CN101842166A - 用于不均匀性聚焦的装置 - Google Patents

用于不均匀性聚焦的装置 Download PDF

Info

Publication number
CN101842166A
CN101842166A CN200880113520A CN200880113520A CN101842166A CN 101842166 A CN101842166 A CN 101842166A CN 200880113520 A CN200880113520 A CN 200880113520A CN 200880113520 A CN200880113520 A CN 200880113520A CN 101842166 A CN101842166 A CN 101842166A
Authority
CN
China
Prior art keywords
subassembly according
aerosol
deposit subassembly
nozzle
passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN200880113520A
Other languages
English (en)
Other versions
CN101842166B (zh
Inventor
布鲁斯·H·金
史蒂文·巴里·伍尔夫森
大卫·H·拉马希
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Optomec Inc
Original Assignee
Optomec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Optomec Inc filed Critical Optomec Inc
Publication of CN101842166A publication Critical patent/CN101842166A/zh
Application granted granted Critical
Publication of CN101842166B publication Critical patent/CN101842166B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/025—Nozzles having elongated outlets, e.g. slots, for the material to be sprayed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • B05B7/0441—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid with one inner conduit of liquid surrounded by an external conduit of gas upstream the mixing chamber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/04—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge
    • B05B7/0416—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid
    • B05B7/0441—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid with one inner conduit of liquid surrounded by an external conduit of gas upstream the mixing chamber
    • B05B7/0475—Spray pistols; Apparatus for discharge with arrangements for mixing liquids or other fluent materials before discharge with arrangements for mixing one gas and one liquid with one inner conduit of liquid surrounded by an external conduit of gas upstream the mixing chamber with means for deflecting the peripheral gas flow towards the central liquid flow
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/06—Spray pistols; Apparatus for discharge with at least one outlet orifice surrounding another approximately in the same plane
    • B05B7/062—Spray pistols; Apparatus for discharge with at least one outlet orifice surrounding another approximately in the same plane with only one liquid outlet and at least one gas outlet
    • B05B7/066—Spray pistols; Apparatus for discharge with at least one outlet orifice surrounding another approximately in the same plane with only one liquid outlet and at least one gas outlet with an inner liquid outlet surrounded by at least one annular gas outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/08—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point
    • B05B7/0807—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point to form intersecting jets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/16—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area
    • B05B12/18—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling the spray area using fluids, e.g. gas streams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B7/00—Spraying apparatus for discharge of liquids or other fluent materials from two or more sources, e.g. of liquid and air, of powder and gas
    • B05B7/02—Spray pistols; Apparatus for discharge
    • B05B7/08—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point
    • B05B7/0884—Spray pistols; Apparatus for discharge with separate outlet orifices, e.g. to form parallel jets, i.e. the axis of the jets being parallel, to form intersecting jets, i.e. the axis of the jets converging but not necessarily intersecting at a point the outlet orifices for jets constituted by a liquid or a mixture containing a liquid being aligned
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Vapour Deposition (AREA)
  • Nozzles (AREA)
  • Coating Apparatus (AREA)

Abstract

一种用于沉积物质的基本上平面型的组件。所述组件包括板，所述板当组装时限定至少一个气溶胶通道、包覆气体喷混室和喷嘴。这些组件优选是不均匀性的，并且优选是矩形。气溶胶通道可以进一步分隔以改善气溶胶流动的均匀性。

