CN101834262A - 一种新型发光二极管 - Google Patents

一种新型发光二极管 Download PDF

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Publication number
CN101834262A
CN101834262A CN201010155991A CN201010155991A CN101834262A CN 101834262 A CN101834262 A CN 101834262A CN 201010155991 A CN201010155991 A CN 201010155991A CN 201010155991 A CN201010155991 A CN 201010155991A CN 101834262 A CN101834262 A CN 101834262A
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CN
China
Prior art keywords
luminescence chip
emitting diode
pin
conductive plate
heat radiation
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Pending
Application number
CN201010155991A
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English (en)
Inventor
蓝国贤
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ZHONGSHAN CITY JEWELLY PHOTOELECTRIC TECHNOLOGY Co Ltd
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ZHONGSHAN CITY JEWELLY PHOTOELECTRIC TECHNOLOGY Co Ltd
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Priority to CN201010155991A priority Critical patent/CN101834262A/zh
Publication of CN101834262A publication Critical patent/CN101834262A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

Abstract

本发明公开了一种新型发光二极管，包括发光芯片，其特征在于所述发光芯片安装在一散热导电板上，发光芯片底部与散热导电板之间用导电银胶或绝缘胶固定，发光芯片顶部的P极或N极与散热导电板之间的焊接线为铝线，散热导电板的另一面安装有引脚，所述引脚为镀锡引脚；本发明具有成本低、稳定性好、在前工序生产过程中减少环境污染等特点。

Description

一种新型发光二极管
技术领域
本发明涉及一种新型发光二极管。
背景技术
发光二极管(LED)主要是由发光芯片、焊接线、引脚、树脂等组成，传统芯线采用的是金线，由于金线的价格昂贵，因而增加了发光二极管的制造成本，并且引脚是采用表面镀银的材料制成，由于镀银过程中废弃的镀液是一种危害较大的污染源，对环境会产生很大的污染，同时传统的发光二极管做成成品后，二极管的两引脚主要是由树脂固定的，这样很容易受外力的影响而造成产品的稳定性不高。
发明内容
为了克服现有技术的不足，本发明提供一种成本低、稳定性好、在前工序生产过程中减少环境污染的发光二极管。
本发明解决其技术问题所采用的技术方案是：
一种新型发光二极管，包括发光芯片，其特征在于所述发光芯片安装在一散热导电板上，发光芯片底部与散热导电板之间用导电银胶或绝缘胶固定，发光芯片顶部的P极或N极与散热导电板之间的焊接线为铝线，散热导电板的另一面安装有引脚，所述引脚为镀锡引脚。
上述发光芯片、散热导电板及焊接线封装在一树脂内。
上述引脚可通过焊接的方式安装在散热导电板上。
本发明的有益效果是：本发明用铝线替代传统的金线，因而可降低发光二极管的生产成本；引脚采用镀锡材料取代镀银材料，从而消除了采用镀银材料时对环境的污染；发光芯片和焊接铝线固定在同一散热导电板上，可降低因外力造成的产品不稳定性。
附图说明
下面结合附图和实施例对本发明进一步说明。
图1是制作时多个发光二极管组合的结构示意图；
图2是本发明的结构示意图。
具体实施方式
参照图1、图2，本发明公开的一种新型发光二极管，包括发光芯片1，其中发光芯片1安装在一散热导电板2上，通过散热导电板2可将发光芯片1产生的热量及时通过引脚散发出去，提高发光二极管的使用寿命。发光芯片1底部与散热导电板2之间用导电银胶或绝缘胶固定，发光芯片1顶部的P极或N极与散热导电板2之间的焊接线3为铝线，散热导电板2的另一面安装有引脚4，引脚可通过焊接的方式安装在散热导电板上，起导电、导热和用户焊接的作用，该引脚为镀锡引脚，从而可消除采用镀银材料时对环境的污染。
如图所示，发光芯片1、散热导电板2及焊接线3封装在一树脂5内，树脂5起到保护内部芯片的作用，如引脚受到外力的作用时不会影响到发光芯片、焊接铝线及散热导电板，从而提高了产品的稳定性。

Claims (3)

1.一种新型发光二极管，包括发光芯片，其特征在于所述发光芯片安装在一散热导电板上，发光芯片底部与散热导电板之间用导电银胶或绝缘胶固定，发光芯片顶部的P极或N极与散热导电板之间的焊接线为铝线，散热导电板的另一面安装有引脚，所述引脚为镀锡引脚。
2.根据权利要求1所述的一种新型发光二极管，其特征在于所述发光芯片、散热导电板及焊接线封装在一树脂内。
3.根据权利要求1所述的一种新型发光二极管，其特征在于所述引脚通过焊接的方式安装在散热导电板上。
CN201010155991A 2010-04-20 2010-04-20 一种新型发光二极管 Pending CN101834262A (zh)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59201475A (ja) * 1983-04-30 1984-11-15 Toshiba Corp 光半導体装置
JP2008103393A (ja) * 2006-10-17 2008-05-01 Funai Electric Co Ltd Ｌｅｄランプ装置
KR20090002082A (ko) * 2007-06-04 2009-01-09 엘이디에스티 주식회사 발광 다이오드용 리드 프레임 및 발광 다이오드
CN201788996U (zh) * 2010-04-20 2011-04-06 中山市晶艺光电科技有限公司 一种新型发光二极管

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59201475A (ja) * 1983-04-30 1984-11-15 Toshiba Corp 光半導体装置
JP2008103393A (ja) * 2006-10-17 2008-05-01 Funai Electric Co Ltd Ｌｅｄランプ装置
KR20090002082A (ko) * 2007-06-04 2009-01-09 엘이디에스티 주식회사 발광 다이오드용 리드 프레임 및 발광 다이오드
CN201788996U (zh) * 2010-04-20 2011-04-06 中山市晶艺光电科技有限公司 一种新型发光二极管

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Application publication date: 20100915