CN101840864B - 半导体装置及其制造方法 - Google Patents

半导体装置及其制造方法 Download PDF

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Publication number
CN101840864B
CN101840864B CN201010146652.8A CN201010146652A CN101840864B CN 101840864 B CN101840864 B CN 101840864B CN 201010146652 A CN201010146652 A CN 201010146652A CN 101840864 B CN101840864 B CN 101840864B
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CN
China
Prior art keywords
substrate
impurity range
layer
insulating barrier
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201010146652.8A
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English (en)
Chinese (zh)
Other versions
CN101840864A (zh
Inventor
矶部敦生
乡户宏充
筱原聪始
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Publication of CN101840864A publication Critical patent/CN101840864A/zh
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Publication of CN101840864B publication Critical patent/CN101840864B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
    • H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02664—Aftertreatments
    • H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
    • H10D30/0321—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon
    • H10D30/0323—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] comprising silicon, e.g. amorphous silicon or polysilicon comprising monocrystalline silicon

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thin Film Transistor (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Solid State Image Pick-Up Elements (AREA)
CN201010146652.8A 2009-03-12 2010-03-12 半导体装置及其制造方法 Expired - Fee Related CN101840864B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-059157 2009-03-12
JP2009059157 2009-03-12

Publications (2)

Publication Number Publication Date
CN101840864A CN101840864A (zh) 2010-09-22
CN101840864B true CN101840864B (zh) 2016-03-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010146652.8A Expired - Fee Related CN101840864B (zh) 2009-03-12 2010-03-12 半导体装置及其制造方法

Country Status (4)

Country Link
US (1) US8530333B2 (enExample)
JP (1) JP2010239123A (enExample)
CN (1) CN101840864B (enExample)
SG (1) SG184747A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011029610A (ja) * 2009-06-26 2011-02-10 Semiconductor Energy Lab Co Ltd 半導体装置及びその作製方法
JP5658916B2 (ja) * 2009-06-26 2015-01-28 株式会社半導体エネルギー研究所 半導体装置
US8766361B2 (en) * 2010-12-16 2014-07-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and electronic device
US8643007B2 (en) * 2011-02-23 2014-02-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2013057771A1 (ja) * 2011-10-21 2013-04-25 株式会社島津製作所 薄膜トランジスタの製造方法
JPWO2013057771A1 (ja) * 2011-10-21 2015-04-02 株式会社島津製作所 薄膜トランジスタの製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1463105A2 (en) * 2003-03-20 2004-09-29 Sharp Kabushiki Kaisha Semiconductor device and method of manufacturing the same by a transfer technique
CN1652339A (zh) * 2004-02-04 2005-08-10 日本电气株式会社 非易失性半导体存储器及其制造方法
CN101335188A (zh) * 2007-06-29 2008-12-31 株式会社半导体能源研究所 Soi基板的制造方法及半导体装置的制造方法

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6534409B1 (en) * 1996-12-04 2003-03-18 Micron Technology, Inc. Silicon oxide co-deposition/etching process
US6534380B1 (en) * 1997-07-18 2003-03-18 Denso Corporation Semiconductor substrate and method of manufacturing the same
JPH11163363A (ja) 1997-11-22 1999-06-18 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
JP4126912B2 (ja) * 2001-06-22 2008-07-30 セイコーエプソン株式会社 電気光学装置及びその製造方法並びに電子機器
JP2003158270A (ja) * 2001-08-27 2003-05-30 Seiko Epson Corp 電気光学装置および電気光学装置の製造方法、並びに投射型表示装置、電子機器
JP3909583B2 (ja) * 2001-08-27 2007-04-25 セイコーエプソン株式会社 電気光学装置の製造方法
US7119365B2 (en) * 2002-03-26 2006-10-10 Sharp Kabushiki Kaisha Semiconductor device and manufacturing method thereof, SOI substrate and display device using the same, and manufacturing method of the SOI substrate
JP3998677B2 (ja) * 2004-10-19 2007-10-31 株式会社東芝 半導体ウェハの製造方法
US7456080B2 (en) * 2005-12-19 2008-11-25 Corning Incorporated Semiconductor on glass insulator made using improved ion implantation process
US7608521B2 (en) * 2006-05-31 2009-10-27 Corning Incorporated Producing SOI structure using high-purity ion shower
JP5216204B2 (ja) * 2006-10-31 2013-06-19 株式会社半導体エネルギー研究所 液晶表示装置及びその作製方法
JP2008225338A (ja) 2007-03-15 2008-09-25 Seiko Epson Corp 電気光学装置およびその製造方法、電子機器
US20080248629A1 (en) * 2007-04-06 2008-10-09 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor substrate
US7767542B2 (en) * 2007-04-20 2010-08-03 Semiconductor Energy Laboratory Co., Ltd Manufacturing method of SOI substrate
EP1993127B1 (en) * 2007-05-18 2013-04-24 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of SOI substrate
US7795111B2 (en) * 2007-06-27 2010-09-14 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of SOI substrate and manufacturing method of semiconductor device
JP2009043748A (ja) * 2007-08-06 2009-02-26 Seiko Epson Corp 半導体装置および電気光学装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1463105A2 (en) * 2003-03-20 2004-09-29 Sharp Kabushiki Kaisha Semiconductor device and method of manufacturing the same by a transfer technique
CN1652339A (zh) * 2004-02-04 2005-08-10 日本电气株式会社 非易失性半导体存储器及其制造方法
CN101335188A (zh) * 2007-06-29 2008-12-31 株式会社半导体能源研究所 Soi基板的制造方法及半导体装置的制造方法

Also Published As

Publication number Publication date
US8530333B2 (en) 2013-09-10
JP2010239123A (ja) 2010-10-21
SG184747A1 (en) 2012-10-30
US20100230754A1 (en) 2010-09-16
CN101840864A (zh) 2010-09-22

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Granted publication date: 20160302

Termination date: 20190312