CN105196678A - Method for manufacturing gray copper-clad plate - Google Patents
Method for manufacturing gray copper-clad plate Download PDFInfo
- Publication number
- CN105196678A CN105196678A CN201510553928.7A CN201510553928A CN105196678A CN 105196678 A CN105196678 A CN 105196678A CN 201510553928 A CN201510553928 A CN 201510553928A CN 105196678 A CN105196678 A CN 105196678A
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- CN
- China
- Prior art keywords
- parts
- copper
- glue
- plate
- silica
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
- B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a mode for manufacturing a gray copper-clad plate. The mode includes the steps of preparing lining rubber liquid, preparing surface rubber liquid, carrying out overlapping and carrying out pressing. According to the performance of the gray copper-clad plate manufactured according to the formula, color decaying is low, and the service life can be prolonged by one time; heat resistance reaches 65S-90S, wherein detection is carried out in a tin immersing mode at the temperature of 288 DEG C according to an IPC-TM-650-2.4.8 standard; heat resistance is excellent; the peel strength of HOZ copper foil is improved to 1.0 N/mm to 1.5 N/mm, the peel strength of 1OZ copper foil commonly ranges from 1.5 N/mm to 2.5 N/mm, and detection is carried out according to an IPC-TM-650-2.4.8 standard; flame resistance reaches V-0 (a UL94 standard), and plate cost is optimized; the content of fillers such as aluminum hydroxide and silicon dioxide in the prepared surface rubber liquid is quite high, and the cost of the fillers is low; the integrated cost of the novel formula is twice that of common FR-4, but the selling price of the plate is 2.5 times that of the common FR-4, and product benefits are greatly increased.
Description
Technical field
The present invention relates to a kind of grey copper-clad plate production method.
Background technology
Constantly flourish along with copper-clad plate industry, a large amount of high-caliber multi-layer sheet meets the tendency, the living space of part low grade products is more and more less, part low grade products has been placed on First Line reducing product costs with the service life of improving product, by research, find to add a kind of black additive in the filler sheet material commercially used, the life of sheet material can be made, prevent conducting and look from declining.
Summary of the invention
The object of the invention is to solve prior art black additive addition very little, this life of sheet material amount of filler is large again, and sheet material aberration should not control, and material is unsightly apparent, is not suitable for large-scale exposed low-end product, the problem that the market share is had a greatly reduced quality.
The technical solution used in the present invention is:
1, a grey copper-clad plate production method, is characterized in that comprising lining glue formula and table material glue formula,
Lining glue comprises brominated epoxy resin A1000 part, black additive: 0.01 part, talcum powder 200 parts, silica 1 50 parts, 300 parts, aluminium hydroxide, electron level dicy-curing agent 21.6 parts, tertiary amines promoter 0.5 part, KH560 type silane coupling agent 4 parts, solvent 350 parts;
Table material glue comprises epoxy resin A1000 part, flexibility agent B10-20 part, silica 50 parts, talcum powder 100 parts, black additive 0.005 part, electron level dicy-curing agent 23.1 parts, tertiary amines promoter 0.5 part, KH560 type silane coupling agent 3 parts, solvent 100-250 part;
Preparation method:
(1), lining glue PP plate makes: by brominated epoxy resin A, curing agent, promoter, coupling agent and evenly become liquefied mixture with the silica of silane surfactant process, talcum powder with appropriate stirring solvent, obtained mixture is coated on 7628 E-glass felts, in 160-175 DEG C of baking oven, toasts 5-8Min make PP sheet;
(2), table material glue PP plate makes: by epoxy resin A, flexibility agent B, curing agent, promoter, coupling agent and with the silica of silane surfactant process, aluminium hydroxide, talcum powder and appropriate stirring solvent completely uniformly liquefied mixture, is coated in by obtained mixture 7628 E-glass cloth toast 7-10Min in 160-175 DEG C of baking oven to make PP sheet;
(3), expect that the mode of glue PP plate-Copper Foil-copper coin is folded by lining glue PP plate-Biao to join;
(4), suppress.
As a further improvement on the present invention, solvent is one or several mixtures in dimethyl formamide, acetone, butanone, alcohol.
The invention has the beneficial effects as follows:
Use the grey copper-clad plate that this formula makes, its performance:
1) look declines low; Can be life-extending one times;
2) heat resistance reaches 65S-90S(according to IPC-TM-650-2.4.8 standard detection, 288 DEG C, wicking) fine heat-resisting performance;
3) (its peel strength of HOZ Copper Foil is promoted to 1.0-1.5N/mm to peel strength; Its peel strength of 1OZ Copper Foil is generally 1.5-2.5N/mm, according to IPC-TM-650-2.4.8 standard detection).
4) fire resistance reaches V-0(UL94 standard)
5) board cost is optimized: the filer content such as aluminium hydroxide and silica is very high in table lining formula glue, and filler is with low cost; This new formulation integrated cost is 2 times of common FR-4 cost, but this sheet material price reaches 2.5 times of common FR-4, significantly increases product profit.
