CN103074021A - Organosilicon bimaleimide-epoxy conductive adhesive for LED - Google Patents
Organosilicon bimaleimide-epoxy conductive adhesive for LED Download PDFInfo
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- CN103074021A CN103074021A CN2011103277402A CN201110327740A CN103074021A CN 103074021 A CN103074021 A CN 103074021A CN 2011103277402 A CN2011103277402 A CN 2011103277402A CN 201110327740 A CN201110327740 A CN 201110327740A CN 103074021 A CN103074021 A CN 103074021A
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- organosilicon
- bismaleimides
- silver powder
- epoxy
- conductive adhesive
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Abstract
The invention discloses an organosilicon bimaleimide-epoxy conductive adhesive for an LED. The adhesive includes, by weight, 5 to 25 parts of an epoxy resin, 5 to 25 parts of organosilicon bimaleimide, 60 to 80 parts of a silver powder conductive filling material, 0.3 to 0.7 part of a curing accelerator and 0.3 to 0.7 part of an interfacial strengthening agent-silane coupling agent. According to the invention, the advantages of both an organosilicon bimaleimide resin and the epoxy resin are combined together, high temperature resistance and UV resistance of a polysilicone resin are retained, and the conductive adhesive also has excellent high temperature adhesive properties.
Description
Technical field
The present invention relates to the LED electro-conductive adhesive, specifically a kind of LED organosilicon bismaleimides-epoxy conducting adhesive.
Background technology
Since striding into 21 century, Energy situation is increasingly serious, and the save energy ratio taps a new source of energy more economical, more environmental protection should be put in the first place.Current, illumination accounts for about 20% of world's total energy consumption.If conventional light source inefficient, high current consumption that the light source of, life-span length low with energy consumption, safety, environmental protection replaces, will bring undoubtedly a global illumination revolution (Yang Xiongfa, Wu Chuan, Dong Hong, etc.The progress of LED organosilicon material for packaging.Organosilicon material, 2009,23,47～50).
LED is with its intrinsic characteristics, such as power saving, long, vibration resistance of life-span, the characteristics such as fast response time, cold light source, be widely used in the fields such as pilot lamp, signal lamp, display screen, illumination, in our daily life everywhere as seen, (Su Yongdao, lucky Aiwa, Zhao Chao such as household electrical appliance, telephone set, dial illumination, automobile anti-fog lamp, traffic lights.The LED encapsulation technology.Shanghai, press of Shanghai Communications University, 2010).The electric energy of ultra-high brightness LED consumption only is 1/10 of conventional light source, has the advantages such as the mercury, the volume that do not use serious environment pollution are little, the life-span is long.Along with the improvement of ultra-high brightness LED performance, great power LED is expected to replace the lighting sources such as incandescent light, become the 4th generation lighting source (Wang Xiaoming, Guo Weiling, high state, etc.LED---lighting source of new generation.Modern demonstration, 2005,53,15～20).
Along with the development of great power LED, the client has proposed more and more higher requirement to the material that uses in the encapsulation process, and new material not only will satisfy the processing requirement that the client produces, and also needing simultaneously has preferably anti-UV and thermotolerance, and enough bonding strengths.Traditional epoxy conductive binding agent has excellent normal temperature adhesiveproperties, but its high temperature bonding performance is not ideal enough, in addition epoxy resin-base not anti-UV often, and under the comprehensive action of UV light and heat, thereby xanthochromia easily occurs and affects the LED luminescent lifetime in it.Therefore, Resins, epoxy is not suitable for the high temperature occasion, or can launch LED and the great power LED of ultraviolet wavelength, and uses out of doors.In sum, traditional epoxy conductive binding agent more and more can not satisfy the performance requriements that day by day upgrades, and need to carry out modification to it.
Resins, epoxy refers to contain in the molecule organic high molecular compound of two or more epoxide groups, and molecular structure is to contain active epoxide group to be its feature in molecular chain, and epoxide group can be positioned at the end, centre of molecular chain or structure circlewise.Because its dielectric properties, mechanical property, adhesiveproperties, excellent anti-corrosion performance, cure shrinkage and linear expansivity are little, good stability of the dimension, good manufacturability, over-all properties is splendid, more because handiness and the diversity of epoxy material formulating of recipe, so that it is widely used in field of electronics.
