CN113747677A - Circuit board clamp and method for repairing circuit board element - Google Patents
Circuit board clamp and method for repairing circuit board element Download PDFInfo
- Publication number
- CN113747677A CN113747677A CN202110956593.9A CN202110956593A CN113747677A CN 113747677 A CN113747677 A CN 113747677A CN 202110956593 A CN202110956593 A CN 202110956593A CN 113747677 A CN113747677 A CN 113747677A
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- circuit board
- swing arm
- component
- cover plate
- substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/02—Assembly jigs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a circuit board clamp and a circuit board element repairing method. Be provided with the opening on the second apron, the opening corresponds the setting with first component, and set up hoist and mount subassembly on the second apron, and extend to the opening part, be used for hoist and mount first component, make when changing the first component on the circuit board, after the circuit board passes through reflow soldering equipment, first component and circuit board separation, and then realized through hoist and mount subassembly hoist to first component, make first component and circuit board open and weld back autosegregation, not only greatly promoted the change efficiency of first component, and work efficiency has still been promoted, and moreover, the steam generator is simple in structure, and convenient operation.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a circuit board clamp and a method for repairing a circuit board element.
Background
At present, when a certain component on a circuit board is damaged, the damaged component needs to be replaced.
In the related art, a common replacement method basically adopts a method of manually replacing an element, but manually disassembling a part and replacing the element results in a complex operation process and a long replacement period of the element.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art or the related art.
To this end, a first aspect of the present invention proposes a circuit board fixture.
The second aspect of the present invention provides a method for repairing a circuit board component.
In view of the above, a first aspect of the present invention provides a circuit board fixture, which is used for clamping a circuit board, the circuit board includes a first element, the circuit board fixture includes a first cover plate, a second cover plate and a hoisting assembly, the second cover plate is fastened on the first cover plate and used for clamping the circuit board, the second cover plate is provided with an opening, and the opening is arranged corresponding to the first element; the hoisting assembly is arranged on the second cover plate and extends to the opening for hoisting the first element.
In the technical scheme, the circuit board clamp is used for clamping a circuit board, the circuit board comprises a first element, the circuit board clamp comprises a first cover plate, a second cover plate and a hoisting assembly, and the second cover plate is buckled on the first cover plate and used for clamping the circuit board, so that the circuit board is clamped. The second cover plate is provided with an opening which is arranged corresponding to the first element, so that after the circuit board is clamped by the circuit board clamp, the first element can be exposed at the opening on the second cover plate, the hoisting assembly is arranged on the second cover plate and extends to the opening for hoisting the first element, when the first element on the circuit board is replaced, the hoisting assembly is firstly used for clamping the first element, then the circuit board passes through reflow soldering equipment, a bonding pad between the first element and the circuit board is melted to separate the first element from the circuit board, further, the hoisting of the first element by the hoisting assembly is realized to automatically separate the first element from the circuit board after the circuit board is soldered, and the first element and the circuit board can be prevented from being soldered together again after being separated, thereby greatly improving the replacement efficiency of the first element and also improving the working efficiency, and the structure is simple and the operation is convenient.
In addition, the circuit board clamp in the above technical solution provided by the present invention may further have the following additional technical features:
in one technical scheme of the invention, the hoisting assembly comprises a supporting part, a first swing arm and a hoisting tool, wherein the supporting part is arranged on the second cover plate; one end of the first swing arm is connected with the supporting part and can rotate relative to the supporting part, and the other end of the first swing arm extends towards the opening; the other end of hoist and first swing arm is connected.
In this technical scheme, including the supporting component in the hoist and mount subassembly, first swing arm and hoist, and the supporting component sets up on the second apron, and then realize the installation and fixed to the supporting component, the one end and the supporting component of first swing arm are connected, but relative supporting component rotates, the other end of first swing arm extends to the opening, and then realize when hoist and mount through the rotation that first swing arm can relative supporting component, and then can be more convenient hoist and mount, the hoist is connected with the other end of first swing arm, make and hoist first component through the hoist.
