CN101896038B

CN101896038B - Circuit board structure and manufacture method thereof

Info

Publication number: CN101896038B
Application number: CN2009101389586A
Authority: CN
Inventors: 李孟翰; 尚希贤
Original assignee: NANYA CIRCUIT BOARD CO Ltd
Current assignee: NANYA CIRCUIT BOARD CO Ltd; Nan Ya Printed Circuit Board Corp
Priority date: 2009-05-21
Filing date: 2009-05-21
Publication date: 2012-08-08
Anticipated expiration: 2029-05-21
Also published as: CN101896038A

Abstract

The invention relates to a circuit board structure and a manufacture method thereof. The method comprises the following steps of: providing a board provided with a main body and a first conducting layer formed on a surface of the main body; forming a first patterned circuit layer on the first conducting layer; covering an insulating layer on the first conducting layer and embedding the first patterned circuit layer in the insulating layer; placing a second conducting layer on the insulating layer; pressing the board, the first conducting layer, the first patterned circuit layer, the insulating layer and the second conducting layer; separating the main body from the first conducting layer; removing the first conducting layer from the first patterned circuit layer and the insulating layer; forming a patterned conducting layer on the second conducting layer; and removing the second conducting layer between circuit patterns of the patterned conducing layer to ensure that a second patterned circuit layer is formed by the patterned conducting layer and the second conducting layer. The invention can prevent the phenomenon of ionic migration and can also ensure that a solder pad in the second patterned circuit layer is accurately formed on a through hole.

Description

Board structure of circuit and manufacturing approach thereof

Technical field

The present invention relates to a kind of manufacturing approach of board structure of circuit, and the circuit board that manufactures of the method has a built-in type circuit layer and and adds the formula circuit layer.

Background technology

Referring to Fig. 1; Known circuit board 1 manufacturing approach be the single face of an insulating barrier 11 or two-sided on wiring, a patterned circuit layer 12 is plated on the insulating barrier 11, after electroplate accomplishing; On insulating barrier 11 surfaces, be coated with the green lacquer 13 of one deck respectively, with protection patterned circuit layer 12.

Yet; Directly the way of wiring can make patterned circuit layer 12 protrude in insulating barrier 11 on insulating barrier 11, on circuit board 1, is easy to generate the phenomenon of ion transfer between close electrode; Cause insulation degradation; In order to prevent that above-mentioned situation from taking place, the setting of both positive and negative polarity can't be adjacent too near, and therefore the wiring density of patterned circuit layer 12 also is affected.

Summary of the invention

In order to solve the problems referred to above that prior art exists, the present invention provides a kind of manufacturing approach of board structure of circuit, and the method comprises: a plate is provided, and plate has a main body and one first conductive layer, and first conductive layer is formed at a surface of main body; On first conductive layer, form a patterning first circuit layer; Cover an insulating barrier on first conductive layer, with being embedded in the insulating barrier in patterning first circuit layer; Provide one second conductive layer on insulating barrier; With plate, first conductive layer, patterning first circuit layer, insulating barrier and the second conductive layer pressing; With the main body and first conductive layers apart; And with first conductive layer by removing on patterning first circuit layer and the insulating barrier, patterning first circuit layer and insulating barrier are exposed.

The present invention provides a kind of board structure of circuit, comprises an insulating barrier, a patterning first circuit layer and a patterning second circuit layer.Insulating barrier has a first surface and a second surface, is embedded in the insulating barrier in patterning first circuit layer, and flushes with first surface, and patterning second circuit layer is arranged on the second surface.

Manufacturing approach through board structure of circuit of the present invention; Can in circuit board, form to be embedded in the insulating barrier and outside the patterning second circuit layer in a patterning first circuit layer and be added on the insulating barrier; Can prevent the phenomenon generation of ion migration except patterning first circuit layer of built-in type; Behind patterning first circuit layer that forms built-in type, just patterning second circuit layer is added on outward on the insulating barrier, the weld pad in the patterning second circuit layer is formed on the via hole accurately.

For make above-mentioned and other purposes of the present invention, feature and advantage can be more obviously understandable, hereinafter is special lifts a concrete preferred embodiment, and conjunction with figs. elaborates.

Description of drawings

Fig. 1 is the sketch map of known circuits plate;

Fig. 2 A-Fig. 2 E is the sketch map of the manufacture process of demonstration board structure of circuit of the present invention;

Fig. 3 A-Fig. 3 D is the sketch map of an execution mode of the manufacture process of demonstration board structure of circuit of the present invention;

Fig. 4 A-Fig. 4 F is the sketch map of another execution mode of the manufacture process of demonstration board structure of circuit of the present invention; And

Fig. 5 A, Fig. 5 B are the flow chart that shows the manufacture process of board structure of circuit of the present invention.