Description

用于不均匀性聚焦的装置
相关申请的交叉引用
本申请要求2007年8月31日提交的名称为“用于不均匀性聚焦的装置(Apparatus for Anisotropic Focusing)”的美国临时专利申请序列60/969,445的申请日的权益，该美国临时专利申请的说明书通过引用结合在此。
发明背景
发明领域(技术领域)：
本发明涉及使用不对称尖端几何结构的物质流的不均匀性聚焦的领域。
相关技术描述：
现有技术通常涉及使用空气动力学聚焦的用于液体和液体-粒子悬浮体的高分辨率、无掩模沉积的装置和方法。在最通常使用的实施方案中，将气溶胶流聚焦并且沉积到平面型或非平面型的目标上，从而形成图案，将该图案热处理或光化学处理以实现接近对应的本体物质的物理、光学和/或电性质的这些性质。该方法称为
Figure GPA00001115626300011
(无掩模中尺度物质沉积(MasklessMesoscale Material Deposition))技术，并且被用于沉积线宽的数量级比使用常规厚膜法沉积的线宽小的气溶胶化物质。沉积是在不使用掩模的条件下进行的。另外，
Figure GPA00001115626300012
方法能够限定宽度小于1微米的线。
Figure GPA00001115626300013
装置优选使用气溶胶喷射沉积头以形成环状传播射流，所述射流包括外部的包覆(sheath)流和内部的负载气溶胶的载体流。在环状气溶胶喷射法中，气溶胶流进入沉积头，优选在气溶胶化过程之后直接进入或在经过加热器组件之后进入，并且沿设备的轴引导至沉积头孔口。质量输出量优选通过气溶胶载气质量流控制器控制。在沉积头内部，气溶胶流优选通过经过毫米大小的孔口初始对准。然后优选将射出(emergent)的粒子流与环状包覆气体合并，所述环状包覆气体起到消除喷嘴的堵塞并且聚焦气溶胶流的作用。载气和包覆气体最通常地包括压缩空气或惰性气体，其中一种或两种可以含有变化的溶剂蒸气含量。例如，当气溶胶由水溶液形成时，可以将水蒸汽加入到载气或包覆气体中以防止液滴挥发。
包覆气体优选通过气溶胶入口下面的包覆空气入口进入并且与气溶胶流形成环状流。与气溶胶载气的情况相同，包覆气体流量优选通过质量流控制器控制。合并流以高速(～50m/s)通过对准目标的孔口离开喷嘴，并且随后冲击到目标上。此环状流将气溶胶流聚焦到目标上并且允许具有尺寸小于约1微米的特征的沉积。图案是通过相对于目标移动沉积头形成的。
涉及M3D方法的现有技术公开了通常使用同轴包覆流技术的装置。图1显示同心管的最简单的几何结构。最内部的雾管10运送气溶胶雾流中的雾化物质。管10与外壳12同心地安装在组件16的近端位置14处。雾管10和外壳12之间的环状空间形成同轴包覆室18。包覆气体在近端位置20处进入包覆室18使得在包覆气体移动了包覆室18的长度的时间之前，气体已经建立了与雾流同轴的充分发展的层流。雾和包覆流在发生流体动力学聚焦的会聚区22中相遇。会聚区22的远端锥体24提供额外的几何聚焦。尖端26可以加入到组件16中以提供额外的几何聚焦。
液体流式细胞计也利用流体动力学聚焦将样品流构成典型地要光学分析的极细的线。与气溶胶和气体包覆M3D法不同，流动流式细胞计仅采用液体，因此受益于液体和用于聚焦样品物质的层流的不可压缩性。液体样品(典型地预先处理的血液样品，类似于
Figure GPA00001115626300021
方法中的气溶胶流)由液体包覆体(sheath)聚焦，该液体包覆体典型地为去离子水或盐水溶液。典型地，液体样品被聚焦至约10微米宽，以使感兴趣的生物细胞几乎依次排列。这些细胞从聚焦室直接进入光学透明且典型正方形的管，所述管具有约250平方微米的内部正方形室。正方形流动池不用于额外地聚焦细胞。在一些情况下，引导激光通过流动池的一个表面，并且光学检测器与激光相对安置，并且垂直于激光，以检测当激光束穿过聚焦的样品流时反射和折射的光。由于样品基本上为顺序排列的细胞，可以分析改变的光图案并且可以检测和计数不同的细胞。另外，然后可以使用特别设备将细胞的流分类并且沉积到独立的室中。聚焦和光学室(典型地称为“流动池”)的构造对于流式细胞计的公众是熟知的并且缺点在于聚焦室与光学室的进口难于对齐；另外的缺点在于高成本。在大部分应用中，这些流动池必须再次洗涤并再次使用，而非丢弃。再次使用的缺点是明显的：交叉污染和浪费时间。还已知流式细胞计尺寸较大，以及其必须泵送、阀控(valve)和计量各种流的复杂性。当处置潜在有害的生物流体时，装载、卸载和运行这些设备可能是极为困难且有害的。
一次性平面型液体处置组件也是流式细胞计领域熟知的，如在专利6,537,501中示例的。并非具有许多管和独立的阀门，而是可利用使用许多典型为塑料材料的薄层的小的液体处置盒。每一层可以具有不同的流体路径的室或仅为将一个通道与另一个通道分隔的阻挡层。当适当取向和组装时，建立流体可以从一层流到另一层的流体“线路板”。采用这种层状途径，2-维聚焦室被用于将样品流体聚焦到光学室中。
发明简述
本发明是物质沉积组件，其包含第一盖板和第二盖板，盖板中的一个或两个包括用于含物质的气溶胶的入口和一个或多个包覆气体入口；在盖板之间密封的插入件，所述插入件包括至少一个与气溶胶入口和不均匀性喷嘴流体连接的气溶胶通道；其中所述一个或多个包覆气体入口与包覆体喷混室(plenum)流体连接，所述包覆体喷混室包封至少一个气溶胶通道的出口和喷嘴的进口。插入件优选包括两个镜像板，其在组装到一起时形成气溶胶通道和喷嘴。包覆气体优选将包覆体喷混室和喷嘴中的气溶胶包围和聚焦。包覆体喷混室优选为不均匀性的。喷嘴优选为矩形，气溶胶通道优选为矩形并且优选与矩形喷嘴对齐。喷嘴优选可在物质沉积过程中相对于基底移动，并且任选地可相对于喷嘴和基底的相对移动方向倾斜。沉积组件优选还包括连接一个或多个包覆气体入口和包覆体喷混室的通道，构造通道使得包覆气体进入包覆体喷混室从而在基本上平行于气溶胶在气溶胶通道中的流动方向的方向上移动。
插入件任选地包括包含气溶胶通道的尖端垫片。尖端垫片优选可变形，并且尖端垫片的变形优选改变气溶胶通道的尖端的宽度。
所述至少一个气溶胶通道的至少一部分任选地包括交替偏置的间隔体或任选地再分隔成多个更小的次通道。次通道优选轴向对齐并且排列成两排，第一排中的次通道偏移第二排中的次通道。第一排中的次通道任选地相对于第二排中的次通道形成角度，在这种情况下，在相邻次通道中的各个气溶胶流优选在离开气溶胶通道时交叉。
本发明的目的、优点和新的特征，以及适用性的进一步范围部分将在后面的详述部分中结合附图描述，对于本领域技术人员，部分地，将通过以下内容的阅读变得明显，或可以通过本发明的实施而知晓。本发明的目的和优点可以通过特别在后附权利要求书中指出的手段和组合而实现和获得。
附图说明
结合到说明书中并且形成说明书的一部分的附图示出本发明的一个或多个实施方案，并且与描述一起起到解释本发明的原理的作用。附图仅为了示出本发明的一个或多个优选实施方案的目的并且不应理解为限制本发明。在附图中：
图1是使用同心管的现有技术纳米沉积头的示意图；
图2是具有矩形喷嘴构造的平面型组件的分解图示意图；
图3是不含管的平面型组件的示意图；
图4是不含管的平面型组件的另一个实施方案的示意图；
图5是解释层流曲线的图；
图6是显示由图5中所示流动曲线产生的沉积图案的图；
图7是解释流动矫直的图；
图8是显示靠近在一起的许多小的层流图案的图；
图9是显示雾通道内多个正方形几何通道的示意图；
图10是显示具有与图9不同的几何结构的雾通道内多个通道的示意图；和
图11是显示具有与图9和图10不同的几何结构的雾通道内多个通道的示意图。
发明详述
本发明涉及使用不对称喷嘴几何结构的用于物质流的不均匀性聚焦的装置和方法。一种构造这样设备的直接方法是挤出两个同轴的矩形管；将它们类似于图1的同心管构造组装，然后连接也与图1中所示设计类似的较小的矩形尖端管。本发明优选采用平面型组件，其提供在通道设计方面的巨大灵活性并且使得可以构造使用普通雾(common mist)的聚焦喷嘴的阵列；包覆体喷混室和废物喷混室。矩形喷嘴仅是可用于这些平面型组件的尖端几何结构的一个实例。
图2显示表现出不均匀性聚焦的矩形喷嘴平面型组件的一个实施方案的分解图。全部四层优选用安置在两个对准孔28中的接合销对齐。所述层优选经由孔30中的六个螺丝钉在仅使用挤压的情况下被密封在一起。为了使挤压密封起作用，所有的啮合表面必须良好地进行精整并且优选抛光。备选地，如果目标能够在挤压的过程中表现出一些变形，例如高硬度塑料基底，则大部分微小缺陷和刮痕将被周围的变形材料密封。使用过软基底的风险在于将组件密封所需的挤压可能显著地影响喷嘴的几何形状。可以备选地采用任何其它密封组件的方法，包括但不限于垫圈和/或粘合剂。
气溶胶雾通过雾口(mist port)32进入组件。包覆气体通过包覆体口34进入组件。有两个相同的雾通道板36和38，它们当以图3中详述的镜像结构(mirrored configuration)组装时形成矩形雾通道52。顶板40相对于雾通道板36的表面42密封。底板44相对于雾通道板38的背表面(在图2中不可见)密封。在图3中，当将顶板和底板40和44(在图3中未显示)组装时，围绕雾通道52的各个侧面54、顶部56和底部(不可见)形成包覆体喷混室。会聚区58是具有大部分不均匀性流体动力学聚焦的区域。不均匀性几何聚焦发生在图2中所示的区域48中。所述流在尖端50处离开喷嘴。
矩形尖端可用于诸如共形涂布之类的应用，因为其提供宽且扁平的喷雾图案。此尖端不对称地聚焦雾，从而在头在垂直于较长边的方向上移动的条件下提供较宽的线宽，而在头在垂直于较短边的方向上移动的条件下提供较窄的线宽。后一种图案将产生增加的沉积厚度，原因在于其在其自身上沉积较多的物质。对于以类似方式使用的多喷嘴沉积头也是这样。之间的任何图案宽度可以通过使头相对于物质沉积的方向形成角度而实现。另外，如果在与矩形喷嘴尖端相同的方向上取向，则使用矩形雾通道(代替典型使用的圆管或正方形通道)改善沉积图案效果的均匀性。当在与矩形喷嘴尖端的细轴相同的方向上沉积时，需要包覆流以将潜在的尖端堵塞最小化并且聚焦气溶胶雾以产生较小的沉积图案(细线)。
图4显示一个实施方案，其中顶板60和底板61几乎相同，并且雾通道62通过将尖端垫片63夹在两个相同的包覆垫片64、66之间而限定。这样的喷嘴允许将相同的平面型组件用于多种形式的(manifold)雾、气体和废物，而不同的尖端-垫片63层可以用于不同的应用。此尖端-垫片可以通过冲压、机械加工、激光切割、金属丝EDM(wire EDM)、光刻蚀或任何其它制造技术来制造。另外，单一尖端-垫片构造可以由可变性材料如退火不锈钢或高硬度塑料制成，并且具有常见的雾通道宽度，例如1mm宽。在制造加工的过程中，可以设定定位销65之间的距离以得到雾通道62的远端尖端的所需宽度，从而改变沉积线的宽度。另外，假定层之间的密封可以保持，或使用者可以接受适当物质沉积中的短暂中断，则此尖端可以在不用必须改变喷嘴或旋转喷嘴的条件下简单地通过移动定位销65以增加尖端宽度来沉积不同的线宽度。
流动矫直
喷嘴中的层流贡献于不均匀的物质沉积，原因在于流的中心的物质的速度大于在边缘的速度，如图5中所示。因此在图案的中心沉积比边缘更多的物质。当基底相对于喷嘴移动时，产生如图6中所示的不均匀的沉积图案，其中在图案的中心比沿边缘沉积更多的物质。然而，层流优于湍流，因为后者典型地产生较差的聚焦和较差的边缘限定。流动矫直改善层流的沉积均匀性，特别是对于宽图案。流动矫直是流体力学领域中熟知的并且是减少大孔管中湍流并且使得层流曲线更均匀的建立方法，如图7和8中所示。
在一个用于实现层流分布的“矫直”的构造中，宽的矩形雾通道与宽的矩形尖端对齐。如图9中所示，雾通道分隔成多个更小的次通道68。次通道可以为矩形、圆形、正方形或包括任何其它形状。雾通道可以备选地包括任何其它几何结构，例如如图10中所示的交替偏置间隔体70，以实现更均匀的流动图案。与图7和8中所示图案类似，此构造导致沉积密度中的较小波动，原因在于许多小的层流图案彼此靠近地沉积。如图11中所示，这样的波动可以通过下列方法减小：安置与第一排形成偏置的另一排的雾次通道，使得一排中通道的中部正好在下一排相邻通道的壁的上方。图11显示轴向对齐的次通道72。可以通过使一排通道相对于其它通道成角度，从而就在流进入不均匀性聚焦区域中时使各个流交叉而进一步改善局部均匀性。
对于将雾通道再分隔的一个备选方案是使用对直且供给单一宽喷嘴的多个任意形状的相邻雾管或通道。在此实施方案中，优选存在为所有管或通道共有的单一包覆体喷混室。
尽管特别参照这些优选实施方案详细描述了本发明，但是其它实施方案也可以实现相同的结果。本发明的变化和改变对于本领域技术人员是明显的，并且意欲在后附权利要求中涵盖所有这样的改变和等价内容。以上引用的全部参考文献、申请、专利和出版物的整个公开内容都通过引用结合在此。

