CN101817408A - 一种塑料薄膜的热合封装方法及热合封装组件 - Google Patents

一种塑料薄膜的热合封装方法及热合封装组件 Download PDF

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CN101817408A
CN101817408A CN201010142151A CN201010142151A CN101817408A CN 101817408 A CN101817408 A CN 101817408A CN 201010142151 A CN201010142151 A CN 201010142151A CN 201010142151 A CN201010142151 A CN 201010142151A CN 101817408 A CN101817408 A CN 101817408A
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heat seal
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CN101817408B (zh
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叶春林
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Abstract

本发明涉及一种塑料薄膜的热合封装方法及热合封装组件，通过在现有的热合封装方法的基础上，增加一个步骤，即在热合封装组件进行热合封装前，先用定位隔断元件将两层薄膜压紧，一方面使薄膜得到可靠的定位，以有利于热合封装，同时可完全隔断封装线与包装腔体之间的空气流通，避免薄膜热熔时分解产生的有害气体对包装物造成二次污染，所述的热合封装组件可采用气压方式或其他机械隔断方式。本发明适用于对食品、药品以及化妆品等物品的热合封装。

Description

一种塑料薄膜的热合封装方法及热合封装组件
 
技术领域
本发明涉及包装技术领域，尤其是涉及一种用于薄膜包装的热合封装方法以及相应的热合封装组件。
 
背景技术
目前，塑料薄膜的热合封装被广泛地应用于食品、药品以及化妆品的包装，其具有成本低、封装效率高以及防潮防渗漏等诸多优点。具体的应用方式有如下几种：（1）液体连续包装，薄膜原料为双层的薄膜长包装带，其两侧边封合。包装时，在包装带内灌入包装物，然后包装带的两端横向封合并切断，从而完成封装；（2）单件包装，在一个一端开口的塑料袋或单一腔体内装入包装物，然后用热合封装组件将塑料袋或单一腔体的开口封合；（3）两层薄膜中至少有一层薄膜设有凹腔以用于放置包装物，热合封装组件的热合刀模制成与要求的封装线一致的形状，然后将两层薄膜在封装线处封合，该包装方式可以是单体包装，也可以是多体包装，多个包装物之间均有封装线，从而将多个包装物相互隔开。上述热合封装的基本原理是：在热合封装组件上设有热合刀模，热合刀模的形状与封装线的形状相同，热合封装组件通过加热装置对热合刀模加热，并使其维持在一个设定的温度上，热合刀模贴近并压紧薄膜，薄膜受热熔融后相互粘结，热合刀模复位，薄膜冷却并完成封装。虽然包装用的薄膜对人体是无害的，但薄膜在封装时因受高温而熔融会产生少量有毒的分解气体，而分解气体进入到包装腔体内并进入包装的食品、药品内，从而造成对包装物的二次污染。人体长期摄入上述受轻微污染的食品或药品，对健康会产生不利的影响。目前，有一些较为先进的热合机，如高频热合机，超声波热合机以及采用激光技术的热合机，虽然其热合封装的质量以及效率等有显著的改善，但热合的薄膜之间还是通过熔融粘合在一起的，因而无法避免对包装物造成二次污染。即使我们平时用的塑胶袋，在打开使用时也经常易嗅到残留其内的熔胶分解才有的气味。
 中国专利文献上公开的“一种流体封装成型装置及方法”，其公开号为CN101337593A，通过在中模座与下模座分别安置上薄膜与下薄膜，并灌注流体于下薄膜上，通过阀门封闭中模座与下模座所在的真空腔体，即可利用真空泵机组抽取真空腔体内的气体而形成接近真空状态，再通过与中模座、下模座形成上下对接的封口座进行热压封合，使上薄膜与下薄膜的周缘在接近真空状态下一次封合而包覆流体，且流体不会有气泡残留。该发明在封装时，将包装腔体抽成真空，有利于延长包装物的保质期，但同样无法避免封装时的微量分解气体对包装物的二次污染。
 
发明内容
本发明是为了克服现有的热合封装方式容易对包装物产生二次污染的不足，提供一种可有效隔绝分解气体进入包装腔体内的塑料薄膜的热合封装方法以及相应的热合封装组件。
为了实现上述目的，本发明采用以下技术方案：一种塑料薄膜的热合封装方法，用于对食品、药品、化妆品以及热封合温度与熔解气体会影响包装物品质的封装，其包括四个步骤：a）将薄膜输送到热合封装的工位；b）一个定位隔断元件先将两层薄膜压紧，从而对薄膜进行定位并隔断包装腔体与封装线之间的空气流通；c）热合封装组件对两层薄膜在封装线处进行热压封合；d）热合封装组件和定位隔断元件复位，封装线处粘合的薄膜冷却固化，从而完成封装。为了避免热合封装时因薄膜受热产生的分解气体进入包装腔体内，本发明在现有的热合封装方法的基础上，增加了一个步骤，即在热合封装组件进行热合封装前，先用定位隔断元件将两层薄膜压紧，一方面使薄膜得到可靠的定位，以有利于热合封装，同时可完全隔断封装线与包装腔体之间的空气流通。并且，定位隔断元件可紧贴封装线设置，从而可保证封装线与定位隔断元件所形成的隔断压痕之间没有空隙，这样，薄膜在受热分解时产生的气体只能从隔断外侧表面散出，进而可有效避免薄膜熔融分解的气体进入到包装腔体内，避免包装物受到二次污染。
作为优选，其中的步骤b中的定位隔断元件是采用压缩空气对准薄膜喷射并先将两层薄膜压紧，从而对薄膜进行定位并隔断包装腔体与封装线之间的空气流通。压缩空气既可均匀有效地压紧薄膜并进行隔断，并且不会在薄膜表面产生压痕，同时还具有冷却效果，可避免封装线两侧产生热传递，有利于封装线的平直美观；或者步骤b中的定位隔断元件为刚性体，它可以是单侧的压紧隔断方式，也可以是双侧挤压的隔断方式。
一种热合封装组件，包括热合刀模，在热合刀模的侧面设有与其联动的定位隔断元件，所述定位隔断元件为耐高温硅胶片，耐高温硅胶片上用以压紧薄膜的下端面高出热合刀模用于热合的下端面。耐高温硅胶具有良好的弹性和绝缘性能，同时可承受热合刀模的热合温度，由于在热合刀模的侧面设有与其联动且高于热合刀模的耐高温硅胶片，因此，可保证在热合刀模进行热压封装前耐高温硅胶片先与薄膜接触，并利用耐高温硅胶片的弹性将薄膜压紧，从而起到对薄膜先行定位和隔断的作用，以确保热压封装时产生的分解气体不会进入包装腔体内。由于耐高温硅胶片与热合刀模是联动的，因此有利于简化结构以及动作步骤，提高封装效率。
作为优选，所述耐高温硅胶片在用于压紧薄膜的端面上配装有金属压片，从而使其用于压紧薄膜的端面有足够的硬度，进而确保其隔断效果，同时金属压片具有较好的散热效果，因而可避免靠近封装线的薄膜受热分解。
作为优选，所述耐高温硅胶片在靠近热合刀模一侧设有用于减少热合刀模与耐高温硅胶片之间的热量传递的凹槽，在耐高温硅胶片上设置凹槽，可减少与热合刀模的接触面积，从而减少两者之间热量的传递，有利于延长耐高温硅胶片的使用寿命；所述耐高温硅胶片的下端面高出热合刀模下端面1mm-5mm，从而可确保耐高温硅胶片能先于热合刀模对薄膜进行定位和隔断，并保持有足够的压力，以保证隔断的可靠。
作为优选，在热合刀模的两侧面上分别设有定位隔断元件，从而可避免分解气体进入封装线两侧的腔体，适用于封装线两侧均有包装物的多体包装。
一种热合封装组件，在热合刀模的侧面设有定位隔断元件，所述定位隔断元件是一个可喷出压缩空气的喷嘴，喷嘴的喷口呈狭缝状，所述喷嘴由控制机构驱动，并具有一个远离薄膜的起始位置和一个靠近薄膜的隔断位置。喷嘴可通过控制装置的控制先于热合刀模动作，在靠近薄膜的隔断位置，其喷口处即可喷出压缩空气将薄膜压紧，并隔断封装线与包装腔体之间的空气流通。此外，利用压缩空气进行隔断，可确保隔断的可靠，避免在封装线旁侧的两层薄膜之间有残留的空隙。
作为优选，所述喷嘴的喷口宽度为0.05mm-1mm，既可确保可靠地隔断，又可避免对包装腔体产生影响；喷嘴在位于隔断位置时，其开口端与薄膜的距离为0.5mm-2mm，有利于压缩空气能集中喷射到薄膜上，提高对薄膜的压力，同时可避免因压缩空气的散射而降低热合刀模的温度。
因此，本发明具有如下有益效果：（1）对封装时的分解气体进行隔断，避免包装物受到二次污染；（2）定位隔断元件结构简单，便于采用。
 
附图说明
图1是本发明的实施例2的热合封装组件的结构示意图；
图2是实施例2的热合封装组件的定位隔断元件在与薄膜接触时的结构示意图；
图3是实施例2的热合封装组件的热合刀模在热压封合时的结构示意图；
图4是本发明的实施例3的热合封装组件的结构示意图；
图5是实施例3的热合封装组件的定位隔断元件在与薄膜接触时的结构示意图；
图6是实施例2的热合封装组件的热合刀模在热压封合时的结构示意图；
图7是本发明的实施例4的热合封装组件的结构示意图；
图8是实施例4的热合封装组件的定位隔断元件在隔断位置的结构示意图；
图9是实施例4的热合封装组件的热合刀模在热压封合时的结构示意图。
 
具体实施方式
下面结合附图对本发明做进一步的描述。
实施例1：一种塑料薄膜的热合封装方法，主要用于对食品、药品和化妆品的封装，是在现有的热合封装方式的基础上，增加一个定位隔断步骤，以阻断薄膜在热合时的分解气体进入包装腔体中，其具体的封装步骤如下：a）送料机构将上、下两层封装用的薄膜输送到热合封装的工位，同时在两层薄膜所形成的包装腔体内放入包装物；b）一个定位隔断元件先将两层薄膜压紧，从而对薄膜进行定位并隔断包装腔体与封装线之间的空气流通；c）热合封装组件对两层薄膜在封装线处进行热压封合；d）热合封装组件和定位隔断元件复位，封装线处粘合的薄膜冷却固化，从而完成封装。其中，热合封装组件是采用热熔粘合方式将两层薄膜在封装线处热压封合，即通过电加热方式使热合刀模加热，并通过控制器对其温度进行控制；或者热合封装组件采用高频热合方式将两层薄膜在封装线处热压封合，采用高频热合方式时，热合刀模本身不加热，因此，与其紧贴的定位隔断元件不会被加热，有利于延长其使用寿命。而定位隔断元件可采用片状的弹性体制成，或者也可采用可弹性伸缩的压片，利用压缩变形的弹力对薄膜压紧并进行隔断；或者也可利用设于热合刀模旁侧的喷嘴喷出的压缩空气将薄膜压紧并进行隔断。薄膜在封装时，定位隔断元件沿着封装线将两层薄膜紧紧压住，因此，薄膜在热合时分解而产生的气体无法进入包装腔体内，只能从其表面挥发，使包装腔体内的包装物免受分解气体的二次污染。
本发明的塑料薄膜的热合封装方法主要在现有的热合封装技术的基础上增加一个隔断的步骤，因此除了上述热熔粘合方式、高频热合方式以外，其同样适用于超声波热合方式以及激光热合方式等各种采用薄膜熔融粘合原理的热合方式，而相应的定位隔断元件除了前述的弹性压片或压缩空气以外，还可采用在薄膜下面设置真空吸嘴或上述几种方式的组合方式。
实施例2：如图1所示的一种热合封装组件，其采用的是热熔粘合方式，主要用于单体封装，包括有一个热合刀模1，在热合刀模的一个侧面固定有片状的定位隔断元件，所述定位隔断元件为耐高温硅胶片2，其厚度与热合刀模基本相同，并紧贴在热合刀模的侧面，同时在耐高温硅胶片与热合刀模贴合的侧面的中间设置相互分开的凹槽21，凹槽的深度为1mm左右。为保证耐高温硅胶片能可靠地压紧薄膜4，耐高温硅胶片用以压紧薄膜的端面高出热合刀模端面3mm，并在其端面上粘结一层厚度为1mm的金属压片5，所述金属压片可采用不锈钢制成，不锈钢既有一定的硬度和弹性，又有良好的导热性能，并可避免生锈。本实施例的热合封装组件在热合刀模对薄膜进行热合封装时，由上下两层薄膜4构成的包装腔体7内置放有包装物，将薄膜输送到热合工位6，此时热合封装组件动作，热合刀模下降并靠近薄膜，如图2所示，紧贴在热合刀模侧面的耐高温硅胶片上的金属压片首先与薄膜相接，并利用耐高温硅胶片压缩变形产生的弹力将薄膜压紧定位，进而隔断封装线与包装腔体之间的空气流通，然后热合刀模与薄膜相接（如图3所示），热合刀模将热量传递到薄膜的封装线处，薄膜受热熔融并相互粘结在一起，由于耐高温硅胶片是紧贴热合刀模设置的，因此，在热合刀模形成的封装线和耐高温硅胶片形成的隔断压线之间没有间隙，薄膜在受热时分解产生的气体在靠近包装腔体一侧被耐高温硅胶片完全隔断，最终从薄膜表面或封装线的两端散出；由于不锈钢制成的金属压片的快速传热，薄膜上隔断压线处的温度始终低于薄膜的分解温度，因此不但可确保包装腔体内不会有分解气体进入，同时也有利于封装后形成的封装线的整齐美观，以提高产品的档次。
实施例3：如图4所示的一种热合封装组件，其采用的是高频热合方式，主要用于多体封装，包括有一个热合刀模1，热合刀模的横截面形状与封装线一致，在热合刀模的两侧面分别固定有片状的定位隔断元件，所述定位隔断元件采用和实施例2同样材料、结构的耐高温硅胶片2。本实施例的热合封装组件在热合刀模对薄膜4进行热合封装时，由上下两层薄膜4构成的包装腔体7内置放有包装物，将薄膜输送到热合工位6，此时热合封装组件动作，热合刀模下降并靠近薄膜，如图5所示，紧贴在热合刀模二侧的耐高温硅胶片上的金属压片5首先与薄膜相接，并利用耐高温硅胶片压缩变形产生的弹力将薄膜压紧定位，进而隔断封装线与二侧包装腔体之间的空气流通，然后热合刀模与薄膜相接（如图6所示），薄膜在高频电场的作用下发热，并在热合刀模的压力作用下相互粘合，由于耐高温硅胶片是紧贴热合刀模两侧设置的，因此，放置包装物的包装腔体被定位隔断元件形成的隔断压线完全封闭，封装线上的薄膜在受热时分解产生的气体被两侧的耐高温硅胶片完全隔断，最终从薄膜表面或封装线的两端散出，从而使包装物免受二次污染。
实施例4：在如图7所示的一种热合封装组件中，其采用的是热熔粘合方式，主要用于单体封装，包括有一个可上下垂直移动的热合刀模1，在热合刀模的一个侧面固定有定位隔断元件，该定位隔断元件是一个可喷出压缩空气的楔形喷嘴3，楔形的喷嘴有利于减少压缩空气的流动阻力，并降低喷嘴工作时的噪音，喷嘴的喷口呈一字型的狭缝状，其宽度为0.5mm，同时在喷嘴的喷口处设有一段长度为2mm的导流段32，喷嘴靠近热合刀模的一侧面与热合刀模的侧面之间成一个夹角，以避免喷嘴与热合刀模之间产生摩擦干涉，该夹角的范围一般可在2°~5°之间。控制喷嘴动作的控制机构包括与喷嘴后端相连的气缸31，喷嘴由气缸带动作上下移动，其位于上方时为起始位置，移动到下方时为隔断位置，在喷嘴移动到下方的隔断位置时，喷嘴离开薄膜的距离为1mm（如图8所示）。本实施例的热合封装组件在热合刀模对薄膜进行热合封装时，由上下两层薄膜4构成的包装腔体7内置放有包装物，将薄膜输送到热合工位6，此时热合封装组件动作，控制装置首先控制气缸推动喷嘴下移并在离薄膜1mm处停止，然后控制装置控制喷嘴向薄膜喷出压缩空气，薄膜受到压缩空气的压力被压紧定位，进而隔断封装线与包装腔体之间的空气流通，然后热合刀模下移与薄膜相接（具体可参见图9），热合刀模将热量传递到薄膜的封装线处，薄膜受热熔融并相互粘结在一起，由于喷嘴是紧贴热合刀模设置的，因此，二层薄膜之间在热合刀模形成的封装线靠近包装腔体一侧不会有间隙产生，并且其温度始终低于薄膜的分解温度，因此，薄膜在受热时分解产生的气体在靠近包装腔体一侧被喷嘴喷出的压缩空气完全隔断，最终从薄膜表面或封装线的两端散出，同时也有利于封装后形成的封装线的整齐美观，以提高产品的档次。当然本实施例的热合封装组件，也可采用高频热合方式，并可通过在热合刀模两侧分别设置喷嘴而使其适用于多体包装，其具体的工作原理和方式可参照实施例3。

Claims (8)

1.一种塑料薄膜的热合封装方法，用于对食品、药品以及化妆品的封装，其特征是，包括四个步骤：
a)送料机构将上、下两层封装用的薄膜输送到热合封装的工位，同时在两层薄膜所形成的包装腔体内放入包装物；
b)一个定位隔断元件先将两层薄膜压紧，从而对薄膜进行定位并隔断包装腔体与封装线之间的空气流通；
c)热合封装组件对两层薄膜在封装线处进行热压封合；
d)热合封装组件和定位隔断元件复位，封装线处粘合的薄膜冷却固化，从而完成封装。
2.根据权利要求1所述的一种塑料薄膜的热合封装方法，其特征是，其中的步骤b中的定位隔断元件是采用压缩空气对准薄膜喷射并先将两层薄膜压紧，从而对薄膜进行定位并隔断包装腔体与封装线之间的空气流通。
3.一种热合封装组件，包括热合刀模，其特征是，在热合刀模（1）的侧面设有与其联动的定位隔断元件，所述定位隔断元件为耐高温硅胶片（2），耐高温硅胶片上用以压紧薄膜（4）的下端面高出热合刀模用于热合的下端面。
4.根据权利要求3所述的热合封装组件，其特征是，所述耐高温硅胶片在用于压紧薄膜的端面上配装有金属压片（5）。
5.根据权利要求3或4所述的热合封装组件，其特征是，所述耐高温硅胶片在靠近热合刀模一侧设有用于减少热合刀模与耐高温硅胶片之间的热量传递的凹槽（21），所述耐高温硅胶片的下端面高出热合刀模下端面1mm-5mm。
6.根据权利要求3或4所述的热合封装组件，其特征是，在热合刀模的两侧面上分别设有定位隔断元件。
7.一种热合封装组件，包括热合刀模，其特征是，在热合刀模（1）的侧面设有定位隔断元件，所述定位隔断元件是一个可喷出压缩空气的喷嘴（3），喷嘴的喷口呈狭缝状，所述喷嘴由控制机构驱动，并具有一个远离薄膜（4）的起始位置和一个靠近薄膜的隔断位置。
8.根据权利要求7所述的热合封装组件，其特征是，所述喷嘴的喷口宽度为0.05mm-1mm；喷嘴在位于隔断位置时，其开口端与薄膜的距离为0.5mm-2mm。
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CN103274086A (zh) * 2013-06-06 2013-09-04 叶春林 避免塑膜封装中有害气体进入包装腔的方式
CN103274086B (zh) * 2013-06-06 2015-08-19 叶春林 避免塑膜封装中有害气体进入包装腔的方式
CN104670571A (zh) * 2015-02-11 2015-06-03 邵武市天福包装彩印有限公司 一种塑料薄膜封口设备
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CN110900671B (zh) * 2019-12-06 2021-07-27 中山市聚达包装制品有限公司 一种覆膜切断机用纸板防褶皱机构
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