CN101787251A - Bonding agent applicable to copper foil cladding laminated board with full light shading performance - Google Patents
Bonding agent applicable to copper foil cladding laminated board with full light shading performance Download PDFInfo
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- CN101787251A CN101787251A CN201010110430A CN201010110430A CN101787251A CN 101787251 A CN101787251 A CN 101787251A CN 201010110430 A CN201010110430 A CN 201010110430A CN 201010110430 A CN201010110430 A CN 201010110430A CN 101787251 A CN101787251 A CN 101787251A
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- China
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- bonding agent
- light shading
- cladding laminated
- copper cladding
- shading performance
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Abstract
The invention belongs to the technical filed of electronic information, in particular to a bonding agent capable of changing the light shading performance of various copper cladding laminated boards. The bonding agent is prepared from epoxy resin, dicyandiamide, 2-methylimidazole, dimethylformamide and additives in proper percentage by weight, wherein the additives are made by proportionally mixing nigrosine and silicon micro powder, and the bonding agent can change the light shading performance of the copper cladding laminated boards on the premise of not changing the major performance parameter of the copper cladding laminated boards. When being used, the copper cladding laminated boards after being improved by the invention has good mechanical property, and can be applied to LED products and high-end printed circuit boards with higher light shading requirements.
Description
Technical field
The invention belongs to electronic information technical field, be specifically related to the tackiness agent of a kind of LED of the adaptation product and the epoxy glass fabric base copper-clad laminate of the high-end printed-wiring board (PWB) that has higher lucifuge to require.
Background technology
The LED industrial investment is an awfully hot main project at present, and global various countries produce all the research and development of LED and relatively pay attention to.The LED industry development lives through various trials and hardships so far.Make a general survey of the development trend of LED industry, it is indubitable having obtained tangible achievement.China is having great advantage aspect the development LED industry, especially LED display manufacturer.At first, the state-owned very big market requirement in.Secondly, from resource view, China has abundant nonferrous metal resource.It is a technology-intensive type and labor-intensive industry that the semiconductor lighting of being exactly industry is arranged again, relatively is fit to the national conditions of China.If China can might realize the great-leap-forward development of Chinese semiconductor lighting industry fully adhering to autonomous innovation aspect the preparation of extension, chip and the autonomous encapsulation technology.The output value of estimating Chinese whole LED industry in 2010 will be above hundred billion yuan.China is that world's lighting source and light fixture are produced first big country, but mainly is mid and low-end products, only accounts for world market 18%, and is strong greatly and not.The development semiconductor lighting, it is significant to promote Competitiveness of Chinese Industries.At present, the innovation of China LED product technology improves gradually with the application and development ability, and device reliability research position is more outstanding, and testing method and standard also go near gradually, and all these indicate that all Chinese LED industry has entered a brand-new developmental stage.Through 30 years of development, Chinese LED industry has begun to take shape the production that comprises epitaxial wafer, the preparation and the encapsulation of chip, and the LED product application is in interior comparatively integrated industrial chain.
Because LED has huge development potentiality in fields such as Landscape Lighting, street lamp, large size backlight, automobile lamps, its development prospect is still good.From the demand face, the light guiding plate technical progress makes the LEDBLU rate of permeation promote, and the light rate promotes and will speed up the illumination application popularization, and only price is still too high; But from supply range, drug on the market will make price drops for competition of day price at factory lattice and platform factory, and the supply range price drops instead will cause small profits and quick turnover to stimulate market, demand is as continuing to increase, the easy pressure of can releiving, the expedite product rate of permeation is added energy problem and is heated up, various countries will formulate rules and standard specifications, promote the LED industry development.
Existing epoxide glass cloth base copper coated foil plate is semi-transparency.In today of photovoltaic fast development, along with using increasing of high-tech feeling optic component, reduce the influence of other light sources to product, progressively improve epoxide glass cloth base copper coated foil plate lucifuge performance demands in market.
Summary of the invention
The objective of the invention is to propose a kind ofly can under the prerequisite that does not change copper clad laminate Specifeca tion speeification and production frock, can improve the tackiness agent of copper clad laminate photophobism.
The tackiness agent of the raising copper clad laminate photophobism that the present invention proposes is equipped with a certain proportion of auxiliary material and additive is formed again by Resins, epoxy.Wherein additive is mixed with certain proportion by nigrosine and silicon powder.In the process that copper clad laminate is produced, use tackiness agent of the present invention can produce required epoxy glass fabric base copper-clad laminate by the technological process of production of routine.