The BMI resin refers to the class thermosetting resin that the bifunctional BMI monomer take maleimide as active end group and the copolymerization component of being correlated with form, and the general formula of BMI is as follows:
The good characteristics such as the BMI resin has good high temperature resistant, radiation hardness, wet-heat resisting, modulus is high, rate of moisture absorption is low and thermal expansivity is little be widely used in field of electronics, but traditional B MI resin rigidity are larger, and the transparency is relatively poor.
The silicon-oxygen backbone structure that polysiloxane-based tackiness agent has, structural formula is as follows:
Si-O-Si has higher bond energy, has stronger ultra-violet resistance, therefore is applicable to any ultraviolet lighting occasion.The SMP-2800L of Japan SHIN-ETSU HANTOTAI chemical industry, the single-component that Japanese Teng Cang changes into contains solvent organosilicon conductive adhesive (XA-819A of DOTITE and FX-730), is this series products.Because the polarity of the main chain of poly-silica is less, so the cementability of conductive resin described above is relatively poor, chip thrust is less than normal, room temperature small pieces thrust＜5kgf/die (2 * 2mm).
In sum, Resins, epoxy, bismaleimides and polysiloxane respectively have advantage, and how the advantage with the three is combined into the technical issues that need to address of the present invention.Three's combination can make material have resistance to elevated temperatures, light transmission and excellent high temperature bonding performance concurrently.This patent uses machine silicon bismaleimides and the Resins, epoxy copolymerization contain polysiloxane structure, the generation have the electro-conductive adhesive of excellent properties.
Summary of the invention
The object of the present invention is to provide a kind of LED organosilicon bismaleimides-epoxy conducting adhesive, advantage combination with Resins, epoxy, organosilicon bismaleimides and polyorganosiloxane resin three, the high transparent of the high adhesion energy of reservation Resins, epoxy, the high temperature resistant and polyorganosiloxane resin of bimaleimide resin also makes product have excellent adhesiveproperties simultaneously.
The objective of the invention is to be achieved through the following technical solutions:
The LED that the present invention relates to organosilicon bismaleimides-epoxy conducting adhesive comprises the component with following weight part:
According to the present invention, described Resins, epoxy is Hydrogenated Bisphenol A epoxy (HEP), and its structural formula is:
According to the present invention, described organosilicon bismaleimides is with the material shown in following formula (I) or the formula (II):
A, methylsiloxane bismaleimides (SiMBMI), its structure are shown in the formula (I):
Wherein, n=1～6;
B, aminomethyl phenyl organosilicon bismaleimides (SiMPBMI), its structure are shown in the formula (II):
Wherein, n=1～6.
According to the present invention, described curing catalyst is glyoxal ethyline (2MZ) or 2-ethyl-4-methylimidazole (2E4MZ).
According to the present invention, described silver powder conductive filler material is particle D90 less than 50 microns silver powder; Described silver powder is flake silver powder, spherical silver powder, unformed silver powder or their any mixture.
According to the present invention, described interface strengthening agent silane coupling agent is 3-glycidyl propyl trimethoxy silicane (Z6040).
LED of the present invention may further comprise the steps with the preparation method of organosilicon bismaleimides-epoxy conducting adhesive:
A) organosilicon bismaleimides, curing catalyst and interface strengthening agent silane coupling agent mix, and then grind by three-roll grinder and obtain uniform resin;
B) with in the resin after the silver powder adding grinding, stirred 1 hour.
Compared with prior art, the present invention has following technique effect: LED of the present invention organosilicon bismaleimides-epoxy conducting adhesive, room temperature chip thrust＞11.6kgf/die (2 * 2mm), high temperature chip thrust＞2.2kgf/die (2 * 2mm), volume specific resistance≤3.7 * 10
-4Ω cm; Namely this tackiness agent has good storage stability, has excellent bonding strength, electroconductibility, thermotolerance and anti-UV after the curing.
Embodiment
Below in conjunction with specific embodiment, the present invention will be further described.Should be understood that following examples are only for explanation the present invention but not for limiting the scope of the invention.
Flake silver powder in following examples, spherical silver powder, unformed silver powder all are that particle D90 (corresponding particle diameter when the cumulative particle sizes distribution number that refers to sample reaches 90%) is less than 50 microns.
