯片。
18.根据权利要求13所述的方法,其中所述给定无线通信协议对应于调幅(AM)、调频(FM)、码分多址(CDMA)、超宽带(UWB)、直接序列UWB(DS-UWB)、频分多址(FDMA)、时分多址(TDMA)、正交频分多址(OFDMA)、混合CDMA/OFDMA协议或基于多带OFDM的超宽带(MB-OFDM-UWB)中的一者。
19.一种无线芯片到芯片通信的方法,其包含:
根据给定无线通信协议将无线通信信号从耦合到第二芯片的第二天线发射到耦合到第一芯片的第一天线,所述第一和第二芯片形成于多层结构上,经由由所述多层结构的第一和第二吸收层形成的具有给定介电常数的传播介质内的直接传播路径发射所述无线通信信号。
20.根据权利要求19所述的方法,其中所述多层结构是印制线路板(PWB)。
21.根据权利要求19所述的方法,其中所述传播介质包括空气。
22.根据权利要求19所述的方法,其中每一芯片的所述第一和第二天线至少部分突出到所述传播介质中。
23.根据权利要求19所述的方法,其中堆叠所述第一和第二芯片。
24.根据权利要求19所述的方法,其中所述无线通信协议对应于调幅(AM)、调频(FM)、码分多址(CDMA)、超宽带(UWB)、直接序列UWB(DS-UWB)、频分多址(FDMA)、时分多址(TDMA)、正交频分多址(OFDMA)、混合CDMA/OFDMA协议或基于多带OFDM的超宽带(MB-OFDM-UWB)中的一者。
25.一种经配置以用于无线芯片到芯片通信的设备,其包含:
用于在多层结构内无线地发射电磁信号的装置;
用于在所述多层结构内无线地接收所述电磁信号的装置;
用于吸收在所述多层结构内传播的所述电磁信号的装置;以及
用于传播所述电磁信号的装置,其具有给定介电常数且被所述用于吸收的装置封闭,且其中所述用于无线地发射的装置与所述用于无线地接收的装置根据给定无线通信协议通过所述用于传播的装置内的直接传播路径而彼此通信。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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US11/970,549 US7873122B2 (en) | 2008-01-08 | 2008-01-08 | Methods and devices for wireless chip-to-chip communications |
US11/970,549 | 2008-01-08 | ||
PCT/US2009/030445 WO2009089354A2 (en) | 2008-01-08 | 2009-01-08 | Methods and devices for wireless chip-to-chip communications |
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CN101919052A CN101919052A (zh) | 2010-12-15 |
CN101919052B true CN101919052B (zh) | 2012-05-23 |
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Country Status (7)
Country | Link |
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US (1) | US7873122B2 (zh) |
EP (1) | EP2238619A2 (zh) |
JP (1) | JP5032673B2 (zh) |
KR (1) | KR101164355B1 (zh) |
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US7873122B2 (en) | 2011-01-18 |
KR20100097233A (ko) | 2010-09-02 |
JP2011514022A (ja) | 2011-04-28 |
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US20090175323A1 (en) | 2009-07-09 |
WO2009089354A2 (en) | 2009-07-16 |
KR101164355B1 (ko) | 2012-07-09 |
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