CN101872823A - Gallium nitride-based light-emitting diode (LED) with distributed Bragg reflectors on side walls and preparation method thereof - Google Patents

Gallium nitride-based light-emitting diode (LED) with distributed Bragg reflectors on side walls and preparation method thereof Download PDF

Info

Publication number
CN101872823A
CN101872823A CN201010200851A CN201010200851A CN101872823A CN 101872823 A CN101872823 A CN 101872823A CN 201010200851 A CN201010200851 A CN 201010200851A CN 201010200851 A CN201010200851 A CN 201010200851A CN 101872823 A CN101872823 A CN 101872823A
Authority
CN
China
Prior art keywords
layer
gan layer
bragg reflector
sapphire substrate
distribution bragg
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201010200851A
Other languages
Chinese (zh)
Inventor
彭康伟
林素慧
刘传桂
林科闯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiamen Sanan Optoelectronics Technology Co Ltd
Original Assignee
Xiamen Sanan Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiamen Sanan Optoelectronics Technology Co Ltd filed Critical Xiamen Sanan Optoelectronics Technology Co Ltd
Priority to CN201010200851A priority Critical patent/CN101872823A/en
Publication of CN101872823A publication Critical patent/CN101872823A/en
Pending legal-status Critical Current

Links

Images

Abstract

The invention discloses a gallium nitride-based light-emitting diode (LED) with distributed Bragg reflectors on side walls and a preparation method thereof. The preparation method comprises the following steps of: sequentially growing a N-GaN layer, a multiple-quantum well layer and a P-GaN layer on a sapphire substrate; forming a transparent conducting layer on the P-GaN layer; etching part of a table top on which the transparent conducting layer is positioned by a light shield until the N-GaN layer is exposed; forming a P electrode on the transparent conducting layer; forming a N electrode on the exposed N-GaN layer; forming the distributed Bragg reflectors on the side walls of the sapphire substrate, the N-GaN layer, the multiple quantum well layer and the P-GaN layer; and thinning and polishing the sapphire substrate, and cutting the sapphire substrate into independent LED core grains. Compared with the prior art, the invention has the advantage that the distributed Bragg reflectors with excellent reflectivity are arranged on the side walls of an LED chip, thus when light reaches the side surfaces of the sapphire substrate, light output or light extraction can be effectively increased, and the external quantum efficiency of the LED can be effectively improved.