Embodiment 1～9
Press the proportioning shown in the table 1, first with the organosilicon bismaleimides, curing catalyst and interface strengthening agent silane coupling agent mix, and then grind by three-roll grinder and obtain uniform resin; Then silver powder is added in the resin after grinding, stirred 1 hour, namely obtain organosilicon bismaleimides-epoxy conducting adhesive.
The component of table 1, organosilicon bismaleimides-epoxy conducting adhesive
The DAGA 4000 thrust machines that adopt, the LED that embodiment 1～9 is obtained tests with the performance of organosilicon bismaleimides electro-conductive adhesive, and the result is as shown in table 2.
The performance of table 2, organosilicon bismaleimides-epoxy conducting adhesive
By the result of table 2 as seen, the LED of the method preparation of employing embodiment 1～9 is 1.47～1.51 with the specific refractory power of organosilicon bismaleimides-epoxy conducting adhesive, second-order transition temperature is 123～132 ℃, 2 * 2mm chip thrust is 11.6～13.1kgf (25 ℃), 2.2～2.9kgf (250 ℃), and volume specific resistance is 1.9 * 10
-4～3.7 * 10
-4Ω .cm.
Embodiment 10～18
Press shown in the table 3, first with the organosilicon bismaleimides, curing catalyst and interface strengthening agent silane coupling agent mix, and then grind by three-roll grinder and obtain uniform resin; Then silver powder is added in the resin after grinding, stirred 1 hour, obtain organosilicon bismaleimides-epoxy conducting adhesive.
The component of table 3, organosilicon bismaleimides-epoxy conducting adhesive
Adopt DAGA 4000 thrust machines, the LED that embodiment 10～18 is obtained tests with the performance of organosilicon bismaleimides electro-conductive adhesive, and the result is as shown in table 4.
The performance of table 4, organosilicon bismaleimides-epoxy conducting adhesive
By the result of table 4 as seen, the LED of the method preparation of employing embodiment 10～18 is 1.52～1.53 with the specific refractory power of organosilicon bismaleimides-epoxy conducting adhesive, second-order transition temperature is 126～132 ℃, 2 * 2mm chip thrust is 12.6～13.9kgf (25 ℃), 2.2～3.1kgf (250 ℃), and volume specific resistance is 1.3 * 10
-4～3.5 * 10
-4Ω .cm.
In conjunction with above-described embodiment, LED of the present invention organosilicon bismaleimides-epoxy conducting adhesive, room temperature chip thrust＞11.6kgf/die (2 * 2mm), and high temperature chip thrust＞2.2kgf/die (2 * 2mm), volume specific resistance≤3.7 * 10
-4Ω cm; Namely this tackiness agent has good storage stability, has excellent bonding strength, electroconductibility, thermotolerance and anti-UV after the curing.
Claims (8)
1. a LED is characterized in that with organosilicon bismaleimides-epoxy conducting adhesive, comprises the component with following weight part:
2. electro-conductive adhesive according to claim 1 is characterized in that, described Resins, epoxy is the Hydrogenated Bisphenol A epoxy, and its structural formula is:
3. electro-conductive adhesive according to claim 1 is characterized in that, described organosilicon bismaleimides is with the material shown in following formula (1) or the formula (II):
A, methylsiloxane bismaleimides, its structure are shown in the formula (I):
Wherein, n=1～6;
B, aminomethyl phenyl organosilicon bismaleimides, its structure are shown in the formula (II):
Wherein, n=1～6.
4. electro-conductive adhesive according to claim 1 is characterized in that, described silver powder conductive filler material is particle D90 less than 50 microns silver powder.
5. silver powder according to claim 4 is characterized in that, described silver powder is flake silver powder, spherical silver powder, unformed silver powder or their any mixture.
6. electro-conductive adhesive according to claim 1 is characterized in that, described curing catalyst is glyoxal ethyline or 2-ethyl-4-methylimidazole.
7. electro-conductive adhesive according to claim 1 is characterized in that, described interface strengthening agent silane coupling agent is 3-glycidyl propyl trimethoxy silicane.
8. each described LED is characterized in that may further comprise the steps with the preparation method of organosilicon bismaleimides-epoxy conducting adhesive in the claim 1～7:
A) organosilicon bismaleimides, curing catalyst and interface strengthening agent silane coupling agent mix, and then grind by three-roll grinder and obtain uniform resin.
B) with in the resin after the silver powder adding grinding, stirred 1 hour.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110327740.2A CN103074021B (en) | 2011-10-25 | 2011-10-25 | Organosilicon bimaleimide-epoxy conductive adhesive for LED |
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|---|---|---|---|
| CN201110327740.2A CN103074021B (en) | 2011-10-25 | 2011-10-25 | Organosilicon bimaleimide-epoxy conductive adhesive for LED |
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|---|---|
| CN103074021A true CN103074021A (en) | 2013-05-01 |
| CN103074021B CN103074021B (en) | 2016-07-20 |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103602309A (en) * | 2013-11-28 | 2014-02-26 | 烟台德邦先进硅材料有限公司 | High-power packaging silica gel for LED (Light Emitting Diode) |
| CN104817989A (en) * | 2015-04-10 | 2015-08-05 | 深圳广恒威科技有限公司 | Underfiller composition and preparation method thereof |
| CN110819120A (en) * | 2018-08-10 | 2020-02-21 | 信越化学工业株式会社 | Thermosetting resin composition and semiconductor device |
| CN110819067A (en) * | 2018-08-10 | 2020-02-21 | 信越化学工业株式会社 | Thermosetting resin composition for semiconductor encapsulation and semiconductor device |
| CN113736401A (en) * | 2021-09-06 | 2021-12-03 | 艾蒙特成都新材料科技有限公司 | High-heat-resistance single-component adhesive and preparation method thereof |
| CN114231230A (en) * | 2021-12-30 | 2022-03-25 | 黑龙江省科学院石油化学研究院 | Adhesive for reducing stress and improving temperature resistance and preparation method thereof |
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|---|---|---|---|---|
| US6238597B1 (en) * | 1999-03-10 | 2001-05-29 | Korea Advanced Institute Of Science And Technology | Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate |
| CN102391811A (en) * | 2011-09-23 | 2012-03-28 | 上海景涵实业有限公司 | Bismaleimide-epoxy conductive adhesive with high adhesive strength for light emitting diode (LED) |
-
2011
- 2011-10-25 CN CN201110327740.2A patent/CN103074021B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6238597B1 (en) * | 1999-03-10 | 2001-05-29 | Korea Advanced Institute Of Science And Technology | Preparation method of anisotropic conductive adhesive for flip chip interconnection on organic substrate |
| CN102391811A (en) * | 2011-09-23 | 2012-03-28 | 上海景涵实业有限公司 | Bismaleimide-epoxy conductive adhesive with high adhesive strength for light emitting diode (LED) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103602309A (en) * | 2013-11-28 | 2014-02-26 | 烟台德邦先进硅材料有限公司 | High-power packaging silica gel for LED (Light Emitting Diode) |
| CN103602309B (en) * | 2013-11-28 | 2014-10-22 | 烟台德邦先进硅材料有限公司 | High-power packaging silica gel for LED (Light Emitting Diode) |
| CN104817989A (en) * | 2015-04-10 | 2015-08-05 | 深圳广恒威科技有限公司 | Underfiller composition and preparation method thereof |
| CN104817989B (en) * | 2015-04-10 | 2017-11-10 | 深圳广恒威科技有限公司 | A kind of Underfill adhesive composition and preparation method thereof |
| CN110819120A (en) * | 2018-08-10 | 2020-02-21 | 信越化学工业株式会社 | Thermosetting resin composition and semiconductor device |
| CN110819067A (en) * | 2018-08-10 | 2020-02-21 | 信越化学工业株式会社 | Thermosetting resin composition for semiconductor encapsulation and semiconductor device |
| CN113736401A (en) * | 2021-09-06 | 2021-12-03 | 艾蒙特成都新材料科技有限公司 | High-heat-resistance single-component adhesive and preparation method thereof |
| CN114231230A (en) * | 2021-12-30 | 2022-03-25 | 黑龙江省科学院石油化学研究院 | Adhesive for reducing stress and improving temperature resistance and preparation method thereof |
| CN114231230B (en) * | 2021-12-30 | 2023-10-20 | 黑龙江省科学院石油化学研究院 | Adhesive capable of reducing stress and improving temperature resistance and preparation method thereof |
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|---|---|
| CN103074021B (en) | 2016-07-20 |
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