CN101323757A - Preparing glue solution for copper clad laminate and manufacturing method of copper clad laminate - Google Patents
Preparing glue solution for copper clad laminate and manufacturing method of copper clad laminate Download PDFInfo
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- CN101323757A CN101323757A CNA200710041959XA CN200710041959A CN101323757A CN 101323757 A CN101323757 A CN 101323757A CN A200710041959X A CNA200710041959X A CN A200710041959XA CN 200710041959 A CN200710041959 A CN 200710041959A CN 101323757 A CN101323757 A CN 101323757A
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Abstract
The invention relates to a blended glue solution used in copper-clad plates and a manufacturing method of the copper-clad plates. The manufacturing method comprises the following steps: firstly, the glue solution which comprises the components as follows is blended: 125 pbw (parts by weight) of bromide bisphenol A resin, 2.9 pbw to 3.1 pbw of electronic grade dicyanodiamide, 0.055 pbw to 0.07 pbw of dimethylimidazole; 15 pbw to 20 pbw of 1250-mesh aluminum hydroxide; 0.8 pbw to 2.5 pbw of nigrosine, and 26.1 pbw to 27.9 pbw of dimethylformamide; secondly, cementing is carried out; thirdly, a piece of electronic grade glass cloth, after being soaked in the glue solution in a steeping vat, is put in an oven for baking at the temperature of 150 DEG C to 210 DEG C and then cooled to obtain a semi-solidified plate which is then chopped into pieces according to the required size; fourthly, the pieces are proportionally overlapped and then pressed; fifthly, a certain amount of well overlapped plates and stainless steel plates are carried out superposition from top to bottom and in one to one correspondence, and then put in a vacuum press machine to be pressed at 100 DEG C to 185 DEG C; the temperature is kept around 180 DEG C to 185 DEG C for not less than 40 minutes when pressing. The blended glue solution and the manufacturing method of the invention have the beneficial effects that: the baseplate of the plate is black and has excellent opaque property and chemical resistance.
Description
Technical field
The present invention relates to a kind of copper-clad plate, relate in particular to a kind of allotment glue of copper-clad plate and manufacture method of copper-clad plate thereof of being used for.
Background technology
Because less energy-consumption, the high efficiency outstanding feature of LED (photodiode), nowadays LED has been widely used in fields such as electrical equipment indication, LED display, LCD backlight, Landscape Lighting, upholstery.The high speed development of LED has also promoted the development of functional copper-clad plate, why be referred to as functional copper-clad plate, that is because the copper-clad plate that is used for LED is except common copper-clad plate provides required insulated substrate, copper foil for conducting, signal transmission, also need substrate that good shade function is arranged, should avoid the light of led light source to see through, waste energy, reduce luminance brightness from the sheet material back side as much as possible.
Summary of the invention
The technical issues that need to address of the present invention have provided a kind of allotment glue that is used for copper-clad plate, are intended to address the above problem;
The present invention also provides a kind of manufacture method of copper-clad plate;
In order to solve the problems of the technologies described above, the present invention is achieved by the following technical solutions:
The allotment glue that is used for copper-clad plate of the present invention is made up of brominated bisphenol A resin, electronic-grade Dyhard RU 100, methylimidazole, 1250 order aluminium hydroxides, nigrosine, dimethyl formamide; With quality share proportioning be: brominated bisphenol A resin 125, electronic-grade Dyhard RU 100 2.9-3.1, methylimidazole 0.055-0.07,1250 order aluminium hydroxide 15-20, nigrosine 0.8-2.5, dimethyl formamide 26.1-27.9;
The manufacture method of a kind of copper-clad plate of the present invention realizes by following steps:
The allotment glue; Each component in the glue is carried out proportioning by following prescription with the quality share:
Brominated bisphenol A resin 125, electronic-grade Dyhard RU 100 2.9-3.1, methylimidazole 0.055-0.07,1250 order aluminium hydroxide 15-20, nigrosine 0.8-2.5, dimethyl formamide 26.1-27.9;
Gluing; The electronic-grade woven fiber glass toasts in 150 ℃ of-210 ℃ of baking ovens through entering temperature behind the impregnated glue of steeping vat, obtains prepreg through cooling again; Prepreg is cut into sheet by needed size; The basic parameter scope of prepreg is:
Resin content: 40-64%
Gel time: 110-160 second
Mobile: 15-35%
Folded joining; According to the sheet metal thickness needs, the sheet prepreg of some amount is built up pellet, apply Copper Foil on the two sides of this pellet then; Copper thickness is between 1/2OZ-3OZ;
Compacting; The folded sheet material for preparing of some amount is corresponding one to one superimposed up and down with stainless steel plate, send vacuum press then to, between 100 ℃-185 ℃, to suppress, 180 ℃-185 ℃ of the holding temperature scopes of compacting, soaking time are no less than 40 minutes.
