CN101859753B - 具有连接装置和内部接头元件的功率半导体模块 - Google Patents
具有连接装置和内部接头元件的功率半导体模块 Download PDFInfo
- Publication number
- CN101859753B CN101859753B CN201010143190.4A CN201010143190A CN101859753B CN 101859753 B CN101859753 B CN 101859753B CN 201010143190 A CN201010143190 A CN 201010143190A CN 101859753 B CN101859753 B CN 101859753B
- Authority
- CN
- China
- Prior art keywords
- power semiconductor
- contact
- conductor belt
- jockey
- semiconductor modular
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
- H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/0601—Structure
- H01L2224/0603—Bonding areas having different sizes, e.g. different heights or widths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
- H01L2224/061—Disposition
- H01L2224/0618—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/06181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/2401—Structure
- H01L2224/2402—Laminated, e.g. MCM-L type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
- H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
- H01L2224/241—Disposition
- H01L2224/24151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/24221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/24225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/24226—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
- H01L2224/83201—Compression bonding
- H01L2224/83205—Ultrasonic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8384—Sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
一种具有连接装置和内部接头元件的功率半导体模块,功率半导体模块具有至少一个功率半导体部件,功率半导体模块具有与功率半导体部件相接触的、由层复合体组成的连接装置,层复合体由至少一个面向功率半导体部件的、构成至少一个第一导体带的第一导电层和在层复合体中接下来的绝缘层以及在层复合体中再接下来的远离功率半导体部件的、构成至少一个第二导体带的第二层组成。此外,功率半导体模块具有至少一个内部接头元件,内部接头元件构成为具有第一接触区段和第二接触区段以及有弹性的区段的接触弹簧,此处第一接触区段具有与连接装置的第一导体带或第二导体带共同的接触面。根据本发明的功率半导体模块减少了引线接合连接部的数量。
Description
技术领域
本发明描述了一种具有内部连接装置的功率半导体模块,该连接装置构成为层复合体,该层复合体由多数个导电层组成,这些导电层从其那方面可以构成多数个导体带和在这些层之间布置的绝缘层。该连接装置有助于功率半导体部件彼此间的电连接或者到衬底的其它导体带的电连接。
背景技术
本发明的出发点是功率半导体模块,像功率半导体模块例如由DE103 55 925 A1公知的那样。它原则上公开了一种上述类型的连接装置。这里借助于超声波焊接将功率半导体部件与第一导电层持久地可靠地电连接。功率半导体元件的模块内部的符合线路要求的连接部在这里敞开地放置,该连接部既包括内部的负载接头又包括控制器接头。为此,连接装置具有在导电层之间穿过绝缘层的穿通接触部。以这种方式将一层的导体带与另一层的导体带电连接。
例如DE 10 2006 027 482 A1公开了所称类型的功率半导体模块的外部连接装置。此处一方面公开的是螺纹接触连接部且另一方面公开的是弹簧加载的插塞接触连接部。
与此相对的是,DE 10 2006 013 078公开了一种具有上述连接装置的功率半导体模块,在该功率半导体模块中,借助于薄引线接合来构成两个导电层之间的穿通接触部。因为所称类型的连接装置还应当用于代替功率半导体模块内的接合连接,并且应当通过它们的使用来改善内部连接部的抗疲劳强度,所以在这里用于构成穿通接触部的薄引线接合连接的使用可能不完全令人满意。
发明内容
因此,本发明的任务在于,通过如下方式进一步形成一种具有连接装置的功率半导体模块,即,减少引线接合连接部的数量。
根据本发明,本任务通过权利要求1所述的方法来解决。优选的实施方式在从属权利要求中描述。
本发明的思想以开头所称类型的功率半导体模块为出发点,该功率半导体模块具有至少一个功率半导体部件以及连接装置,该连接装置用于将至少一个功率半导体部件与另一功率半导体部件或与衬底的导体带进行符合线路要求的模块内部的连接。优选借助于衬底可以将这种功率半导体模块布置在冷却装置上。此外,这种功率半导体模块优选具有绝缘的、包围带有至少一个功率半导体部件的衬底和连接装置的壳体。
