CN101855708B - 热处理装置 - Google Patents

热处理装置 Download PDF

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Publication number
CN101855708B
CN101855708B CN200980100966XA CN200980100966A CN101855708B CN 101855708 B CN101855708 B CN 101855708B CN 200980100966X A CN200980100966X A CN 200980100966XA CN 200980100966 A CN200980100966 A CN 200980100966A CN 101855708 B CN101855708 B CN 101855708B
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CN
China
Prior art keywords
container handling
handled object
film
annealing device
heating unit
Prior art date
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Expired - Fee Related
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CN200980100966XA
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English (en)
Chinese (zh)
Other versions
CN101855708A (zh
Inventor
青山真太郎
下村晃司
小林仙尚
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
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Publication of CN101855708A publication Critical patent/CN101855708A/zh
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Publication of CN101855708B publication Critical patent/CN101855708B/zh
Expired - Fee Related legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
CN200980100966XA 2008-03-31 2009-03-18 热处理装置 Expired - Fee Related CN101855708B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008089069A JP5077018B2 (ja) 2008-03-31 2008-03-31 熱処理装置
JP2008-089069 2008-03-31
PCT/JP2009/055325 WO2009122913A1 (ja) 2008-03-31 2009-03-18 熱処理装置

Publications (2)

Publication Number Publication Date
CN101855708A CN101855708A (zh) 2010-10-06
CN101855708B true CN101855708B (zh) 2012-10-10

Family

ID=41135299

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200980100966XA Expired - Fee Related CN101855708B (zh) 2008-03-31 2009-03-18 热处理装置

Country Status (5)

Country Link
JP (1) JP5077018B2 (enExample)
KR (1) KR20100138984A (enExample)
CN (1) CN101855708B (enExample)
TW (1) TW200949950A (enExample)
WO (1) WO2009122913A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5466670B2 (ja) * 2010-10-28 2014-04-09 株式会社日立国際電気 基板処理装置および半導体装置の製造方法
JP5640890B2 (ja) * 2011-05-23 2014-12-17 ウシオ電機株式会社 光照射装置および光照射方法
JP6038503B2 (ja) * 2011-07-01 2016-12-07 株式会社日立国際電気 基板処理装置及び半導体装置の製造方法
KR101297981B1 (ko) * 2011-10-07 2013-08-23 (주) 예스티 기판의 열처리 장치
JP5964630B2 (ja) * 2012-03-27 2016-08-03 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
US8785815B2 (en) * 2012-06-22 2014-07-22 Applied Materials, Inc. Aperture control of thermal processing radiation
CN105261576A (zh) * 2014-07-15 2016-01-20 北京北方微电子基地设备工艺研究中心有限责任公司 一种加热腔室及半导体加工设备
US11089657B2 (en) * 2015-03-06 2021-08-10 SCREEN Holdings Co., Ltd. Light-irradiation heat treatment apparatus
JP6518548B2 (ja) * 2015-08-10 2019-05-22 東京応化工業株式会社 紫外線照射装置、レジストパターン形成装置、紫外線照射方法及びレジストパターン形成方法
JP6546512B2 (ja) * 2015-11-04 2019-07-17 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
CN107706139A (zh) * 2017-11-13 2018-02-16 上海华力微电子有限公司 一种半导体加工机台的温度控制装置
JP7048372B2 (ja) * 2018-03-20 2022-04-05 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置および熱処理方法
KR102737498B1 (ko) 2019-12-13 2024-12-04 삼성전자주식회사 비-접촉식 온도 센서를 가진 공정 설비
JP7546417B2 (ja) * 2020-09-09 2024-09-06 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
CN115064471B (zh) * 2022-08-01 2023-11-28 北京屹唐半导体科技股份有限公司 晶圆的热处理装置
FR3142757A1 (fr) * 2022-12-05 2024-06-07 Annealsys Four de recuit thermique rapide à uniformité de chauffage améliorée
CN118712105B (zh) * 2024-08-29 2025-02-14 一塔半导体(安徽)有限公司 一种快速热退火装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09270390A (ja) 1996-03-29 1997-10-14 Dainippon Screen Mfg Co Ltd 基板の光照射式熱処理装置
JPH10321547A (ja) 1997-05-22 1998-12-04 Kokusai Electric Co Ltd 熱処理装置
CN1701416A (zh) * 2003-08-11 2005-11-23 东京毅力科创株式会社 热处理装置
JP2006005177A (ja) * 2004-06-17 2006-01-05 Tokyo Electron Ltd 熱処理装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09270390A (ja) 1996-03-29 1997-10-14 Dainippon Screen Mfg Co Ltd 基板の光照射式熱処理装置
JPH10321547A (ja) 1997-05-22 1998-12-04 Kokusai Electric Co Ltd 熱処理装置
CN1701416A (zh) * 2003-08-11 2005-11-23 东京毅力科创株式会社 热处理装置
JP2006005177A (ja) * 2004-06-17 2006-01-05 Tokyo Electron Ltd 熱処理装置

Also Published As

Publication number Publication date
JP2009246061A (ja) 2009-10-22
TW200949950A (en) 2009-12-01
WO2009122913A1 (ja) 2009-10-08
CN101855708A (zh) 2010-10-06
KR20100138984A (ko) 2010-12-31
JP5077018B2 (ja) 2012-11-21

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Granted publication date: 20121010

Termination date: 20160318