CN101911320B - 具有光引导装置的光电器件以及形成该装置的方法 - Google Patents
具有光引导装置的光电器件以及形成该装置的方法 Download PDFInfo
- Publication number
- CN101911320B CN101911320B CN2008801235261A CN200880123526A CN101911320B CN 101911320 B CN101911320 B CN 101911320B CN 2008801235261 A CN2008801235261 A CN 2008801235261A CN 200880123526 A CN200880123526 A CN 200880123526A CN 101911320 B CN101911320 B CN 101911320B
- Authority
- CN
- China
- Prior art keywords
- light
- edge
- light reflecting
- material layer
- reflecting material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
- H10F71/1215—The active layers comprising only Group IV materials comprising at least two Group IV elements, e.g. SiGe
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/40—Optical elements or arrangements
- H10F77/407—Optical elements or arrangements indirectly associated with the devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
- H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/12—Active materials
- H10F77/122—Active materials comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/826—Materials of the light-emitting regions comprising only Group IV materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Devices (AREA)
- Light Receiving Elements (AREA)
- Optical Couplings Of Light Guides (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ZA200709436 | 2007-11-01 | ||
| ZA2007/09436 | 2007-11-01 | ||
| PCT/IB2008/054534 WO2009057075A2 (en) | 2007-11-01 | 2008-10-31 | Optoelectronic device with light directing arrangement and method of forming the arrangement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101911320A CN101911320A (zh) | 2010-12-08 |
| CN101911320B true CN101911320B (zh) | 2012-11-21 |
Family
ID=40591580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801235261A Expired - Fee Related CN101911320B (zh) | 2007-11-01 | 2008-10-31 | 具有光引导装置的光电器件以及形成该装置的方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8729582B2 (enExample) |
| EP (1) | EP2218113B1 (enExample) |
| JP (1) | JP5550558B2 (enExample) |
| CN (1) | CN101911320B (enExample) |
| TW (1) | TWI467789B (enExample) |
| WO (1) | WO2009057075A2 (enExample) |
| ZA (1) | ZA201002944B (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2245676A1 (en) * | 2008-01-21 | 2010-11-03 | Insiava (Pty) Limited | Semiconductor light emitting device utilising punch-through effects |
| WO2009095886A2 (en) * | 2008-02-01 | 2009-08-06 | Insiava (Pty) Limited | Semiconductor light emitting device comprising heterojunction |
| US8237832B2 (en) * | 2008-05-30 | 2012-08-07 | Omnivision Technologies, Inc. | Image sensor with focusing interconnections |
| CN102292834A (zh) | 2008-12-15 | 2011-12-21 | 因西亚瓦(控股)有限公司 | 利用穿通效应的硅发光器件 |
| JP6008742B2 (ja) | 2010-01-22 | 2016-10-19 | インシアヴァ (ピーテーワイ) リミテッド | シリコン発光デバイス及び該デバイスを製造する方法 |
| US9515227B2 (en) | 2011-09-16 | 2016-12-06 | Insiava (Pty) Limited | Near infrared light source in bulk silicon |
| DE102012107794B4 (de) | 2012-08-23 | 2023-10-19 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronische Vorrichtung |
| EP3045896B1 (en) | 2015-01-16 | 2023-06-07 | Personal Genomics, Inc. | Optical sensor with light-guiding feature |
| KR102385941B1 (ko) * | 2015-06-15 | 2022-04-13 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자 패키지 |
| KR20210023459A (ko) * | 2019-08-23 | 2021-03-04 | 에스케이하이닉스 주식회사 | 이미지 센싱 장치 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1534638A (zh) * | 2003-01-10 | 2004-10-06 | ���µ�����ҵ��ʽ���� | 半导体激光器装置及其制造方法 |
| CN1812133A (zh) * | 2004-12-24 | 2006-08-02 | 夏普株式会社 | 遥控感光单元和使用它的电子设备 |
| CN101399305A (zh) * | 2007-09-29 | 2009-04-01 | 先进开发光电股份有限公司 | 光电元件的封装结构和其制造方法 |
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| US5994720A (en) * | 1996-03-04 | 1999-11-30 | University Of Pretoria | Indirect bandgap semiconductor optoelectronic device |
| US6111271A (en) * | 1996-03-28 | 2000-08-29 | University Of Pretoria | Optoelectronic device with separately controllable carrier injection means |
| JPH10335618A (ja) | 1997-05-20 | 1998-12-18 | Hewlett Packard Co <Hp> | 光センサ・アレイ |
| JPH11345999A (ja) * | 1998-06-01 | 1999-12-14 | Matsushita Electron Corp | 光電変換装置 |
| US6545289B1 (en) * | 1998-11-20 | 2003-04-08 | California Institute Of Technology | Wavelength-insensitive radiation coupling for multi-quantum well sensor based on intersubband absorption |
