CN101894784B - Wafer rotating plate device for special equipment of semiconductor - Google Patents
Wafer rotating plate device for special equipment of semiconductor Download PDFInfo
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- CN101894784B CN101894784B CN2010101959402A CN201010195940A CN101894784B CN 101894784 B CN101894784 B CN 101894784B CN 2010101959402 A CN2010101959402 A CN 2010101959402A CN 201010195940 A CN201010195940 A CN 201010195940A CN 101894784 B CN101894784 B CN 101894784B
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- rotating shaft
- bearing
- ring
- vacuum
- inner ring
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Abstract
The invention provides a wafer rotating plate device for special equipment of a semiconductor, relating to the technical field of a wafer rotating device for the especial equipment of the semiconductor. The wafer rotating plate device for the especial equipment of the semiconductor comprises a vacuum sucking disk, a rotating shaft, a motor and a mechanical transmission mechanism; the vacuum sucking disk is fixed on the upper end face of the rotating shaft; the rotating shaft is supported with a fixed end and a free end and arranged in a bearing sleeve by two angular contact ball bearings and a deep groove ball bearing; the lower part of the rotating shaft is connected with the motor and the mechanical transmission device; and the bearing sleeve and a base body are fixed together. The invention effectively solves the problems in the prior art. Compared with the prior art, the invention has the advantages of compact structure, stable operation, high processing quality, good leak tightness, convenient use and long service life.
Description
Technical field
The present invention relates to semiconductor manufacturing equipment with wafer whirligig technical field.
Background technology
Semiconductor manufacturing equipment need be fixing to process with wafer vacuum absorption in the process of carrying out wafer process.There are some problems in common whirligig, and is low etc. like galloping, poor sealing, rigidity.
Summary of the invention
The purpose of invention provides a kind of wafer rotating plate device for special equipment of semiconductor, compared with prior art, has compact conformation, running steadily, high, the good airproof performance of crudy, easy to use, advantage such as the life-span is long.
The present invention is achieved in that a kind of wafer rotating plate device for special equipment of semiconductor; Comprise vacuum cup, rotating shaft, motor and mechanical driving device; It is characterized in that vacuum cup is fixed on the rotating shaft upper surface, the support of moving about of the fixing end of an end is adopted in rotating shaft, is installed in bearing holder (housing, cover) through two angular contact ball bearings and a deep groove ball bearing; The rotating shaft below is connected with motor and mechanical driving device, and bearing holder (housing, cover) and pedestal fix.
Described rotating shaft is a multidiameter; Two angular contact ball bearing two ends Internal and external cycles are all fixing; The upper end inner ring is stuck on the shaft shoulder of rotating shaft, and the outer ring, upper end is pressed on the lower surface of bearing cap, and the lower end inner ring contacts with the spacer upper surface; The outer ring, lower end is pressed on the interior hole end surface of bearing holder (housing, cover), and bearing cap passes through screw on the upper surface of bearing holder (housing, cover); A deep groove ball bearing two ends inner ring is fixed, and the upper end inner ring contacts with the spacer lower surface, and the lower end inner ring is by last locknut and the screw thread double locking of following locknut through the rotating shaft lower end, and end cap is fixed on the bearing holder (housing, cover) lower surface; The vacuum locknut is pressed in the groove of vacuum cup, connects with vacuum tube in the rotating shaft through screw thread, and the below of vacuum tube is connected to the swivel joint that links to each other with vacuum plant.
Between described two angular contact ball bearings internal space ring and external space ring is installed, the inner ring spacer ring is installed between deep groove ball bearing and the locknut.
Described upper sealing ring is fixed on the lower surface of vacuum cup, intersects each other with lower sealing ring.
Between described above-mentioned vacuum cup and the bearing cap, be equipped with the radial labyrinth sealing between end cap and the last locknut.
Good effect of the present invention is: can effectively solve the problem that exists in the prior art, compared with prior art, have compact conformation, running steadily, high, the good airproof performance of crudy, easy to use, advantage such as the life-span is long.
Description of drawings
Fig. 1 is the structural representation of the present invention's one preferred embodiment.
Among the figure: locknut under 1-vacuum cup, 2-vacuum locknut, 3-bearing cap, 4-upper sealing ring, 5-lower sealing ring, 6-rotating shaft, 7-angular contact ball bearing, 8-vacuum tube, 9-spacer, 10-bearing holder (housing, cover), 11-deep groove ball bearing, 12-end cap, the last locknut of 13-, the 14-.
Embodiment
Further specify below in conjunction with preferred embodiment and accompanying drawing thereof with to the present invention, but not as to qualification of the present invention.