When the first element is not hoisted, the first swing arm is in a raised state, and when the first element is needed to be hoisted, the first swing arm is firstly pressed down and then hoisted on the first element. After the first element is welded, the first swing arm recovers the lifted state, and then lifts the first element, so that the first element is separated from the circuit board.
In one technical scheme of the invention, the hoisting assembly further comprises a second swing arm and a handle, wherein one end of the second swing arm is connected with one end of the first swing arm, and the other end of the second swing arm extends in a direction departing from the first swing arm; the handle is connected with the other end of the second swing arm.
In this technical scheme, still be provided with second swing arm and handle in the hoist and mount subassembly, the one end of second swing arm is connected with the one end of first swing arm, and the other end extends to the direction that deviates from first swing arm for the second swing arm can rotate along with the rotation of first swing arm, and the handle is connected with the other end of second swing arm, and then makes when adjusting the handle, first arm can rotate along with it, and then realizes adjusting the height of first arm through handle and second arm.
The weight of second swing arm is greater than the weight of first swing arm, and then makes first swing arm can keep being in the state of raiseing under the effect of second swing arm.
In one technical scheme of the invention, the hoisting assembly further comprises: one side of the fixed part is connected with the supporting part, and the other side of the fixed part extends to the second swing arm; a gap is formed between the fixed part and the supporting part, and the second swing arm is embedded in the gap.
In the technical scheme, a fixing part is further arranged in the hoisting assembly, one side of the fixing part is connected with the supporting part, the other side of the fixing part extends towards the direction of the second swing arm, the fixing part is further installed and fixed, a gap is reserved between the fixing part and the supporting part, the second swing arm is embedded in the gap, and the second swing arm can be clamped tightly by the fixing part and the supporting part.
In one technical scheme of the invention, the lifting appliance is provided with a gap, the circuit board clamp further comprises a clamping component and a connecting shaft, the clamping component is provided with a clamping end which can be opened or closed, and the clamping end is used for clamping a first element; the connecting shaft is arranged on the clamping component in a penetrating way and is lapped in the gap.
In this technical scheme, circuit board fixture still includes clamping component and connecting axle, is provided with the exposed core that can open or closed in clamping component, and then can pass through the clamping end to first component centre gripping for on the connecting axle wears to locate clamping component, and overlap joint in the breach that sets up on the hoist, and then make the breach of hoist to clamping component's restriction, prevent to remove the in-process, clamping component follows the hoist and drops.
In one technical scheme of the invention, the first cover plate and the second cover plate are bakelite plates.
In this technical scheme, select for use the bakelite board as first apron and second apron, and then make first apron and second apron have characteristics such as not absorb water, non-conducting, high temperature resistant and intensity height, and then make first apron and second apron durable more.
The second aspect of the present invention provides a method for repairing a circuit board component, comprising: placing the circuit board in a circuit board clamp; connecting the hoisting assembly with the first element; heating a bonding pad corresponding to the first element on the circuit board to separate the first element from the substrate of the circuit board; and welding the second element on the substrate of the circuit board.
In the technical scheme, the method for repairing the circuit board element specifically comprises the steps of firstly placing the circuit board in a circuit board clamp, further fixing the circuit board, and connecting a hoisting assembly with a first element; heating the bonding pad corresponding to the first element on the circuit board, so that the first element is separated from the substrate of the circuit board, heating the bonding pad to melt, separating the first element from the circuit board, further lifting the first element by the lifting assembly, preventing the first element from being welded with the circuit board again after the temperature is reduced, and after the first element is separated from the circuit board, further welding the second element on the substrate of the circuit board, and further realizing the replacement of the element on the circuit board by the circuit board clamp.
