CN101856759A - Component disassembling method on circuit board for failure analysis - Google Patents
Component disassembling method on circuit board for failure analysis Download PDFInfo
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- CN101856759A CN101856759A CN 201010137480 CN201010137480A CN101856759A CN 101856759 A CN101856759 A CN 101856759A CN 201010137480 CN201010137480 CN 201010137480 CN 201010137480 A CN201010137480 A CN 201010137480A CN 101856759 A CN101856759 A CN 101856759A
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Abstract
The invention discloses a component disassembling method on a circuit board for failure analysis. The method comprises the following steps of: pre-processing; pre-heating; disassembling a component; leveling solder; cleaning and drying, wherein the component which is not in welded connection is disassembled by using a mechanical method during the pre-processing; the circuit board is pre-heated; the circuit board is heated in high temperature medium of a certain temperature until the solder is melted during the disassembling of the component and the leveling of the solder; the component on the circuit board is disassembled and the solder on the pad on the surface of the circuit board is leveled in liquid medium; and a clean and flat circuit board is used for an electrical test of a flying probe or a clamp, so that the failed network of the circuit board is found out and the failure analysis is performed. Compared with a conventional method, the method greatly improves the disassembling efficiency and can avoid the defects of possible damage to the circuit board, serious short-circuit failure of the circuit board caused by soldering adhesion, non-flatness of the surface of the pad, and the incapability of being used for the electrical test of the flying probe or the clamp of the circuit board and the like.
Description
Technical field
The present invention relates to the electronic product failure analysis method, the method for dismounting of the components and parts on particularly a kind of wiring board.
Background technology
After electronic product broke down, the engineering staff was when carrying out failure analysis, and a wherein important step is exactly network or the position that inefficacy takes place in the location in electron product circuit.
For the plate level fault of general electronic products, its possible reason is nothing more than three kinds: the one, and the components and parts fault, the 2nd, be connected fault, the 3rd, wiring board fault between components and parts and the wiring board.
During for the wiring board accident analysis, need find the wiring board network site of breaking down earlier, owing to have hundreds of network on a wiring board, it is then complicated more that the network of the PCBA that goes up components and parts is welded in assembling, the ICT functional test of SMT producer also can only be with possible fault location to certain module or zone, these modules or zone may comprise one or more elements, therefore chip and a plurality of PCB network do not have a kind of method can not test one by one these wiring board module or regional all-networks of having assembled components and parts yet.The electrical testing of PCB factory can carry out 100% test to all wiring board networks, but can only be to there not being the wiring board bare board test of components and parts, and to having welded the wiring board of components and parts, most of pad is all covered by components and parts, can't directly carry out the wiring board electrical testing and locate the network and the position of breaking down, must be with all components and parts complete removals.
When carrying out the wiring board failure analysis at present, remove components and parts if desired wiring board is carried out fault location and analysis, all be to adopt methods such as heat gun or electric iron, it is very low that these methods are removed efficient on the one hand, on the other hand the damage that may cause wiring board or because a large amount of short circuits of wiring board that the scolding tin adhesion causes and bond pad surface out-of-flatness and can not be used for wiring board flying needle or anchor clamps electrical testing.