See Fig. 1; This wafer rotating plate device for special equipment of semiconductor comprises vacuum cup 1, rotating shaft 6, motor and mechanical driving device, and vacuum cup 1 is fixed on rotating shaft 6 upper surfaces; The support of moving about of the fixing end of an end is adopted in rotating shaft 6; Be installed in bearing holder (housing, cover) 10 through two angular contact ball bearings 7 and a deep groove ball bearing 11, rotating shaft 6 belows are connected with motor and mechanical driving device, and bearing holder (housing, cover) 10 fixes with pedestal; Vacuum locknut 2 is pressed in the groove of vacuum cup 1, connects with vacuum tube 8 in the rotating shaft 6 through screw thread, and the below of vacuum tube 8 is connected to the swivel joint that links to each other with vacuum plant.Rotating shaft 6 is a multidiameter; Two angular contact ball bearing 7 two ends Internal and external cycles are all fixing; The upper end inner ring is stuck on the shaft shoulder of rotating shaft 6, and the outer ring, upper end is pressed on the lower surface of bearing cap 3, and the lower end inner ring contacts with spacer 9 upper surfaces; The outer ring, lower end is pressed on the interior hole end surface of bearing holder (housing, cover) 10, and bearing cap 3 passes through screw on the upper surface of bearing holder (housing, cover) 10; Deep groove ball bearing 11 a two ends inner ring is fixed, and the upper end inner ring contacts with spacer 9 lower surfaces, and the lower end inner ring is by last locknut 13 and the screw thread double locking of following locknut 14 through the rotating shaft lower end, and end cap 12 is fixed on bearing holder (housing, cover) 10 lower surfaces.Between two angular contact ball bearings 7 internal space ring and external space ring is installed, between deep groove ball bearing 11 and the locknut 13 the inner ring spacer ring is installed.Upper sealing ring 4 is fixed on the lower surface of vacuum cup 1, intersects each other with lower sealing ring 5.Between above-mentioned vacuum cup 1 and the bearing cap 3, be equipped with the radial labyrinth sealing between end cap 12 and the last locknut 13.
Patent of the present invention is that a kind of stable action, wafer easy to use adsorb whirligig.Axle is that bearing adopts supports of moving about of the fixing end of an end, increase stability of rotation.Rotation axis is supported by a pair of angular contact bearing and a deep groove ball bearing; Wherein, the angular contact bearing Internal and external cycle both sides of upper end are all fixing, move thereby limited the two-way of axle; And a deep groove ball bearing inner ring is fixed; When the shaft extension Shi Kezuo that contracts moves axially, good operating stability can adapt to the variations in temperature that high speed rotating brings.The above and below of bearing all is designed with labyrinth seal, can prevent that dust, moisture and other impurity from getting into bearing, improves the life-span of bearing.Upper sealing ring intersects with lower sealing ring each other, can prevent that the cooling fluid access to plant is inner.Add labyrinth seal in many places, prevent that dust from getting into.Device is hollow devices, and the centre is equipped with vacuum tube, and following termination swivel joint is convenient to vacuum suction.
Claims (4)
1. wafer rotating plate device for special equipment of semiconductor; Comprise vacuum cup (1), rotating shaft (6), motor and mechanical driving device; It is characterized in that vacuum cup (1) is fixed on rotating shaft (6) upper surface; Rotating shaft (6) is adopted the fixing end of an end to move about and is supported in the bearing holder (housing, cover) (10), and rotating shaft (6) below is connected with motor and mechanical driving device, and bearing holder (housing, cover) (10) and pedestal fix; The below of rotating shaft (6) is connected to the swivel joint that links to each other with vacuum plant; Described rotating shaft (6) is a multidiameter; Two angular contact ball bearings (7) and a deep groove ball bearing (11) are installed, and two angular contact ball bearings (7) two ends Internal and external cycle is all fixing, and the upper end inner ring is stuck on the shaft shoulder of rotating shaft (6); The outer ring, upper end is pressed on the lower surface of bearing cap (3); The lower end inner ring contacts with spacer (9) upper surface, and the outer ring, lower end is pressed on the interior hole end surface of bearing holder (housing, cover) (10), and bearing cap (3) passes through screw on the upper surface of bearing holder (housing, cover) (10); Deep groove ball bearing (a 11) two ends inner ring is fixed, and the upper end inner ring contacts with spacer (9) lower surface, and the lower end inner ring is by the screw thread double locking through the rotating shaft lower end of last locknut (13) and following locknut (14), and end cap (12) is fixed on bearing holder (housing, cover) (10) lower surface; Vacuum locknut (2) is pressed in the groove of vacuum cup (1), connects with vacuum tube (8) in the rotating shaft (6) through screw thread, and the below of vacuum tube (8) is connected to the swivel joint that links to each other with vacuum plant.
2. wafer rotating plate device for special equipment of semiconductor according to claim 1 is characterized in that between two angular contact ball bearings (7) internal space ring and external space ring being installed, and between deep groove ball bearing (11) and the last locknut (13) the inner ring spacer ring is installed.
3. wafer rotating plate device for special equipment of semiconductor according to claim 2 is characterized in that being provided with upper sealing ring (4), lower sealing ring (5), and upper sealing ring (4) is fixed on the lower surface of vacuum cup (1), intersects each other with lower sealing ring (5).