Claims (17)

1.一种物质沉积组件，所述物质沉积组件包括：
第一盖板和第二盖板，所述盖板中的一个或两个包括用于含物质的气溶胶的入口和一个或多个包覆气体入口；和
在所述盖板之间密封的插入件，所述插入件包括至少一个与所述气溶胶入口和不均匀的喷嘴流体连接的气溶胶通道；
其中所述一个或多个包覆气体入口与包覆体喷混室流体连接，所述包覆体喷混室包封所述至少一个气溶胶通道的出口和所述喷嘴的进口。
2.根据权利要求1所述的沉积组件，其中所述插入件包含两个镜像板，所述镜像板在组装到一起时形成所述气溶胶通道和所述喷嘴。
3.根据权利要求1所述的沉积组件，其中所述包覆气体将所述包覆体喷混室和所述喷嘴中的所述气溶胶包围和聚焦。
4.根据权利要求1所述的沉积组件，其中所述喷嘴为矩形。
5.根据权利要求4所述的沉积组件，其中所述气溶胶通道为矩形，并且与所述矩形喷嘴对齐。
6.根据权利要求1所述的沉积组件，其中所述喷嘴在物质沉积过程中相对于基底是可移动的。
7.根据权利要求6所述的沉积组件，其中所述喷嘴相对于所述喷嘴和所述基底的相对移动方向是可倾斜的。
8.根据权利要求1所述的沉积组件，所述沉积组件还包括连接所述一个或多个包覆气体入口和所述包覆体喷混室的通道，构造所述通道使得所述包覆气体进入所述包覆体喷混室，从而在基本上平行于所述气溶胶在所述气溶胶通道中的流动方向的方向上移动。
9.根据权利要求1所述的沉积组件，其中所述插入件包括尖端垫片，所述尖端垫片包括气溶胶通道。
10.根据权利要求9所述的沉积组件，其中所述尖端垫片是可变形的。
11.根据权利要求10所述的沉积组件，其中所述尖端垫片的变形改变所述气溶胶通道的尖端的宽度。
12.根据权利要求1所述的沉积组件，其中所述至少一个气溶胶通道的至少一部分被再分隔成多个更小的次通道。
13.根据权利要求12所述的沉积组件，其中所述次通道轴向对齐并且排列成两排，第一排中的所述次通道偏移第二排中的所述次通道。
14.根据权利要求13所述的沉积组件，其中所述第一排中的所述次通道相对于所述第二排中的所述次通道形成角度。
15.根据权利要求14所述的沉积组件，其中在相邻次通道中的各个气溶胶流在离开所述气溶胶通道时交叉。
16.根据权利要求1所述的沉积组件，其中所述至少一个气溶胶通道的至少一部分包括交替偏置间隔体。
17.根据权利要求1所述的沉积组件，其中所述包覆体喷混室是不均匀性的。
CN2008801135206A 2007-08-31 2008-09-02 用于不均匀性聚焦的装置 Active CN101842166B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US96944507P 2007-08-31 2007-08-31
US60/969,445 2007-08-31
PCT/US2008/075035 WO2009029938A2 (en) 2007-08-31 2008-09-02 Apparatus for anisotropic focusing

Publications (2)

Publication Number Publication Date
CN101842166A true CN101842166A (zh) 2010-09-22
CN101842166B CN101842166B (zh) 2013-10-09

Family

ID=40388168

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008801135206A Active CN101842166B (zh) 2007-08-31 2008-09-02 用于不均匀性聚焦的装置

Country Status (6)

Country Link
US (1) US9192054B2 (zh)
JP (1) JP2010538277A (zh)
KR (1) KR20100067098A (zh)
CN (1) CN101842166B (zh)
TW (1) TWI538737B (zh)
WO (1) WO2009029938A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109689224A (zh) * 2016-07-14 2019-04-26 伊利诺斯工具制品有限公司 层压槽模组件