In one aspect of the present invention, a pad corresponding to a first component on a heating circuit board includes: placing a circuit board clamp on a conveying line; controlling the transmission line to move so as to drive the circuit board clamp to enter reflow soldering equipment; and controlling the reflow soldering equipment to heat the bonding pads corresponding to the first element on the circuit board.
In the technical scheme, the circuit board clamp is placed on the conveying line; then controlling the transmission line to move, so that the transmission line drives the circuit board clamp to enter reflow soldering equipment; and controlling the reflow soldering equipment to heat the soldering pad corresponding to the first element on the circuit board, and heating the soldering pad by the reflow soldering equipment to further melt the soldering pad so as to separate the circuit board from the first element.
In one aspect of the present invention, before soldering the second component to the substrate of the circuit board, the method for repairing the circuit board component further includes: removing residual welding slag on the substrate; pads are coated on the substrate.
In the technical scheme, the first element is taken down from the circuit board, the residual welding slag on the substrate of the circuit board is removed before the second element is welded on the substrate of the circuit board, the influence of the residual welding slag on the substrate on the second element is prevented, and then the bonding pad is coated on the substrate of the circuit board, so that the newly coated bonding pad can better enable the substrate of the circuit board to be connected with the second element.
Specifically, when residual welding slag on a substrate of a circuit board is cleaned, firstly, a brush is used for slightly brushing the movable welding slag on the substrate, then, a layer of rosin is coated on the substrate of the circuit board by the brush, an electric iron is used for scraping the circuit board substrate coated with the rosin for several times, most of the molten welding slag is cleaned, a small section of conducting wire is taken and placed at the position where the electric iron is in contact with the circuit board substrate, the electric iron is used for scraping the circuit board substrate coated with the rosin for several times again to remove the residual fine residual welding slag on the circuit board substrate, and finally, a paper towel is placed on the substrate, the paper towel is brushed by the brush to clean the circuit board substrate.
Specifically, the conductive wire is a copper wire or the like.
In an aspect of the present invention, before heating the pads corresponding to the first component on the circuit board, the method for repairing the circuit board component further includes: the first member is coated with rosin in a circumferential direction.
In the technical scheme, before the pad corresponding to the first element on the heating circuit board, rosin is coated in the circumferential direction of the first element, so that the rosin plays a role of scaling powder, the pad is enabled to be melted more easily when being heated, the time for melting the pad can be shortened, the replacement time of the circuit board element can be shortened, and the working efficiency is improved.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 shows one of the hoist assembly schematic diagrams of a circuit board clamp according to one embodiment of the present invention;
FIG. 2 illustrates a second schematic view of a hoist assembly of the circuit board clamp according to an embodiment of the present invention;
FIG. 3 illustrates a third schematic view of a lifting assembly of a circuit board clamp according to an embodiment of the present invention;
FIG. 4 shows a fourth schematic view of a hoist assembly of a circuit board clamp according to an embodiment of the present invention;
FIG. 5 shows a fifth schematic view of a hoist assembly of a circuit board clamp according to an embodiment of the present invention;
FIG. 6 shows a sixth schematic view of a hoist assembly of a circuit board clamp according to an embodiment of the present invention;
FIG. 7 illustrates a flow diagram of a method of reworking a circuit board component according to one embodiment of the present invention;
FIG. 8 illustrates a flow diagram of a method of reworking a circuit board component according to one embodiment of the present invention;
fig. 9 shows a flow diagram of a method of reworking a circuit board component according to one embodiment of the present invention;
fig. 10 shows a flowchart of a method of reworking a circuit board component according to one embodiment of the present invention.
Wherein, the correspondence between the reference numbers and the part names in fig. 1 to 6 is:
100 hoisting components, 110 supporting parts, 120 first swing arms, 130 lifting appliances, 132 gaps, 140 second swing arms, 150 handles, 160 fixing parts, 200 first cover plates, 300 second cover plates, 400 clamping parts, 500 connecting shafts and 600 first elements.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
The wiring board clamp and the method of reworking a wiring board component according to some embodiments of the present invention will be described with reference to fig. 1 to 10.
The first embodiment is as follows:
as shown in fig. 1, the present invention provides a circuit board fixture, which is used for clamping a circuit board, the circuit board comprises a first element 600, the circuit board fixture comprises a first cover plate 200, a second cover plate 300 and a hoisting assembly 100, the second cover plate 300 is buckled on the first cover plate 200 and used for clamping the circuit board, an opening is arranged on the second cover plate 300, and the opening is arranged corresponding to the first element 600; the lifting assembly 100 is disposed on the second cover plate 300 and extends to the opening for lifting the first element 600.
In this technical scheme, the circuit board anchor clamps are used for the centre gripping circuit board, and the circuit board includes first component 600, and the circuit board anchor clamps include first apron 200, second apron 300 and hoist and mount subassembly 100, and second apron 300 lock is on first apron 200 for the centre gripping circuit board, and then realize the centre gripping to the circuit board. The second cover plate 300 is provided with an opening which is arranged corresponding to the first element 600, so that after the circuit board is clamped by the circuit board clamp, the first element 600 can be exposed at the opening on the second cover plate 300, the hoisting assembly 100 is arranged on the second cover plate 300 and extends to the opening for hoisting the first element 600, when the first element 600 on the circuit board is replaced, the hoisting assembly is firstly used for clamping the first element 600, then the circuit board passes through reflow soldering equipment, a bonding pad between the first element 600 and the circuit board is melted to separate the first element 600 from the circuit board, thereby realizing that the first element 600 and the circuit board are automatically separated after the circuit board is soldered by hoisting the hoisting assembly 100, and preventing the first element 600 and the circuit board from being soldered together again after being separated, thereby greatly improving the replacement efficiency of the first element 600, but also improves the working efficiency, and has simple structure and convenient operation.
Example two:
the present embodiment provides a circuit board fixture, and in addition to the technical features of the above-described embodiments, the present embodiment further includes the following technical features.
As shown in fig. 2, 3, 5 and 6, the hoist assembly 100 includes a support part 110, a first swing arm 120 and a hoist 130, the support part 110 being disposed on the second cover plate 300; one end of the first swing arm 120 is connected to the support member 110 and can rotate relative to the support member 110, and the other end of the first swing arm 120 extends toward the opening; the spreader 130 is connected to the other end of the first swing arm 120.
In this technical scheme, including supporting part 110 in hoist and mount subassembly 100, first swing arm 120 and hoist 130, and supporting part 110 sets up on second apron 300, and then realize the installation and fixed to supporting part 110, the one end and the supporting part 110 of first swing arm 120 are connected, but relative supporting part 110 rotates, the other end of first swing arm 120 extends to the opening, and then realize supporting part 110's rotation relatively through first swing arm 120 when hoist, and then can be more convenient hoist, hoist 130 is connected with the other end of first swing arm 120, make to hoist first element 600 through hoist 130.
When the first swing arm 120 does not hoist the first element 600, the first swing arm 120 is in a lifted state, and when the first element 600 needs to be hoisted, the first swing arm 120 is firstly pressed down and then hoisted on the first element 600. After the first element 600 is welded, the first swing arm 120 recovers the lifted state, and then lifts the first element 600, so that the first element 600 is separated from the circuit board.
Example three:
the present embodiment provides a circuit board fixture, and in addition to the technical features of the above-described embodiments, the present embodiment further includes the following technical features.
As shown in fig. 1 and 4, the hoisting assembly 100 further includes a second swing arm 140 and a handle 150, one end of the second swing arm 140 is connected to one end of the first swing arm 120, and the other end extends in a direction away from the first swing arm 120; the handle 150 is connected to the other end of the second swing arm 140.
In this technical scheme, still be provided with second swing arm 140 and handle 150 in hoist and mount subassembly 100, the one end of second swing arm 140 is connected with the one end of first swing arm 120, and the other end extends to the direction that deviates from first swing arm 120 for second swing arm 140 can rotate along with the rotation of first swing arm 120, and handle 150 is connected with the other end of second swing arm 140, and then makes when adjusting handle 150, first arm can rotate along with it, and then realizes adjusting the height of first arm through handle 150 and second arm.
The weight of the second swing arm 140 is greater than the weight of the first swing arm 120, so that the first swing arm 120 can be kept in a raised state under the action of the second swing arm 140.
Example four:
the present embodiment provides a circuit board fixture, and in addition to the technical features of the above-described embodiments, the present embodiment further includes the following technical features.
As shown in fig. 1, the hoist assembly 100 further includes: a fixing part 160, one side of the fixing part 160 is connected with the supporting part 110, and the other side extends to the second swing arm 140; a gap is formed between the fixing member 160 and the supporting member 110, and the second swing arm 140 is embedded in the gap.
In this technical solution, a fixing member 160 is further disposed in the hoisting assembly 100, one side of the fixing member 160 is connected to the support member 110, and the other side extends toward the second swing arm 140, so as to mount and fix the fixing member 160, and a gap is formed between the fixing member 160 and the support member 110, and the second swing arm 140 is embedded in the gap, so that the second swing arm 140 can be clamped by the fixing member 160 and the support member 110.
Example five:
the present embodiment provides a circuit board fixture, and in addition to the technical features of the above-described embodiments, the present embodiment further includes the following technical features.
As shown in fig. 1 and 3, the hanger 130 is provided with a notch 132, the circuit board clamp further includes a clamping member 400 and a connecting shaft 500, the clamping member 400 is provided with a clamping end which can be opened or closed, and the clamping end is used for clamping a first element 600; the connecting shaft 500 is inserted into the clamping member 400 and overlaps the notch 132.
In this technical scheme, circuit board fixture still includes clamping component 400 and connecting axle 500, is provided with the exposed or closed exposed core in clamping component 400, and then can pass through the exposed core centre gripping of first component 600 for connecting axle 500 wears to locate on clamping component 400, and laps in the breach 132 that sets up on hoist 130, and then makes the breach 132 of hoist 130 to clamping component 400's restriction, prevents to remove the in-process, and clamping component 400 drops from hoist 130.
Example six:
the present embodiment provides a circuit board fixture, and in addition to the technical features of the above-described embodiments, the present embodiment further includes the following technical features.
The first and second cover plates 200 and 300 are bakelite plates.
In the technical scheme, the bakelite plate is selected as the first cover plate 200 and the second cover plate 300, so that the first cover plate 200 and the second cover plate 300 have the characteristics of no water absorption, no electric conduction, high temperature resistance, high strength and the like, and the first cover plate 200 and the second cover plate 300 are more durable.
Example seven:
the invention provides a method for repairing circuit board components.
As shown in fig. 7, the method for repairing a circuit board component includes:
202, placing the circuit board in a circuit board clamp;
In the technical scheme, the method for repairing the circuit board element specifically comprises the steps of firstly placing the circuit board in a circuit board clamp, further fixing the circuit board, and connecting a hoisting assembly with a first element; heating the bonding pad corresponding to the first element on the circuit board, so that the first element is separated from the substrate of the circuit board, heating the bonding pad to melt, separating the first element from the circuit board, further lifting the first element by the lifting assembly, preventing the first element from being welded with the circuit board again after the temperature is reduced, and after the first element is separated from the circuit board, further welding the second element on the substrate of the circuit board, and further realizing the replacement of the element on the circuit board by the circuit board clamp.
Example eight:
the present embodiment provides a method for repairing a circuit board component, as shown in fig. 8, the method for repairing a circuit board component further includes:
302, placing the circuit board in a circuit board clamp;
308, controlling reflow soldering equipment to heat a bonding pad corresponding to the first element on the circuit board; so as to separate the first element from the substrate of the circuit board;
In the technical scheme, the circuit board clamp is placed on the conveying line; then controlling the transmission line to move, so that the transmission line drives the circuit board clamp to enter reflow soldering equipment; and controlling the reflow soldering equipment to heat the soldering pad corresponding to the first element on the circuit board, and heating the soldering pad by the reflow soldering equipment to further melt the soldering pad so as to separate the circuit board from the first element.
Example nine:
the present embodiment provides a method for repairing a circuit board component, as shown in fig. 9, the method for repairing a circuit board component further includes:
In the technical scheme, the first element is taken down from the circuit board, the residual welding slag on the substrate of the circuit board is removed before the second element is welded on the substrate of the circuit board, the influence of the residual welding slag on the substrate on the second element is prevented, and then the bonding pad is coated on the substrate of the circuit board, so that the newly coated bonding pad can better enable the substrate of the circuit board to be connected with the second element.
Specifically, when residual welding slag on a substrate of a circuit board is cleaned, firstly, a brush is used for slightly brushing the movable welding slag on the substrate, then, a layer of rosin is coated on the substrate of the circuit board by the brush, an electric iron is used for scraping the circuit board substrate coated with the rosin for several times, most of the molten welding slag is cleaned, a small section of conducting wire is taken and placed at the position where the electric iron is in contact with the circuit board substrate, the electric iron is used for scraping the circuit board substrate coated with the rosin for several times again to remove the residual fine residual welding slag on the circuit board substrate, and finally, a paper towel is placed on the substrate, the paper towel is brushed by the brush to clean the circuit board substrate.
Specifically, the conductive wire is a copper wire or the like.
Example ten:
the present embodiment provides a method for repairing a circuit board component, as shown in fig. 10, the method for repairing a circuit board component further includes:
In the technical scheme, before the pad corresponding to the first element on the heating circuit board, rosin is coated in the circumferential direction of the first element, so that the rosin plays a role of scaling powder, the pad is enabled to be melted more easily when being heated, the time for melting the pad can be shortened, the replacement time of the circuit board element can be shortened, and the working efficiency is improved.
In the claims, the specification and the drawings of the specification of the present invention, the term "plurality" means two or more, unless explicitly defined otherwise, the terms "upper", "lower", and the like indicate orientations or positional relationships based on those shown in the drawings only for the purpose of describing the present invention more conveniently and simplifying the description, and do not indicate or imply that the device or first element referred to must have the specific orientation described, be constructed and operated in the specific orientation, and thus the description should not be construed as limiting the present invention; the terms "connect," "mount," "secure," and the like are to be construed broadly, and for example, "connect" may refer to a fixed connection between multiple objects, a removable connection between multiple objects, or an integral connection; the multiple objects may be directly connected to each other or indirectly connected to each other through an intermediate. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art from the above data specifically.
In the claims, specification, and drawings that follow the present disclosure, the description of the terms "one embodiment," "some embodiments," "specific embodiments," and so forth, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. In the claims, specification and drawings of the present invention, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A circuit board clip for holding a circuit board, the circuit board including a first component, the circuit board clip comprising:
a first cover plate;
the second cover plate is buckled on the first cover plate and used for clamping the circuit board, and an opening is formed in the second cover plate and corresponds to the first element;
and the hoisting assembly is arranged on the second cover plate, extends to the opening and is used for hoisting the first element.
2. A board clamp according to claim 1, wherein the lifting assembly comprises:
a support member disposed on the second cover plate;
one end of the first swing arm is connected with the supporting part and can rotate relative to the supporting part, and the other end of the first swing arm extends towards the opening;
and the lifting appliance is connected with the other end of the first swing arm.
3. A board clamp according to claim 2, wherein the lifting assembly further comprises:
one end of the second swing arm is connected with one end of the first swing arm, and the other end of the second swing arm extends in the direction back to the first swing arm;
and the handle is connected with the other end of the second swing arm.
4. The circuit board clamp of claim 3, wherein the hoist assembly further comprises:
the supporting part is connected with one side of the fixed part, and the other side of the fixed part extends to the second swing arm;
a gap is formed between the fixed part and the supporting part, and the second swing arm is embedded in the gap.
5. A circuit board clamp according to claim 2, wherein the hanger is provided with a notch, the circuit board clamp further comprising:
a clamping member provided with a clamping end that can be opened or closed, the clamping end being used to clamp the first element;
the connecting shaft penetrates through the clamping component and is lapped in the gap.
6. A wiring board clip according to any one of claims 1 to 5,
the first cover plate and the second cover plate are bakelite plates.
7. A method of reworking a circuit board component, comprising:
placing a circuit board in a circuit board holder of any one of claims 1 to 6;
connecting the hoisting assembly with the first element;
heating a bonding pad corresponding to the first element on the circuit board to separate the first element from a substrate of the circuit board;
and welding a second element on the substrate of the circuit board.
8. A method of reworking a circuit board component according to claim 7, wherein heating the pads on said circuit board corresponding to said first component comprises:
placing the circuit board clamp on a conveying line;
controlling the conveying line to move so as to drive the circuit board clamp to enter reflow soldering equipment;
and controlling reflow soldering equipment to heat the bonding pads corresponding to the first element on the circuit board.
9. The method of repairing a circuit board component according to claim 7, wherein before soldering a second component onto the substrate of the circuit board, the method of repairing a circuit board component further comprises:
removing residual welding slag on the substrate;
a pad is coated on the substrate.
10. A method of repairing a circuit board member according to any one of claims 7 to 9, wherein before heating the pads on the circuit board corresponding to the first member, the method of repairing a circuit board member further comprises:
rosin is coated on the circumferential direction of the first member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110956593.9A CN113747677A (en) | 2021-08-19 | 2021-08-19 | Circuit board clamp and method for repairing circuit board element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110956593.9A CN113747677A (en) | 2021-08-19 | 2021-08-19 | Circuit board clamp and method for repairing circuit board element |
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| Publication Number | Publication Date |
|---|---|
| CN113747677A true CN113747677A (en) | 2021-12-03 |
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| CN202110956593.9A Pending CN113747677A (en) | 2021-08-19 | 2021-08-19 | Circuit board clamp and method for repairing circuit board element |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001084895A1 (en) * | 2000-04-27 | 2001-11-08 | Sony Corporation | System for mounting electronic device |
| CN101856759A (en) * | 2010-03-31 | 2010-10-13 | 上海美维科技有限公司 | Component disassembling method on circuit board for failure analysis |
| CN102169809A (en) * | 2010-11-22 | 2011-08-31 | 苏剑锋 | BGA (Ball Grid Array) component repairing method and fixture |
| CN202877673U (en) * | 2012-08-21 | 2013-04-17 | 深圳市易迈克实业有限公司 | Welding mechanism |
-
2021
- 2021-08-19 CN CN202110956593.9A patent/CN113747677A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001084895A1 (en) * | 2000-04-27 | 2001-11-08 | Sony Corporation | System for mounting electronic device |
| CN101856759A (en) * | 2010-03-31 | 2010-10-13 | 上海美维科技有限公司 | Component disassembling method on circuit board for failure analysis |
| CN102169809A (en) * | 2010-11-22 | 2011-08-31 | 苏剑锋 | BGA (Ball Grid Array) component repairing method and fixture |
| CN202877673U (en) * | 2012-08-21 | 2013-04-17 | 深圳市易迈克实业有限公司 | Welding mechanism |
Non-Patent Citations (1)
| Title |
|---|
| 黄伟: "《工程机械再制造若干基础问题研究》" * |
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