Description of reference numerals in the above-mentioned accompanying drawing is following:

1～circuit board; 10,10 '～board structure of circuit;

11～insulating barrier; 12～patterned circuit layer;

13～green lacquer; 100～main body;

101～the first conductive layers; 102～the second conductive layers;

103,103 '～patterned conductive layer;

111,111 '～patterning first circuit layer;

112,112 '～patterning second circuit layer;

130～insulating barrier; 150,150 '～green lacquer;

M～electric conducting material; P～plate;

S1～first surface; S2～second surface;

V, V '～via hole.

Embodiment

Please cooperate referring to Fig. 2 A-Fig. 2 E and Fig. 5 A; The manufacturing approach of board structure of circuit of the present invention comprises: A1～provide a plate P; Plate P has a main body 100 and two-layer first conductive layer 101; Main body 100 is that insulating material is made, and first conductive layer 101 is formed at respectively on the opposed surface of main body 100 (shown in Fig. 2 A).

Then, A2～on two first conductive layers 101, form a patterning first circuit layer 111 (shown in Fig. 2 B) respectively, wherein patterning first circuit layer 111 utilizes the mode of electroplating to be formed on first conductive layer 101.

After step in; A3～cover an insulating barrier 130 respectively on two first conductive layers 101; With being embedded in the insulating barrier 130 in patterning first circuit layer 111, and, A4～provide two second conductive layers 102 respectively on two insulating barriers 130; Then, A5～with plate P, patterning first circuit layer 111, insulating barrier 130 and second conductive layer, 102 pressings (shown in Fig. 2 C).

After above-mentioned layer is by pressing; A6～respectively main body 100 is separated (shown in Fig. 2 D) with two first conductive layers 101; It should be noted; In the step of A6, main body 100 with can produce two sheet materials after two first conductive layers 101 separate, but all only utilize one of them sheet material to do follow-up narration in Fig. 2 D and the accompanying drawing afterwards thereof.

At last; A7～utilize etched mode by removing on patterning first circuit layer 111 and the insulating barrier 130 first conductive layer 101 on the sheet material; Make patterning first circuit layer 111 and insulating barrier 130 expose (shown in Fig. 2 E), the wherein one side (part surface) of the circuit board that so the manufactures road of sunkening cord in having had.

In circuit board, sunken cord after the formation of road, following different execution modes capable of using continue the processing and manufacturing circuit boards circuit of one side (solder side) in addition.

In one embodiment, cooperate referring to Fig. 3 A-Fig. 3 D and Fig. 5 B, B1～in second conductive layer 102 and insulating barrier 130, form a via hole V through machine drilling or laser drill, and via hole V exposes patterning first circuit layer 111 (shown in Fig. 3 A).

Then; B2～formation one patterned conductive layer 103 on second conductive layer 102; And patterned conductive layer 103 is filled in (shown in Fig. 3 B) among the via hole V; The patterned conductive layer 103 that is filled among the via hole V can be formed directly in a weld pad W, wherein utilizes the mode of electroplating to be formed on second conductive layer 102 at patterned conductive layer 103.

At last, B3～utilize etching technique that second conductive layer 102 between one circuit pattern of patterned conductive layer 103 is removed (shown in Fig. 3 C) makes the patterned conductive layer 103 and second conductive layer 102 form a patterning second circuit layer 112; And B4～coating one green lacquer 150 (shown in Fig. 3 D) on patterning first circuit layer 111 and patterning second circuit layer 112 is in order to the protection patterned circuit layer.

In another embodiment; Referring to Fig. 4 A-Fig. 4 F and Fig. 5 B; The sheet material that is produced after Fig. 4 A step display A7; Wherein patterning first circuit layer 111 ' the pattern of pattern and patterning first circuit layer 111 among the last embodiment slightly different, on this sheet material, the mode of C1～plating capable of using forms a patterned conductive layer 103 ' (shown in Fig. 4 B) on second conductive layer 102.

Then, the mode of C2～through laser drill forms a via hole V ' in insulating barrier 130, and via hole V ' exposes second conductive layer 102 (shown in Fig. 4 C).And C3～filling one electric conducting material M is in (shown in Fig. 4 D) among the via hole V ', and wherein electric conducting material M is a copper.