| JP3827909B2 (ja) * | 2000-03-21 | 2006-09-27 | シャープ株式会社 | 固体撮像装置およびその製造方法 |
| JP2002043632A (ja) * | 2000-07-21 | 2002-02-08 | Citizen Electronics Co Ltd | 発光ダイオード |
| JP4652634B2 (ja) * | 2001-08-31 | 2011-03-16 | キヤノン株式会社 | 撮像装置 |
| TWI236767B (en) * | 2002-12-13 | 2005-07-21 | Sony Corp | Solid-state image pickup device and its manufacturing method |
| JP4120543B2 (ja) | 2002-12-25 | 2008-07-16 | ソニー株式会社 | 固体撮像素子およびその製造方法 |
| US6861686B2 (en) * | 2003-01-16 | 2005-03-01 | Samsung Electronics Co., Ltd. | Structure of a CMOS image sensor and method for fabricating the same |
| US6953925B2 (en) | 2003-04-28 | 2005-10-11 | Stmicroelectronics, Inc. | Microlens integration |
| JP4548702B2 (ja) * | 2003-10-02 | 2010-09-22 | キヤノン株式会社 | 撮像装置および撮像システム |
| JP4572312B2 (ja) * | 2004-02-23 | 2010-11-04 | スタンレー電気株式会社 | Led及びその製造方法 |
| US7119319B2 (en) * | 2004-04-08 | 2006-10-10 | Canon Kabushiki Kaisha | Solid-state image sensing element and its design support method, and image sensing device |
| JP4910079B2 (ja) * | 2004-05-07 | 2012-04-04 | 光照 木村 | テラヘルツ波発生ダイオードおよびこれを用いたテラヘルツ波放射装置 |
| KR100689885B1 (ko) * | 2004-05-17 | 2007-03-09 | 삼성전자주식회사 | 광감도 및 주변광량비 개선을 위한 cmos 이미지 센서및 그 제조방법 |
| US20050274871A1 (en) * | 2004-06-10 | 2005-12-15 | Jin Li | Method and apparatus for collecting photons in a solid state imaging sensor |
| JP2006005091A (ja) * | 2004-06-16 | 2006-01-05 | Ngk Spark Plug Co Ltd | 発光素子用パッケージ |
| US7193289B2 (en) * | 2004-11-30 | 2007-03-20 | International Business Machines Corporation | Damascene copper wiring image sensor |
| US7683407B2 (en) * | 2005-08-01 | 2010-03-23 | Aptina Imaging Corporation | Structure and method for building a light tunnel for use with imaging devices |
| JP2007173590A (ja) * | 2005-12-22 | 2007-07-05 | Toshiba Corp | 半導体発光材料およびそれを用いた発光素子 |
| US7358583B2 (en) * | 2006-02-24 | 2008-04-15 | Tower Semiconductor Ltd. | Via wave guide with curved light concentrator for image sensing devices |
| JP2008091643A (ja) * | 2006-10-02 | 2008-04-17 | Matsushita Electric Ind Co Ltd | 固体撮像装置 |
| JP5420550B2 (ja) * | 2007-10-08 | 2014-02-19 | インシアヴァ (ピーテーワイ) リミテッド | キャリア注入を用いるシリコン発光素子 |
| EP2245676A1 (en) * | 2008-01-21 | 2010-11-03 | Insiava (Pty) Limited | Semiconductor light emitting device utilising punch-through effects |
| WO2009095886A2 (en) * | 2008-02-01 | 2009-08-06 | Insiava (Pty) Limited | Semiconductor light emitting device comprising heterojunction |
| CN102292834A (zh) * | 2008-12-15 | 2011-12-21 | 因西亚瓦(控股)有限公司 | 利用穿通效应的硅发光器件 |
| WO2010086798A1 (en) * | 2009-01-27 | 2010-08-05 | Insiava (Pty) Limited | Microchip-based moems and waveguide device |
| JP6008742B2 (ja) * | 2010-01-22 | 2016-10-19 | インシアヴァ (ピーテーワイ) リミテッド | シリコン発光デバイス及び該デバイスを製造する方法 |
-
2008
- 2008-10-31 US US12/740,597 patent/US8729582B2/en active Active
- 2008-10-31 JP JP2010531626A patent/JP5550558B2/ja not_active Expired - Fee Related
- 2008-10-31 WO PCT/IB2008/054534 patent/WO2009057075A2/en not_active Ceased
- 2008-10-31 EP EP08846163.7A patent/EP2218113B1/en not_active Not-in-force
- 2008-10-31 CN CN2008801235261A patent/CN101911320B/zh not_active Expired - Fee Related
- 2008-10-31 TW TW97142312A patent/TWI467789B/zh not_active IP Right Cessation
-
2010
- 2010-04-28 ZA ZA2010/02944A patent/ZA201002944B/en unknown
-
2014
- 2014-05-15 US US14/278,181 patent/US8969112B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1534638A (zh) * | 2003-01-10 | 2004-10-06 | ���µ�����ҵ��ʽ���� | 半导体激光器装置及其制造方法 |
| CN1812133A (zh) * | 2004-12-24 | 2006-08-02 | 夏普株式会社 | 遥控感光单元和使用它的电子设备 |
| CN101399305A (zh) * | 2007-09-29 | 2009-04-01 | 先进开发光电股份有限公司 | 光电元件的封装结构和其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US8729582B2 (en) | 2014-05-20 |
| US8969112B2 (en) | 2015-03-03 |
| EP2218113A2 (en) | 2010-08-18 |
| ZA201002944B (en) | 2010-12-29 |
| JP2011503842A (ja) | 2011-01-27 |
| WO2009057075A2 (en) | 2009-05-07 |
| JP5550558B2 (ja) | 2014-07-16 |
| EP2218113B1 (en) | 2016-04-27 |
| TWI467789B (zh) | 2015-01-01 |
| TW200943569A (en) | 2009-10-16 |
| US20110042701A1 (en) | 2011-02-24 |
| CN101911320A (zh) | 2010-12-08 |
| WO2009057075A3 (en) | 2010-03-18 |
| US20140248728A1 (en) | 2014-09-04 |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121121 |