Detailed description of the invention
Embodiment:
(1) lining glue PP plate makes: by brominated epoxy resin A1000 part, 21.6 parts, curing agent, promoter 0.5 part, coupling agent 4 parts and be stirred into liquefied mixture with the silica 50 parts of silane surfactant process, talcum powder 100 parts and solvent 350 parts, obtained mixture is coated on 7628 E-glass felts, in 160-175 DEG C of baking oven, toasts 5-8Min make PP sheet;
(2) table material glue PP plate makes: by epoxy resin A1000 part, flexibility agent B10 part, 23.1 parts, curing agent, promoter 0.5 part, coupling agent 3 parts and stir completely uniformly liquefied mixture with the silica 50 parts of silane surfactant process, 300 parts, aluminium hydroxide, talcum powder 200 parts and solvent 0.5 part, is coated in by obtained mixture 7628 E-glass cloth toast 7-10Min in 160-175 DEG C of baking oven to make PP sheet;
(3) expect that the mode of glue PP plate-Copper Foil-copper coin is folded by lining glue PP plate-Biao to join;
(4) suppress.The product of system
Above embodiments of the present invention are described, but the invention is not restricted to above-mentioned embodiment, in the ken that art those of ordinary skill possesses, can also make a variety of changes under the prerequisite not departing from present inventive concept.
Claims (2)
1. a grey copper-clad plate production method, is characterized in that comprising lining glue formula and table material glue formula,
Lining glue comprises brominated epoxy resin A1000 part, black additive: 0.01 part, talcum powder 200 parts, silica 1 50 parts, 300 parts, aluminium hydroxide, electron level dicy-curing agent 21.6 parts, tertiary amines promoter 0.5 part, KH560 type silane coupling agent 4 parts, solvent 350 parts;
Table material glue comprises epoxy resin A1000 part, flexibility agent B10-20 part, silica 50 parts, talcum powder 100 parts, black additive 0.005 part, electron level dicy-curing agent 23.1 parts, tertiary amines promoter 0.5 part, KH560 type silane coupling agent 3 parts, solvent 100-250 part;
Preparation method:
(1), lining glue PP plate makes: by brominated epoxy resin A, curing agent, promoter, coupling agent and evenly become liquefied mixture with the silica of silane surfactant process, talcum powder with appropriate stirring solvent, obtained mixture is coated on 7628 E-glass felts, in 160-175 DEG C of baking oven, toasts 5-8Min make PP sheet;
(2), table material glue PP plate makes: by Resin A, flexibility agent B, curing agent, promoter, coupling agent and with the silica of silane surfactant process, aluminium hydroxide, talcum powder and appropriate stirring solvent completely uniformly liquefied mixture, is coated in by obtained mixture 7628 E-glass cloth toast 7-10Min in 160-175 DEG C of baking oven to make PP sheet;
(3), expect that the mode of glue PP plate-Copper Foil-copper coin is folded by lining glue PP plate-Biao to join;
(4), suppress.
2. a kind of grey copper-clad plate production method according to claim 1, is characterized in that described solvent is one or several mixtures in dimethyl formamide, acetone, butanone, alcohol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510553928.7A CN105196678A (en) | 2015-09-02 | 2015-09-02 | Method for manufacturing gray copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510553928.7A CN105196678A (en) | 2015-09-02 | 2015-09-02 | Method for manufacturing gray copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105196678A true CN105196678A (en) | 2015-12-30 |
Family
ID=54944791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510553928.7A Pending CN105196678A (en) | 2015-09-02 | 2015-09-02 | Method for manufacturing gray copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105196678A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118125458A (en) * | 2024-05-10 | 2024-06-04 | 苏州锦艺新材料科技股份有限公司 | Black spherical silicon dioxide, preparation method thereof and black copper-clad plate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101323757A (en) * | 2007-06-13 | 2008-12-17 | 上海国纪电子材料有限公司 | Preparing glue solution for copper clad laminate and manufacturing method of copper clad laminate |
| CN102190865A (en) * | 2010-03-16 | 2011-09-21 | 金安国纪科技股份有限公司 | Epoxy resin glue solution, prepreg and copper clad panel containing epoxy resin glue solution, and preparation method thereof |
| CN102924869A (en) * | 2012-11-14 | 2013-02-13 | 广东生益科技股份有限公司 | Application of black modified silicon dioxide |
| CN103978766A (en) * | 2014-05-27 | 2014-08-13 | 铜陵浩荣华科复合基板有限公司 | Manufacturing mode of high-CTI (comparative tracking index) value copper-clad plate |
-
2015
- 2015-09-02 CN CN201510553928.7A patent/CN105196678A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101323757A (en) * | 2007-06-13 | 2008-12-17 | 上海国纪电子材料有限公司 | Preparing glue solution for copper clad laminate and manufacturing method of copper clad laminate |
| CN102190865A (en) * | 2010-03-16 | 2011-09-21 | 金安国纪科技股份有限公司 | Epoxy resin glue solution, prepreg and copper clad panel containing epoxy resin glue solution, and preparation method thereof |
| CN102924869A (en) * | 2012-11-14 | 2013-02-13 | 广东生益科技股份有限公司 | Application of black modified silicon dioxide |
| CN103978766A (en) * | 2014-05-27 | 2014-08-13 | 铜陵浩荣华科复合基板有限公司 | Manufacturing mode of high-CTI (comparative tracking index) value copper-clad plate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118125458A (en) * | 2024-05-10 | 2024-06-04 | 苏州锦艺新材料科技股份有限公司 | Black spherical silicon dioxide, preparation method thereof and black copper-clad plate |
| CN118125458B (en) * | 2024-05-10 | 2024-07-12 | 苏州锦艺新材料科技股份有限公司 | Black spherical silicon dioxide, preparation method thereof and black copper-clad plate |
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| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151230 |
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| WD01 | Invention patent application deemed withdrawn after publication |