Compared with prior art, the invention has the beneficial effects as follows: the sheet material substrate is black, has good opacifying property and chemical resistant properties.
Embodiment
Below in conjunction with embodiment the present invention is described in further detail:
The raw material source that relates among the present invention:
Brominated bisphenol A Resins, epoxy: the GEBR-450A80 of Hongchang Electronic Material Inustry Co., Ltd., Guangzhou
Electronic-grade Dyhard RU 100: Ningxia Darong Chemical and Metallurgy Co., Ltd.'s electronic-grade Dyhard RU 100
Methylimidazole: Ningxia Darong Chemical and Metallurgy Co., Ltd.'s methylimidazole
Aluminium hydroxide: the Shanghai chemical rubber company limited aluminium hydroxide (1250 order) of making a fresh start
Dimethyl formamide: Jiangshan Chemical Co Ltd, Zhejiang's dimethyl formamide
Embodiment 1:
| Brominated bisphenol A Resins, epoxy (g) | 125 |
| Electronic-grade Dyhard RU 100 (g) | 3.0 |
| Methylimidazole (g) | 0.060 |
| Aluminium hydroxide (g) | 15 |
| Nigrosine (g) | 0.8 |
| Dimethyl formamide (g) | 27 |
| Prepreg resin content (%) | 41.5-42.5 |
| Prepreg gel time (S) | 145 |
| Tg, the DSC method (℃) | 130.5 |
Embodiment 2:
| Brominated bisphenol A Resins, epoxy (g) | 125 |
| Electronic-grade Dyhard RU 100 (g) | 2.9 |
| Methylimidazole (g) | 0.070 |
| Aluminium hydroxide (g) | 18 |
| Nigrosine (g) | 1.5 |
| Dimethyl formamide (g) | 26.1 |
| Prepreg resin content (%) | 41.0-42.0 |
| Prepreg gel time (S) | 135 |
| Tg, the DSC method (℃) | 131.3 |
Embodiment 3:
| Brominated bisphenol A Resins, epoxy (g) | 125 |
| Electronic-grade Dyhard RU 100 (g) | 3.0 |
| Methylimidazole (g) | 0.065 |
| Aluminium hydroxide (g) | 20 |
| Nigrosine (g) | 2.0 |
| Dimethyl formamide (g) | 27 |
| Prepreg resin content (%) | 41.3-42.1 |
| Prepreg gel time (S) | 142 |
| Tg, the DSC method (℃) | 132.0 |
Wherein: Tg, the DSC method is meant differential scanning calorimetry.
Claims (6)
1. an allotment glue that is used for copper-clad plate is made up of brominated bisphenol A resin, electronic-grade Dyhard RU 100, methylimidazole, 1250 order aluminium hydroxides, nigrosine, dimethyl formamide; With quality share proportioning be: brominated bisphenol A resin 125, electronic-grade Dyhard RU 100 2.9-3.1, methylimidazole 0.055-0.07,1250 order aluminium hydroxide 15-20, nigrosine 0.8-2.5, dimethyl formamide 26.1-27.9.
2. the allotment glue that is used for copper-clad plate according to claim 1, wherein: brominated bisphenol A resin 125, electronic-grade Dyhard RU 100 3.0, methylimidazole 0.060,1250 order aluminium hydroxides 15, nigrosine 0.8, dimethyl formamide 27.
3. the allotment glue that is used for copper-clad plate according to claim 1, wherein: brominated bisphenol A resin 125, electronic-grade Dyhard RU 100 2.9, methylimidazole 0.070,1250 order aluminium hydroxides 18, nigrosine 1.5, dimethyl formamide 26.1.
4. the allotment glue that is used for copper-clad plate according to claim 1, wherein: brominated bisphenol A resin 125, electronic-grade Dyhard RU 100 3.0, methylimidazole 0.065,1250 order aluminium hydroxides 20, nigrosine 2.0, dimethyl formamide 27.