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7045015B2 (en) 1998-09-30 2006-05-16 Optomec Design Company Apparatuses and method for maskless mesoscale material deposition
US7938341B2 (en) * 2004-12-13 2011-05-10 Optomec Design Company Miniature aerosol jet and aerosol jet array
US7674671B2 (en) 2004-12-13 2010-03-09 Optomec Design Company Aerodynamic jetting of aerosolized fluids for fabrication of passive structures
US20070154634A1 (en) * 2005-12-15 2007-07-05 Optomec Design Company Method and Apparatus for Low-Temperature Plasma Sintering
US20100310630A1 (en) * 2007-04-27 2010-12-09 Technische Universitat Braunschweig Coated surface for cell culture
TWI482662B (zh) * 2007-08-30 2015-05-01 Optomec Inc 機械上一體式及緊密式耦合之列印頭以及噴霧源
US8887658B2 (en) * 2007-10-09 2014-11-18 Optomec, Inc. Multiple sheath multiple capillary aerosol jet
US9178184B2 (en) 2013-02-21 2015-11-03 Universal Display Corporation Deposition of patterned organic thin films
GB2546016B (en) 2014-06-20 2018-11-28 Velo3D Inc Apparatuses, systems and methods for three-dimensional printing
KR102444204B1 (ko) 2015-02-10 2022-09-19 옵토멕 인코포레이티드 에어로졸의 비행 중 경화에 의해 3차원 구조를 제조하는 방법
WO2017079091A1 (en) 2015-11-06 2017-05-11 Velo3D, Inc. Adept three-dimensional printing
CN108698126A (zh) 2015-12-10 2018-10-23 维洛3D公司 精湛的三维打印
CN106256447B (zh) * 2015-12-10 2018-09-21 耘创九州智能装备有限公司 字符选择气控装置以及字符选择的气控方法
WO2017143077A1 (en) 2016-02-18 2017-08-24 Velo3D, Inc. Accurate three-dimensional printing
EP3492244A1 (en) 2016-06-29 2019-06-05 VELO3D, Inc. Three-dimensional printing system and method for three-dimensional printing
DE202016103464U1 (de) * 2016-06-29 2016-07-19 SMR Patents S.à.r.l. Heizung, Vorrichtung zum Aufbringen einer Heizung und Außenrückblickspiegel mit einer Heizung
US11691343B2 (en) 2016-06-29 2023-07-04 Velo3D, Inc. Three-dimensional printing and three-dimensional printers
CN112941465A (zh) * 2016-07-29 2021-06-11 环球展览公司 沉积喷嘴
US10661341B2 (en) 2016-11-07 2020-05-26 Velo3D, Inc. Gas flow in three-dimensional printing
US10611092B2 (en) 2017-01-05 2020-04-07 Velo3D, Inc. Optics in three-dimensional printing
US10369629B2 (en) 2017-03-02 2019-08-06 Veo3D, Inc. Three-dimensional printing of three-dimensional objects
US20180281237A1 (en) 2017-03-28 2018-10-04 Velo3D, Inc. Material manipulation in three-dimensional printing
US10632746B2 (en) 2017-11-13 2020-04-28 Optomec, Inc. Shuttering of aerosol streams
US10272525B1 (en) 2017-12-27 2019-04-30 Velo3D, Inc. Three-dimensional printing systems and methods of their use
US10144176B1 (en) 2018-01-15 2018-12-04 Velo3D, Inc. Three-dimensional printing systems and methods of their use
EP3853395A4 (en) * 2018-09-21 2022-06-15 Raytheon Technologies Corporation SOLUTION BASED CORROSION Inhibitor FOR ALUMINUM ALLOY HEAT SPRAY COATINGS
US11454490B2 (en) 2019-04-01 2022-09-27 General Electric Company Strain sensor placement
KR102479361B1 (ko) * 2019-08-13 2022-12-19 티에스아이 인코포레이티드 광학 챔버용 커튼 유동 설계

