CN101858871B - 一种pcb板检测方法 - Google Patents
一种pcb板检测方法 Download PDFInfo
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- CN101858871B CN101858871B CN201010195946XA CN201010195946A CN101858871B CN 101858871 B CN101858871 B CN 101858871B CN 201010195946X A CN201010195946X A CN 201010195946XA CN 201010195946 A CN201010195946 A CN 201010195946A CN 101858871 B CN101858871 B CN 101858871B
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CN201010195946XA CN101858871B (zh) | 2010-06-04 | 2010-06-04 | 一种pcb板检测方法 |
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CN101858871A CN101858871A (zh) | 2010-10-13 |
CN101858871B true CN101858871B (zh) | 2011-07-27 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102608131A (zh) * | 2012-02-29 | 2012-07-25 | 博罗县精汇电子科技有限公司 | 线路板制造中胶带掉胶的检测方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102721696B (zh) * | 2012-05-22 | 2014-05-07 | 珠海承鸥卫浴用品有限公司 | 无铅铜合金压铸件表面缺陷的快速检测方法 |
CN105717105A (zh) * | 2016-01-29 | 2016-06-29 | 奥瑞金包装股份有限公司 | 一种检测覆膜铁表面缺陷的溶液和方法 |
CN110461097A (zh) * | 2019-08-23 | 2019-11-15 | 惠州中京电子科技有限公司 | 一种改善led印制线路板色差的方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1448537A (zh) * | 2002-03-28 | 2003-10-15 | 陈平助 | 非导体表面金属化的方法 |
CN101033550A (zh) * | 2007-03-27 | 2007-09-12 | 广东东硕科技有限公司 | 一种微蚀液及其在印制线路板沉银前处理中的应用 |
CN201289466Y (zh) * | 2008-10-09 | 2009-08-12 | 广东正业科技有限公司 | 一种印刷电路板外观检查机 |
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JPS62299711A (ja) * | 1986-06-20 | 1987-12-26 | Fujitsu Ltd | パタ−ン検査装置 |
JP2002250693A (ja) * | 2001-02-26 | 2002-09-06 | Toshiba Corp | 電子回路部品の金属露出部検出方法および耐環境性電子回路部品 |
JP2005257585A (ja) * | 2004-03-15 | 2005-09-22 | Doshisha | 金属表面状態検出装置及び検出方法 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1448537A (zh) * | 2002-03-28 | 2003-10-15 | 陈平助 | 非导体表面金属化的方法 |
CN101033550A (zh) * | 2007-03-27 | 2007-09-12 | 广东东硕科技有限公司 | 一种微蚀液及其在印制线路板沉银前处理中的应用 |
CN201289466Y (zh) * | 2008-10-09 | 2009-08-12 | 广东正业科技有限公司 | 一种印刷电路板外观检查机 |
Non-Patent Citations (3)
Title |
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JP昭62-299711A 1987.12.26 |
JP特开2002-250693A 2002.09.06 |
JP特开2005-257585A 2005.09.22 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102608131A (zh) * | 2012-02-29 | 2012-07-25 | 博罗县精汇电子科技有限公司 | 线路板制造中胶带掉胶的检测方法 |
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Inventor after: Wu Shengguang Inventor before: Liu Dong Inventor before: Zhou Gang Inventor before: Lin Jianzhu |
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Effective date of registration: 20180213 Address after: 523000 Guangdong Province, Dongguan City Zhangmutou Yinyang Avenue Dongshen industrial city Patentee after: Dongguan first rich Electronics Co., Ltd. Address before: 516008 Guangdong province Huizhou City Road seven Lane three, eling Park in Beijing Patentee before: Huizhou China Eagle Electronic Technology Co., Ltd. |
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