5. the manufacture method of a copper-clad plate is allocated glue; Each component in the glue is carried out proportioning by following prescription with the quality share:
Brominated bisphenol A resin 125, electronic-grade Dyhard RU 100 2.9-3.1, methylimidazole 0.055-0.07,1250 order aluminium hydroxide 15-20, nigrosine 0.8-2.5, dimethyl formamide 26.1-27.9;
Gluing; The electronic-grade woven fiber glass toasts in 150 ℃ of-210 ℃ of baking ovens through entering temperature behind the impregnated glue of steeping vat, obtains prepreg through cooling again; Prepreg is cut into sheet by needed size;
Folded joining; According to the sheet metal thickness needs, the sheet prepreg of some amount is built up pellet, apply Copper Foil on the two sides of this pellet then; Copper thickness is between 1/2OZ-3OZ;
Compacting; The folded sheet material for preparing of some amount is corresponding one to one superimposed up and down with stainless steel plate, send vacuum press then to, between 100 ℃-185 ℃, to suppress, 180 ℃-185 ℃ of the holding temperature scopes of compacting, soaking time are no less than 40 minutes.
6. the manufacture method of copper-clad plate according to claim 5, wherein: the basic parameter scope of prepreg is:
Resin content: 40-64%
Gel time: 110-160 second
Mobile: 15-35%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710041959XA CN101323757B (en) | 2007-06-13 | 2007-06-13 | Preparing glue solution for copper clad laminate and manufacturing method of copper clad laminate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710041959XA CN101323757B (en) | 2007-06-13 | 2007-06-13 | Preparing glue solution for copper clad laminate and manufacturing method of copper clad laminate |
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| CN101323757A true CN101323757A (en) | 2008-12-17 |
| CN101323757B CN101323757B (en) | 2011-01-19 |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101787251A (en) * | 2010-02-10 | 2010-07-28 | 上海南亚覆铜箔板有限公司 | Bonding agent applicable to copper foil cladding laminated board with full light shading performance |
| CN102114453A (en) * | 2011-03-03 | 2011-07-06 | 吴江市东风电子有限公司 | Preparation method of dielectric cloth for preparing copper-clad plate |
| CN102173131A (en) * | 2010-12-30 | 2011-09-07 | 上海南亚覆铜箔板有限公司 | Copper foil-coated plate with high electricity leakage tracking index and preparation method thereof |
| CN102190865A (en) * | 2010-03-16 | 2011-09-21 | 金安国纪科技股份有限公司 | Epoxy resin glue solution, prepreg and copper clad panel containing epoxy resin glue solution, and preparation method thereof |
| CN102304271A (en) * | 2011-04-03 | 2012-01-04 | 广东生益科技股份有限公司 | Thermosetting epoxy resin composition and epoxy fiberglass cloth-based copper clad laminate prepared from same |
| CN102618195A (en) * | 2012-01-21 | 2012-08-01 | 金安国纪科技股份有限公司 | Light shading adhesive, laminated plate, preparation method of light shading adhesive, and application of light shading adhesive |
| CN103112213A (en) * | 2012-12-31 | 2013-05-22 | 金安国纪科技股份有限公司 | LED (Light Emitting Diode) copper-clad plate with black fundamental color and preparation method thereof |
| CN103214795A (en) * | 2013-04-07 | 2013-07-24 | 西安科技大学 | Composition of high-insulation heat conduction copper-clad plate and preparation method thereof |
| CN103540103A (en) * | 2013-09-22 | 2014-01-29 | 重庆德凯覆铜板有限公司 | Epoxy resin composition and method for preparing adhesive by using same |
| CN104589667A (en) * | 2014-12-02 | 2015-05-06 | 陕西生益科技有限公司 | Preparation method and application of bonding sheet for copper clad laminate |
| CN105196678A (en) * | 2015-09-02 | 2015-12-30 | 铜陵翔宇商贸有限公司 | Method for manufacturing gray copper-clad plate |
| CN106633669A (en) * | 2016-12-30 | 2017-05-10 | 铜陵华科电子材料有限公司 | Modified epoxide resin glue solution with low transmissivity for preparing copper-clad plate and preparing method thereof |