Family Cites Families (218)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3256677A (en) * 1965-02-05 1966-06-21 Mixing Equipment Co Inc Defoaming
US4200660A (en) * 1966-04-18 1980-04-29 Firmenich & Cie. Aromatic sulfur flavoring agents
US3474971A (en) 1967-06-14 1969-10-28 North American Rockwell Two-piece injector
US3590477A (en) 1968-12-19 1971-07-06 Ibm Method for fabricating insulated-gate field effect transistors having controlled operating characeristics
US3808550A (en) * 1969-12-15 1974-04-30 Bell Telephone Labor Inc Apparatuses for trapping and accelerating neutral particles
US3642202A (en) * 1970-05-13 1972-02-15 Exxon Research Engineering Co Feed system for coking unit
US3808432A (en) * 1970-06-04 1974-04-30 Bell Telephone Labor Inc Neutral particle accelerator utilizing radiation pressure
US3715785A (en) * 1971-04-29 1973-02-13 Ibm Technique for fabricating integrated incandescent displays
US3846661A (en) 1971-04-29 1974-11-05 Ibm Technique for fabricating integrated incandescent displays
US3854321A (en) 1973-04-27 1974-12-17 B Dahneke Aerosol beam device and method
US3901798A (en) 1973-11-21 1975-08-26 Environmental Research Corp Aerosol concentrator and classifier
US4036434A (en) 1974-07-15 1977-07-19 Aerojet-General Corporation Fluid delivery nozzle with fluid purged face
US3982251A (en) 1974-08-23 1976-09-21 Ibm Corporation Method and apparatus for recording information on a recording medium
US3959798A (en) 1974-12-31 1976-05-25 International Business Machines Corporation Selective wetting using a micromist of particles
US4019188A (en) * 1975-05-12 1977-04-19 International Business Machines Corporation Micromist jet printer
US3974769A (en) 1975-05-27 1976-08-17 International Business Machines Corporation Method and apparatus for recording information on a recording surface through the use of mists
US4004733A (en) * 1975-07-09 1977-01-25 Research Corporation Electrostatic spray nozzle system
US4016417A (en) * 1976-01-08 1977-04-05 Richard Glasscock Benton Laser beam transport, and method
US4046073A (en) 1976-01-28 1977-09-06 International Business Machines Corporation Ultrasonic transfer printing with multi-copy, color and low audible noise capability
US4046074A (en) 1976-02-02 1977-09-06 International Business Machines Corporation Non-impact printing system
US4034025A (en) 1976-02-09 1977-07-05 Martner John G Ultrasonic gas stream liquid entrainment apparatus
US4092535A (en) * 1977-04-22 1978-05-30 Bell Telephone Laboratories, Incorporated Damping of optically levitated particles by feedback and beam shaping
US4171096A (en) 1977-05-26 1979-10-16 John Welsh Spray gun nozzle attachment
US4112437A (en) 1977-06-27 1978-09-05 Eastman Kodak Company Electrographic mist development apparatus and method
JPS592617B2 (ja) 1977-12-22 1984-01-19 株式会社リコー インク噴射装置
US4132894A (en) * 1978-04-04 1979-01-02 The United States Of America As Represented By The United States Department Of Energy Monitor of the concentration of particles of dense radioactive materials in a stream of air
US4200669A (en) 1978-11-22 1980-04-29 The United States Of America As Represented By The Secretary Of The Navy Laser spraying
GB2052566B (en) * 1979-03-30 1982-12-15 Rolls Royce Laser aplication of hard surface alloy
US4323756A (en) * 1979-10-29 1982-04-06 United Technologies Corporation Method for fabricating articles by sequential layer deposition
US4315458A (en) * 1980-12-01 1982-02-16 Hudson Iii Raymond M Ventilated wind-diverter shed for man-spraying of polyurethane foam from within onto roofs
US4453803A (en) * 1981-06-25 1984-06-12 Agency Of Industrial Science & Technology Optical waveguide for middle infrared band
US4605574A (en) 1981-09-14 1986-08-12 Takashi Yonehara Method and apparatus for forming an extremely thin film on the surface of an object
US4485387A (en) 1982-10-26 1984-11-27 Microscience Systems Corp. Inking system for producing circuit patterns
US4497692A (en) * 1983-06-13 1985-02-05 International Business Machines Corporation Laser-enhanced jet-plating and jet-etching: high-speed maskless patterning method
US4601921A (en) 1984-12-24 1986-07-22 General Motors Corporation Method and apparatus for spraying coating material
US4689052A (en) 1986-02-19 1987-08-25 Washington Research Foundation Virtual impactor
US4823009A (en) * 1986-04-14 1989-04-18 Massachusetts Institute Of Technology Ir compatible deposition surface for liquid chromatography
US4670135A (en) * 1986-06-27 1987-06-02 Regents Of The University Of Minnesota High volume virtual impactor
JPS6359195A (ja) * 1986-08-29 1988-03-15 Hitachi Ltd 磁気記録再生装置
DE3686161D1 (de) * 1986-09-25 1992-08-27 Lucien Diego Laude Vorrichtung zur laserunterstuetzten, elektrolytischen metallabscheidung.
US4904621A (en) * 1987-07-16 1990-02-27 Texas Instruments Incorporated Remote plasma generation process using a two-stage showerhead
US4893886A (en) * 1987-09-17 1990-01-16 American Telephone And Telegraph Company Non-destructive optical trap for biological particles and method of doing same
US4997809A (en) * 1987-11-18 1991-03-05 International Business Machines Corporation Fabrication of patterned lines of high Tc superconductors
US4920254A (en) * 1988-02-22 1990-04-24 Sierracin Corporation Electrically conductive window and a method for its manufacture
JPH0621335B2 (ja) 1988-02-24 1994-03-23 工業技術院長 レ−ザ溶射法
US4895735A (en) 1988-03-01 1990-01-23 Texas Instruments Incorporated Radiation induced pattern deposition
US4917830A (en) * 1988-09-19 1990-04-17 The United States Of America As Represented By The United States Department Of Energy Monodisperse aerosol generator
US4971251A (en) 1988-11-28 1990-11-20 Minnesota Mining And Manufacturing Company Spray gun with disposable liquid handling portion
US5614252A (en) * 1988-12-27 1997-03-25 Symetrix Corporation Method of fabricating barium strontium titanate
US4911365A (en) * 1989-01-26 1990-03-27 James E. Hynds Spray gun having a fanning air turbine mechanism
US5043548A (en) 1989-02-08 1991-08-27 General Electric Company Axial flow laser plasma spraying
US5064685A (en) 1989-08-23 1991-11-12 At&T Laboratories Electrical conductor deposition method
US5032850A (en) 1989-12-18 1991-07-16 Tokyo Electric Co., Ltd. Method and apparatus for vapor jet printing
DE4000690A1 (de) 1990-01-12 1991-07-18 Philips Patentverwaltung Verfahren zum herstellen von ultrafeinen partikeln und deren verwendung
DE69130184T2 (de) 1990-02-23 1999-02-11 Fuji Photo Film Co Ltd Verfahren zur Herstellung mehrschichtiger Beschichtungen
DE4006511A1 (de) 1990-03-02 1991-09-05 Krupp Gmbh Einrichtung zum zufuehren pulverfoermiger zusatzwerkstoffe in den bereich einer schweissstelle
US5152462A (en) 1990-08-10 1992-10-06 Roussel Uclaf Spray system
JPH04120259A (ja) * 1990-09-10 1992-04-21 Agency Of Ind Science & Technol レーザ溶射法による機器・部材の製造方法および装置
FR2667811B1 (fr) * 1990-10-10 1992-12-04 Snecma Dispositif d'apport de poudre pour revetement par traitement au faisceau laser.
US5245404A (en) 1990-10-18 1993-09-14 Physical Optics Corportion Raman sensor
US5170890A (en) 1990-12-05 1992-12-15 Wilson Steven D Particle trap
CA2061069C (en) * 1991-02-27 1999-06-29 Toshio Kubota Method of electrostatically spray-coating a workpiece with paint
US5292418A (en) * 1991-03-08 1994-03-08 Mitsubishi Denki Kabushiki Kaisha Local laser plating apparatus
US5176744A (en) * 1991-08-09 1993-01-05 Microelectronics Computer & Technology Corp. Solution for direct copper writing
US5164535A (en) 1991-09-05 1992-11-17 Silent Options, Inc. Gun silencer
US5495105A (en) * 1992-02-20 1996-02-27 Canon Kabushiki Kaisha Method and apparatus for particle manipulation, and measuring apparatus utilizing the same
US5194297A (en) * 1992-03-04 1993-03-16 Vlsi Standards, Inc. System and method for accurately depositing particles on a surface
US5378508A (en) * 1992-04-01 1995-01-03 Akzo Nobel N.V. Laser direct writing
AU4668393A (en) * 1992-07-08 1994-01-31 Nordson Corporation Apparatus and methods for applying discrete foam coatings
US5335000A (en) 1992-08-04 1994-08-02 Calcomp Inc. Ink vapor aerosol pen for pen plotters
US5294459A (en) * 1992-08-27 1994-03-15 Nordson Corporation Air assisted apparatus and method for selective coating
IL107120A (en) * 1992-09-29 1997-09-30 Boehringer Ingelheim Int Atomising nozzle and filter and spray generating device
US5344676A (en) 1992-10-23 1994-09-06 The Board Of Trustees Of The University Of Illinois Method and apparatus for producing nanodrops and nanoparticles and thin film deposits therefrom
US5322221A (en) * 1992-11-09 1994-06-21 Graco Inc. Air nozzle
US5449536A (en) 1992-12-18 1995-09-12 United Technologies Corporation Method for the application of coatings of oxide dispersion strengthened metals by laser powder injection
