CN111221220A - Hollow rotating platform device - Google Patents
Hollow rotating platform device Download PDFInfo
- Publication number
- CN111221220A CN111221220A CN201811423357.5A CN201811423357A CN111221220A CN 111221220 A CN111221220 A CN 111221220A CN 201811423357 A CN201811423357 A CN 201811423357A CN 111221220 A CN111221220 A CN 111221220A
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- CN
- China
- Prior art keywords
- hollow shaft
- bevel gear
- bearing
- hollow
- motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 230000005540 biological transmission Effects 0.000 claims description 4
- 238000001179 sorption measurement Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000003292 glue Substances 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000011112 process operation Methods 0.000 description 2
- 230000008092 positive effect Effects 0.000 description 1
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the field of glue coating and developing in semiconductor manufacturing processes, and particularly relates to a hollow rotary platform device which comprises a unit platform, a bearing assembly, a hollow shaft, a chuck, a bevel gear A, a bevel gear B and a motor, wherein the hollow shaft is rotatably arranged on the unit platform through the bearing assembly; the motor is arranged on the unit platform, an output shaft of the motor is connected with a bevel gear A, a hollow shaft is provided with a bevel gear B, and the bevel gear B is meshed with the bevel gear A; the wafer is placed on the chuck and is pulled onto the chuck by a vacuum provided by a negative pressure source. The invention can select a common motor, and the aim of chuck rotation is achieved through a bevel gear meshing structure; the hollow shaft of the invention realizes the function of vacuum adsorption, and solves the application limitations of small quantity, narrow surface, high price, large occupied space and the like of a special hollow rotating motor adopted by a unit motor.
Description
Technical Field
The invention belongs to the field of glue coating and developing in semiconductor manufacturing process, and particularly relates to a hollow rotary platform device.
Background
In the traditional gluing and developing machine, a hollow rotating motor basically and directly drives a chuck (bearing table) to carry out the process operation of the wafer, and the vacuum adsorption function of the traditional gluing and developing machine is realized through the internal structure of the motor. The special hollow rotating motor has small market quantity, few brands, narrow surface and relatively high price, and occupies larger assembly space on the unit.
Disclosure of Invention
In order to solve the problems caused by directly driving the chuck by using the hollow rotating motor, the invention aims to provide a hollow rotating platform device.
The purpose of the invention is realized by the following technical scheme:
the device comprises a unit platform, a bearing assembly, a hollow shaft, a chuck, a bevel gear A, a bevel gear B and a motor, wherein the hollow shaft is rotatably arranged on the unit platform through the bearing assembly; the motor is arranged on the unit platform, an output shaft of the motor is connected with a bevel gear A, a hollow shaft is provided with a bevel gear B, and the bevel gear B is meshed with the bevel gear A; a wafer is placed on the chuck and is adsorbed on the chuck through vacuum provided by the negative pressure source;
wherein: the axial direction of the output shaft of the motor is vertical to the axial direction of the hollow shaft, namely, the motor drives the hollow shaft to rotate through the meshing transmission of the bevel gear A and the bevel gear B, and the transverse axial rotation is converted into the vertical axial rotation;
a vacuum channel A is axially arranged in the hollow shaft, a vacuum interface is arranged at the other end of the hollow shaft, and the hollow shaft is connected with a negative pressure source through the vacuum interface;
the chuck is an internal hollow structure, the lower part of the hollow structure is sleeved at one end of the hollow shaft and is linked with the hollow shaft, and the upper part of the hollow structure is a vacuum channel B;
the bearing assembly comprises a bearing seat, a bearing end cover and a locking nut, the bearing seat is installed on the unit platform, a hollow shaft penetrates through the bearing seat and is rotatably connected with the bearing seat through the bearing, the lower end of the bearing seat is fixedly connected with the bearing end cover, and the middle of the bearing end cover is provided with the locking nut in threaded connection with the hollow shaft;
the bearing comprises a deep groove ball bearing and an angular contact ball bearing which are arranged up and down, and an intermediate sleeve sleeved on the hollow shaft is arranged between the deep groove ball bearing and the angular contact ball bearing; the outer rings of the deep groove ball bearing and the angular contact ball bearing are axially positioned through the spigot on the inner wall of the bearing seat and the bearing end cover, and the inner rings of the deep groove ball bearing and the angular contact ball bearing are axially positioned through the middle sleeve and the locking nut.
The invention has the advantages and positive effects that:
the invention can select a common motor, and the aim of chuck rotation is achieved through a bevel gear meshing structure; the hollow shaft of the invention realizes the function of vacuum adsorption, and solves the application limitations of small quantity, narrow surface, high price, large occupied space and the like of a special hollow rotating motor adopted by a unit motor.