| CN106739220A (en) * | 2016-12-28 | 2017-05-31 | 江阴市明康绝缘玻纤有限公司 | Heat resistance paper phenol ultravioletlight screening copper-clad plate |
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| CN107791649B (en) * | 2016-08-29 | 2021-04-23 | 上海国纪电子材料有限公司 | Glue solution for high-toughness halogen-free CEM-3 copper-clad plate |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN100432144C (en) * | 2005-11-16 | 2008-11-12 | 广东生益科技股份有限公司 | Resin composition and its uses in adhesive sheet and copper-cladded plate |
-
2007
- 2007-06-13 CN CN200710041959XA patent/CN101323757B/en active Active
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101787251A (en) * | 2010-02-10 | 2010-07-28 | 上海南亚覆铜箔板有限公司 | Bonding agent applicable to copper foil cladding laminated board with full light shading performance |
| CN101787251B (en) * | 2010-02-10 | 2013-08-28 | 上海南亚覆铜箔板有限公司 | Bonding agent applicable to copper foil cladding laminated board with full light shading performance |
| CN102190865A (en) * | 2010-03-16 | 2011-09-21 | 金安国纪科技股份有限公司 | Epoxy resin glue solution, prepreg and copper clad panel containing epoxy resin glue solution, and preparation method thereof |
| CN102190865B (en) * | 2010-03-16 | 2012-12-26 | 上海国纪电子有限公司 | Epoxy resin glue solution, prepreg and copper clad panel containing epoxy resin glue solution, and preparation method thereof |
| CN102173131A (en) * | 2010-12-30 | 2011-09-07 | 上海南亚覆铜箔板有限公司 | Copper foil-coated plate with high electricity leakage tracking index and preparation method thereof |
| CN102114453A (en) * | 2011-03-03 | 2011-07-06 | 吴江市东风电子有限公司 | Preparation method of dielectric cloth for preparing copper-clad plate |
| CN102114453B (en) * | 2011-03-03 | 2016-05-04 | 吴江市东风电子有限公司 | A kind of preparation method who prepares copper-clad plate dielectric cloth |
| CN102304271B (en) * | 2011-04-03 | 2013-06-12 | 广东生益科技股份有限公司 | Thermosetting epoxy resin composition and epoxy fiberglass cloth-based copper clad laminate prepared from same |
| CN102304271A (en) * | 2011-04-03 | 2012-01-04 | 广东生益科技股份有限公司 | Thermosetting epoxy resin composition and epoxy fiberglass cloth-based copper clad laminate prepared from same |
| CN102618195A (en) * | 2012-01-21 | 2012-08-01 | 金安国纪科技股份有限公司 | Light shading adhesive, laminated plate, preparation method of light shading adhesive, and application of light shading adhesive |
| CN103112213A (en) * | 2012-12-31 | 2013-05-22 | 金安国纪科技股份有限公司 | LED (Light Emitting Diode) copper-clad plate with black fundamental color and preparation method thereof |
| CN103214795A (en) * | 2013-04-07 | 2013-07-24 | 西安科技大学 | Composition of high-insulation heat conduction copper-clad plate and preparation method thereof |
| CN103540103A (en) * | 2013-09-22 | 2014-01-29 | 重庆德凯覆铜板有限公司 | Epoxy resin composition and method for preparing adhesive by using same |
| CN104589667A (en) * | 2014-12-02 | 2015-05-06 | 陕西生益科技有限公司 | Preparation method and application of bonding sheet for copper clad laminate |
| CN105196678A (en) * | 2015-09-02 | 2015-12-30 | 铜陵翔宇商贸有限公司 | Method for manufacturing gray copper-clad plate |
| CN106739220A (en) * | 2016-12-28 | 2017-05-31 | 江阴市明康绝缘玻纤有限公司 | Heat resistance paper phenol ultravioletlight screening copper-clad plate |
| CN106633669A (en) * | 2016-12-30 | 2017-05-10 | 铜陵华科电子材料有限公司 | Modified epoxide resin glue solution with low transmissivity for preparing copper-clad plate and preparing method thereof |
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| CN101323757B (en) | 2011-01-19 |
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Effective date of registration: 20181009 Address after: 201613 33 Baosheng Road, Songjiang Industrial Zone, Shanghai Patentee after: Shanghai Guoji Electronic Material Co., Ltd. Address before: 201600 33 Baosheng Road, Songjiang Industrial Zone, Shanghai Patentee before: Goldenmax International Technology Co., Ltd. |