US5270542A (en) 1992-12-31 1993-12-14 Regents Of The University Of Minnesota Apparatus and method for shaping and detecting a particle beam
US5425802A (en) * 1993-05-05 1995-06-20 The United States Of American As Represented By The Administrator Of Environmental Protection Agency Virtual impactor for removing particles from an airstream and method for using same
US5366559A (en) 1993-05-27 1994-11-22 Research Triangle Institute Method for protecting a substrate surface from contamination using the photophoretic effect
US5733609A (en) * 1993-06-01 1998-03-31 Wang; Liang Ceramic coatings synthesized by chemical reactions energized by laser plasmas
IL106803A (en) 1993-08-25 1998-02-08 Scitex Corp Ltd Printable inkjet head
US5403617A (en) * 1993-09-15 1995-04-04 Mobium Enterprises Corporation Hybrid pulsed valve for thin film coating and method
US5736195A (en) * 1993-09-15 1998-04-07 Mobium Enterprises Corporation Method of coating a thin film on a substrate
US5554415A (en) 1994-01-18 1996-09-10 Qqc, Inc. Substrate coating techniques, including fabricating materials on a surface of a substrate
US5512745A (en) * 1994-03-09 1996-04-30 Board Of Trustees Of The Leland Stanford Jr. University Optical trap system and method
EP0705483B1 (en) * 1994-04-25 1999-11-24 Koninklijke Philips Electronics N.V. Method of curing a film
US5609921A (en) * 1994-08-26 1997-03-11 Universite De Sherbrooke Suspension plasma spray
US5732885A (en) * 1994-10-07 1998-03-31 Spraying Systems Co. Internal mix air atomizing spray nozzle
US5486676A (en) * 1994-11-14 1996-01-23 General Electric Company Coaxial single point powder feed nozzle
US5861136A (en) * 1995-01-10 1999-01-19 E. I. Du Pont De Nemours And Company Method for making copper I oxide powders by aerosol decomposition
US5770272A (en) 1995-04-28 1998-06-23 Massachusetts Institute Of Technology Matrix-bearing targets for maldi mass spectrometry and methods of production thereof
US5814152A (en) 1995-05-23 1998-09-29 Mcdonnell Douglas Corporation Apparatus for coating a substrate
US5612099A (en) * 1995-05-23 1997-03-18 Mcdonnell Douglas Corporation Method and apparatus for coating a substrate
TW284907B (en) 1995-06-07 1996-09-01 Cauldron Lp Removal of material by polarized irradiation and back side application for radiation
US5882722A (en) * 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
GB9515439D0 (en) 1995-07-27 1995-09-27 Isis Innovation Method of producing metal quantum dots
US5997956A (en) 1995-08-04 1999-12-07 Microcoating Technologies Chemical vapor deposition and powder formation using thermal spray with near supercritical and supercritical fluid solutions
US5607730A (en) * 1995-09-11 1997-03-04 Clover Industries, Inc. Method and apparatus for laser coating
ATE219165T1 (de) 1995-12-14 2002-06-15 Imperial College Film- oder schicht-abscheidung und pulver herstellung
US6015083A (en) * 1995-12-29 2000-01-18 Microfab Technologies, Inc. Direct solder bumping of hard to solder substrate
US5772106A (en) * 1995-12-29 1998-06-30 Microfab Technologies, Inc. Printhead for liquid metals and method of use
US5993549A (en) 1996-01-19 1999-11-30 Deutsche Forschungsanstalt Fuer Luft- Und Raumfahrt E.V. Powder coating apparatus
US5676719A (en) 1996-02-01 1997-10-14 Engineering Resources, Inc. Universal insert for use with radiator steam traps
US5772964A (en) * 1996-02-08 1998-06-30 Lab Connections, Inc. Nozzle arrangement for collecting components from a fluid for analysis
CN1093783C (zh) * 1996-02-21 2002-11-06 松下电器产业株式会社 液体喷涂喷嘴和液体喷涂喷嘴的制造方法
CN1137285C (zh) * 1997-04-30 2004-02-04 高松研究所 金属糊和金属膜的制造方法
US5844192A (en) 1996-05-09 1998-12-01 United Technologies Corporation Thermal spray coating method and apparatus
US6116184A (en) 1996-05-21 2000-09-12 Symetrix Corporation Method and apparatus for misted liquid source deposition of thin film with reduced mist particle size
US5854311A (en) 1996-06-24 1998-12-29 Richart; Douglas S. Process and apparatus for the preparation of fine powders
CN1226960A (zh) * 1996-07-08 1999-08-25 康宁股份有限公司 气体助推式雾化装置
US5772963A (en) * 1996-07-30 1998-06-30 Bayer Corporation Analytical instrument having a control area network and distributed logic nodes
US6544599B1 (en) * 1996-07-31 2003-04-08 Univ Arkansas Process and apparatus for applying charged particles to a substrate, process for forming a layer on a substrate, products made therefrom
US6143116A (en) 1996-09-26 2000-11-07 Kyocera Corporation Process for producing a multi-layer wiring board
US5742050A (en) * 1996-09-30 1998-04-21 Aviv Amirav Method and apparatus for sample introduction into a mass spectrometer for improving a sample analysis
US6379745B1 (en) * 1997-02-20 2002-04-30 Parelec, Inc. Low temperature method and compositions for producing electrical conductors
US6699304B1 (en) 1997-02-24 2004-03-02 Superior Micropowders, Llc Palladium-containing particles, method and apparatus of manufacture, palladium-containing devices made therefrom
US5894403A (en) * 1997-05-01 1999-04-13 Wilson Greatbatch Ltd. Ultrasonically coated substrate for use in a capacitor
US6890624B1 (en) * 2000-04-25 2005-05-10 Nanogram Corporation Self-assembled structures
US6952504B2 (en) 2001-12-21 2005-10-04 Neophotonics Corporation Three dimensional engineering of planar optical structures
US6391494B2 (en) * 1999-05-13 2002-05-21 Nanogram Corporation Metal vanadium oxide particles
US5980998A (en) 1997-09-16 1999-11-09 Sri International Deposition of substances on a surface
US6548122B1 (en) * 1997-09-16 2003-04-15 Sri International Method of producing and depositing a metal film
WO1999019900A2 (en) * 1997-10-14 1999-04-22 Patterning Technologies Limited Method of forming an electronic device
US6007631A (en) 1997-11-10 1999-12-28 Speedline Technologies, Inc. Multiple head dispensing system and method
US5993416A (en) 1998-01-15 1999-11-30 Medtronic Ave, Inc. Method and apparatus for regulating the fluid flow rate to and preventing over-pressurization of a balloon catheter
US6349668B1 (en) * 1998-04-27 2002-02-26 Msp Corporation Method and apparatus for thin film deposition on large area substrates
WO1999060397A1 (en) * 1998-05-18 1999-11-25 University Of Washington Liquid analysis cartridge
DE19822674A1 (de) 1998-05-20 1999-12-09 Gsf Forschungszentrum Umwelt Gaseinlaß für eine Ionenquelle
DE19822672B4 (de) * 1998-05-20 2005-11-10 GSF - Forschungszentrum für Umwelt und Gesundheit GmbH Verfahren und Vorrichtung zur Erzeugung eines gerichteten Gasstrahls
FR2780170B1 (fr) * 1998-06-19 2000-08-11 Aerospatiale Dispositif autonome de limitation du debit d'un fluide dans une canalisation et circuit de carburant pour aeronef comportant un tel dispositif
US6159749A (en) 1998-07-21 2000-12-12 Beckman Coulter, Inc. Highly sensitive bead-based multi-analyte assay system using optical tweezers
US6149076A (en) * 1998-08-05 2000-11-21 Nordson Corporation Dispensing apparatus having nozzle for controlling heated liquid discharge with unheated pressurized air
KR100271208B1 (ko) 1998-08-13 2000-12-01 윤덕용 선택적 용침공정을 이용한 쾌속조형방법및 쾌속조형장치
US7347850B2 (en) 1998-08-14 2008-03-25 Incept Llc Adhesion barriers applicable by minimally invasive surgery and methods of use thereof
US7098163B2 (en) * 1998-08-27 2006-08-29 Cabot Corporation Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells
DE19841401C2 (de) 1998-09-10 2000-09-21 Lechler Gmbh & Co Kg Zweistoff-Flachstrahldüse
US6290342B1 (en) 1998-09-30 2001-09-18 Xerox Corporation Particulate marking material transport apparatus utilizing traveling electrostatic waves
US7294366B2 (en) 1998-09-30 2007-11-13 Optomec Design Company Laser processing for heat-sensitive mesoscale deposition
US7045015B2 (en) * 1998-09-30 2006-05-16 Optomec Design Company Apparatuses and method for maskless mesoscale material deposition
US20050156991A1 (en) 1998-09-30 2005-07-21 Optomec Design Company Maskless direct write of copper using an annular aerosol jet
US6136442A (en) 1998-09-30 2000-10-24 Xerox Corporation Multi-layer organic overcoat for particulate transport electrode grid
US6454384B1 (en) 1998-09-30 2002-09-24 Xerox Corporation Method for marking with a liquid material using a ballistic aerosol marking apparatus
US6116718A (en) 1998-09-30 2000-09-12 Xerox Corporation Print head for use in a ballistic aerosol marking apparatus
US6416157B1 (en) 1998-09-30 2002-07-09 Xerox Corporation Method of marking a substrate employing a ballistic aerosol marking apparatus
US8110247B2 (en) * 1998-09-30 2012-02-07 Optomec Design Company Laser processing for heat-sensitive mesoscale deposition of oxygen-sensitive materials
US20030020768A1 (en) * 1998-09-30 2003-01-30 Renn Michael J. Direct write TM system
US6416156B1 (en) 1998-09-30 2002-07-09 Xerox Corporation Kinetic fusing of a marking material
US20040197493A1 (en) 1998-09-30 2004-10-07 Optomec Design Company Apparatus, methods and precision spray processes for direct write and maskless mesoscale material deposition