Drawings
FIG. 1 is a sectional view showing the internal structure of the present invention;
FIG. 2 is a top view of the structure of the present invention;
wherein: the device comprises a unit platform 1, a bearing assembly 2, a bearing seat 201, a deep groove ball bearing 202, a middle sleeve 203, an angular contact ball bearing 204, a bearing end cover 205, a locking nut 206, a hollow shaft 3, a chuck (bearing table) 4, a bevel gear A5, a bevel gear B6, a motor 7, a vacuum interface 8, a vacuum channel A9, a vacuum channel B10 and a wafer 11.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1 and 2, the present invention includes a unit platform 1, a bearing assembly 2, a hollow shaft 3, a chuck4, a bevel gear a5, a bevel gear B6 and a motor 7, wherein the motor 7 is fixed at the lower side of the unit platform 1, the hollow shaft 3 is rotatably mounted on the unit platform 1 through the bearing assembly 2, one end (upper end) of the hollow shaft 3 is connected with the chuck4, the other end (lower end) is provided with a vacuum port 8, and the hollow shaft 3 is connected with a negative pressure source through the vacuum port 8. The output shaft of the motor 7 is connected with a bevel gear A5, a bevel gear B6 is arranged on the hollow shaft 3 near the lower end, the bevel gear B6 is in key connection with the hollow shaft 3 and is axially positioned through a locking piece (such as a locking nut) positioned below the bevel gear B6, and the bevel gear B6 is meshed with the bevel gear A5. The axial direction of the output shaft of the motor 7 is perpendicular to the axial direction of the hollow shaft 3, namely, the motor 7 drives the hollow shaft 3 to rotate through the meshing transmission of the bevel gear A5 and the bevel gear B6, and the transverse axial rotation is converted into the vertical axial rotation.
A vacuum passage a9 is axially formed in the hollow shaft 3. The chuck4 is an internal hollow structure, the lower part of the hollow structure is sleeved outside the upper end of the hollow shaft 3 and is linked with the hollow shaft 3, the upper part of the hollow structure is a vacuum channel B10, and the vacuum channel B10 is communicated with a vacuum channel A9 in the hollow shaft 3. The wafer 11 is placed on chuck4 and is pulled onto chuck4 by a vacuum provided by a negative pressure source.
The bearing assembly 2 comprises a bearing seat 201, a bearing end cover 205 and a locking nut 206, the bearing seat 201 is fixedly connected to the lower side of the unit platform 1, the hollow shaft 3 penetrates through the bearing seat 201 and is rotatably connected with the bearing seat 201 through the bearing, the bearing end cover 205 is fixedly connected to the lower end of the bearing seat 201, and the locking nut 206 in threaded connection with the hollow shaft 3 is arranged in the middle of the bearing end cover 205. The bearing of the present embodiment includes a deep groove ball bearing 202 and an angular ball bearing 204 which are vertically disposed, and an intermediate sleeve 203 which is fitted over the hollow shaft 3 is disposed between the deep groove ball bearing 202 and the angular ball bearing 204. The outer rings of the deep groove ball bearing 202 and the angular contact ball bearing 204 are axially positioned through the spigot on the inner wall of the bearing seat 201 and the bearing end cover 205, and the inner rings of the deep groove ball bearing 202 and the angular contact ball bearing 204 are axially positioned through the intermediate sleeve 203 and the lock nut 206.
The working principle of the invention is as follows:
the horizontal motor 7 works and operates to drive the bevel gear A5 to rotate, and the hollow shaft 3 and the chuck4 are driven to rotate through the meshing transmission of the bevel gear A5 and the bevel gear B6, so that the wafer 11 on the chuck4 is subjected to process operation. It is desirable that chuck4 vacuum chuck wafer 11 while wafer 11 is undergoing processing operations to ensure that wafer 11 is concentric and relatively stationary with chuck4 to avoid wafer 11 flying out as wafer 11 rotates at high speeds with chuck 4.
Vacuum is introduced through the vacuum port 8 at the lower end of the hollow shaft 3, and the vacuum passage a9 inside the hollow shaft 3 communicates with the vacuum passage B10 inside the chuck4, so that the wafer 11 can be sucked by the surface of the chuck 4.
The invention can completely replace the function of connecting the special hollow rotating motor into the vacuum pipeline, simultaneously realizes the purpose of high-speed rotation of the same motor, and solves the application limitations of small quantity, narrow surface, high price, large occupied space and the like of the special hollow rotating motor.
Claims (6)
1. The utility model provides a cavity rotary platform device which characterized in that: the device comprises a unit platform (1), a bearing assembly (2), a hollow shaft (3), a chuck (4), a bevel gear A (5), a bevel gear B (6) and a motor (7), wherein the hollow shaft (3) is rotatably mounted on the unit platform (1) through the bearing assembly (2), one end of the hollow shaft (3) is connected with the chuck (4), and the other end of the hollow shaft is connected with a negative pressure source; the motor (7) is installed on the unit platform (1), an output shaft of the motor (7) is connected with a bevel gear A (5), a bevel gear B (6) is installed on the hollow shaft (3), and the bevel gear B (6) is meshed with the bevel gear A (5); a wafer (11) is placed on the chuck (4) and is sucked onto the chuck (4) by the vacuum provided by the negative pressure source.
2. A hollow rotary platform device according to claim 1, characterized in that: the axial direction of the output shaft of the motor (7) is vertical to the axial direction of the hollow shaft (3), namely, the motor (7) drives the hollow shaft (3) to rotate through the meshing transmission of the bevel gear A (5) and the bevel gear B (6), and the horizontal axial rotation is converted into the vertical axial rotation.