Reclaim based on components and parts at present, scolder reclaims, perhaps board substrate reclaims and the method for dismounting with the components and parts on the wiring board of invention has had multiple, comprise selectivity dismounting and globality dismounting etc., as adopting scolder among Chinese patent CN101112728 and the CN101362239, can't avoid removing the situation that pad scolder adhesion on the components and parts rear board causes introducing short circuit as heat medium; Adopt silicone oil as heat medium among Chinese patent CN2904571 and the CN1288795, but be to use the mechanical shock mode, can cause mechanical damage wiring board with the components and parts on the wiring board that shakes; Chinese patent CN1600458, CN101014227, CN1590032, adopt air as heat medium among CN101014228 and the CN101014229, equipment is huge, heat transfer rate is slow and the heat transfer uniformity is bad, and adopts the components and parts on steel wire round brush or mechanical shock and the mode of vibration dismounting wiring board, can cause mechanical damage to wiring board; Chinese patent CN2843016, CN1935398, CN1897790, CN1832663, CN2904571 adopt liquid as heat medium, and the cam mechanical oscillation are impacted, manually beat, or mode such as ultrasonic vibration removes components and parts on the wiring board, equipment is huge and can cause mechanical damage to wiring board.More than these based on board substrate, scolder, circuit board component method for dismounting and equipment that metal material etc. reclaim, appliance arrangement is too complicated or huge, be applicable to large batch of dismantling circuit board work, and be not suitable for the circuit board component dismounting work that is used for failure analysis of a small amount of a slice or several samples; In addition, more than these based on board substrate, circuit board component method for dismounting and equipment that scolder, metal material etc. reclaim, all there be not the protection of consideration to wiring board, wherein adopted strong mechanical oscillation, beaten, ultrasonic, perhaps mode such as steel wire round brush, these modes all may cause in various degree damage to wiring board, thereby other defect is introduced wiring board, therefore are not suitable for the wiring board failure analysis; And, more than based on board substrate, scolder, circuit board component method for dismounting and equipment that metal material etc. reclaim, 100% electrical testing that behind the consideration dismounting components and parts wiring board is used for wiring board flying needle or anchor clamps, therefore PCB surface scolder out-of-flatness has a large amount of scolding tin adhesions and has introduced circuit defect between pad and the pad, thereby wiring board can't be used for failure analysis.
Summary of the invention
The object of the present invention is to provide the component disassembling method on a kind of wiring board that is used for failure analysis, can remove the components and parts on the wiring board during wiring board failure analysis fully, do not damage simultaneously the method and apparatus of wiring board, the wiring board behind the dismounting components and parts can be located the wiring board network or the position of breaking down by the PCB electrical testing.
For achieving the above object, technical scheme of the present invention is:
Component disassembling method on a kind of wiring board that is used for failure analysis, it comprises following steps:
1) preliminary treatment
Remove all non-components and parts that are welded to connect on the wiring board;
2) preheating
With anchor clamps wiring board is transferred to the baking oven baking, baking temperature is 100 degree～120 degree, toasts 2～6 hours; Remove on the one hand the steam of waiting to remove in the wiring board, thereby can reduce the wiring board damage that the temperature shock to wiring board may cause when on the other hand wiring board being put into heating tank;
3) remove first of wiring board and go up components and parts
Wiring board after the baking is put into heating tank, and wiring board and top components and parts thereof must be immersed in below the heating tank liquid level fully, with the heat medium temperature in the heating tank be elevated to than scolding tin fusing point high 10 ℃～30 ℃ temperature, heated 0.5～5 minute; Hand-held components and parts shovel in the heating process becomes the angle of 30 degree to 60 degree with wiring board, push ahead in PCB surface, and the components and parts after the melts soldering tin are released from wiring board;
4) solder leveling on the wiring board
After treating the full scale clearance of the first bin device,, be close to the wiring board shoveling,, and make bond pad surface smooth with the scolding tin of removal wiring board bond pad surface with the width components and parts shovel suitable with the wiring board width;
5) remove second of wiring board and go up components and parts
Turnover fixture, wiring board are not removed one of components and parts as yet and are faced up, and transfer to heating tank again, in heating tank, heated 0.5～5 minute, hand-held components and parts shovel is pushed ahead in PCB surface in the heating process, and the components and parts after the melts soldering tin are released from wiring board;
6) solder leveling on the wiring board pad
After treating the full scale clearance of the second bin device,, be close to the wiring board shoveling,, and make bond pad surface smooth with the scolding tin of removal wiring board bond pad surface with the width components and parts shovel suitable with the wiring board width;
7) cooling and sample removal
Wiring board and the anchor clamps of removing the second bin device are taken out with shadoof from media slot, treat wiring board and anchor clamps cool to room temperature after, with wiring board removal from the anchor clamps.
After treating the medium cool to room temperature in the media slot, the framework that steel wire is housed is taken out from heating tank, with components and parts and scolder cleaning wherein.