US6636676B1 (en) 1998-09-30 2003-10-21 Optomec Design Company Particle guidance system
US6251488B1 (en) 1999-05-05 2001-06-26 Optomec Design Company Precision spray processes for direct write electronic components
US6511149B1 (en) 1998-09-30 2003-01-28 Xerox Corporation Ballistic aerosol marking apparatus for marking a substrate
US6291088B1 (en) 1998-09-30 2001-09-18 Xerox Corporation Inorganic overcoat for particulate transport electrode grid
US6467862B1 (en) 1998-09-30 2002-10-22 Xerox Corporation Cartridge for use in a ballistic aerosol marking apparatus
US6265050B1 (en) 1998-09-30 2001-07-24 Xerox Corporation Organic overcoat for electrode grid
US7108894B2 (en) 1998-09-30 2006-09-19 Optomec Design Company Direct Write™ System
WO2000023825A2 (en) 1998-09-30 2000-04-27 Board Of Control Of Michigan Technological University Laser-guided manipulation of non-atomic particles
US7938079B2 (en) * 1998-09-30 2011-05-10 Optomec Design Company Annular aerosol jet deposition using an extended nozzle
US6340216B1 (en) * 1998-09-30 2002-01-22 Xerox Corporation Ballistic aerosol marking apparatus for treating a substrate
US6151435A (en) 1998-11-01 2000-11-21 The United States Of America As Represented By The Secretary Of The Navy Evanescent atom guiding in metal-coated hollow-core optical fibers
JP2000238270A (ja) * 1998-12-22 2000-09-05 Canon Inc インクジェット記録ヘッド及びインクジェット記録ヘッドの製造方法
US6280302B1 (en) 1999-03-24 2001-08-28 Flow International Corporation Method and apparatus for fluid jet formation
DE19913451C2 (de) 1999-03-25 2001-11-22 Gsf Forschungszentrum Umwelt Gaseinlaß zur Erzeugung eines gerichteten und gekühlten Gasstrahls
AU4856100A (en) 1999-05-17 2000-12-05 Stephen T Flock Electromagnetic energy driven separation methods
US6267301B1 (en) 1999-06-11 2001-07-31 Spraying Systems Co. Air atomizing nozzle assembly with improved air cap
US6348687B1 (en) * 1999-09-10 2002-02-19 Sandia Corporation Aerodynamic beam generator for large particles
US6293659B1 (en) 1999-09-30 2001-09-25 Xerox Corporation Particulate source, circulation, and valving system for ballistic aerosol marking
US6318642B1 (en) * 1999-12-22 2001-11-20 Visteon Global Tech., Inc Nozzle assembly
US6423366B2 (en) 2000-02-16 2002-07-23 Roll Coater, Inc. Strip coating method
US6384365B1 (en) * 2000-04-14 2002-05-07 Siemens Westinghouse Power Corporation Repair and fabrication of combustion turbine components by spark plasma sintering
AU5273401A (en) 2000-04-18 2001-11-12 Kang-Ho Ahn Apparatus for manufacturing ultra-fine particles using electrospray device and method thereof
US20020063117A1 (en) * 2000-04-19 2002-05-30 Church Kenneth H. Laser sintering of materials and a thermal barrier for protecting a substrate
US6572033B1 (en) * 2000-05-15 2003-06-03 Nordson Corporation Module for dispensing controlled patterns of liquid material and a nozzle having an asymmetric liquid discharge orifice
US6521297B2 (en) * 2000-06-01 2003-02-18 Xerox Corporation Marking material and ballistic aerosol marking process for the use thereof
US6576861B2 (en) * 2000-07-25 2003-06-10 The Research Foundation Of State University Of New York Method and apparatus for fine feature spray deposition
US6416389B1 (en) 2000-07-28 2002-07-09 Xerox Corporation Process for roughening a surface
US6607597B2 (en) 2001-01-30 2003-08-19 Msp Corporation Method and apparatus for deposition of particles on surfaces
US6471327B2 (en) 2001-02-27 2002-10-29 Eastman Kodak Company Apparatus and method of delivering a focused beam of a thermodynamically stable/metastable mixture of a functional material in a dense fluid onto a receiver
US6657213B2 (en) 2001-05-03 2003-12-02 Northrop Grumman Corporation High temperature EUV source nozzle
EP1258293A3 (de) 2001-05-16 2003-06-18 Roberit Ag Vorrichtung zum Spritzen einer Mehrkomponentenmischung
US6811805B2 (en) 2001-05-30 2004-11-02 Novatis Ag Method for applying a coating
JP2003011100A (ja) * 2001-06-27 2003-01-15 Matsushita Electric Ind Co Ltd ガス流中のナノ粒子の堆積方法、並びに表面修飾方法
US6998785B1 (en) * 2001-07-13 2006-02-14 University Of Central Florida Research Foundation, Inc. Liquid-jet/liquid droplet initiated plasma discharge for generating useful plasma radiation
US6531976B1 (en) * 2001-09-07 2003-03-11 Lockheed Martin Corporation Adaptive digital beamforming radar technique for creating high resolution range profile for target in motion in the presence of jamming
US7524528B2 (en) 2001-10-05 2009-04-28 Cabot Corporation Precursor compositions and methods for the deposition of passive electrical components on a substrate
US7629017B2 (en) 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
US20030108664A1 (en) 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US6598954B1 (en) 2002-01-09 2003-07-29 Xerox Corporation Apparatus and process ballistic aerosol marking
NL1019781C2 (nl) * 2002-01-18 2003-07-21 Tno Deklaag alsmede werkwijzen en inrichtingen voor de vervaardiging daarvan.
WO2003062796A1 (en) 2002-01-22 2003-07-31 Dakocytomation Denmark A/S Environmental containment system for a flow cytometer
CA2374338A1 (en) 2002-03-01 2003-09-01 Ignis Innovations Inc. Fabrication method for large area mechanically flexible circuits and displays
JP4388263B2 (ja) * 2002-09-11 2009-12-24 日鉱金属株式会社 珪化鉄スパッタリングターゲット及びその製造方法
US7067867B2 (en) * 2002-09-30 2006-06-27 Nanosys, Inc. Large-area nonenabled macroelectronic substrates and uses therefor
JP2004122341A (ja) 2002-10-07 2004-04-22 Fuji Photo Film Co Ltd 成膜方法
US20040080917A1 (en) * 2002-10-23 2004-04-29 Steddom Clark Morrison Integrated microwave package and the process for making the same
US20040151978A1 (en) 2003-01-30 2004-08-05 Huang Wen C. Method and apparatus for direct-write of functional materials with a controlled orientation
US6815246B2 (en) 2003-02-13 2004-11-09 Rwe Schott Solar Inc. Surface modification of silicon nitride for thick film silver metallization of solar cell
US7579251B2 (en) 2003-05-15 2009-08-25 Fujitsu Limited Aerosol deposition process
WO2004112151A2 (en) 2003-06-12 2004-12-23 Patterning Technologies Limited Transparent conducting structures and methods of production thereof
US20050002818A1 (en) * 2003-07-04 2005-01-06 Hitachi Powdered Metals Co., Ltd. Production method for sintered metal-ceramic layered compact and production method for thermal stress relief pad
JP2007507114A (ja) * 2003-09-26 2007-03-22 オプトメック・デザイン・カンパニー 感熱性中規模デポジションのレーザ処理
EP1530065B1 (en) 2003-11-06 2008-09-10 Rohm and Haas Electronic Materials, L.L.C. Opticle article with conductive pattern
US20050147749A1 (en) 2004-01-05 2005-07-07 Msp Corporation High-performance vaporizer for liquid-precursor and multi-liquid-precursor vaporization in semiconductor thin film deposition
JP4593947B2 (ja) 2004-03-19 2010-12-08 キヤノン株式会社 成膜装置および成膜方法
US7220456B2 (en) * 2004-03-31 2007-05-22 Eastman Kodak Company Process for the selective deposition of particulate material
KR101054129B1 (ko) * 2004-03-31 2011-08-03 이스트맨 코닥 캄파니 균일한 미립자 물질층의 침착
EP1625893A1 (en) * 2004-08-10 2006-02-15 Konica Minolta Photo Imaging, Inc. Spray coating method, spray coating device and inkjet recording sheet
US7129567B2 (en) 2004-08-31 2006-10-31 Micron Technology, Inc. Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements
US7575999B2 (en) * 2004-09-01 2009-08-18 Micron Technology, Inc. Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
US7235431B2 (en) 2004-09-02 2007-06-26 Micron Technology, Inc. Methods for packaging a plurality of semiconductor dice using a flowable dielectric material
US20060280866A1 (en) 2004-10-13 2006-12-14 Optomec Design Company Method and apparatus for mesoscale deposition of biological materials and biomaterials
US7938341B2 (en) * 2004-12-13 2011-05-10 Optomec Design Company Miniature aerosol jet and aerosol jet array
US20080013299A1 (en) * 2004-12-13 2008-01-17 Optomec, Inc. Direct Patterning for EMI Shielding and Interconnects Using Miniature Aerosol Jet and Aerosol Jet Array
US7674671B2 (en) 2004-12-13 2010-03-09 Optomec Design Company Aerodynamic jetting of aerosolized fluids for fabrication of passive structures
US7178380B2 (en) 2005-01-24 2007-02-20 Joseph Gerard Birmingham Virtual impactor device with reduced fouling
US7393559B2 (en) 2005-02-01 2008-07-01 The Regents Of The University Of California Methods for production of FGM net shaped body for various applications
ATE443658T1 (de) 2005-11-21 2009-10-15 Mannkind Corp Pulverabgabe und -erfassungsvorrichtung und - verfahren
US20070154634A1 (en) 2005-12-15 2007-07-05 Optomec Design Company Method and Apparatus for Low-Temperature Plasma Sintering
US20080099456A1 (en) 2006-10-25 2008-05-01 Schwenke Robert A Dispensing method for variable line volume
TWI482662B (zh) * 2007-08-30 2015-05-01 Optomec Inc 機械上一體式及緊密式耦合之列印頭以及噴霧源