Description

Sidewall has gallium nitride based light emitting diode of distribution Bragg reflector and preparation method thereof
Technical field
The present invention relates to gallium nitride based light emitting diode, particularly a kind of sidewall has gallium nitride based light emitting diode of distribution Bragg reflector and preparation method thereof.
Background technology
That light-emitting diode (English is Light Emitting Diode, be called for short LED) has is pollution-free, brightness is high, low in energy consumption, advantages such as the life-span is long, operating voltage is low, easy miniaturization.Along with the efficient of power-type GaN base LED constantly promotes, will become inundant trend with the alternative existing lighting source of GaN base LED semiconductor lamp; Yet semiconductor lighting will enter huge numbers of families, still has many problems to need to solve, and wherein most crucial problem is exactly luminous efficiency and production cost.
The existing method of improving the LED luminous efficiency mainly contains and adopts image substrate, transparency carrier, distribution Bragg reflector (the English Distributed Bragg Reflector of being is called for short DBR) structure, surface micro-structure, flip-chip, chip bonding, laser lift-off technique etc.Traditional gallium nitride based light emitting diode structure, as shown in Figure 1, on substrate 11, grow successively N-GaN layer 12, quantum well layer 13 and P-GaN layer 14; Transparency conducting layer 15 is formed on the P-GaN layer 14.These transparency conducting layer 15 end faces are provided with P electrode 16, and the P-GaN layer 14 of exposure is provided with N electrode 17.When light when quantum well layer 13 sends, this structure makes the sidewall bright dipping effectively to take out easily, i.e. upwards bright dipping has influenced the light extraction efficiency of light-emitting diode.
Summary of the invention
For solving the existing light extraction efficiency problem of above-mentioned light-emitting diode, the present invention aims to provide a kind of sidewall and has gallium nitride based light emitting diode of distribution Bragg reflector and preparation method thereof.
The present invention addresses the above problem the technical scheme that is adopted: sidewall has the gallium nitride based light emitting diode of distribution Bragg reflector, comprise a sapphire substrate, on sapphire substrate, stack gradually growth N-GaN layer, multiple quantum well layer and P-GaN layer, on the P-GaN layer, form transparency conducting layer, on transparency conducting layer, form a P electrode, on the exposure of N-GaN layer, form a N electrode; Distribution Bragg reflector is formed at the sidewall of sapphire substrate, N-GaN layer, multiple quantum well layer and P-GaN layer.
Prepare the method that above-mentioned sidewall has the gallium nitride based light emitting diode of distribution Bragg reflector, its processing step is as follows:
1) on sapphire substrate, grow successively N-GaN layer, multiple quantum well layer and P-GaN layer;
2) on the P-GaN layer, form transparency conducting layer;
3) by light shield, etching, with the part mesa etch at transparency conducting layer place to exposing the N-GaN layer;
4) on transparency conducting layer, form the P electrode;
5) on the N-GaN layer that exposes, form the N electrode;
6) on the sidewall of sapphire substrate, N-GaN layer, multiple quantum well layer and P-GaN layer, form distribution Bragg reflector;
7) with the sapphire substrate attenuate, polish and cut into independent LED core grains.
Among the present invention, described transparency conducting layer is selected from one of ITO, ZnO, In doping ZnO, Al doping ZnO, Ga doping ZnO or aforesaid combination in any; Distribution Bragg reflector is made up of high index of refraction that replaces and low refractive index material layer; The high index of refraction layer material of distribution Bragg reflector is selected from TiO, TiO 2, Ti 3O 5, Ti 2O 3, Ta 2O 5, ZrO 2One of or aforesaid combination in any; The low-refraction layer material of distribution Bragg reflector is selected from SiO 2, SiN X, Al 2O 3One of or aforesaid combination in any.
The invention has the beneficial effects as follows: compared with prior art, the present invention has the distribution Bragg reflector of excellent reflection in the sidewall setting of led chip, when light arrives the sapphire substrate side, can effectively increase bright dipping or get light, can effectively improve the external quantum efficiency of light-emitting diode.
Description of drawings
Fig. 1 is the schematic diagram of traditional gallium nitride based light emitting diode.
Fig. 2 has the structural representation of the gallium nitride based light emitting diode of distribution Bragg reflector for sidewall of the present invention.
Among Fig. 2: 21. sapphire substrates; 22.N-GaN layer; 23. multiple quantum well layer; 24.P-GaN layer; 25. transparency conducting layer; 26.P electrode; 27.N electrode; 28. distribution Bragg reflector.
Embodiment
The present invention is further described below in conjunction with drawings and Examples.
A kind of sidewall as shown in Figure 2 has the preparation method of the gallium nitride based light emitting diode of distribution Bragg reflector, and its processing step is:
On sapphire substrate 21, grow successively N-GaN layer 22, multiple quantum well layer 23 and P-GaN layer 24; Form ITO transparency conducting layer 25 on P-GaN layer 24;
By light shield, etching operation, with the part mesa etch at ITO transparency conducting layer 25 places to exposing N-GaN layer 22;
Form P electrode 26 on ITO transparency conducting layer 25;
Form N electrode 27 on the N-GaN layer 22 that exposes;
Form distribution Bragg reflector 28 in the sidewall of sapphire substrate 21, N-GaN layer 22, multiple quantum well layer 23 and P-GaN layer 24; Distribution Bragg reflector 28 is by the high index of refraction Ti that replaces 3O 5Material layer and low-refraction SiO 2Material layer is formed;
With sapphire substrate 21 attenuates, polish and cut into independently LED core grain.
As shown in Figure 2, the gallium nitride based light emitting diode that has distribution Bragg reflector according to the sidewall of above-mentioned prepared, its structure is: comprise a sapphire substrate 21, on sapphire substrate 21, stack gradually growth N-GaN layer 22, multiple quantum well layer 23 and P-GaN layer 24, on P-GaN layer 24, form ITO transparency conducting layer 25, on ITO transparency conducting layer 25, form a P electrode 26, on the exposure of N-GaN layer 22, form a N electrode 27; Distribution Bragg reflector 28 is formed at the sidewall of sapphire substrate 21, N-GaN layer 22, multiple quantum well layer 23 and P-GaN layer 24.
Above embodiment is only for the usefulness that the present invention is described, but not limitation of the present invention, those skilled in the art under the situation that does not break away from the spirit and scope of the present invention, can also make various conversion or variation; Therefore, all technical schemes that are equal to also should belong to category of the present invention, should be limited by each claim.

Claims (6)

1. sidewall has the gallium nitride based light emitting diode of distribution Bragg reflector, comprise a sapphire substrate, on sapphire substrate, stack gradually growth N-GaN layer, multiple quantum well layer and P-GaN layer, on the P-GaN layer, form transparency conducting layer, on transparency conducting layer, form a P electrode, on the exposure of N-GaN layer, form a N electrode; Distribution Bragg reflector is formed at the sidewall of sapphire substrate, N-GaN layer, multiple quantum well layer and P-GaN layer.
2. sidewall has the preparation method of the gallium nitride based light emitting diode of distribution Bragg reflector, and its processing step is as follows:
1) on sapphire substrate, grow successively N-GaN layer, multiple quantum well layer and P-GaN layer;
2) on the P-GaN layer, form transparency conducting layer;
3) by light shield, etching, with the part mesa etch at transparency conducting layer place to exposing the N-GaN layer;
4) on transparency conducting layer, form the P electrode;
5) on the N-GaN layer that exposes, form the N electrode;
6) on the sidewall of sapphire substrate, N-GaN layer, multiple quantum well layer and P-GaN layer, form distribution Bragg reflector;
7) with the sapphire substrate attenuate, polish and cut into independent LED core grains.
3. sidewall as claimed in claim 2 has the preparation method of the gallium nitride based light emitting diode of distribution Bragg reflector, it is characterized in that: transparency conducting layer is selected from one of ITO, ZnO, In doping ZnO, Al doping ZnO, Ga doping ZnO or aforesaid combination in any.
4. sidewall as claimed in claim 2 has the preparation method of the gallium nitride based light emitting diode of distribution Bragg reflector, it is characterized in that: distribution Bragg reflector is made up of high index of refraction that replaces and low refractive index material layer.
5. have the preparation method of the gallium nitride based light emitting diode of distribution Bragg reflector as claim 2 or 4 described sidewalls, it is characterized in that: the high index of refraction layer material of distribution Bragg reflector is selected from TiO, TiO 2, Ti 3O 5, Ti 2O 3, Ta 2O 5, ZrO 2One of or aforesaid combination in any.
6. have the preparation method of the gallium nitride based light emitting diode of distribution Bragg reflector as claim 2 or 4 described sidewalls, it is characterized in that: the low-refraction layer material of distribution Bragg reflector is selected from SiO 2, SiN X, Al 2O 3One of or aforesaid combination in any.
CN201010200851A 2010-06-07 2010-06-07 Gallium nitride-based light-emitting diode (LED) with distributed Bragg reflectors on side walls and preparation method thereof Pending CN101872823A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201010200851A CN101872823A (en) 2010-06-07 2010-06-07 Gallium nitride-based light-emitting diode (LED) with distributed Bragg reflectors on side walls and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201010200851A CN101872823A (en) 2010-06-07 2010-06-07 Gallium nitride-based light-emitting diode (LED) with distributed Bragg reflectors on side walls and preparation method thereof

Publications (1)

Publication Number Publication Date
CN101872823A true CN101872823A (en) 2010-10-27

Family

ID=42997582

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010200851A Pending CN101872823A (en) 2010-06-07 2010-06-07 Gallium nitride-based light-emitting diode (LED) with distributed Bragg reflectors on side walls and preparation method thereof

Country Status (1)

Country Link
CN (1) CN101872823A (en)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103199183A (en) * 2013-04-08 2013-07-10 厦门市三安光电科技有限公司 Packaging structure enhancing brightness of vertical light-emitting diode (LED) chip
CN103296150A (en) * 2012-03-01 2013-09-11 上海蓝光科技有限公司 Light-emitting diode and manufacturing method thereof
CN103972346A (en) * 2013-02-04 2014-08-06 刘胜 Area light source device with high top-emergence rate and low side-emergence rate
CN104269486A (en) * 2014-09-15 2015-01-07 映瑞光电科技(上海)有限公司 Flip LED chip and manufacturing method thereof
CN104716245A (en) * 2013-12-13 2015-06-17 晶元光电股份有限公司 Light emitting device and manufacturing method thereof
US9306138B2 (en) 2013-04-08 2016-04-05 Xiamen Sanan Optoelectronics Technology Co., Ltd. Light emitting diode packaging structure
WO2016115875A1 (en) * 2015-01-20 2016-07-28 湘能华磊光电股份有限公司 Method for manufacturing group iii semiconductor luminescent device
WO2016115876A1 (en) * 2015-01-20 2016-07-28 湘能华磊光电股份有限公司 Method for manufacturing group iii semiconductor luminescent device
CN105932120A (en) * 2016-06-15 2016-09-07 佛山市国星半导体技术有限公司 Manufacturing method of LED chip with side wall DBR
CN105977353A (en) * 2016-05-11 2016-09-28 青岛杰生电气有限公司 Uv led
WO2016177333A1 (en) * 2015-05-05 2016-11-10 湘能华磊光电股份有限公司 Manufacturing method for group iii semiconductor light-emitting component flip-chip structure
CN106935689A (en) * 2015-12-31 2017-07-07 比亚迪股份有限公司 Flip-chip and preparation method thereof and lighting apparatus
CN108110117A (en) * 2016-11-25 2018-06-01 首尔伟傲世有限公司 Light emitting diode with photoresist layer
JP2018527748A (en) * 2015-08-03 2018-09-20 ルミレッズ ホールディング ベーフェー Semiconductor light-emitting device with reflective side coating
CN110223972A (en) * 2019-05-05 2019-09-10 华南理工大学 A kind of upside-down mounting COB light source and preparation method thereof with mirror structure
CN111416023A (en) * 2019-01-07 2020-07-14 聚灿光电科技(宿迁)有限公司 Method for improving light efficiency by laterally coating high-reflection film on metal electrode

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1218996A (en) * 1997-11-27 1999-06-09 陈兴 Multiple colour light emitting diode body
US20040245535A1 (en) * 2000-10-23 2004-12-09 General Electric Company Homoepitaxial gallium-nitride-based light emitting device and method for producing
US20070114552A1 (en) * 2005-11-23 2007-05-24 Samsung Electro-Mechanics Co., Ltd. Vertical gallium-nitride based light emitting diode
US20080056322A1 (en) * 2006-09-04 2008-03-06 Nichia Corporation Nitride semiconductor laser element and method for manufacturing same
CN101604715A (en) * 2008-06-10 2009-12-16 普光科技(广州)有限公司 Gallium nitride LED chip and preparation method thereof

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1218996A (en) * 1997-11-27 1999-06-09 陈兴 Multiple colour light emitting diode body
US20040245535A1 (en) * 2000-10-23 2004-12-09 General Electric Company Homoepitaxial gallium-nitride-based light emitting device and method for producing
US20070114552A1 (en) * 2005-11-23 2007-05-24 Samsung Electro-Mechanics Co., Ltd. Vertical gallium-nitride based light emitting diode
US20080056322A1 (en) * 2006-09-04 2008-03-06 Nichia Corporation Nitride semiconductor laser element and method for manufacturing same
CN101604715A (en) * 2008-06-10 2009-12-16 普光科技(广州)有限公司 Gallium nitride LED chip and preparation method thereof

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103296150A (en) * 2012-03-01 2013-09-11 上海蓝光科技有限公司 Light-emitting diode and manufacturing method thereof
CN103972346A (en) * 2013-02-04 2014-08-06 刘胜 Area light source device with high top-emergence rate and low side-emergence rate
CN103199183A (en) * 2013-04-08 2013-07-10 厦门市三安光电科技有限公司 Packaging structure enhancing brightness of vertical light-emitting diode (LED) chip
WO2014166309A1 (en) * 2013-04-08 2014-10-16 厦门市三安光电科技有限公司 Encapsulating structure for improving vertical led chip luminance
CN103199183B (en) * 2013-04-08 2016-01-27 厦门市三安光电科技有限公司 A kind of encapsulating structure improving vertical LED chip brightness
US9306138B2 (en) 2013-04-08 2016-04-05 Xiamen Sanan Optoelectronics Technology Co., Ltd. Light emitting diode packaging structure
CN104716245A (en) * 2013-12-13 2015-06-17 晶元光电股份有限公司 Light emitting device and manufacturing method thereof
US11107797B2 (en) 2013-12-13 2021-08-31 Epistar Corporation Light-emitting device and the method of manufacturing the same
US10756067B2 (en) 2013-12-13 2020-08-25 Epistar Corporation Light-emitting device and the method of manufacturing the same
CN104269486A (en) * 2014-09-15 2015-01-07 映瑞光电科技(上海)有限公司 Flip LED chip and manufacturing method thereof
WO2016115875A1 (en) * 2015-01-20 2016-07-28 湘能华磊光电股份有限公司 Method for manufacturing group iii semiconductor luminescent device
WO2016115876A1 (en) * 2015-01-20 2016-07-28 湘能华磊光电股份有限公司 Method for manufacturing group iii semiconductor luminescent device
WO2016177333A1 (en) * 2015-05-05 2016-11-10 湘能华磊光电股份有限公司 Manufacturing method for group iii semiconductor light-emitting component flip-chip structure
US10147849B2 (en) 2015-05-05 2018-12-04 Xiangneng Hualei Optoelectronic Co., Ltd Manufacturing method of flip-chip structure of group III semiconductor light emitting device
JP2018527748A (en) * 2015-08-03 2018-09-20 ルミレッズ ホールディング ベーフェー Semiconductor light-emitting device with reflective side coating
JP7181792B2 (en) 2015-08-03 2022-12-01 ルミレッズ ホールディング ベーフェー Semiconductor light emitting device with reflective side coating
CN106935689A (en) * 2015-12-31 2017-07-07 比亚迪股份有限公司 Flip-chip and preparation method thereof and lighting apparatus
CN105977353B (en) * 2016-05-11 2018-11-09 青岛杰生电气有限公司 A kind of UV LED
CN105977353A (en) * 2016-05-11 2016-09-28 青岛杰生电气有限公司 Uv led
CN105932120A (en) * 2016-06-15 2016-09-07 佛山市国星半导体技术有限公司 Manufacturing method of LED chip with side wall DBR
CN108110117A (en) * 2016-11-25 2018-06-01 首尔伟傲世有限公司 Light emitting diode with photoresist layer
CN111081841A (en) * 2016-11-25 2020-04-28 首尔伟傲世有限公司 Light emitting diode
CN111106216A (en) * 2016-11-25 2020-05-05 首尔伟傲世有限公司 Light emitting diode
CN111416023A (en) * 2019-01-07 2020-07-14 聚灿光电科技(宿迁)有限公司 Method for improving light efficiency by laterally coating high-reflection film on metal electrode
CN110223972A (en) * 2019-05-05 2019-09-10 华南理工大学 A kind of upside-down mounting COB light source and preparation method thereof with mirror structure

Similar Documents

Publication Publication Date Title
CN101872823A (en) Gallium nitride-based light-emitting diode (LED) with distributed Bragg reflectors on side walls and preparation method thereof
US20130112944A1 (en) Nanorod light emitting device and method of manufacturing the same
CN101872824A (en) Gallium nitride-based inverted light-emitting diode (LED) with two reflecting layers on lateral surfaces and preparation method thereof
US8710530B2 (en) Light emitted diode
CN101378103A (en) White light light-emitting device and manufacturing method thereof
CN101789477A (en) Method for preparing all-side-wall saw-tooth coarsened light-emitting diode chip
CN102290505A (en) GaN-base light-emitting diode chip and manufacturing method thereof
CN102024898B (en) LED (light-emitting diode) and manufacturing method thereof
CN204088355U (en) A kind of light emitting diode construction
CN103367590A (en) Gallium nitride-based light-emitting diode and production method thereof
CN103904174A (en) Manufacturing method for LED chip
TW202029529A (en) Light-emitting device and manufacturing method thereof
CN104064640A (en) Vertical type led structure and manufacturing method thereof
CN1773736A (en) Crystal coating light-emitting diode and producing method thereof
CN103022310A (en) Light extraction layer of LED luminous chip and LED device
CN101976715B (en) Manufacturing process of inverted-trapezoidal aluminum-gallium-indium-phosphorus series light-emitting diode
CN102082216B (en) Light emitting diode chip and manufacturing method thereof
CN101944566A (en) Quaternary LED (Light-Emitting Diode) with transparent intensifying bonding layer and manufacture process thereof
US8247837B2 (en) Light-emitting diode with high lighting efficiency
KR101014339B1 (en) Gallium nitride light emitting diode and method for manufacturing the same
CN104064639A (en) Vertical type led structure and manufacturing method thereof
CN101859859B (en) High-brightness GaN-based light-emitting diode and preparation method thereof
CN103715319A (en) Light emitting diode and manufacturing method thereof
CN216250771U (en) Composite pattern substrate and LED epitaxial structure comprising same
KR100936058B1 (en) Gallium nitride light emitting diode and method for manufacturing the same

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20101027

RJ01 Rejection of invention patent application after publication