CN101780456B - Crystal grain angle correction method applied to chip separating system - Google Patents

Abstract

The invention relates to a crystal grain angle correction method applied to a chip separating system, which mainly comprises the following steps: judging a deflection angle of target crystal grains; driving a swinging arm of a crystal grain conveying mechanism to rotate 90 degrees minus alpha when the deflection angle alpha of the target crystal grains is a positive number, simultaneously executing the difference-alpha deflection angle position compensation on an arrangement region, and placing the target crystal grains into the arrangement region; driving the swinging arm of the crystal grain conveying mechanism to rotate 90 degrees plus alpha when the deflection angle alpha of the target crystal grains is a negative number, simultaneously executing the multi-alpha deflection angle position compensation on the arrangement region, and placing the target crystal grains into the arrangement region; and driving the swinging arm of the crystal grain conveying mechanism to rotate 90 degrees when the deflection angle alpha of the target crystal grains is zero, and directly placing the target crystal grains into the arrangement region. The invention combines the rotation movement of the crystal grain conveying mechanism and the translational movement of the arrangement region for compensating the angle deflection of the crystal grains, carries out parallel dispatch between the position compensation of a material supply region and the arrangement region, and realizes the automatic correction of the crystal grain angle under the condition of not reducing the conveying speed.

Description

Crystal grain angle correction method applied to chip sorting system

Technical Field

The invention relates to the field of LED chip sorting, in particular to a grain angle correction method applied to a chip sorting system.

Background

Generally, in the sorting process of LED chips, it is required to arrange the dies on the chip film in a square sheet form according to the type. However, it is difficult to keep all the crystal grains absolutely aligned after the chip film is cut, inverted, and expanded. If the crystal grains are only irregular in position, the crystal grains can be corrected through translation, and the motion control is easier to realize; if the crystal grains have angular deviation, the angular deviation needs to be realized through rotation correction. Since the whole chip film needs to be rotated for the correction of any one die, the positions of all other dies on the chip film are changed, and great difficulty is brought to the accurate positioning of the subsequent dies. Therefore, how to correct the angle of the crystal grains so that the crystal grains can be arranged neatly to the arrangement region becomes a problem in the sorting process.

In the prior art, a chip sorting system includes an image recognition system, a chip supply table, a crystal grain transfer mechanism, and an arrangement area, where the chip supply table includes an XY cross platform, a thimble, and a Z-axis rotary platform. The general steps for chip sorting are: the XY cross platform transfers the crystal grains to the center of the thimble; the thimble jacks up and pierces the film to peel off the crystal grains; the crystal grain transfer mechanism grabs the crystal grains and places the crystal grains in the arrangement area. If the crystal grain angle deviation occurs, firstly, the crystal grain angle is corrected through the rotation action of the Z-axis rotating platform of the chip feeding platform, and then the crystal grain is transferred to the arrangement area for placing. According to the method for correcting the grain angle, the whole chip film is required to be rotated for correcting the angle of any grain in the feeding area, so that the positions of all other grains on the chip film are changed, great difficulty is brought to accurate positioning of subsequent grains, the grain angle correction speed is seriously influenced, and the sorting speed of chips is reduced as a whole.

Therefore, it is desirable to provide a die angle correction method applied to a chip sorting system, which can sufficiently utilize the capability of multi-axis parallel scheduling in the chip sorting system while ensuring accurate positioning of the die, and can realize an angle self-correction of the die without delay without reducing the transfer speed, thereby improving the chip sorting speed.

Disclosure of Invention

Based on the defects of the prior art, the invention needs to solve the following problems: the method for correcting the grain angle applied to the chip sorting system can ensure the accurate positioning of the grains, can fully play the capability of multi-axis parallel scheduling in the chip sorting system, and can realize the angle self-correction of the grains without delay under the condition of not reducing the transfer speed so as to improve the sorting speed of the chips.

In order to solve the above problems, the present invention provides a method for correcting a die angle applied to a chip sorting system, the chip sorting system including an image recognition system, a chip supply stage, a die transfer mechanism, and an arrangement area, the image recognition system including a high-speed camera, the chip supply stage including an XY cross platform, a thimble, and a Z-axis rotary platform, wherein the method includes the steps of:

A. setting a deflection range parameter of an allowable grain angle in the chip sorting system;

B. driving an XY cross platform of the chip feeding table, respectively transferring all crystal grains on a chip film to an identification area of a lens of the high-speed camera, identifying through machine vision, and acquiring center position coordinates and a deflection angle alpha of all the crystal grains;