4. wafer rotating plate device for special equipment of semiconductor according to claim 3 is characterized in that between above-mentioned vacuum cup (1) and the bearing cap (3) end cap (12) and last locknut (13)) between be equipped with radial labyrinth sealing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101959402A CN101894784B (en) | 2010-06-10 | 2010-06-10 | Wafer rotating plate device for special equipment of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101959402A CN101894784B (en) | 2010-06-10 | 2010-06-10 | Wafer rotating plate device for special equipment of semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101894784A CN101894784A (en) | 2010-11-24 |
| CN101894784B true CN101894784B (en) | 2012-07-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101959402A Expired - Fee Related CN101894784B (en) | 2010-06-10 | 2010-06-10 | Wafer rotating plate device for special equipment of semiconductor |
Country Status (1)
| Country | Link |
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| CN (1) | CN101894784B (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102126170A (en) * | 2011-01-06 | 2011-07-20 | 无锡市第二轴承有限公司 | Bearing ring grinding equal-high rotary table |
| CN102327908A (en) * | 2011-06-24 | 2012-01-25 | 无锡市常欣机电科技有限公司 | Guide wheel part for pulling machine |
| CN103009799B (en) * | 2012-12-28 | 2016-03-02 | 中国电子科技集团公司第四十五研究所 | Conplane X, Y, Θ direction auto-alignment adjusting device |
| CN104882402B (en) * | 2014-02-28 | 2018-03-13 | 上海微电子装备（集团）股份有限公司 | A kind of substrate bearing device |
| CN105300823A (en) * | 2015-10-14 | 2016-02-03 | 青岛理工大学 | Small-load impact abrasion testing machine with tangential velocity |
| CN105216001B (en) * | 2015-10-28 | 2017-05-24 | 惠州Tcl移动通信有限公司 | Automatic carrying equipment and rotary suction device thereof |
| CN109424726B (en) * | 2017-08-30 | 2024-04-30 | 上海旭恒精工机械制造有限公司 | Steering transmission supporting device |
| CN109332732B (en) * | 2018-11-19 | 2024-01-12 | 浙江万丰科技开发股份有限公司 | But follow-up stability spindle unit |
| CN111221220A (en) * | 2018-11-27 | 2020-06-02 | 沈阳芯源微电子设备股份有限公司 | Hollow rotating platform device |
| CN113820921A (en) * | 2021-10-04 | 2021-12-21 | 强一半导体（苏州）有限公司 | Automatic gluing and glue throwing device for semiconductor silicon wafer and key structure thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5073037A (en) * | 1989-01-20 | 1991-12-17 | Ntn Corporation | Spindle assembly |
| JP2006118574A (en) * | 2004-10-20 | 2006-05-11 | Nsk Ltd | Stage drive device |
| CN101220836A (en) * | 2007-12-25 | 2008-07-16 | 中国电子科技集团公司第四十五研究所 | Accurate mechanical bearing and aerostatic bearing associated shafting |
| CN201178092Y (en) * | 2008-04-08 | 2009-01-07 | 徐竹林 | Single chip washer |
-
2010
- 2010-06-10 CN CN2010101959402A patent/CN101894784B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5073037A (en) * | 1989-01-20 | 1991-12-17 | Ntn Corporation | Spindle assembly |
| JP2006118574A (en) * | 2004-10-20 | 2006-05-11 | Nsk Ltd | Stage drive device |
| CN101220836A (en) * | 2007-12-25 | 2008-07-16 | 中国电子科技集团公司第四十五研究所 | Accurate mechanical bearing and aerostatic bearing associated shafting |
| CN201178092Y (en) * | 2008-04-08 | 2009-01-07 | 徐竹林 | Single chip washer |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2006118574A 2006.05.11 |
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| Publication number | Publication date |
|---|---|
| CN101894784A (en) | 2010-11-24 |
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| C06 | Publication | ||
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| ASS | Succession or assignment of patent right |
Owner name: CETC BEIJING ELECTRONIC EQUIPMENT CO., LTD. Free format text: FORMER OWNER: NO.45 INST., CHINA ELECTRONIC SCIENCE AND TECHNOLOGY GROUP CORP. Effective date: 20101215 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 065201 NO. 20, HAIYOU STREET, BEIJING EAST YANJIAO DEVELOPMENT AREA, YANJIAO DEVELOPMENT AREA, SANHE CITY, HEBEI PROVINCE TO: 100176 ROOM A119, NO. 18, XIHUAN SOUTH ROAD, ECONOMIC AND TECHNOLOGY DEVELOPMENT ZONE, BEIJING |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20101215 Address after: 100176 room All9, No. 18 West South Road, Beijing economic and Technological Development Zone Applicant after: CETC BEIJING ELECTRONIC EQUIPMENT Co.,Ltd. Address before: Beijing East Yanjiao Development Zone, Hebei province Sanhe 065201 Street CNOOC Yanjiao Development Zone No. 20 Applicant before: THE 45TH Research Institute OF CETC |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120711 |
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| CF01 | Termination of patent right due to non-payment of annual fee |