Among the present invention, the share meter is as follows by weight for binder ingredients:
Resins, epoxy: 125,
Dyhard RU 100: 25～3,
Methylimidazole 0.1～0.3,
Dimethyl formamide 30～35,
Additive 20～30;
Additive wherein, its component weight share is counted:
Nigrosine 10-12
Silicon powder 40-45
Acetone 40-45
Above each component is mixed.
Among the present invention, described silicon powder is SiO
2Powder, powder median size＜8 μ m.
In the impregnation process, at first Dyhard RU 100 is dissolved in dimethyl formamide, then nigrosine and silicon powder and acetone mixture is added in the solvent of the Dyhard RU 100 that mixes and dimethyl formamide, adding Resins, epoxy stirs behind the mixing, add methylimidazole at last, stirred 8～12 hours.
The above-mentioned tackiness agent that changes the copper clad laminate photophobism can be used for the production of all size epoxy glass fabric base copper-clad laminate of products such as FR-4:Tg140, Tg150, Tg170 and Halogen.
Use transmittance＜0.1% of the epoxy glass fabric base copper-clad laminate of the present invention's preparation, and have good mechanical property, anti-electro-chemical properties, flame retardant resistance, meet the requirement that is used for the processing of PCB processing procedure fully in visibility region.The high-end printed-wiring board (PWB) that is applicable to the LED product and has higher lucifuge to require.
Embodiment
Raw material:
A. nigrosine
B. silicon powder (containing nature impurity)
Chemical constitution:
| ??SiO 2 | ??Fe 2O 3 | ??Al 2O 3 | ??CaO | ??K 2O | ??Na + | ??cl - |
| ??(％) | ??(％) | ??(％) | ??(％) | ??(％) | ??(ppm) | ??(ppm) |
| ??≥99.98 | ??≤0.005 | ??≤0.05 | ??≤0.05 | ??≤0.05 | ??≤10 | ??≤10 |
Physicals:
| Whiteness | ??％ | ??≥90 |
| PH value | ??- | ??7.0±0.5 |
| Whiteness | ??％ | ??≥90 |
| Median size | ??μm | ??≤8 |
| Specific conductivity | ??μs/cm | ??≤15 |
| Relative density (water: 1) | ??g/cm 3 | ??2.65 |
| Thermal expansivity | ??ppm/℃ | ??9 |
| Water ratio | ??％ | ??0.1 |
| Mohs' hardness | ??- | ??4-6 |
These compositions itself have diffuse-reflectance performance preferably, can increase the photophobism of substrate.
The c.E grade fiberglass cloth
Component: main component is SiO
2, AL
2O
3, B
2O
3, CaO, contain trace impurity.
| ??SiO 2 | ??52-56 | ??Na 2O、K 2O | ??0-0.8 |
| ??AL 2O 3 | ??12-16 | ??TiO 2 | ??0-0.8 |
| ??B 2O 3 | ??5-10 | ??Fe 2O 3 | ??0.05-0.4 |
| ??CaO | ??16-25 | ??F 2 | ??0-1.0 |
| ??MgO | ??0-5 |
Performance index (7628):
| The Interventions Requested title | Technical requirements | Assay |
| Thickness (mm) | ??0.18±0.018 | ??0.181 |
| Weight (g/m2) | ??203±5 | ??201.3 |
| Warp count (root/cm) | ??17.5±1 | ??17.4 |
| Weft count (root/cm) | ??12.2±1 | ??11.8 |
| The warp-wise breaking tenacity | ??≥295N/2.5cm | ??507.8 |
| The Interventions Requested title | Technical requirements | Assay |
| The broadwise breaking tenacity | ??≥250N/2.5cm | ??325.9 |
| Combustion loss rate (%) | ??0.10-0.26 | ??0.16 |
| Alkali metal oxide content (%) | ??≤0.8 | ??0.35 |
This glasscloth glass fibre tensile strength height, electrical insulation capability is good, dimensional stabilizing, high temperature resistant, is good reinforced insulation material, widespread use aspect electric insulation.
D. Resins, epoxy
Chemical constitution: brominated epoxy resin (80%)+acetone (20%)
The brominated epoxy resin characteristic is easily to flow, and is good with the glass fibre impregnation, and sclerosis then property is good, and the resin kinematic viscosity changes little, processing temperature wide ranges in the hot pressing, hardening is complete.Easy handling and stay in grade.
E. electrolytic copper foil
Performance index (HOZ):
| Indicated weight | ??g/m2 | ??155.4 |
| ??Ra | ??um | ??0.23 |
| ??Rz | ??um | ??4.65 |
| Peel strength | ??N/mm | ??1.48 |
| Tensile strength | ??Mpa | ??344.8 |
| Unit elongation | ??％ | ??4.5 |
| Oxidisability | ??200℃/0.5h | Qualified |
Be mainly used in single face, the two-sided and multilayer board, because the heat that multilayer board is advanced in pressing can make Copper Foil generation recrystallize phenomenon, the same high-elongation in the time of need also having with normal temperature when high temperature is to guarantee the driffractive ring phenomenon not occur in the printed board making processes.
Embodiment 1:
1) additive formulations (weight share meter):
Nigrosine silicon powder acetone
11????????45????????45
2) adhesive formula (weight share meter):
Resin Dyhard RU 100 methylimidazole dimethyl formamide additive
125?????2.5???????0.2???????????30??????????????25
3) gluing oven dry:
Oven temperature is provided with: 150-210 ℃,
Prepreg gluing speed: 12-15m/min.
4) prepreg controlled variable:
Gel time: 115sec epoxy resin content: 42% (mass percent of finger ring epoxy resins in prepreg)
Resin flow: 20.5% fugitive constituent: 0.25%
5) plate row flaggy number: 8 7628 prepregs (1.6mm)
6) pressing plate parameter:
Vacuum tightness :-0.097MPa,
Pressure: 300-450psi,
Temperature of heat plate: 135-220 ℃,
Set time: 50min.
7) product substrate performance perameter
Embodiment 2:
1) additive formulations (weight share meter):
Nigrosine silicon powder acetone
12????????45????????45
2) impregnation prescription (weight share meter):
Resin Dyhard RU 100 methylimidazole dimethyl formamide additive
125?????2.5???????0.2???????????35??????????????20
3) gluing oven dry:
Oven temperature is provided with: 150-210 ℃,
Prepreg gluing speed: 12-15m/min.
4) prepreg controlled variable:
Gel time: 115sec epoxy resin content: 45.0%
Resin flow: 20.5% fugitive constituent: 0.25%
5) plate row flaggy number: 8 7628 prepregs (1.6mm)
6) pressing plate parameter:
Vacuum tightness :-0.097Mpa,
Pressure: 300-450psi,
Temperature of heat plate: 135-220 ℃,
Set time: 50min.
7) product substrate performance perameter
Embodiment 3:
1) additive formulations (weight share meter):
Nigrosine silicon powder acetone
11????????40????????40
2) impregnation prescription (weight share meter):
Resin Dyhard RU 100 methylimidazole dimethyl formamide additive
125?????3?????????0.3???????????30??????????????30
3) gluing oven dry:
Oven temperature is provided with: 150-210 ℃,
Prepreg gluing speed: 12-15m/min.
4) prepreg controlled variable:
Gel time: 115sec epoxy resin content: 45.0%
Resin flow: 20.5% fugitive constituent: 0.25%
5) plate row flaggy number: 8 7628 prepregs (1.6mm)
6) pressing plate parameter:
Vacuum tightness :-0.097Mpa,
Pressure: 300-450psi,
Temperature of heat plate: 135-220 ℃,
Set time: 50min.
7) product substrate performance perameter
This epoxide glass cloth base copper coated foil plate substrate is at transmittance＜0.1% of visible region, and has superior mechanical intensity, mechanical properties, anti-electrification, flame resistivity etc., is applicable to PCB and multi-ply wood manufacturing processing.
