CN101848600A - 印刷电路板 - Google Patents

印刷电路板 Download PDF

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Publication number
CN101848600A
CN101848600A CN200910301151A CN200910301151A CN101848600A CN 101848600 A CN101848600 A CN 101848600A CN 200910301151 A CN200910301151 A CN 200910301151A CN 200910301151 A CN200910301151 A CN 200910301151A CN 101848600 A CN101848600 A CN 101848600A
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CN
China
Prior art keywords
circuit board
plane
printed circuit
pcb
via hole
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200910301151A
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English (en)
Inventor
白育彰
刘建宏
谢博全
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN200910301151A priority Critical patent/CN101848600A/zh
Priority to US12/430,131 priority patent/US20100243310A1/en
Publication of CN101848600A publication Critical patent/CN101848600A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09454—Inner lands, i.e. lands around via or plated through-hole in internal layer of multilayer PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种印刷电路板，包括一电源层、一接地层、若干贯穿电源层及接地层的接地过孔及电源过孔，接地过孔位于电源层的部分及电源过孔位于接地层的部分均形成一隔离空间，每一接地过孔及电源过孔内均设置一导电体，每一导电体于对应隔离空间内形成一延伸件以增大所述电源层与接地层的正对面积。所述印刷电路板通过增加所述电源层与接地层之间的正对面积，提高了自身的电容量，降低了输入阻抗。

Description

印刷电路板
技术领域
本发明涉及一种印刷电路板，特别涉及一种电压输出稳定的印刷电路板。
背景技术
印刷电路板上设有多种电源，如5V、1.5V、3.3V的直流电源及各种交流电源。为了降低交流电源的噪声对信号的干扰，通常会在电源过孔与接地过孔之间跨接大量的去耦合电容，以保证印刷电路板具有较低的输入阻抗来稳定交流电源。传统的电源过孔及接地过孔均通过设置隔离区分别实现其与接地层及电源层互相隔开。尽管单个电容比较便宜，但若量产的印刷电路板上使用了大量的去耦合电容，则会大大地增加成本。
发明内容
鉴于以上内容，有必要提供一种印刷电路板，其上的交流电源具有较低的输入阻抗以减少其对信号的干扰。
一种印刷电路板，包括一电源层、一接地层、若干贯穿电源层及接地层的接地过孔及电源过孔，每一接地过孔通过一第一隔离区与所述电源层隔离，每一电源过孔通过一第二隔离区与所述接地层隔离，每一接地过孔及电源过孔均包括一孔壁，每一接地过孔及电源过孔还均包括一孔壁延伸体，每一接地过孔的孔壁延伸体置于所述第一隔离区内且与所述电源层隔离，每一电源过孔的孔壁延伸体置于所述第二隔离区内且与所述接地层隔离。
一种印刷电路板，包括一电源层、一接地层、若干贯穿电源层及接地层的接地过孔及电源过孔，接地过孔位于电源层的部分及电源过孔位于接地层的部分均形成一隔离空间，每一接地过孔及电源过孔内均设置一导电体，所述电源层及接地层于对应的隔离空间内均形成一延伸件以增大所述电源层与接地层的正对面积。
相较现有技术，所述印刷电路板通过增加了所述电源层与接地层之间的正对面积，提高了自身的电容量，降低了输入阻抗，从而减少稳定输出交流电压所需的去耦合电容的数量，降低成本。
附图说明
下面结合附图及较佳实施方式对本发明作进一步详细描述：
图1是本发明印刷电路板的较佳实施方式的结构示意图。
图2是本发明印刷电路板的较佳实施方式的导电体的立体图。
图3是本发明印刷电路板及设置去耦合电容的传统印刷电路板上交流电源的输入阻抗随频率变化的波形图。
具体实施方式
请参考图1及图2，本发明印刷电路板的较佳实施方式包括从上至下顺序放置的一第一信号层10、一电源层11、一接地层12及一第二信号层13。所述印刷电路板上纵向贯穿设置有若干接地过孔及若干电源过孔100。接地过孔位于所述电源层11的部分及电源过孔位于所述接地层12的部分孔径均增大以形成一隔离空间101。每一接地过孔及电源过孔100均形成一导电体20。每一导电体20包括一位于过孔100内呈圆柱状的主体部21、一设置在主体部21周缘的延伸件23及设置在该主体部21两端的焊盘25与27。其中，所述焊盘25位于所述第一信号层10，所述焊盘27位于所述第二信号层13，所述延伸件23位于所述电源层11或接地层12的隔离空间101。所述导电体20由导电材料制成，如铜。本实施方式中，所述延伸件23包括一环绕所述主体部21的呈圆环状的中心部231、一沿所述中心部231的直径方向延伸的连接部232及设置在该连接部232两端的环形的延伸部233。所述中心部231的直径大致与所述焊盘25，27的直径相等。所述延伸部233分布在一直径大于该中心部232的圆上。在其他实施方式中，所述中心部231、连接部232及延伸部233的尺寸及形状均可根据需要进行设计，以增大与所述接地层12与电源层11的正对面积。
所述接地及电源过孔101分别在所述电源层11及接地层12的隔离空间101内增设了所述延伸件23以增加所述电源层11与接地层12之间的正对面积，加大本发明印刷电路板的自身电容量，降低输入阻抗，从而稳定了输出电源。本发明印刷电路板相对通过设置去耦合电容来稳定输出电源的传统印刷电路板，降低了成本。
请参考图3，本发明印刷电路板及设置去耦合电容的传统印刷电路板上交流电源的输入阻抗随频率变化的波形图分别如实线及虚线所示。从图3中可清楚得知，当频率小于0.6MHZ时，本发明印刷电路板上交流电源的输入阻抗明显小于设置去耦合电容的传统印刷电路板上交流电源的输入阻抗。

Claims (6)

1.一种印刷电路板，包括一电源层、一接地层、若干贯穿电源层及接地层的接地过孔及电源过孔，接地过孔位于电源层的部分及电源过孔位于接地层的部分均形成一隔离空间，每一接地过孔及电源过孔内均设置一导电体，其特征在于：每一导电体于对应隔离空间内形成一延伸件以增大所述电源层与接地层的正对面积。
2.如权利要求1所述的印刷电路板，其特征在于：所述导电体由铜箔制成。
3.如权利要求1所述的印刷电路板，其特征在于：每一导电体包括一位于接地过孔或电源过孔内呈圆柱状的主体部，所述延伸件包括一环绕所述主体部的呈圆环状的中心部、一沿所述中心部的直径方向延伸的连接部及设置在该连接部两端的环形的延伸部。
4.如权利要求3所述的印刷电路板，其特征在于：所述延伸部分布在一直径大于该中心部的圆上。
5.一种印刷电路板，包括一电源层、一接地层、若干贯穿电源层及接地层的接地过孔及电源过孔，接地过孔位于电源层的部分及电源过孔位于接地层的部分均形成一隔离空间，每一接地过孔及电源过孔内均设置一导电体，其特征在于：所述电源层及接地层于对应的隔离空间内均形成一延伸件以增大所述电源层与接地层的正对面积。
6.如权利要求5所述的印刷电路板，其特征在于：所述延伸件由导电材料制成。
CN200910301151A 2009-03-26 2009-03-26 印刷电路板 Pending CN101848600A (zh)

Priority Applications (2)

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CN200910301151A CN101848600A (zh) 2009-03-26 2009-03-26 印刷电路板
US12/430,131 US20100243310A1 (en) 2009-03-26 2009-04-27 Printed circuit board

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Application Number Priority Date Filing Date Title
CN200910301151A CN101848600A (zh) 2009-03-26 2009-03-26 印刷电路板

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103917048A (zh) * 2012-12-31 2014-07-09 联想(北京)有限公司 一种柔性电路板的制作方法及柔性电路板
CN106211556A (zh) * 2016-07-28 2016-12-07 广东欧珀移动通信有限公司 印刷电路板及具有其的电子装置
CN108770186A (zh) * 2018-05-25 2018-11-06 联合汽车电子有限公司 电压隔离电路及电子装置
CN112512208A (zh) * 2019-09-16 2021-03-16 中兴通讯股份有限公司 一种电路板

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6084779A (en) * 1998-10-02 2000-07-04 Sigrity, Inc. Ground and power patches on printed circuit board signal planes in the areas of integrated circuit chips
KR101045505B1 (ko) * 2005-06-15 2011-06-30 이비덴 가부시키가이샤 다층 프린트 배선판

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103917048A (zh) * 2012-12-31 2014-07-09 联想(北京)有限公司 一种柔性电路板的制作方法及柔性电路板
CN103917048B (zh) * 2012-12-31 2018-01-23 联想(北京)有限公司 一种柔性电路板的制作方法及柔性电路板
CN106211556A (zh) * 2016-07-28 2016-12-07 广东欧珀移动通信有限公司 印刷电路板及具有其的电子装置
CN108770186A (zh) * 2018-05-25 2018-11-06 联合汽车电子有限公司 电压隔离电路及电子装置
CN108770186B (zh) * 2018-05-25 2020-10-23 联合汽车电子有限公司 电压隔离电路及电子装置
CN112512208A (zh) * 2019-09-16 2021-03-16 中兴通讯股份有限公司 一种电路板

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Application publication date: 20100929