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109689224A (zh) * 2016-07-14 2019-04-26 伊利诺斯工具制品有限公司 层压槽模组件
US11453026B2 (en) 2016-07-14 2022-09-27 Illinois Tool Works Inc. Laminated slot die assembly

Also Published As

Publication number Publication date
WO2009029938A3 (en) 2009-05-07
JP2010538277A (ja) 2010-12-09
US20090090298A1 (en) 2009-04-09
TWI538737B (zh) 2016-06-21
CN101842166B (zh) 2013-10-09
US9192054B2 (en) 2015-11-17
TW200924852A (en) 2009-06-16
KR20100067098A (ko) 2010-06-18
WO2009029938A2 (en) 2009-03-05

Similar Documents

Publication Publication Date Title
CN101842166B (zh) 用于不均匀性聚焦的装置
KR100566182B1 (ko) 미세혼합장치
CN101258398B (zh) 利用微粒流体检测蜂窝结构体中的缺陷的方法、系统和装置
CA2145758C (en) Atomising nozzle and filter and spray generating device
US10086622B2 (en) Apparatuses and methods for stable aerosol-based printing using an internal pneumatic shutter
EP0910775A1 (en) Gas-assisted atomizing device
KR101239415B1 (ko) 소형 연무질 분사 장치 및 연무질 분사 장치의 배열
CN101693178B (zh) 制造微型球体的方法和装置以及金属制基板及其制造方法
CN1968817B (zh) 细长过滤器组件
US20100327074A1 (en) Method for dispensing random pattern of adhesive filaments
CZ298849B6 (cs) Mikrostrukturní filtr a rozprašovac pro inhalacníterapii
KR20100051557A (ko) 층상 노즐 구조물 및 마이크로 압출 시스템
US20230002934A1 (en) Meltblown die tip assembly and method
KR20150032914A (ko) 적어도 하나의 다중 입구 포트 및/또는 다중 출구 포트를 가진 연료 분사기 노즐
US20120074108A1 (en) Method for drilling micro-hole and structure thereof
WO2009052805A2 (de) Düsen-, filter- oder/und positionierelement
Kazoe et al. Development of microfluidic droplet shooter and its application to interface for mass spectrometry
US20210101117A1 (en) Microfilter, manufacturing method and microfiltration unit
US9844791B2 (en) Micronozzle atomizers and methods of manufacture and use
TW467769B (en) Die set for preparing ABCABC multiple-stripe coating, method and product thereof
US20220410579A1 (en) Aerosol-based printing cartridge and use thereof in apparatus and method of use thereof
CN114859443B (zh) 基于声学及微流控技术的液体可调微透镜阵列
JP2949108B1 (ja) 噴霧器アレイ
KR20230140568A (ko) 담체 상에 액체를 침착하기 위한 장치 및 방법
JP2007003238A (ja) 液滴吐出ヘッド、液滴吐出装置、および混合液体の吐出方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant