CN101840855B - Ultraviolet ray irradiator - Google Patents
Ultraviolet ray irradiator Download PDFInfo
- Publication number
- CN101840855B CN101840855B CN201010142699.7A CN201010142699A CN101840855B CN 101840855 B CN101840855 B CN 101840855B CN 201010142699 A CN201010142699 A CN 201010142699A CN 101840855 B CN101840855 B CN 101840855B
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- ultraviolet ray
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- 238000005520 cutting process Methods 0.000 claims abstract description 87
- 230000002093 peripheral effect Effects 0.000 claims abstract description 7
- 239000000853 adhesive Substances 0.000 claims abstract description 6
- 230000001070 adhesive effect Effects 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 26
- 230000005855 radiation Effects 0.000 claims description 20
- 239000011230 binding agent Substances 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 4
- 238000007711 solidification Methods 0.000 abstract 1
- 230000008023 solidification Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 47
- 238000000034 method Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 3
- STNJBCKSHOAVAJ-UHFFFAOYSA-N Methacrolein Chemical compound CC(=C)C=O STNJBCKSHOAVAJ-UHFFFAOYSA-N 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Dicing (AREA)
Abstract
The present invention provides an ultraviolet ray irradiator which irradiates ultraviolet ray without conveying complication or damage to plate-shaped object and cutting blade. The ultraviolet ray irradiator irradiates ultraviolet ray to a plate-shaped object unit which is adhibited with the plate-shaped object on an ultraviolet solidification type carrier belt for solidifying the adhesive of the carrier belt. The peripheral part of the carrier belt is equipped to an annular frame. The ultraviolet ray irradiator comprises the following components: a box which can receive a plurality of plate-shaped object units; a supporting part which supports the plate-shaped object units; an ultraviolet ray irradiation unit which irradiates ultraviolet ray from a back surface of a plate-shaped object adhesion surface of the plate-shaped object unit to the carrier belt; a conveying unit which conveys the plate-shaped object units from the box to the supporting part and conveys the plate-shaped object unit from the supporting part after ultraviolet ray irradiation; a mask which is provided with an opening with an expected size for allowing the passing-through of the ultraviolet ray and shields the ultraviolet ray outside the opening; and a positioning unit which selectively positions the mask between the plate-shaped object unit and the ultraviolet ray irradiation unit, wherein when the mask is positioned between the plate-shaped object unit and the ultraviolet ray irradiation nit, the ultraviolet ray irradiation unit irradiates ultraviolet ray to the carrier belt through the opening.
Description
Technical field
The present invention relates to the ultraviolet lamp of ultraviolet hardening carrier band irradiation ultraviolet radiation, on this ultraviolet hardening carrier band, be pasted with the plate objects such as wafer, and its peripheral part is installed on ring-shaped frame.
Background technology
Processing unit (plant) as the plate objects such as semiconductor wafer, ceramic wafer, glass plate or resin substrate are cut, is being widely used the topping machanism that is called as cutter with cutting tip.For example in Japanese kokai publication hei 11-74228 communique, disclose this topping machanism.
With the plate object of topping machanism cutting, be attached in advance in the cutting belt as adhesive tape, and by cutting belt, be installed on the framework of ring-type.The thickness direction that cutting tip is cut into cutting belt, cuts plate object simultaneously midway, makes thus the plate object being cut as a plurality of chips can not be held in cutting belt dispersedly.Ring-shaped frame is easy to transport plate object, cutting belt and chip.
Conventionally, cutting belt is the base material by for example 100 μ m left and right thicknesses by formations such as PO (polyolefin), PVC (polyvinyl chloride), PET (polyethylene terephthalate) and is formed at rubber-like on base material or the paste layer (binding agent) of for example 10 μ m left and right thicknesses of methacrylaldehyde base class forms.
Among this cutting belt, on base material, be formed with by ultraviolet ray and irradiate and the cutting belt of curing paste layer is known as ultraviolet hardening cutting belt.For ultraviolet hardening cutting belt, because ultraviolet ray irradiation causes paste layer, solidify, thereby cohesive force also can reduce, and therefore has the good advantage of chip fissility, is widely used in semiconductor manufacturing process.
Use the cutting method of this ultraviolet hardening cutting belt raising processing quality open in Japanese kokai publication hei 10-242083 communique.This cutting method is a kind of following method, that is: before cutting to being attached at ultraviolet hardening cutting belt on machined object irradiation ultraviolet radiation slightly, the movement of chip when making the paste layer of ultraviolet hardening cutting belt solidify to suppress to cut slightly, thus processing quality improved.
[prior art document]
[patent documentation 1] Japanese kokai publication hei 11-74228 communique
[patent documentation 2] TOHKEMY 2000-104026 communique
[patent documentation 3] Japanese kokai publication hei 10-242083 communique
Yet, if ultraviolet hardening cutting belt irradiation ultraviolet radiation is made binding agent (sticking with paste layer) solidify before cutting, the cohesive force of ultraviolet hardening cutting belt also can reduce, thereby according to the difference of the kind of the material of plate object or ultraviolet hardening cutting belt, due to deadweight of plate object etc., plate object and cutting belt can strip down from ring-shaped frame, produce the problem that carrying after this becomes complicated.
On the other hand, mostly plate object all has chip area and in the mode around chip area, is formed at the end material region in its outside.So-called chip area refers to the region playing a role as chip after cutting, and end material region goes out of use as unwanted part after plate object cutting.
Different according to the kind of the plate objects such as semiconductor wafer, end material can be less than chip size, the problem that exists end material easily to splash in cutting.The end material splashing in cutting can damage the plate object upper surface among processing and make plate object damaged, moreover, if the end material splashing and cutting tip clash into, also can produce blade breakage.
Especially before cutting to ultraviolet hardening cutting belt irradiation ultraviolet radiation in the situation that, the cohesive force of ultraviolet hardening cutting belt also can reduce, thereby end material more likely flies up among cutting.
Summary of the invention
The present invention completes in view of this problem, and its object is to provide a kind of can not make carrying become complicated, and can in the situation that not destroying plate object and cutting tip, carry out the ultraviolet lamp that ultraviolet ray is irradiated.
The invention provides a kind of ultraviolet lamp, it is to the plate-shaped object units irradiation ultraviolet radiation that is attaching plate object on ultraviolet hardening carrier band, make the adhesive cures of this ultraviolet hardening carrier band, wherein the peripheral part of this ultraviolet hardening carrier band is installed on ring-shaped frame, this ultraviolet lamp is characterised in that, have: casket box, it can take in a plurality of these plate-shaped object units; Support portion, it supports this plate-shaped object units; Ultraviolet irradiation unit, it attaches the reverse side of face to this ultraviolet hardening carrier band irradiation ultraviolet radiation of this plate-shaped object units from being supported in the plate object of this plate-shaped object units this support portion; Carrying unit, it takes out of this support portion by this plate-shaped object units from this casket box, and this plate-shaped object units is moved into this casket box from this support portion after irradiation ultraviolet radiation; Mask, it has the peristome that allows the ultraviolet expectation size of passing through, and the part beyond this peristome is covered ultraviolet ray; And positioning unit, it optionally positions this mask between this plate-shaped object units and this ultraviolet irradiation unit, when this mask alignment is between this plate-shaped object units and this ultraviolet irradiation unit, this ultraviolet irradiation unit via this peristome of this mask to this ultraviolet hardening carrier band irradiation ultraviolet radiation.
Preferably carrying unit is also used as positioning unit.So just without positioning unit is set separately.Plate object has chip area and around the outer circumference end material region of chip area, preferably peristome has the size corresponding with chip area.
According to the present invention, under the ultraviolet ray irradiation before cutting, mask makes ultraviolet ray can not be irradiated to the bonded areas of ring-shaped frame and ultraviolet hardening cutting belt, therefore can prevent that ultraviolet hardening cutting belt and plate object from peeling off and cause carrying the complicated situation that becomes from ring-shaped frame.
In addition, when making the whiles such as chip area periphery size of mask open portion and plate object, can be to the ultraviolet ray of outer circumference end material area illumination, only to chip area irradiation ultraviolet radiation.Therefore, the cohesive force in end material region can not reduce, and holds material to splash among being suppressed at cutting, can prevent the end material splashing cause plate object and cutting tip damaged.
Accompanying drawing explanation
Fig. 1 is the face side stereogram of semiconductor wafer.
Fig. 2 is by the stereogram of ultraviolet hardening cutting belt state on ring-shaped frame by wafer support.
Fig. 3 is the stereogram that utilizes the ultraviolet lamp under the state of carrying handling wafers unit, unit.
Fig. 4 means the stereogram that utilizes carrying unit ultraviolet lamp of the situation on support portion by mask alignment.
Fig. 5 is the stereogram that mask is located in the ultraviolet lamp under the state that also utilizes carrying handling wafers unit, unit on support portion.
Fig. 6 mean utilize ultra-violet lamp via mask open the cutaway view to the ultraviolet situation of wafer illumination.
Fig. 7 means and utilizes cutting tip along the stereogram of the situation of straight cuts wafer.
Fig. 8 is the stereogram of the rectangular plate shape thing after cutting.
Symbol description
W semiconductor wafer; T ultraviolet hardening cutting belt; F ring-shaped frame; 2 chips; 4 chip areas; 6 outer circumference end material regions; 8 wafer cells; 10 ultraviolet lamps; 12 casket boxes; 14 move into and take out of unit; 28 carrying unit; 32 ultraviolet irradiation unit; 34 housings; 34a support portion; 36 ultra-violet lamps; 38 masks; 39 circular open portions; 46 cutting tips.
Embodiment
Below, the execution mode that present invention will be described in detail with reference to the accompanying.As shown in Figure 1, on the surface of a kind of semiconductor wafer W of the plate object as cutting object, quadrature is formed with the 1st straight line S1 and the 2nd straight line S2, in the region marking off by the 1st straight line S1 and the 2nd straight line S2, is formed with a plurality of chips (device) 2.The semiconductor wafer W so forming possesses: the chip area 4 that is formed with chip 2; With the outer circumference end material region 6 around chip area 4.
When semiconductor wafer W is cut, as shown in Figure 2 the back side of wafer W is attached to the adhesive surface of ultraviolet hardening cutting belt T, the peripheral part of ultraviolet hardening cutting belt T is attached to ring-shaped frame F, thereby form wafer cell 8, carry.Thus, wafer W becomes by ultraviolet hardening cutting belt T and is supported in the state on ring-shaped frame F.
Then, the ultraviolet lamp 10 to the embodiment of the present invention of ultraviolet hardening cutting belt irradiation ultraviolet radiation with reference to Fig. 3 to Fig. 5 explanation.Fig. 3 is the stereogram by the state of carrying handling wafers unit, unit 8, Fig. 4 means the stereogram by carrying unit situation on support portion by mask alignment, and Fig. 5 means that mask is located in the stereogram that also utilizes the state of carrying handling wafers unit, unit 8 on support portion.
Symbol 12 is the casket boxes that can take in a plurality of wafer cells 8, by having the wafer of the handle part 16 of controlling wafer cell 8, moves into and takes out of unit 14 and move along gathering sill 18, and the wafer cell 8 that makes to be accommodated in casket box 12 pulled into wafer orientation region 20.By a pair of backstay 22, in side close to each other, move up, reach being thus pulled out to the location of the wafer cell 8 in wafer orientation region 20.
Symbol 28 is the carrying unit that adsorb and carry the wafer cell 8 behind location on locating area 20, can along the pilot hole 26 being formed on goalpost 24, move left and right by not shown driver element.
Carrying 28Qi bottom, unit has four absorption layers 30, by the ring-shaped frame F of these absorption layer 30 absorption and maintenance wafer cell 8, handling wafers unit 8 between locating area 20 and ultraviolet irradiation unit 32.
Ultraviolet irradiation unit 32 has the housing 34 that a plurality of ultra-violet lamps 36 is accommodated in to the rectangular shape of inside and its upper surface open, and the upper end of housing 34 is formed at the 34a place, support portion that supports mask.
With reference to Fig. 4, it shows the situation by 28 carryings of carrying unit with the mask 38 of predetermined big or small circular open portion 39.Mask 38 is the quadrangle form identical shaped with the housing 34 of ultraviolet irradiation unit 32, before the ultraviolet ray of ultra-violet lamp 36 is irradiated, mask 38 as shown in Figure 5 positioning installation on the 34a of support portion.
As above, after mask 38 being placed on the 34a of support portion, as shown in Figure 5, the wafer cell 8 taking out from casket box 12 by 28 carryings of carrying unit, is placed in wafer cell 9 on mask 38.
Cutaway view under this state is as shown in Fig. 6 (A).Mask 38 has the size circular open portion 39 corresponding with the chip area 4 of wafer W, and the ultraviolet ray irradiation of ultra-violet lamp 36 has been covered in outer circumference end material region 6 masked 38.
Therefore,, when ultra-violet lamp 36 is lighted, can, to the ultraviolet hardening cutting belt T irradiation ultraviolet radiation corresponding with chip area 4, the binding agent (sticking with paste layer) of the ultraviolet hardening cutting belt T in this region be solidified.Ultraviolet irradiation amount is in this case preferably: can not make binding agent fully solidify and cohesive force is fully reduced, but to keep the mode of cohesive force to a certain degree to make adhesive cures.
For example, preferably adhesive cures is become: the cohesive force of ultraviolet hardening cutting belt T that makes to have the cohesive force of 2400g/25mm in cohesive force according to JIS specification JIS Z0237 is measured is reduced to 1200g/25mm left and right.
By as above optionally making ultraviolet hardening cutting belt T solidify, the chip 2 of the chip area 4 of wafer W can not move in the process of cutting, thereby can not cause the deteriorated of processing quality.On the other hand, owing to ultraviolet ray not being carried out in the outer circumference end material region 6 of wafer W, do not irradiate, so the cohesive force of wafer peripheral part can not reduce, can prevent that triangle chip from splashing in the process of cutting.
With reference to Fig. 6 (B), mask 38A has the circular open portion 39 of the peristome that is slightly less than ring-shaped frame F.The plate object that this mask 38A is suitable for such cutting object shown in Fig. 8 A is for example the ultraviolet ray irradiation in the situation that rectangular plate shape thing 52 and end material 58 are larger.
In Fig. 8, the 54th, the cut-off rule after cutting, 56 represent chip.Rectangular plate shape thing 52 is attached at ultraviolet hardening cutting belt T, and the peripheral part of ultraviolet hardening cutting belt T is attached at ring-shaped frame F.
End material 58 shown in Fig. 8 is larger, even make to hold the cutting belt T semi-solid preparation in material region to ultraviolet hardening cutting belt T irradiation ultraviolet radiation, but a main point material 58 can not splash in the process of cutting, just can use the mask 38A shown in Fig. 6 (B).
By using this mask 38A, can also be to outer circumference end material region 6 irradiation ultraviolet radiations of wafer W or plate object 52, make ultraviolet hardening cutting belt T semi-solid preparation, and, due to can not be to the bonded areas irradiation ultraviolet radiation between ring-shaped frame F and ultraviolet hardening cutting belt T, thereby can guarantee the larger cohesive force between ultraviolet hardening cutting belt T and ring-shaped frame F, prevent that ultraviolet hardening cutting belt T from peeling off and cause the carrying complicated situation that becomes from ring-shaped frame F.
When the semi-solid preparation step of the ultraviolet hardening cutting belt T shown in Fig. 6 finishes, wafer W is cut.That is,, by known alignment process detection of straight lines S1, then as shown in Figure 7, with cutting tip, 46 couples of straight line S1 cut.
In Fig. 7, in the main shaft housing 50 of the main axle unit 48 of cutting unit 42, in revolvable mode, take in the main shaft 44 rotating by not shown motor driven, at the front end of main shaft 44, cutting tip 46 is installed.
As shown in Figure 7, the wafer W being held on not shown chuck is moved in X-direction, and, when making cutting tip 46 High Rotation Speeds, make main axle unit 48 decline, so the straight line S1 after contraposition is cut.
According to each rectilineal interval being stored in memory, make cutting tip 46 index feed in Y direction, cut simultaneously, thereby unidirectional straight line S1 is all cut.And then, make chuck 90-degree rotation, carry out afterwards cutting same as described above, so straight line S2 is also all cut, and be split into chip 2 one by one.
After cutting finishes, use the mask 38A shown in Fig. 6 (B), whole the irradiation ultraviolet radiation to the ultraviolet hardening cutting belt T the binding part between ultraviolet hardening cutting belt T and ring-shaped frame F, fully reduces the cohesive force of ultraviolet hardening cutting belt T.
Thus, both can guarantee the cohesive force between ultraviolet hardening cutting belt T and ring-shaped frame F, and the fissility of chip is also good, therefore picking up in operation below can be easy to pick-up chip 2.
Can also be after cutting finish, whole the irradiation ultraviolet radiation to ultraviolet hardening cutting belt T in the situation that not using mask, the binding part that makes to comprise between itself and ring-shaped frame F fully reduces in the cohesive force of interior ultraviolet hardening cutting belt T.If process like this, very effective when cutting is peeled off ultraviolet hardening cutting belt T from ring-shaped frame F afterwards at once.
After the ultraviolet ray of ultraviolet irradiation unit 32 is irradiated and finished, as shown in Figure 5, first by carrying unit 28, wafer cell 8 is transported to locating area 20, then takes out of unit 14 wafer cell 8 is pushed in casket box 12 to be accommodated in casket box by moving into.
Next, as shown in Figure 4, by carrying unit 28, mask 38 is transported to locating area 20, then takes out of unit 14 mask 38 is pushed in casket box 12 by moving into, mask 38 is accommodated in casket box 12.Although do not illustrate especially, yet as required, can utilize driver element that casket box 12 is moved up at upper and lower.
In the above-described embodiment, ultra-violet lamp 36 is disposed at the downside of the wafer cell 8 being supported on the 34a of support portion, although not special diagram out, yet also ultra-violet lamp 36 can be disposed to the top of wafer cell 8.In this case, preferably make the wafer W of wafer cell 8 down also by 34a supporting wafers unit, support portion 8.
About above-mentioned ultraviolet lamp, it both can arrange separately, also can be assembled in topping machanism and use.The in the situation that of in being assembled in topping machanism, can, wafer being carried out to ultraviolet ray midway and irradiate of a series of cutting operations, therefore can when maintaining production efficiency, reach the distinctive effect of the present invention.
Claims (1)
1. a ultraviolet lamp, it is to the plate-shaped object units irradiation ultraviolet radiation that is attaching plate object on ultraviolet hardening carrier band, make the adhesive cures of this ultraviolet hardening carrier band, wherein the peripheral part of this ultraviolet hardening carrier band is installed on ring-shaped frame, it is characterized in that, this ultraviolet lamp has:
Casket box, it can take in a plurality of these plate-shaped object units;
Support portion, it supports this plate-shaped object units;
Ultraviolet irradiation unit, it attaches the reverse side of face to this ultraviolet hardening carrier band irradiation ultraviolet radiation of this plate-shaped object units from being supported in the plate object of this plate-shaped object units this support portion;
Carrying unit, it takes out of this support portion by this plate-shaped object units from this casket box, and from this support portion to this casket box, moves into this plate-shaped object units after irradiation ultraviolet radiation; And
Mask, it has the peristome that allows the ultraviolet expectation size of passing through, and the part beyond this peristome is covered ultraviolet ray,
Above-mentioned carrying unit also optionally positions this mask between this plate-shaped object units and this ultraviolet irradiation unit,
For the plate object before cutting, by this carrying unit, between this plate-shaped object units and this ultraviolet irradiation unit, this mask is positioned, this ultraviolet irradiation unit via this peristome of this mask to this ultraviolet hardening carrier band irradiation ultraviolet radiation corresponding to the part with this plate-shaped object units, thereby make this ultraviolet hardening carrier band irradiation the binding agent semi-solid preparation of ultraviolet part
For the plate object after cutting, not this ultraviolet hardening carrier band WBR ultraviolet ray from this ultraviolet irradiation unit to this plate-shaped object units via this mask, thus make the binding agent of this ultraviolet hardening carrier band completely curing,
Above-mentioned plate object has chip area and around the outer circumference end material region of this chip area,
Above-mentioned peristome is corresponding with this chip area.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009065403A JP5312997B2 (en) | 2009-03-18 | 2009-03-18 | UV irradiation equipment |
| JP2009-065403 | 2009-03-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101840855A CN101840855A (en) | 2010-09-22 |
| CN101840855B true CN101840855B (en) | 2014-09-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010142699.7A Active CN101840855B (en) | 2009-03-18 | 2010-03-18 | Ultraviolet ray irradiator |
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| Country | Link |
|---|---|
| JP (1) | JP5312997B2 (en) |
| CN (1) | CN101840855B (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5908696B2 (en) * | 2011-10-12 | 2016-04-26 | 株式会社ディスコ | Hard substrate grinding method |
| JP6170827B2 (en) * | 2013-12-18 | 2017-07-26 | 株式会社ディスコ | Processing method of package substrate |
| JP2015133434A (en) * | 2014-01-15 | 2015-07-23 | 株式会社ディスコ | Method for dividing tabular object and ultraviolet irradiation unit |
| JP6066013B2 (en) | 2014-02-21 | 2017-01-25 | 株式会社村田製作所 | Electronic component supplier and manufacturing method thereof |
| JP2018094596A (en) * | 2016-12-13 | 2018-06-21 | 株式会社ディスコ | Laser processing device |
| JP6957108B2 (en) * | 2017-12-07 | 2021-11-02 | 株式会社ディスコ | Processing equipment |
| JP7164970B2 (en) * | 2018-05-10 | 2022-11-02 | 株式会社ディスコ | processing equipment |
| JP7316899B2 (en) * | 2019-10-08 | 2023-07-28 | 株式会社ディスコ | UV irradiation device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1722406A (en) * | 2004-07-12 | 2006-01-18 | 精工爱普生株式会社 | Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63211644A (en) * | 1987-05-12 | 1988-09-02 | Nec Home Electronics Ltd | Manufacture of semiconductor pellet |
| JP2003007743A (en) * | 2001-06-22 | 2003-01-10 | Mitsumi Electric Co Ltd | Uv tape and method for manufacturing semiconductor integrated circuit package |
| JP4617150B2 (en) * | 2004-12-09 | 2011-01-19 | キヤノン株式会社 | Wafer dicing method |
| JP2007048876A (en) * | 2005-08-09 | 2007-02-22 | Renesas Technology Corp | Manufacturing method for semiconductor device |
| JP2007258245A (en) * | 2006-03-20 | 2007-10-04 | Dainippon Printing Co Ltd | Manufacturing method of sheet with wafer, method of separating external circumferential part of disc-like wafer, separating sheet, and manufacturing method of separating sheet |
| JP2010135356A (en) * | 2008-12-02 | 2010-06-17 | Disco Abrasive Syst Ltd | Dicing method of wafer |
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- 2009-03-18 JP JP2009065403A patent/JP5312997B2/en active Active
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1722406A (en) * | 2004-07-12 | 2006-01-18 | 精工爱普生株式会社 | Dicing sheet, manufacturing method thereof, and manufacturing method of semiconductor apparatus |
Non-Patent Citations (1)
| Title |
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| JP昭63-211644A 1988.09.02 |
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| Publication number | Publication date |
|---|---|
| CN101840855A (en) | 2010-09-22 |
| JP5312997B2 (en) | 2013-10-09 |
| JP2010219358A (en) | 2010-09-30 |
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