连接装置由层复合体组成,该层复合体由至少两个导电层和布置在这些导电层之间的绝缘层组成。优选的是还可以设置由连接装置的绝缘层和导电层组成的其它层状序列。在不限制普遍性的情况下,出于清楚明了的原因,下面仅还涉及具有两个导电层和一个绝缘层的连接装置的最简单的方案。
相应的导电层可以自身结构化并且由此形成多数个彼此绝缘的第一导体带。第一导电层的至少一个第一导体带与功率半导体部件的接触面导电连接。此处,材料配合的连接或者还有压力接触连接根据现有技术被证实是特别具有优点的。在层状序列中,在面向功率半导体部件的该第一导电层之后是连接装置的绝缘层,并且邻接的再是连接装置的远离功率半导体部件的导电层。
根据本发明,功率半导体部件具有至少一个内部接头元件,其中,该内部接头元件构成为具有第一和第二接触区段以及有弹性的区段的接触弹簧。该接触弹簧的第一接触区段具有与连接装置的第一或第二导体带共同的接触面。
此处优选的是,与第一或第二导体带的接触面布置在连接装置的凹隙中。由此提高了导体带与接触弹簧之间的接触可靠性,即使是在机械影响或热影响下,这些影响会引起整个接触弹簧或者接触弹簧的第一接触装置横向运动。由此还简化了在壳体中对接触弹簧的可能的固定和引导,这是因为必须满足对接触弹簧或其第一接触区段的定位的这些低的要求。
在第一优选构造方案中,通过第二导体带的和绝缘层的空隙形成该凹隙。于是出现了连接装置的开口,该开口以穿过的方式到达第一导体带,由此接触面因此布置在该第一导体带上并且接触弹簧因此建立到该第一导体带的导电连接。
在第二优选的构造方案中,通过第二导体带的凹陷部形成该凹隙,该凹陷部没有完全切穿该导体带,由此将接触面布置在第二导体带上,并且接触弹簧因此建立到该第二导体带的导电连接。
此外特别具有优点的是,接触弹簧的第二接触装置从功率半导体模块的壳体中突出。由此功率半导体模块并且因此连接装置可以与外部接头元件直接连接。
附图说明
结合图1至4的实施例来进一步阐述本发明的解决方案。
图1示出根据现有技术的功率半导体模块的剖面图。
图2示出根据现有技术的功率半导体模块的连接装置的详图。
图3示出根据本发明的功率半导体模块的连接装置的详图。
图4示出根据本发明的功率半导体模块的剖面图。
具体实施方式
图1示出根据现有技术的功率半导体模块的剖面图。显示出的是,功率半导体模块布置在冷却装置76上,其中,功率半导体模块具有带有功率半导体部件10和连接装置20的衬底74。功率半导体模块的这些部分10、20、74由壳体70包围并覆盖。这里衬底74构成功率半导体模块的下面的连接部。
连接装置20通过层状序列来形成,该层状序列由面向功率半导体部件10的第一导电层22、在层状序列中邻接在这里的绝缘层24和第二导电层26组成。优选的是,导电层22、26的层厚度为10μm至500μm之间,而绝缘层24的层厚度为2μm至100μm之间。
导电层22、26根据现有技术形成功率半导体部件10和衬底74的模块内部的符合线路要求的连接部并且以此代替各种公知的引线接合连接部。当然此处也有必要的是,设置用于将第一导电层的第一导体带22与第二导电层的第二导体带26连接起来的穿通接触部90。该穿通接触部90构成为绝缘层的导电式填充的凹隙。
此外,这里连接装置20有助于以带有外部接头元件80的螺纹连接部82、84形式出现的外部接触部。外部接触部的类型特别适用于负载接头。辅助接头(如控制器接头、辅助发射器接头或传感器接头)的外部接触部也作为插塞连接部或钎焊连接部而公知。
图2示出根据现有技术的具有控制器接头区域14和发射器接头区域16的功率半导体模块10的连接装置。这里显示出的是上述(参见图1)穿通接触部90的供选方案。在该公知的构造方案中,部分布置在连接装置20的凹隙40中的薄引线接合连接部92形成连接装置的第一导电层的第一导体带22与第二导电层的第二导体带26之间的导电连接。
图3示出根据本发明的功率半导体模块的连接装置20、功率半导体部件10和传感器50的详图。功率半导体部件10,在这里是功率晶体管,在其第一主体面12上具有两个接触区域:一个控制器接头区域14和一个发射器接头区域16。这两个接触区域14、16与连接装置20的第一层的配属的并且理所当然彼此电绝缘的第一导体带22连接。特别优选的是,这两个连接构造为材料配合的连接,优选通过烧结工艺来建立。
这里连接装置20具有三个彼此电绝缘的第一导体带22,这些第一导体带22通过将第一导电层结构化而形成。该第一层形成连接装置20的面向功率半导体部件10的面。此外,连接装置20具有两段绝缘层24。然后在连接装置20的层构造中,该连接装置20的第二导电层接到连接装置20的远离功率半导体部件10的侧上,同样将该第二导电层结构化,并且因此具有两个彼此电绝缘的第二导体带22。
借助于封装的或者还未封装的传感器50的接头元件52将封装的或者还未封装的传感器50与这些第二导体带26之一导电连接。该传感器50有助于在功率半导体模块中进行测量,例如电流测量或温度测量。功率半导体模块具有第一内部接头元件30用于其外部连接。该第一内部接头元件30构成为具有第一接触区段32和第二接触区段36以及有弹性的区段34的接触弹簧30。第一接触区段32与配属的第二导体带26导电接触,并且为此具有与该第二导体带26共同的接触面62。
该接触面62布置在第二导体带22的凹隙42中,其通过第二导体带22的凹陷部而构成。接触弹簧30的第一接触区段32可以不同方式地构成,当然在这里重要是构成第二导体带26的凹陷部42。通过该凹陷部42基本上阻止了接触弹簧30的第一接触区段32的由机械作用或热作用造成的横向运动。
这种效果通过凹隙40来实现,绝缘层24以及第二导电层的相叠的区域通过空隙形成该凹隙40。该空隙通过如下方式构成,即,由此形成的凹隙40穿过连接装置到达第一导电层上。
因此布置在该凹隙40中的接触弹簧30在接触面60上与该第一导体带22接触,该第一导体带22与功率半导体部件10的控制器接头14连接。因此,通过内部接头元件,即接触弹簧30,能够进行对功率半导体部件10的直接控制。此处特别具有优点的是,第二接触区段36可以直接与外部引线连接。