At last; C4～with patterned conductive layer 103 ' a circuit pattern between second conductive layer 102 remove (shown in Fig. 4 E); Make patterned conductive layer 103 ' and second conductive layer 102 form a patterning second circuit layer 112 ', the pairing patterning second circuit of via hole V ' layer 112 ' the be weld pad W ' in this layer wherein; And, C5～in patterning first circuit layer 111 ' and patterning second circuit layer 112 ' on be coated with a green lacquer 150 ' (shown in Fig. 4 F), in order to the protection patterned circuit layer.

Referring to Fig. 3 D and Fig. 4 F, through above manufacturing approach can produce a kind of board structure of circuit 10,10 ', comprise an insulating barrier 130, a patterning first circuit layer 111,111 ' and patterning second circuit layer 112,112 '.Insulating barrier 130 has a first surface S1 and a second surface S2; Patterning first circuit layer 111,111 ' in be embedded in the insulating barrier 130; And flush with first surface S1, patterning second circuit layer 112,112 ' then is arranged on the second surface S2, and protrudes in second surface S2.In addition, a via hole V, V ' are formed in the insulating barrier 130, and via hole V, V ' be filled with electric conducting material, can electrically connect patterning first circuit layer 111,111 ' and patterning second circuit layer 112,112 '.And patterning first circuit layer 111,111 ' and patterning second circuit layer 112,112 ' on also be coated with a green lacquer 150.

Though the present invention discloses as above with preferred embodiment; Right its is not in order to limit the present invention; Any those of ordinary skill in the art; Do not breaking away from the spirit and scope of the present invention, still can do a little change and retouching, so protection scope of the present invention is as the criterion when looking appended the scope that claim defined.

Claims

1. the manufacturing approach of a board structure of circuit comprises:

One plate is provided, and this plate has a main body and one first conductive layer, and this first conductive layer is formed at a surface of this main body;

On this first conductive layer, form a patterning first circuit layer;

Cover an insulating barrier on this first conductive layer, with being embedded in this insulating barrier in this patterning first circuit layer;

Provide one second conductive layer on this insulating barrier;

With this main body, this first conductive layer, this patterning first circuit layer, this insulating barrier and this second conductive layer pressing;

With this main body and this first conductive layers apart;

By removing on this patterning first circuit layer and this insulating barrier, this patterning first circuit layer and this insulating barrier are exposed this first conductive layer;

On this second conductive layer, form a patterned conductive layer;

In this insulating barrier, form a via hole, this via hole exposes this second conductive layer under this patterned conductive layer; And

Fill an electric conducting material in this via hole.

2. the manufacturing approach of board structure of circuit as claimed in claim 1, wherein this patterning first circuit layer is to utilize the mode of electroplating to be formed on this first conductive layer.

3. the manufacturing approach of board structure of circuit as claimed in claim 1, the method for wherein removing this first conductive layer is to utilize etching technique.

4. the manufacturing approach of board structure of circuit as claimed in claim 1; Wherein this plate has two these first conductive layers; Be formed at the both sides of this main body respectively, and this patterning first circuit layer, this insulating barrier, this second conductive layer are all two, and are formed at the both sides of this plate respectively.

5. the manufacturing approach of board structure of circuit as claimed in claim 1, wherein this patterned conductive layer is to utilize the mode of electroplating to be formed on this second conductive layer.

6. the manufacturing approach of board structure of circuit as claimed in claim 1, wherein this via hole is to form through laser drill.

7. the manufacturing approach of board structure of circuit as claimed in claim 1, wherein this electric conducting material is a copper.

8. the manufacturing approach of board structure of circuit as claimed in claim 1 also comprises:

This second conductive layer between one circuit pattern of this patterned conductive layer is removed, made this patterned conductive layer and this second conductive layer form a patterning second circuit layer; And

Coating one green lacquer on this patterning first circuit layer and this patterning second circuit layer.

9. the manufacturing approach of board structure of circuit as claimed in claim 8, the method for wherein removing this second conductive layer is to utilize etching technique.

10. board structure of circuit comprises:

One insulating barrier has a first surface and a second surface;

One patterning, first circuit layer, in be embedded in this insulating barrier, and flush with this first surface;

One patterning second circuit layer; Be arranged on this second surface; This patterning second circuit layer has the conductive layer and that is arranged on this second surface and is arranged at the patterned conductive layer on this conductive layer; Wherein a via hole is formed in this insulating barrier, and is communicated with this patterning first circuit layer and this patterning second circuit layer, and this patterned conductive layer is to this via hole in should insulating barrier; And

One electric conducting material is filled in this via hole, electrically connects this patterning first circuit layer and this patterning second circuit layer.

11. board structure of circuit as claimed in claim 10 also comprises a green lacquer, coats on this patterning first circuit layer.

12. board structure of circuit as claimed in claim 10 also comprises a green lacquer, coats on this patterning second circuit layer.