8) cleaning-drying
To remove wiring board soaking and washing in suitable solvent of components and parts, dry then, then clean smooth wiring board is used for failure analysis.
Further, described heat medium is a liquid nonwetting with scolding tin or that wetability is lower, can use silicone oil or methyl-silicone oil or dimethicone.
Again, the temperature of described heat medium is 230 ℃～280 ℃.
In addition, hand-held components and parts shovel in the heating process becomes the angle of 30 degree to 60 degree with wiring board, push ahead in PCB surface, and the components and parts after the melts soldering tin are released from wiring board.
The material of described components and parts shovel is close or identical with the wiring board material of components and parts to be removed, can be FR4 sheet material, phenolic resins sheet material, PTFE sheet material or PI sheet material.
Described components and parts shovel comprise width be 5mm-10mm shovel mouthful for flat mouthful small size components and parts shovel, less element pasted on surface such as shoveling resistance, electric capacity;
Width is 20mm-50mm, the shovel mouthful medium size components and parts shovel for flat mouth, components and parts such as QFP that shoveling is bigger and BGA;
Width be 100mm-300mm, shovel mouthful be the large size components and parts of angle shovel, the angle angle of large size components and parts shovel be 30 degree to 70 degree, remove the scolding tin of wiring board bond pad surface, and make bond pad surface smooth.
Heating tank of the present invention comprises, cell body, and framework is arranged in the cell body, is provided with before and after the framework and can be shelved on the cell body groove along last protuberance, and steel wire is installed on the framework; Heating tube or heating plate are arranged on the cell body; Discharging tube is arranged at the cell body bottom, and valve is housed on the discharging tube; Anchor clamps shelves bar is arranged at the cell body groove along last, and is locked in cell body groove edge by lock(ing) bolt.
The order number of described steel wire is 100 order to 300 orders.
The described anchor clamps that are used for the clamping wiring board comprise that at least 4 pillars set up separately in twos, in the middle of two pillars of homonymy a cross bar are set; Respectively connect between relative thirty years of age pillar, and lock by lock(ing) bolt by an internal and external casing; Cross bar offers chute along its length; Some clamping compressing tablets are arranged on the cross bar, and by locked with bolts, bolt is slidedly arranged in the cross bar chute.
The invention provides the heating tank that is used for heat medium, the heating tank cell body adopts stainless steel, heating tank can adopt heating tube or heating plate to heat, the controllable temperature of heating tank is between 100 degrees centigrade to 400 degrees centigrade, the medium of heating tank heating uses silicone oil, methyl-silicone oil, the dimethyl-silicon wet goods.The degree of depth of heating tank more than 60mm so as can the most of wiring boards of submergence when implementing and on components and parts, and wiring board can directly not touch heaters such as heating tube in the heating tank or heating plate.The framework that the little 2mm-5mm of profile in the one length-width ratio heating tank is arranged in the heating tank, framework are used for preventing that anchor clamps and wiring board from directly contacting with heaters such as the heating tube of heating tank or heating plates, and may cause the damage to wiring board.100 orders-300 purpose steel wire is installed on the framework, and its effect is to collect components and parts and the scolder that comes off, and after enforcement is finished, the framework that steel wire is housed can be taken out from heating tank, removes and wherein collects components and parts and the scolder that comes off.
The invention provides the suitable special anchor clamps that are used for the clamping wiring board, clamp material adopts stainless steel, the length of anchor clamps is fixed, width can be regulated and can lock by sleeve pipe, to adapt to the wiring board clamping of different sizes, adopts the clamping nut to grip between wiring board and the anchor clamps, the anchor clamps both sides can be installed 2 or more clamping nut respectively, the clamping nut enterprising line position of anchor clamps length direction is again regulated, and adapting to different wiring boards, and avoids the components and parts at wiring board edge.Distance to anchor clamps upper surface and lower surface after the wiring board clamping is identical.The special shadoof of mobile employing of anchor clamps, shadoof also can hinge through be regulated width, to adapt to the width that anchor clamps are regulated.When moving anchor clamps, lancet is opened with shadoof, ride over the anchor clamps both sides the anchor clamps B-C post near, can move anchor clamps by hand-held shadoof handle.After taking out the components and parts of first of wiring board, only need anchor clamps to be taken out from heating tank with shadoof, anchor clamps are spun upside down, be that available shadoof is put into the component disassembling that heating tank carries out second with anchor clamps, therefore only need carry out a clamping in the whole implementation process, just can finish the dismounting of two sides components and parts wiring board.
The invention provides the components and parts shovel that is used to remove components and parts, its material is close or identical with the wiring board material of components and parts to be removed, is unlikely to damage wiring board when removing components and parts like this owing to its hardness is suitable with wiring board.
Beneficial effect of the present invention
Other tear the present invention and existing commonly used heat gun and flatiron etc. wiring board open and remove the components and parts method and compare, improved dismounting efficient on the one hand greatly, on the other hand owing in liquid medium, operate, wiring board be heated evenly and liquid and scolding tin between nonwetting, thereby the damage that can avoid may causing, a large amount of short circuits of wiring board that the scolding tin adhesion causes and bond pad surface out-of-flatness and can not be used for defectives such as wiring board flying needle or anchor clamps electrical testing to wiring board.
Description of drawings
Fig. 1 is the structural representation of heating tank in one embodiment of the invention;
Fig. 2 is the vertical view of Fig. 1;
Fig. 3 is the structural representation of anchor clamps in the embodiment of the invention;
Fig. 4 is the structural representation of shadoof in the embodiment of the invention.
The specific embodiment
The present invention will be further described below in conjunction with embodiment.
Referring to Fig. 1, Fig. 2, heating tank of the present invention comprises, cell body 1, and framework 2 is arranged in the cell body 1, and framework 2 front and back are provided with and can be shelved on cell body 1 groove along last protuberance 4, and steel wire 3 is installed on the framework 2, and the order number of steel wire 3 is 100 order to 300 orders; Heating tube or heating plate 9 are arranged on the cell body 1; Discharging tube 6 is arranged at cell body 1 bottom, and valve 5 is housed on the discharging tube 6; Anchor clamps shelves bar 7 is arranged at cell body 1 groove along last, and is locked in cell body 1 groove edge by lock(ing) bolt 8.
Referring to Fig. 3, the anchor clamps that are used for the clamping wiring board of the present invention comprise, 6 pillars, and each pillar 11,12,13 before, during and after 2 (is example with anchor clamps one side structure, down with) is oppositely arranged in twos, in the middle of two pillars of homonymy a cross bar 14 is set; Respectively connect between relative thirty years of age pillar by an internal and external casing 15,16, and by lock(ing) bolt 17 lockings; Cross bar 14 offers chute 18 along its length; Some clamping compressing tablets 19 are arranged on the cross bar 14, and by bolt 20 lockings, bolt 20 is slidedly arranged in the cross bar chute 18.
Present embodiment is according to equipment of the present invention and method the mobile phone board of the two-sided welding of a slice to be removed components and parts.
1) preliminary treatment
Remove all non-components and parts that are welded to connect on the wiring board, comprise grafting, crimping, snapping, the components and parts that various mechanical systems such as be threaded connect.
The pin of the through hole of bending welding if any bending, is broken off with the fingers and thumb it directly with instrument, also long pin can be cut off.
The scolding tin type that the wiring board assembling is used, scolder is the SAC305 lead-free solder, fusing point is 217 degrees centigrade.
By the width of sleeve pipe alignment jig, to be fit to the clamping wiring board; Adjust the position of sandwich nut, make the clamping nut clip be held on the wiring board and avoid components and parts; 2 clamping nuts of the every side clamping in wiring board both sides, locking anchor clamps width is regulated sleeve pipe, and shadoof is inserted in the bending of anchor clamps B-C post, locks shadoof then;
The special shadoof of mobile employing of anchor clamps, shadoof adopts stainless steel material, the middle part of shadoof 21 is handles 24, heat insulation foam 25 is installed on the handle 24, and shadoof is regulated width by hinge 23, to adapt to the width that anchor clamps are regulated, when moving anchor clamps with shadoof, lancet 22 is opened, ride over the anchor clamps both sides anchor clamps B-C post 12 near, can move anchor clamps by hand-held shadoof handle; As shown in Figure 4;
2) preheating
The anchor clamps of wiring board will be installed with shadoof transfer to baking oven, it is 110 degree that oven temperature is set, and toasts 4 hours.
3) remove the first bin device
Temperature with 260 degrees centigrade of the risings of the heat medium temperature in the heating tank, the anchor clamps of wiring board will be installed with shadoof to be transferred to the heating tank from baking oven in 1 minute, wiring board and top components and parts thereof must be immersed in the following 0.5cm-4cm of heating tank liquid level fully, mobile anchor clamps shelves bar is also locking to suitable position, with the fixed line board clamp.
The sight path plate bulk varies in size, and wiring board heats in heating tank and do not wait in 3～5 minutes.Hand-held components and parts shovel in the heating process becomes the angle of 30 degree to 60 degree with wiring board, push ahead in PCB surface, and the components and parts after scolding tin is melted are released from wiring board.General earlier with narrower small size components and parts shovel shoveling resistance, the element pasted on surface that electric capacity etc. are less, push away components and parts such as bigger QFP and BGA with slightly wide medium size components and parts shovel then, components and parts under the shoveling need complete shoveling to leave wiring board, and components and parts and scolding tin are fallen in the framework that steel wire is housed and collected.
To the components and parts of through hole welding, with pliers the components and parts of through hole welding upwards to be extracted, the components and parts of extracting directly are placed in the heating tank, also can hold with a suitable vessel in addition.
4) solder leveling on the wiring board
Use large size components and parts shovel, adopt the method for mechanical spatula.After treating the full scale clearance of the first bin device,, be close to the wiring board shoveling,, and make bond pad surface smooth with the scolding tin of removal wiring board bond pad surface with the width large size components and parts shovel suitable with the wiring board width.
5) remove the second bin device
Unclamp anchor clamps shelves bar, wiring board and the anchor clamps of having removed the first bin device are taken out with shadoof from heating tank, removed one of components and parts and faced up this moment, do not remove one of components and parts as yet and face down, and cooled off 3 minutes, the anchor clamps that wiring board is housed are spun upside down, removed one of components and parts and faced down this moment, do not remove one of components and parts as yet and face up, and the anchor clamps that wiring board will be housed with shadoof are transferred to heating tank, mobile anchor clamps shelves bar is also locking to suitable position, with the fixed line board clamp.
The sight path plate bulk varies in size, and wiring board heats in heating tank and do not wait in 0.5 minute-5 minutes.Hand-held components and parts shovel in the heating process becomes the angle of 30 degree to 60 degree with wiring board, push ahead in PCB surface, and the components and parts after scolding tin is melted are released from wiring board.General earlier with narrower small size components and parts shovel shoveling resistance, the element pasted on surface that electric capacity etc. are less, push away components and parts such as bigger QFP and BGA with slightly wide medium size components and parts shovel then, components and parts under the shoveling need complete shoveling to leave wiring board, and components and parts and scolding tin are fallen in the framework that steel wire is housed and collected.
To the components and parts of through hole welding, with pliers the components and parts of through hole welding upwards to be extracted, the components and parts of extracting directly are placed in the heating tank, also can place with a suitable vessel in addition.
6) solder leveling on the wiring board pad
Solder leveling on the wiring board uses large size components and parts shovel, adopts the method for mechanical spatula.After treating the full scale clearance of the second bin device,, be close to the wiring board shoveling,, and make bond pad surface smooth with the scolding tin of removal wiring board bond pad surface with the width large size components and parts shovel suitable with the wiring board width.
7) cooling and sample removal
Unclamp anchor clamps shelves bar, wiring board and the anchor clamps of removing the second bin device taken out with shadoof from media slot, treat wiring board and anchor clamps cool to room temperature after, with wiring board removal from the anchor clamps.
After treating the medium cool to room temperature in the media slot, the framework that steel wire is housed is taken out from heating tank, with components and parts and scolder cleaning wherein.
8) cleaning-drying
To remove wiring board soaking and washing in organic solvent of components and parts, dry then.
Will the clean smooth wiring board of cleaning, carry out the electrical testing of 100% all-network with flying needle or anchor clamps, find out fault networks such as open circuit on the wiring board or short circuit.
Claims (10)
1. the component disassembling method on the wiring board that is used for failure analysis, it comprises following steps:
1) preliminary treatment
Remove all non-components and parts that are welded to connect on the wiring board;
2) preheating
With anchor clamps wiring board is transferred to the baking oven baking, baking temperature is 100 degree～120 degree, toasts 2～6 hours;
3) remove first of wiring board and go up components and parts
Wiring board after the baking is put into heating tank, and wiring board and top components and parts thereof must be immersed in below the heating tank liquid level fully, with the heat medium temperature in the heating tank be elevated to than scolding tin fusing point high 10 ℃～30 ℃ temperature, heated 0.5～5 minute; Hand-held components and parts shovel in the heating process becomes the angle of 30 degree to 60 degree with wiring board, push ahead in PCB surface, and the components and parts after the melts soldering tin are released from wiring board;
4) solder leveling on the wiring board
After treating the full scale clearance of the first bin device,, be close to the wiring board shoveling,, and make bond pad surface smooth with the scolding tin of removal wiring board bond pad surface with the width components and parts shovel suitable with the wiring board width;
5) remove second of wiring board and go up components and parts
Turnover fixture, wiring board are not removed one of components and parts as yet and are faced up, and transfer to heating tank again, in heating tank, heated 0.5～5 minute, hand-held components and parts shovel is pushed ahead in PCB surface in the heating process, and the components and parts after the melts soldering tin are released from wiring board;
6) solder leveling on the wiring board pad
After treating the full scale clearance of the second bin device,, be close to the wiring board shoveling,, and make bond pad surface smooth with the scolding tin of removal wiring board bond pad surface with the width components and parts shovel suitable with the wiring board width;
7) cooling and sample removal
Wiring board and the anchor clamps of removing the second bin device are taken out with shadoof from media slot, treat wiring board and anchor clamps cool to room temperature after, with wiring board removal from the anchor clamps.
After treating the medium cool to room temperature in the media slot, the framework that steel wire is housed is taken out from heating tank, with components and parts and scolder cleaning wherein;
8) cleaning-drying
To remove wiring board soaking and washing in suitable solvent of components and parts, dry then, then clean smooth wiring board is used for failure analysis.
2. the component disassembling method on the wiring board that is used for failure analysis as claimed in claim 1 is characterized in that described heat medium is a liquid nonwetting with scolding tin or that wetability is lower, can use silicone oil or methyl-silicone oil or dimethicone.
3. the component disassembling method on the wiring board that is used for failure analysis as claimed in claim 1 is characterized in that the temperature of described heat medium is 230 ℃～280 ℃.
4. the component disassembling method on the wiring board that is used for failure analysis as claimed in claim 1, it is characterized in that hand-held components and parts shovel in the heating process becomes the angle of 30 degree to 60 degree with wiring board, push ahead in PCB surface, the components and parts after the melts soldering tin are released from wiring board.
5. the component disassembling method on the wiring board that is used for failure analysis as claimed in claim 1, it is characterized in that, the material of described components and parts shovel is close or identical with the wiring board material of components and parts to be removed, can be FR4 sheet material, phenolic resins sheet material, PTFE sheet material or PI sheet material.
6. the component disassembling method on the wiring board that is used for failure analysis as claimed in claim 1, it is characterized in that, described components and parts shovel comprise width be 5mm-10mm shovel mouthful for flat mouthful small size components and parts shovel, perhaps be, width is 20mm-50mm, the shovel mouthful medium size components and parts shovel for flat mouth, perhaps be that width is 100mm-300mm, the shovel mouthful large size components and parts shovel for angle.
7. the component disassembling method on the wiring board that is used for failure analysis as claimed in claim 6 is characterized in that, the angle angle of described large size components and parts shovel is that 30 degree are to 70 degree.
8. the component disassembling method on the wiring board that is used for failure analysis as claimed in claim 1 is characterized in that, described heating tank comprises,
Cell body,
Framework is arranged in the cell body, is provided with before and after the framework and can be shelved on the cell body groove along last protuberance, and steel wire is installed on the framework;
Heating tube or heating plate are arranged on the cell body;
Discharging tube is arranged at the cell body bottom, and valve is housed on the discharging tube;
Anchor clamps shelves bar is arranged at the cell body groove along last, and is locked in cell body groove edge by lock(ing) bolt.
9. the component disassembling method on the wiring board that is used for failure analysis as claimed in claim 8 is characterized in that the order number of described steel wire is 100 order to 300 orders.
10. the component disassembling method on the wiring board that is used for failure analysis as claimed in claim 1 is characterized in that, the described anchor clamps that are used for the clamping wiring board comprise,
At least 4 pillars set up separately in twos, in the middle of two pillars of homonymy a cross bar are set; Respectively connect between relative thirty years of age pillar, and lock by lock(ing) bolt by an internal and external casing; Cross bar offers chute along its length;
Some clamping compressing tablets are arranged on the cross bar, and by locked with bolts, bolt is slidedly arranged in the cross bar chute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101374808A CN101856759B (en) | 2010-03-31 | 2010-03-31 | Component disassembling method on circuit board for failure analysis |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101374808A CN101856759B (en) | 2010-03-31 | 2010-03-31 | Component disassembling method on circuit board for failure analysis |
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| Publication Number | Publication Date |
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| CN101856759A true CN101856759A (en) | 2010-10-13 |
| CN101856759B CN101856759B (en) | 2012-02-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2010101374808A Active CN101856759B (en) | 2010-03-31 | 2010-03-31 | Component disassembling method on circuit board for failure analysis |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113747677A (en) * | 2021-08-19 | 2021-12-03 | 珠海市浩威达电子科技有限公司 | Circuit board clamp and method for repairing circuit board element |
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| JP2000151094A (en) * | 1998-11-16 | 2000-05-30 | Matsushita Electric Ind Co Ltd | Method and system of disassembling printed circuit board |
| JP2004022607A (en) * | 2002-06-12 | 2004-01-22 | Sharp Corp | Method and apparatus for dismantling printed circuit board |
| CN1832663A (en) * | 2006-03-23 | 2006-09-13 | 合肥工业大学 | Method and device of sealing-off separating device in printed substrate liquid state heat-conducting medium |
| CN101014227A (en) * | 2007-02-02 | 2007-08-08 | 清华大学 | Method and equipment for disassembling circuit board using contacted impact |
| CN101362143A (en) * | 2008-09-19 | 2009-02-11 | 中南大学 | Technique and device for effectively recovering waste printed circuit boards solder |
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2010
- 2010-03-31 CN CN2010101374808A patent/CN101856759B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000151094A (en) * | 1998-11-16 | 2000-05-30 | Matsushita Electric Ind Co Ltd | Method and system of disassembling printed circuit board |
| JP2004022607A (en) * | 2002-06-12 | 2004-01-22 | Sharp Corp | Method and apparatus for dismantling printed circuit board |
| CN1832663A (en) * | 2006-03-23 | 2006-09-13 | 合肥工业大学 | Method and device of sealing-off separating device in printed substrate liquid state heat-conducting medium |
| CN101014227A (en) * | 2007-02-02 | 2007-08-08 | 清华大学 | Method and equipment for disassembling circuit board using contacted impact |
| CN101362143A (en) * | 2008-09-19 | 2009-02-11 | 中南大学 | Technique and device for effectively recovering waste printed circuit boards solder |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113747677A (en) * | 2021-08-19 | 2021-12-03 | 珠海市浩威达电子科技有限公司 | Circuit board clamp and method for repairing circuit board element |
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| Publication number | Publication date |
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| CN101856759B (en) | 2012-02-01 |
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