图4示出根据本发明的功率半导体模块的剖面图,该功率半导体模块具有布置在冷却装置76上的衬底74和进行包围的壳体70。借助于所述的连接装置20构成模块内部的符合线路要求的连接。仅示出其中的内部接触装置接触弹簧30,这些内部接触装置布置在杯形的壳体70的引导部中,其中,这些接触弹簧30的第二接触区段36从壳体70中突出,并且直接与外部接头元件(例如控制电路板)连接。
Claims (5)
1.功率半导体模块,所述功率半导体模块具有至少一个功率半导体部件(10),所述功率半导体模块具有与所述功率半导体部件(10)相接触的由层复合体组成的连接装置(20),所述层复合体由至少一个面向所述功率半导体部件(10)的、构成至少一个第一导体带(22)的第一导电层;在所述层复合体中接下来的绝缘层(24)和在所述层复合体中再接下来的远离所述功率半导体部件(10)的、构成至少一个第二导体带(26)的第二层组成,并且所述功率半导体模块具有至少一个内部接头元件(30),其中,所述内部接头元件构成为具有第一接触区段(32)和第二接触区段(36)以及有弹性的区段(34)的接触弹簧(30),其中,所述第一接触区段(32)具有与所述连接装置(20)的第一导体带(22)或第二导体带(26)共同的接触面(60、62),
其中,与第一导体带(22)或第二导体带(26)的所述接触面(60、62)布置在所述连接装置(20)的凹隙(40、42)中,
其中,通过所述第二导体带(26)的和所述绝缘层(24)的空隙形成所述凹隙(40),作为开口,并且所述接触面(60)因此布置在所述第一导体带(22)上,或者
其中,通过所述第二导体带(26)的凹陷部形成所述凹隙(42),并且所述接触面(62)因此布置在所述第二导体带(26)上。
2.根据权利要求1所述的功率半导体模块,其中,所述导电层(22、26)的层厚度为10μm至500μm之间,而所述绝缘层(24)的层厚度为2μm至100μm之间。
3.根据权利要求1所述的功率半导体模块,其中,所述至少一个功率半导体部件(10)布置在衬底(74)上,并且所述功率半导体模块具有壳体(70),所述壳体(70)包围并覆盖带有所述至少一个功率半导体部件(10)的所述衬底(74)和在壳体(70)中的所述连接装置(20)。
4.根据权利要求3所述的功率半导体模块,其中,所述内部接头元件(30)部分地布置在所述功率半导体模块的所述壳体(70)的引导部(72)中,并且所述内部接头元件(30)的所述第二接触区段(36)从所述壳体(70)中突出并且能够在那里与外部接头元件连接。
5.根据权利要求1所述的功率半导体模块,其中,所述连接装置(20)的至少一个第一导体带(22)与所述功率半导体部件(10)的至少一个接头区域(14、16)连接,并且这种连接被构造为材料配合的连接或者压力接触连接。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009017733.7 | 2009-04-11 | ||
DE102009017733A DE102009017733B4 (de) | 2009-04-11 | 2009-04-11 | Leistungshalbleitermodul mit einer Verbindungseinrichtung und mit als Kontaktfeder ausgebildeten internen Anschlusselementen |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101859753A CN101859753A (zh) | 2010-10-13 |
CN101859753B true CN101859753B (zh) | 2014-06-04 |
Family
ID=42237175
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010143190.4A Active CN101859753B (zh) | 2009-04-11 | 2010-03-24 | 具有连接装置和内部接头元件的功率半导体模块 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8247899B2 (zh) |
EP (1) | EP2239768A1 (zh) |
JP (1) | JP5649321B2 (zh) |
KR (1) | KR101709786B1 (zh) |
CN (1) | CN101859753B (zh) |
DE (1) | DE102009017733B4 (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009024385B4 (de) * | 2009-06-09 | 2011-03-17 | Semikron Elektronik Gmbh & Co. Kg | Verfahren zur Herstellung eines Leistungshalbleitermoduls und Leistungshalbleitermodul mit einer Verbindungseinrichtung |
KR101443980B1 (ko) | 2012-11-27 | 2014-09-23 | 삼성전기주식회사 | 접속핀 및 이를 갖는 전력 모듈 패키지 |
DE102013111422A1 (de) | 2013-10-16 | 2015-04-30 | Osram Oled Gmbh | Optoelektronisches Bauelement, Kontaktiervorrichtung und optoelektronische Baugruppe |
DE102014115812B4 (de) * | 2014-10-30 | 2019-09-05 | Infineon Technologies Ag | Halbleitermodul und Halbleitermodulanordnung mit geringen Kriechströmen |
