CN101802989A - 形成用于集成电路器件的任意结构的方法和设备 - Google Patents

形成用于集成电路器件的任意结构的方法和设备 Download PDF

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CN101802989A
CN101802989A CN200880106804A CN200880106804A CN101802989A CN 101802989 A CN101802989 A CN 101802989A CN 200880106804 A CN200880106804 A CN 200880106804A CN 200880106804 A CN200880106804 A CN 200880106804A CN 101802989 A CN101802989 A CN 101802989A
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mechanical structure
electric
electric device
interconnection
design document
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Chinese (zh)
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克里斯托弗·怀兰德
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Koninklijke Philips NV
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Koninklijke Philips Electronics NV
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P80/00—Climate change mitigation technologies for sector-wide applications
    • Y02P80/30—Reducing waste in manufacturing processes; Calculations of released waste quantities
CN200880106804A 2007-09-14 2008-09-12 形成用于集成电路器件的任意结构的方法和设备 Pending CN101802989A (zh)

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US97270107P 2007-09-14 2007-09-14
US60/972,701 2007-09-14
PCT/IB2008/053714 WO2009034557A2 (fr) 2007-09-14 2008-09-12 Procédé et appareil pour former des structures arbitraires destinées à des dispositifs à circuits intégrés

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Cited By (2)

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CN104485416A (zh) * 2013-11-22 2015-04-01 北京大学 一种采用超材料电极结构的阻变存储器及其制备方法
CN111640842A (zh) * 2020-07-02 2020-09-08 江文涛 一种用于led倒装芯片封装的封装结构及其封装方法

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Publication number Priority date Publication date Assignee Title
US9818665B2 (en) 2014-02-28 2017-11-14 Infineon Technologies Ag Method of packaging a semiconductor chip using a 3D printing process and semiconductor package having angled surfaces
EP3216690B1 (fr) 2016-03-07 2018-11-07 Airbus Operations GmbH Procédé de fabrication d'un tel panneau
DE102018104144B4 (de) 2018-02-23 2022-12-15 Technische Universität Chemnitz Verfahren zum Kontaktieren und Paketieren eines Halbleiterchips

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Publication number Priority date Publication date Assignee Title
JP2738017B2 (ja) * 1989-05-23 1998-04-08 ブラザー工業株式会社 三次元成形装置
US5278442A (en) * 1991-07-15 1994-01-11 Prinz Fritz B Electronic packages and smart structures formed by thermal spray deposition
US5779833A (en) * 1995-08-04 1998-07-14 Case Western Reserve University Method for constructing three dimensional bodies from laminations

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104485416A (zh) * 2013-11-22 2015-04-01 北京大学 一种采用超材料电极结构的阻变存储器及其制备方法
CN104485416B (zh) * 2013-11-22 2018-11-27 北京大学 一种采用超材料电极结构的阻变存储器及其制备方法
CN111640842A (zh) * 2020-07-02 2020-09-08 江文涛 一种用于led倒装芯片封装的封装结构及其封装方法

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