3. A hollow rotary platform device according to claim 1, characterized in that: a vacuum channel A (9) is axially arranged in the hollow shaft (3), a vacuum interface (8) is arranged at the other end of the hollow shaft (3), and the hollow shaft (3) is connected with a negative pressure source through the vacuum interface (8).
4. A hollow rotary platform device according to claim 1, characterized in that: the chuck (4) is of an internal hollow structure, the lower part of the hollow structure is sleeved at one end of the hollow shaft (3) and is linked with the hollow shaft (3), and the upper part of the hollow structure is a vacuum channel B (10).
5. A hollow rotary platform device according to claim 1, characterized in that: the bearing assembly (2) comprises a bearing seat (201), a bearing end cover (205) and a locking nut (206), the bearing seat (201) is installed on the unit platform (1), a hollow shaft (3) penetrates through the bearing seat (201) and is rotatably connected with the bearing seat (201) through the bearing, the bearing end cover (205) is fixedly connected to the lower end of the bearing seat (201), and the locking nut (206) in threaded connection with the hollow shaft (3) is arranged in the middle of the bearing end cover (205).
6. A hollow rotary platform device according to claim 5, characterized in that: the bearing comprises a deep groove ball bearing (202) and an angular contact ball bearing (204) which are arranged up and down, and an intermediate sleeve (203) sleeved on the hollow shaft (3) is arranged between the deep groove ball bearing (202) and the angular contact ball bearing (204); the outer rings of the deep groove ball bearing (202) and the angular contact ball bearing (204) are axially positioned through a spigot on the inner wall of the bearing seat (201) and a bearing end cover (205), and the inner rings of the deep groove ball bearing (202) and the angular contact ball bearing (204) are axially positioned through an intermediate sleeve (203) and a lock nut (206).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811423357.5A CN111221220A (en) | 2018-11-27 | 2018-11-27 | Hollow rotating platform device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811423357.5A CN111221220A (en) | 2018-11-27 | 2018-11-27 | Hollow rotating platform device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111221220A true CN111221220A (en) | 2020-06-02 |
Family
ID=70826500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811423357.5A Pending CN111221220A (en) | 2018-11-27 | 2018-11-27 | Hollow rotating platform device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111221220A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113820921A (en) * | 2021-10-04 | 2021-12-21 | 强一半导体（苏州）有限公司 | Automatic gluing and glue throwing device for semiconductor silicon wafer and key structure thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08203818A (en) * | 1995-01-19 | 1996-08-09 | Hitachi Electron Eng Co Ltd | Work rotating and processing apparatus |
| KR20100002883A (en) * | 2008-06-30 | 2010-01-07 | 주식회사 케이씨텍 | Apparatus for cleaning both sides of substrate |
| CN101894784A (en) * | 2010-06-10 | 2010-11-24 | 中国电子科技集团公司第四十五研究所 | Wafer rotating plate device for special equipment of semiconductor |
| CN202780646U (en) * | 2012-09-04 | 2013-03-13 | 吴林权 | High-precision lathe |
| US20160155616A1 (en) * | 2014-12-02 | 2016-06-02 | Samsung Electronics Co., Ltd. | Substrate processing apparatus |
| CN107914173A (en) * | 2017-11-27 | 2018-04-17 | 河南理工大学 | Micro- drilling-milling apparatus is turned to for what exocoel in workpiece was processed |
| CN208953887U (en) * | 2018-11-27 | 2019-06-07 | 沈阳芯源微电子设备股份有限公司 | Hollow rotating stage apparatus |
-
2018
- 2018-11-27 CN CN201811423357.5A patent/CN111221220A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08203818A (en) * | 1995-01-19 | 1996-08-09 | Hitachi Electron Eng Co Ltd | Work rotating and processing apparatus |
| KR20100002883A (en) * | 2008-06-30 | 2010-01-07 | 주식회사 케이씨텍 | Apparatus for cleaning both sides of substrate |
| CN101894784A (en) * | 2010-06-10 | 2010-11-24 | 中国电子科技集团公司第四十五研究所 | Wafer rotating plate device for special equipment of semiconductor |
| CN202780646U (en) * | 2012-09-04 | 2013-03-13 | 吴林权 | High-precision lathe |
| US20160155616A1 (en) * | 2014-12-02 | 2016-06-02 | Samsung Electronics Co., Ltd. | Substrate processing apparatus |
| CN107914173A (en) * | 2017-11-27 | 2018-04-17 | 河南理工大学 | Micro- drilling-milling apparatus is turned to for what exocoel in workpiece was processed |
| CN208953887U (en) * | 2018-11-27 | 2019-06-07 | 沈阳芯源微电子设备股份有限公司 | Hollow rotating stage apparatus |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113820921A (en) * | 2021-10-04 | 2021-12-21 | 强一半导体（苏州）有限公司 | Automatic gluing and glue throwing device for semiconductor silicon wafer and key structure thereof |
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| Date | Code | Title | Description |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200602 |
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| RJ01 | Rejection of invention patent application after publication |