DE102014222189B4 (de) | 2014-10-30 | 2022-06-30 | Infineon Technologies Ag | Halbleiterbaugruppe und Leistungshalbleitermodul |
DE102016107083B4 (de) * | 2016-04-18 | 2019-05-23 | Semikron Elektronik Gmbh & Co. Kg | Leistungselektronische Anordnung und Fahrzeug hiermit |
DE102019117476B4 (de) | 2019-06-28 | 2024-03-14 | Semikron Elektronik Gmbh & Co. Kg | Leistungselektronische Schalteinrichtung mit einem Anschlusselement |
DE102020200106A1 (de) * | 2020-01-08 | 2021-07-08 | Robert Bosch Gesellschaft mit beschränkter Haftung | Kontaktanordnung |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006027482B3 (de) * | 2006-06-14 | 2007-08-16 | Semikron Elektronik Gmbh & Co. Kg | Gehauste Halbleiterschaltungsanordnung mit Kontakteinrichtung |
CN101202258A (zh) * | 2006-12-13 | 2008-06-18 | 塞米克朗电子有限及两合公司 | 具有接触弹簧的功率半导体模件 |
EP1956647A1 (de) * | 2007-02-10 | 2008-08-13 | SEMIKRON Elektronik GmbH & Co. KG | Schaltungsanordnung mit Verbindungseinrichtung sowie Herstellungsverfahren hierzu |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10121970B4 (de) * | 2001-05-05 | 2004-05-27 | Semikron Elektronik Gmbh | Leistungshalbleitermodul in Druckkontaktierung |
EP1391966A1 (de) * | 2002-08-19 | 2004-02-25 | ABB Schweiz AG | Druckkontaktfeder und Anwendung in Leistungshalbleitermodul |
JP2004281538A (ja) * | 2003-03-13 | 2004-10-07 | Seiko Epson Corp | 電子装置及びその製造方法、回路基板並びに電子機器 |
DE10355925B4 (de) * | 2003-11-29 | 2006-07-06 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul und Verfahren seiner Herstellung |
JP4764979B2 (ja) * | 2004-06-08 | 2011-09-07 | 富士電機株式会社 | 半導体装置 |
JP4613590B2 (ja) * | 2004-11-16 | 2011-01-19 | セイコーエプソン株式会社 | 実装基板及び電子機器 |
DE102004061099B4 (de) * | 2004-12-18 | 2010-11-11 | Semikron Elektronik Gmbh & Co. Kg | Verfahren zur Herstellung eines Leistungshalbleitermoduls mit ESD-Schutzbeschaltung |
DE102005050534B4 (de) * | 2005-10-21 | 2008-08-07 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul |
DE102005053398B4 (de) * | 2005-11-09 | 2008-12-24 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul |
DE102006013078B4 (de) * | 2006-03-22 | 2008-01-03 | Semikron Elektronik Gmbh & Co. Kg | Kompaktes Leistungshalbleitermodul mit Verbindungseinrichtung |
DE102006015198A1 (de) * | 2006-04-01 | 2007-10-11 | Semikron Elektronik Gmbh & Co. Kg | Verbindungseinrichtung für elektronische Bauelemente |
DE102006058694B4 (de) * | 2006-12-13 | 2011-06-16 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit Kontaktfedern |
-
2009
- 2009-04-11 DE DE102009017733A patent/DE102009017733B4/de active Active
-
2010
- 2010-02-13 EP EP10001492A patent/EP2239768A1/de not_active Withdrawn
- 2010-03-24 CN CN201010143190.4A patent/CN101859753B/zh active Active
- 2010-04-06 JP JP2010087724A patent/JP5649321B2/ja active Active
- 2010-04-08 KR KR1020100032211A patent/KR101709786B1/ko active IP Right Grant
- 2010-04-12 US US12/758,237 patent/US8247899B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102006027482B3 (de) * | 2006-06-14 | 2007-08-16 | Semikron Elektronik Gmbh & Co. Kg | Gehauste Halbleiterschaltungsanordnung mit Kontakteinrichtung |
CN101202258A (zh) * | 2006-12-13 | 2008-06-18 | 塞米克朗电子有限及两合公司 | 具有接触弹簧的功率半导体模件 |
EP1956647A1 (de) * | 2007-02-10 | 2008-08-13 | SEMIKRON Elektronik GmbH & Co. KG | Schaltungsanordnung mit Verbindungseinrichtung sowie Herstellungsverfahren hierzu |
Also Published As
Publication number | Publication date |
---|---|
JP2010251749A (ja) | 2010-11-04 |
EP2239768A1 (de) | 2010-10-13 |
DE102009017733B4 (de) | 2011-12-08 |
JP5649321B2 (ja) | 2015-01-07 |
KR20100113034A (ko) | 2010-10-20 |
CN101859753A (zh) | 2010-10-13 |
US8247899B2 (en) | 2012-08-21 |
KR101709786B1 (ko) | 2017-03-08 |
DE102009017733A1 (de) | 2010-10-21 |
US20100258935A1 (en) | 2010-10-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101859753B (zh) | 具有连接装置和内部接头元件的功率半导体模块 | |
US7683472B2 (en) | Power semiconductor modules and method for producing them | |
US9768094B2 (en) | Power electronics module with load connection elements | |
US20070194429A1 (en) | Pressure contact power semiconductor module | |
US7495324B2 (en) | Power semiconductor module | |
US20070194443A1 (en) | Power semiconductor modules having a cooling component and method for producing them | |
CN101047172B (zh) | 具有连接装置的紧凑型功率半导体模块 | |
CN100588038C (zh) | 半导体装置及其制造方法 | |
US20130285232A1 (en) | Semiconductor package module | |
TW200707677A (en) | Package, subassembly and methods of manufacturing thereof | |
JP5156355B2 (ja) | 接触バネを有するパワー半導体モジュール | |
US10763244B2 (en) | Power module having power device connected between heat sink and drive unit | |
JP2012178504A (ja) | 半導体装置、および、半導体装置の実装構造 | |
US20150262985A1 (en) | Photorelay | |
US9812431B2 (en) | Power semiconductor module | |
CN105514048A (zh) | 电子模块和用于制造电子模块的方法 | |
KR101672548B1 (ko) | 전력 반도체 모듈의 제조방법, 및 접속장치를 포함하는 전력 반도체 모듈 | |
CN102903681A (zh) | 在功率半导体模块中的衬底的柔性连接 | |
CN105789143A (zh) | 电子组件 | |
US7030491B2 (en) | Power semiconductor module with deflection-resistant base plate | |
CN108172550B (zh) | 用于电力电子开关装置的压力装置、开关装置及其配置 | |
CN105393350A (zh) | 功率半导体模块 | |
US20190267736A1 (en) | Semiconductor module | |
CN109219246B (zh) | 封装的集成电路构件 | |
CN108010891B (zh) | 功率半导体模块 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |