CN101809765B - 光电子器件 - Google Patents
光电子器件 Download PDFInfo
- Publication number
- CN101809765B CN101809765B CN2008801088845A CN200880108884A CN101809765B CN 101809765 B CN101809765 B CN 101809765B CN 2008801088845 A CN2008801088845 A CN 2008801088845A CN 200880108884 A CN200880108884 A CN 200880108884A CN 101809765 B CN101809765 B CN 101809765B
- Authority
- CN
- China
- Prior art keywords
- opto
- radiation
- electronic device
- wave
- semiconductor body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
Landscapes
- Led Device Packages (AREA)
- Photovoltaic Devices (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007046699.6 | 2007-09-28 | ||
| DE102007046699 | 2007-09-28 | ||
| DE102007049799A DE102007049799A1 (de) | 2007-09-28 | 2007-10-17 | Optoelektronisches Bauelement |
| DE102007049799.9 | 2007-10-17 | ||
| PCT/DE2008/001514 WO2009039826A1 (de) | 2007-09-28 | 2008-09-10 | Optoelektronisches bauelement |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101809765A CN101809765A (zh) | 2010-08-18 |
| CN101809765B true CN101809765B (zh) | 2012-06-27 |
Family
ID=40384457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008801088845A Expired - Fee Related CN101809765B (zh) | 2007-09-28 | 2008-09-10 | 光电子器件 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8624289B2 (enExample) |
| EP (1) | EP2193552A1 (enExample) |
| JP (1) | JP2010541220A (enExample) |
| KR (1) | KR20100061562A (enExample) |
| CN (1) | CN101809765B (enExample) |
| DE (1) | DE102007049799A1 (enExample) |
| TW (1) | TWI419361B (enExample) |
| WO (1) | WO2009039826A1 (enExample) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5140082B2 (ja) * | 2007-08-03 | 2013-02-06 | パナソニック株式会社 | 発光装置 |
| DE102007044146A1 (de) | 2007-09-12 | 2009-03-19 | Bayer Materialscience Ag | Thermoplast mit Metallkennzeichnungsplättchen |
| BRPI0913195A2 (pt) | 2008-05-30 | 2016-01-12 | Sharp Kk | dispostivo emissor de luz, fonte de luz de superfície, dispositivo de vídeo de cristal líquido e método para a fabricação de dispositivo emissor de luz |
| DE102008045331A1 (de) | 2008-09-01 | 2010-03-04 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| DE102008057140A1 (de) | 2008-11-13 | 2010-05-20 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| US10422503B2 (en) | 2009-10-30 | 2019-09-24 | Ideal Industries Lighting Llc | One-piece multi-lens optical member and method of manufacture |
| JP5451534B2 (ja) * | 2010-06-07 | 2014-03-26 | 株式会社東芝 | 半導体発光装置および半導体発光装置の製造方法 |
| GB2507223B (en) * | 2010-06-17 | 2015-01-14 | Achrolux Inc | Light-emitting structure |
| KR101689163B1 (ko) * | 2010-07-08 | 2016-12-23 | 엘지이노텍 주식회사 | 발광소자 패키지 |
| US8835199B2 (en) * | 2010-07-28 | 2014-09-16 | GE Lighting Solutions, LLC | Phosphor suspended in silicone, molded/formed and used in a remote phosphor configuration |
| TWI529348B (zh) | 2011-03-07 | 2016-04-11 | 皇家飛利浦電子股份有限公司 | 發光模組、燈、燈具及顯示裝置 |
| JP2013021136A (ja) * | 2011-07-11 | 2013-01-31 | Sharp Corp | 発光装置および表示装置 |
| KR101859653B1 (ko) * | 2011-08-30 | 2018-05-18 | 삼성전자주식회사 | 액정 디스플레이 장치용 발광 유닛 및 그를 구비한 액정 디스플레이 장치 |
| US8492746B2 (en) * | 2011-09-12 | 2013-07-23 | SemiLEDs Optoelectronics Co., Ltd. | Light emitting diode (LED) dice having wavelength conversion layers |
| EP3367445B1 (en) | 2011-11-23 | 2020-07-29 | Quarkstar LLC | Light-emitting devices providing asymmetrical propagation of light |
| JP2013135084A (ja) * | 2011-12-26 | 2013-07-08 | Nitto Denko Corp | 発光ダイオード装置の製造方法 |
| CN103375708B (zh) * | 2012-04-26 | 2015-10-28 | 展晶科技(深圳)有限公司 | 发光二极管灯源装置 |
| CN103489997B (zh) * | 2012-06-09 | 2016-02-03 | 王树生 | Led |
| US20140048824A1 (en) | 2012-08-15 | 2014-02-20 | Epistar Corporation | Light-emitting device |
| US9356070B2 (en) | 2012-08-15 | 2016-05-31 | Epistar Corporation | Light-emitting device |
| US9612002B2 (en) | 2012-10-18 | 2017-04-04 | GE Lighting Solutions, LLC | LED lamp with Nd-glass bulb |
| US20140209950A1 (en) * | 2013-01-31 | 2014-07-31 | Luxo-Led Co., Limited | Light emitting diode package module |
| US9752757B2 (en) | 2013-03-07 | 2017-09-05 | Quarkstar Llc | Light-emitting device with light guide for two way illumination |
| US8847261B1 (en) | 2013-03-14 | 2014-09-30 | Cooledge Lighting Inc. | Light-emitting devices having engineered phosphor elements |
| US9920901B2 (en) | 2013-03-15 | 2018-03-20 | Cree, Inc. | LED lensing arrangement |
| US10400984B2 (en) | 2013-03-15 | 2019-09-03 | Cree, Inc. | LED light fixture and unitary optic member therefor |
| USD735683S1 (en) * | 2013-05-03 | 2015-08-04 | Cree, Inc. | LED package |
| USD758976S1 (en) * | 2013-08-08 | 2016-06-14 | Cree, Inc. | LED package |
| US9335023B2 (en) * | 2013-12-11 | 2016-05-10 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Quantum dot lens and manufacturing method thereof |
| USD746240S1 (en) * | 2013-12-30 | 2015-12-29 | Cree, Inc. | LED package |
| KR20150092801A (ko) * | 2014-02-05 | 2015-08-17 | 삼성디스플레이 주식회사 | 발광 다이오드 패키지 및 그 제조 방법 |
| KR102188500B1 (ko) * | 2014-07-28 | 2020-12-09 | 삼성전자주식회사 | 발광다이오드 패키지 및 이를 이용한 조명장치 |
| WO2016086173A1 (en) * | 2014-11-25 | 2016-06-02 | Quarkstar Llc | Lighting device having a 3d scattering element and optical extractor with convex output surface |
| CN107408572A (zh) * | 2015-02-04 | 2017-11-28 | 默克专利股份有限公司 | 电子元件和显示器 |
| US10118547B2 (en) * | 2015-11-13 | 2018-11-06 | The Boeing Company | Embedded lighting features for lighting panels |
| DE102016113942A1 (de) * | 2016-07-28 | 2018-02-15 | HELLA GmbH & Co. KGaA | Lichtquelle mit einer Primäroptik aus Silikon und Verfahren zur Herstellung der Lichtquelle |
| CN108255545B (zh) * | 2016-12-28 | 2022-09-02 | 阿里巴巴集团控股有限公司 | 组件间的功能调用方法、装置及组件化架构系统 |
| WO2019161895A1 (en) * | 2018-02-21 | 2019-08-29 | Osram Opto Semiconductors Gmbh | Method for producing an optoelectronic component |
| KR102646700B1 (ko) * | 2018-08-16 | 2024-03-13 | 엘지이노텍 주식회사 | 조명 장치 |
| CN110544738B (zh) * | 2019-08-22 | 2021-06-29 | 佛山市柔浩电子有限公司 | 一种紫外线发光二极管结构 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027728A (ja) * | 2005-07-14 | 2007-02-01 | Osram Opto Semiconductors Gmbh | オプトエレクトロニックチップ |
Family Cites Families (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3676668A (en) * | 1969-12-29 | 1972-07-11 | Gen Electric | Solid state lamp assembly |
| FR2175571B1 (enExample) | 1972-03-14 | 1978-08-25 | Radiotechnique Compelec | |
| FR2440563A1 (fr) * | 1978-11-02 | 1980-05-30 | Labo Electronique Physique | Dispositif de liaison entre fibres optiques et/ou dispositifs electro-optiques, et procede pour assurer leur positionnement optimal |
| US5055892A (en) * | 1989-08-29 | 1991-10-08 | Hewlett-Packard Company | High efficiency lamp or light accepter |
| JP2990652B2 (ja) | 1996-03-22 | 1999-12-13 | 株式会社村田製作所 | 積層型バルントランス |
| DE19638667C2 (de) * | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| US5684309A (en) | 1996-07-11 | 1997-11-04 | North Carolina State University | Stacked quantum well aluminum indium gallium nitride light emitting diodes |
| KR100688240B1 (ko) | 1997-01-09 | 2007-03-02 | 니치아 카가쿠 고교 가부시키가이샤 | 질화물반도체소자 |
| US5831277A (en) | 1997-03-19 | 1998-11-03 | Northwestern University | III-nitride superlattice structures |
| JP2907286B1 (ja) * | 1998-06-26 | 1999-06-21 | サンケン電気株式会社 | 蛍光カバーを有する樹脂封止型半導体発光装置 |
| DE19955747A1 (de) | 1999-11-19 | 2001-05-23 | Osram Opto Semiconductors Gmbh | Optische Halbleitervorrichtung mit Mehrfach-Quantentopf-Struktur |
| AU3226101A (en) * | 2000-02-09 | 2001-08-20 | Nippon Leiz Corporation | Light source |
| US6635363B1 (en) * | 2000-08-21 | 2003-10-21 | General Electric Company | Phosphor coating with self-adjusting distance from LED chip |
| US7064355B2 (en) * | 2000-09-12 | 2006-06-20 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
| DE10054966A1 (de) * | 2000-11-06 | 2002-05-16 | Osram Opto Semiconductors Gmbh | Bauelement für die Optoelektronik |
| AT410266B (de) * | 2000-12-28 | 2003-03-25 | Tridonic Optoelectronics Gmbh | Lichtquelle mit einem lichtemittierenden element |
| DE10101554A1 (de) | 2001-01-15 | 2002-08-01 | Osram Opto Semiconductors Gmbh | Lumineszenzdiode |
| DE10120703A1 (de) * | 2001-04-27 | 2002-10-31 | Osram Opto Semiconductors Gmbh | Halbleiterchip für die Optoelektronik |
| US6737681B2 (en) * | 2001-08-22 | 2004-05-18 | Nichia Corporation | Light emitting device with fluorescent member excited by semiconductor light emitting element |
| US7800121B2 (en) | 2002-08-30 | 2010-09-21 | Lumination Llc | Light emitting diode component |
| CN100468791C (zh) * | 2002-08-30 | 2009-03-11 | 吉尔科有限公司 | 具有改良效率的镀膜led |
| US6744077B2 (en) * | 2002-09-27 | 2004-06-01 | Lumileds Lighting U.S., Llc | Selective filtering of wavelength-converted semiconductor light emitting devices |
| US6896381B2 (en) * | 2002-10-11 | 2005-05-24 | Light Prescriptions Innovators, Llc | Compact folded-optics illumination lens |
| US6730940B1 (en) * | 2002-10-29 | 2004-05-04 | Lumileds Lighting U.S., Llc | Enhanced brightness light emitting device spot emitter |
| US20040159900A1 (en) * | 2003-01-27 | 2004-08-19 | 3M Innovative Properties Company | Phosphor based light sources having front illumination |
| CA2517009A1 (en) | 2003-02-26 | 2004-09-10 | Cree, Inc. | White light source using emitting diode and phosphor and method of fabrication |
| US20040223315A1 (en) * | 2003-03-03 | 2004-11-11 | Toyoda Gosei Co., Ltd. | Light emitting apparatus and method of making same |
| EP2264798B1 (en) * | 2003-04-30 | 2020-10-14 | Cree, Inc. | High powered light emitter packages with compact optics |
| US7029935B2 (en) | 2003-09-09 | 2006-04-18 | Cree, Inc. | Transmissive optical elements including transparent plastic shell having a phosphor dispersed therein, and methods of fabricating same |
| US6995402B2 (en) * | 2003-10-03 | 2006-02-07 | Lumileds Lighting, U.S., Llc | Integrated reflector cup for a light emitting device mount |
| WO2005067066A1 (ja) * | 2004-01-07 | 2005-07-21 | Matsushita Electric Industrial Co., Ltd. | Led照明光源 |
| US20060012298A1 (en) * | 2004-07-14 | 2006-01-19 | Taiwan Oasis Technology Co., Ltd. | LED chip capping construction |
| DE102004047640A1 (de) | 2004-09-30 | 2006-04-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Gehäuse für ein optoelektronisches Bauelement |
| US7344902B2 (en) * | 2004-11-15 | 2008-03-18 | Philips Lumileds Lighting Company, Llc | Overmolded lens over LED die |
| WO2006067885A1 (ja) * | 2004-12-24 | 2006-06-29 | Kyocera Corporation | 発光装置および照明装置 |
| JP2007035802A (ja) | 2005-07-25 | 2007-02-08 | Matsushita Electric Works Ltd | 発光装置 |
| US8969908B2 (en) * | 2006-04-04 | 2015-03-03 | Cree, Inc. | Uniform emission LED package |
| EP2057693A1 (en) * | 2006-08-29 | 2009-05-13 | Osram-Sylvania Inc. | Enhanced emission from phosphor-converted leds using interferometric filters |
| US7994529B2 (en) * | 2008-11-05 | 2011-08-09 | Koninklijke Philips Electronics N.V. | LED with molded bi-directional optics |
| JP5325639B2 (ja) * | 2009-04-03 | 2013-10-23 | パナソニック株式会社 | 発光装置 |
| US8168998B2 (en) * | 2009-06-09 | 2012-05-01 | Koninklijke Philips Electronics N.V. | LED with remote phosphor layer and reflective submount |
-
2007
- 2007-10-17 DE DE102007049799A patent/DE102007049799A1/de not_active Withdrawn
-
2008
- 2008-09-10 EP EP08801318A patent/EP2193552A1/de not_active Withdrawn
- 2008-09-10 KR KR1020107008650A patent/KR20100061562A/ko not_active Withdrawn
- 2008-09-10 CN CN2008801088845A patent/CN101809765B/zh not_active Expired - Fee Related
- 2008-09-10 JP JP2010526155A patent/JP2010541220A/ja active Pending
- 2008-09-10 US US12/680,637 patent/US8624289B2/en not_active Expired - Fee Related
- 2008-09-10 WO PCT/DE2008/001514 patent/WO2009039826A1/de not_active Ceased
- 2008-09-18 TW TW097135863A patent/TWI419361B/zh not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007027728A (ja) * | 2005-07-14 | 2007-02-01 | Osram Opto Semiconductors Gmbh | オプトエレクトロニックチップ |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100308356A1 (en) | 2010-12-09 |
| TW200933932A (en) | 2009-08-01 |
| JP2010541220A (ja) | 2010-12-24 |
| DE102007049799A1 (de) | 2009-04-02 |
| US8624289B2 (en) | 2014-01-07 |
| EP2193552A1 (de) | 2010-06-09 |
| TWI419361B (zh) | 2013-12-11 |
| CN101809765A (zh) | 2010-08-18 |
| WO2009039826A1 (de) | 2009-04-02 |
| KR20100061562A (ko) | 2010-06-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120627 Termination date: 20190910 |