CN101866869A - 一种半导体专用设备用晶片传输装置 - Google Patents
一种半导体专用设备用晶片传输装置 Download PDFInfo
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CN2010101814070A CN101866869B (zh) | 2010-05-25 | 2010-05-25 | 一种半导体专用设备用晶片传输装置 |
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CN2010101814070A CN101866869B (zh) | 2010-05-25 | 2010-05-25 | 一种半导体专用设备用晶片传输装置 |
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CN101866869A true CN101866869A (zh) | 2010-10-20 |
CN101866869B CN101866869B (zh) | 2012-08-29 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102082064A (zh) * | 2010-11-29 | 2011-06-01 | 常州亿晶光电科技有限公司 | 等离子刻蚀机硅片定压施压夹具 |
CN107973122A (zh) * | 2016-10-21 | 2018-05-01 | 南京瀚宇彩欣科技有限责任公司 | 活动式支撑机构 |
CN109590705A (zh) * | 2018-12-26 | 2019-04-09 | 上海福赛特机器人有限公司 | 一种晶圆自动装配装置及自动装配方法 |
CN115036248A (zh) * | 2022-08-12 | 2022-09-09 | 安徽大华半导体科技有限公司 | 一种防过载芯片推出装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1126544A (ja) * | 1997-07-08 | 1999-01-29 | Matsushita Electric Ind Co Ltd | ワーク搬送用キャリアの位置決め装置および位置決め方法 |
CN1820897A (zh) * | 2005-02-18 | 2006-08-23 | 株式会社迪思科 | 晶片搬运装置 |
CN1963620A (zh) * | 2006-11-17 | 2007-05-16 | 友达光电股份有限公司 | 吸附装置 |
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2010
- 2010-05-25 CN CN2010101814070A patent/CN101866869B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1126544A (ja) * | 1997-07-08 | 1999-01-29 | Matsushita Electric Ind Co Ltd | ワーク搬送用キャリアの位置決め装置および位置決め方法 |
CN1820897A (zh) * | 2005-02-18 | 2006-08-23 | 株式会社迪思科 | 晶片搬运装置 |
CN1963620A (zh) * | 2006-11-17 | 2007-05-16 | 友达光电股份有限公司 | 吸附装置 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102082064A (zh) * | 2010-11-29 | 2011-06-01 | 常州亿晶光电科技有限公司 | 等离子刻蚀机硅片定压施压夹具 |
CN107973122A (zh) * | 2016-10-21 | 2018-05-01 | 南京瀚宇彩欣科技有限责任公司 | 活动式支撑机构 |
CN107973122B (zh) * | 2016-10-21 | 2020-04-28 | 南京瀚宇彩欣科技有限责任公司 | 活动式支撑机构 |
CN109590705A (zh) * | 2018-12-26 | 2019-04-09 | 上海福赛特机器人有限公司 | 一种晶圆自动装配装置及自动装配方法 |
CN109590705B (zh) * | 2018-12-26 | 2020-09-04 | 上海福赛特机器人有限公司 | 一种晶圆自动装配装置及自动装配方法 |
CN115036248A (zh) * | 2022-08-12 | 2022-09-09 | 安徽大华半导体科技有限公司 | 一种防过载芯片推出装置 |
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CN101866869B (zh) | 2012-08-29 |
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