Claims (1)
1. tackiness agent that can improve the copper clad laminate photophobism, the share meter is as follows by weight to it is characterized in that this binder ingredients:
Resins, epoxy: 125,
Dyhard RU 100: 25～3,
Methylimidazole 0.1～0.3,
Dimethyl formamide 30～35,
Additive 20～30;
Wherein, the components of additives weight share is counted:
Nigrosine 10-12,
Silicon powder 40-45,
Acetone 40-45.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010110430 CN101787251B (en) | 2010-02-10 | 2010-02-10 | Bonding agent applicable to copper foil cladding laminated board with full light shading performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010110430 CN101787251B (en) | 2010-02-10 | 2010-02-10 | Bonding agent applicable to copper foil cladding laminated board with full light shading performance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101787251A true CN101787251A (en) | 2010-07-28 |
| CN101787251B CN101787251B (en) | 2013-08-28 |
Family
ID=42530633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010110430 Active CN101787251B (en) | 2010-02-10 | 2010-02-10 | Bonding agent applicable to copper foil cladding laminated board with full light shading performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101787251B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102173131A (en) * | 2010-12-30 | 2011-09-07 | 上海南亚覆铜箔板有限公司 | Copper foil-coated plate with high electricity leakage tracking index and preparation method thereof |
| CN102304272A (en) * | 2011-04-03 | 2012-01-04 | 广东生益科技股份有限公司 | Black halogen-free flame-retardant epoxy resin composition and cover film prepared from same |
| CN102632664A (en) * | 2012-03-22 | 2012-08-15 | 杭州盛发电子科技有限公司 | Manufacturing method of epoxy glass cloth laminated sheet |
| CN103540103A (en) * | 2013-09-22 | 2014-01-29 | 重庆德凯覆铜板有限公司 | Epoxy resin composition and method for preparing adhesive by using same |
| CN110475909A (en) * | 2017-03-30 | 2019-11-19 | 古河电气工业株式会社 | Surface treatment copper foil and the copper clad laminate for using it |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6180250B1 (en) * | 1997-04-07 | 2001-01-30 | Hitachi Chemical Co., Ltd. | Epoxy composition for printed circuit boards |
| CN101323757A (en) * | 2007-06-13 | 2008-12-17 | 上海国纪电子材料有限公司 | Preparing glue solution for copper clad laminate and manufacturing method of copper clad laminate |
| CN101585955A (en) * | 2008-12-31 | 2009-11-25 | 广东生益科技股份有限公司 | Resin composition, resin-coated copper foil produced by same and copper-clad plate produced by utilizing resin-coated copper foil |
-
2010
- 2010-02-10 CN CN 201010110430 patent/CN101787251B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6180250B1 (en) * | 1997-04-07 | 2001-01-30 | Hitachi Chemical Co., Ltd. | Epoxy composition for printed circuit boards |
| CN101323757A (en) * | 2007-06-13 | 2008-12-17 | 上海国纪电子材料有限公司 | Preparing glue solution for copper clad laminate and manufacturing method of copper clad laminate |
| CN101585955A (en) * | 2008-12-31 | 2009-11-25 | 广东生益科技股份有限公司 | Resin composition, resin-coated copper foil produced by same and copper-clad plate produced by utilizing resin-coated copper foil |
Non-Patent Citations (2)
| Title |
|---|
| 师剑英: "高耐热、低膨胀系数覆铜板开发思路", 《覆铜板资讯》 * |
| 祝大同: "硅微粉填料在覆铜板中应用的研究进展", 《印刷电路信息》 * |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102173131A (en) * | 2010-12-30 | 2011-09-07 | 上海南亚覆铜箔板有限公司 | Copper foil-coated plate with high electricity leakage tracking index and preparation method thereof |
| CN102304272A (en) * | 2011-04-03 | 2012-01-04 | 广东生益科技股份有限公司 | Black halogen-free flame-retardant epoxy resin composition and cover film prepared from same |
| CN102304272B (en) * | 2011-04-03 | 2013-08-14 | 广东生益科技股份有限公司 | Black halogen-free flame-retardant epoxy resin composition and cover film prepared from same |
| CN102632664A (en) * | 2012-03-22 | 2012-08-15 | 杭州盛发电子科技有限公司 | Manufacturing method of epoxy glass cloth laminated sheet |
| CN103540103A (en) * | 2013-09-22 | 2014-01-29 | 重庆德凯覆铜板有限公司 | Epoxy resin composition and method for preparing adhesive by using same |
| CN110475909A (en) * | 2017-03-30 | 2019-11-19 | 古河电气工业株式会社 | Surface treatment copper foil and the copper clad laminate for using it |
| CN110475909B (en) * | 2017-03-30 | 2021-12-24 | 古河电气工业株式会社 | Surface-treated copper foil and copper-clad laminate using same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101787251B (en) | 2013-08-28 |
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| C14 | Grant of patent or utility model | ||
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Address after: 201802 Shanghai Nanxiang Chang Cheung Road No. 158 Patentee after: South Asia new materials Polytron Technologies Inc Address before: 201802 Shanghai Nanxiang Chang Cheung Road No. 158 Patentee before: Shanghai Nanya Copper Clad Laminate Co., Ltd. |