C. attributing the crystal grains with the deflection angle alpha exceeding the deflection range of the allowed crystal grain angle to an excluded crystal grain set, and attributing the rest crystal grains to a crystal grain set to be sorted;

D. selecting one crystal grain in the crystal grain set to be sorted as a target crystal grain;

E. moving the chip supply table to transfer the target crystal grains to the centers of the thimbles according to the central position coordinates of the target crystal grains, wherein the centers of the thimbles are aligned with the center of the lens;

F. driving the thimble to jack up and pierce the film, and stripping the target crystal grains;

G. driving the crystal grain transfer mechanism to grab the target crystal grain;

H. judging the deflection angle alpha of the target crystal grain in the step G, if the deflection angle alpha of the target crystal grain is positive, driving a swing arm of the crystal grain transfer mechanism to rotate by 90-alpha, and simultaneously performing position compensation of difference alpha deflection angle on the arrangement area to place the target crystal grain in the arrangement area;

if the deflection angle alpha of the target crystal grain is negative, driving a swing arm of the crystal grain transfer mechanism to rotate by 90 degrees + alpha, and simultaneously executing position compensation of multiple alpha deflection angles on the arrangement area to place the target crystal grain in the arrangement area;

if the deflection angle alpha of the target crystal grains is 0 degrees, driving a swing arm of the crystal grain transfer mechanism to rotate 90 degrees, and directly placing the target crystal grains in an arrangement area;

continuing the step I;

I. judging whether the grain set to be sorted has grains or not, if so, selecting the next grain in the grain set to be sorted as a target grain, and returning to the step E; otherwise, finishing the grain sorting.

Further, in the above-mentioned case,

the position compensation in the step H is specifically an X offset and a Y offset of the target crystal grain in the platform coordinate system of the arrangement region,

the X offset and the Y offset in the position compensation of the difference α deflection angle are calculated by the following formulas: $\left\{\begin{array}{c}X=R(\cos \mathrm{\β}-\cos (\mathrm{\β}+\mathrm{\α}))\\ Y=R(\sin (\mathrm{\β}+\mathrm{\α})-\sin \mathrm{\β})\end{array},\right.$

the X offset and the Y offset in the position compensation of the multiple alpha deflection angles are calculated by the following formulas: $\left\{\begin{array}{c}X=R(\cos (\mathrm{\β}-\mathrm{\α})-\cos \mathrm{\β})\\ Y=R(\sin \mathrm{\β}-\sin (\mathrm{\β}-\mathrm{\α})),\end{array}\right.$

wherein alpha is the deflection angle of the target crystal grain, beta is the initial angle of the swing arm, and R is the length of the swing arm.

Further, in the above-mentioned case,

after the step I finishes the grain sorting, the method further includes:

step J, if the user is not satisfied with the grain sorting result, the chip film can be driven to rotate for a certain angle, and one grain in the excluded grain set is selected as a target grain;

step K, moving the chip supply table to transfer the central position coordinates of the target crystal grains to the center of the ejector pin, wherein the center of the ejector pin is aligned with the center of the lens;

step L, driving the thimble to jack up and pierce the film, and stripping the target crystal grains;

step M, driving the crystal grain transfer mechanism to grab the target crystal grain;

n, judging whether the deflection angle alpha of the target crystal grain in the step M is positive or negative, if the deflection angle alpha of the target crystal grain is positive, driving a swing arm of the crystal grain transfer mechanism to rotate by 90-alpha, and simultaneously performing position compensation of difference alpha deflection angle on the arrangement area to place the target crystal grain in the arrangement area;

if the deflection angle alpha of the target crystal grain is negative, driving a swing arm of the crystal grain transfer mechanism to rotate by 90 degrees + alpha, and simultaneously executing position compensation of multiple alpha deflection angles on the arrangement area to place the target crystal grain in the arrangement area;

if the deflection angle alpha of the target crystal grains is 0 degrees, driving a swing arm of the crystal grain transfer mechanism to rotate 90 degrees, and directly placing the target crystal grains in an arrangement area;

continuing the step O;

step O, judging whether the excluded grain set has grains or not, if so, selecting the next grain in the excluded grain set as a target grain, and returning to the step K; otherwise, finishing all grain sorting.

Further, in the above-mentioned case,

the allowable range of the grain angle deflection in the step A is-15 DEG to +15 deg.

Further, in the above-mentioned case,

the allowable grain angle in step A is within a range of-9 DEG to +9 deg.

The invention also provides a crystal grain angle correction method applied to a chip sorting system, wherein the chip sorting system comprises an image recognition system, a chip feeding table, a crystal grain transfer mechanism and an arrangement area, the image recognition system comprises a high-speed camera, the chip feeding table comprises an XY cross platform, a thimble and a Z-axis rotating platform, and the method comprises the following steps:

A. setting a deflection range parameter of an allowable grain angle in the chip sorting system;

B. selecting one of crystal grains on the chip film as a target crystal grain;

C. driving an XY cross platform of the chip feeding table, transferring the target crystal grain to an identification area of a lens of the high-speed camera, identifying through machine vision, and acquiring a central position coordinate and a deflection angle alpha of the target crystal grain;

D. judging whether the deflection angle alpha of the target crystal grain exceeds the deflection range of the crystal grain angle allowed in the chip sorting system, if so, attributing the target crystal grain to the excluded crystal grain set, and executing the following step I; otherwise, executing the following step E on the target crystal grain;

E. moving the chip supply table to transfer the target crystal grains to the centers of the thimbles according to the central position coordinates of the target crystal grains, wherein the centers of the thimbles are aligned with the center of the lens;

F. driving the thimble to jack up and pierce the film, and stripping the target crystal grains;

G. driving the crystal grain transfer mechanism to grab the target crystal grain;

H. judging the deflection angle alpha of the target crystal grain in the step G, if the deflection angle alpha of the target crystal grain is positive, driving a swing arm of the crystal grain transfer mechanism to rotate by 90-alpha, and simultaneously performing position compensation of difference alpha deflection angle on the arrangement area to place the target crystal grain in the arrangement area;

if the deflection angle alpha of the target crystal grain is negative, driving a swing arm of the crystal grain transfer mechanism to rotate by 90 degrees + alpha, and simultaneously executing position compensation of multiple alpha deflection angles on the arrangement area to place the target crystal grain in the arrangement area;

if the deflection angle alpha of the target crystal grains is 0 degrees, driving a swing arm of the crystal grain transfer mechanism to rotate 90 degrees, and directly placing the target crystal grains in an arrangement area;

continuing the step I;

I. judging whether the chip film has crystal grains, if so, selecting the next crystal grain on the chip film as a target crystal grain, and returning to the step C; otherwise, finishing the grain sorting.

Further, in the above-mentioned case,

the position compensation in the step G is specifically an X offset and a Y offset of the target die in the platform coordinate system of the arrangement region,

the X offset and the Y offset in the position compensation of the difference α deflection angle are calculated by the following formulas: $\left\{\begin{array}{c}X=R(\cos \mathrm{\β}-\cos (\mathrm{\β}+\mathrm{\α}))\\ Y=R(\sin (\mathrm{\β}+\mathrm{\α})-\sin \mathrm{\β})\end{array},\right.$

the X offset and the Y offset in the position compensation of the multiple alpha deflection angles are calculated by the following formulas: $\left\{\begin{array}{c}X=R(\cos (\mathrm{\β}-\mathrm{\α})-\cos \mathrm{\β})\\ Y=R(\sin \mathrm{\β}-\sin (\mathrm{\β}-\mathrm{\α})),\end{array}\right.$

wherein alpha is the deflection angle of the target crystal grain, beta is the initial angle of the swing arm, and R is the length of the swing arm.

Further, in the above-mentioned case,

after the step I finishes the grain sorting, the method further includes:

step J, if the user is not satisfied with the grain sorting result, the chip film can be driven to rotate for a certain angle, and one grain in the excluded grain set is used as a target grain;

step K, moving the chip supply table to transfer the target crystal grains to the centers of the ejector pins according to the center position coordinates of the target crystal grains, wherein the centers of the ejector pins are aligned with the center of the lens;

step L, driving the thimble to jack up and pierce the film, and stripping the target crystal grains;

step M, driving the crystal grain transfer mechanism to grab the target crystal grain;

step N, judging the deflection angle alpha of the target crystal grain in the step G, if the deflection angle alpha of the target crystal grain is positive, driving a swing arm of the crystal grain transfer mechanism to rotate by 90-alpha, and simultaneously performing position compensation of the difference alpha deflection angle on the arrangement area to place the target crystal grain in the arrangement area;

if the deflection angle alpha of the target crystal grain is negative, driving a swing arm of the crystal grain transfer mechanism to rotate by 90 degrees + alpha, and simultaneously executing position compensation of multiple alpha deflection angles on the arrangement area to place the target crystal grain in the arrangement area;

if the deflection angle alpha of the target crystal grains is 0 degrees, driving a swing arm of the crystal grain transfer mechanism to rotate 90 degrees, and directly placing the target crystal grains in an arrangement area;

continuing the step O;

step O, judging whether the excluded grain set has grains or not, if so, selecting the next grain in the excluded grain set as a target grain; otherwise, finishing all grain sorting.

Further, in the above-mentioned case,

the allowable range of the grain angle deflection in the step A is-15 DEG to +15 deg.

Further, in the above-mentioned case,

the allowable grain angle in step A is within a range of-9 DEG to +9 deg.

The chip sorting system comprises an image identification system, a chip supply table, a crystal grain transfer mechanism and an arrangement area, wherein the image identification system comprises a high-speed camera, the chip supply table comprises an XY cross platform and a thimble, and the method mainly comprises the following steps: judging the deflection angle alpha of the target crystal grain, if the deflection angle alpha of the target crystal grain is positive, driving a swing arm of a crystal grain transfer mechanism to rotate by 90-alpha, and simultaneously performing position compensation of the difference alpha deflection angle on an arrangement area to place the target crystal grain in the arrangement area; if the deflection angle alpha of the target crystal grain is negative, driving a swing arm of the crystal grain transfer mechanism to rotate 90 degrees + alpha, simultaneously executing multi-alpha deflection angle position compensation on the arrangement area, and placing the target crystal grain in the arrangement area; and if the deflection angle alpha of the target crystal grain is 0 degrees, driving a swing arm of the crystal grain transfer mechanism to rotate 90 degrees, and directly placing the target crystal grain in the arrangement area.

Compared with the prior art, the invention compensates the angle deviation of the crystal grains by combining the rotary motion of the crystal grain transfer mechanism and the translation motion of the arrangement area, carries out parallel scheduling between the position compensation of the feeding area and the arrangement area, and realizes the self-correction of the crystal grain angle under the condition of not reducing the transfer speed. The method can ensure the accurate positioning of the crystal grains, and can fully play the capability of multi-axis parallel scheduling in the chip sorting system, so that the crystal grains can be corrected in an angle without delay, the speed of correcting the angle of the crystal grains is improved, and the sorting speed of the chips is further improved.

Drawings

The invention is further illustrated by means of the attached drawings, the examples of which are not to be construed as limiting the invention in any way.

FIG. 1 is a flowchart of a die angle calibration method applied to a chip sorting system according to a first embodiment of the present invention;

FIG. 2 is a flowchart of a die angle calibration method applied to a chip sorting system according to a second embodiment of the present invention;

FIG. 3 is a schematic diagram of the rotation and alignment of the crystal grain of the present invention when the deflection angle α is 0 °;

FIG. 4 is a schematic diagram of the rotation and alignment of the crystal grain according to the present invention when the deflection angle α is a positive angle;

FIG. 5 is a schematic view of the rotation and alignment of the crystal grain according to the present invention when the deflection angle α is negative.

Detailed Description

The invention is further described with reference to the following examples:

example 1:

fig. 1 shows an embodiment of a die angle calibration method applied to a chip sorting system according to the present invention, which is a flowchart of the method according to the present invention.

Specifically, the crystal grain angle correction method applied to the chip sorting system comprises an image recognition system, a chip supply table, a crystal grain transfer mechanism and an arrangement area, wherein the image recognition system comprises a high-speed camera, the chip supply table comprises an XY cross platform, a thimble and a Z-axis rotary platform, and the method comprises the following steps:

step 101, setting a deflection range parameter of an allowable grain angle in the chip sorting system; wherein, the parameter can select different deflection range values according to the requirements of users, and the deflection range of the allowable crystal grain angle commonly used in industry is-15 degrees to +15 degrees or-9 degrees to +9 degrees.

102, driving an XY cross platform of the chip supply table to respectively transfer all crystal grains on a chip film to an identification area of a lens of the high-speed camera, identifying through machine vision, and acquiring center position coordinates and a deflection angle alpha of all the crystal grains; the identification area is completely dependent on the position of the lens, and the center of the identification area is coincident with the center of the lens and does not change along with the position change of the tray. Wherein the center position coordinates of the die are physically offset from the center of the lens.

103, attributing the crystal grains with the deflection angles alpha exceeding the deflection range of the allowed crystal grain angles in all the crystal grains to a excluded crystal grain set, and attributing the rest crystal grains in all the crystal grains to a crystal grain set to be sorted; because the crystal grains with larger deflection angle alpha can be missed to be detected during chip detection, the crystal grains with larger deflection angle alpha do not have detection parameters. Therefore, when chip sorting is carried out, the crystal grains with larger deflection angles which are not in accordance with the requirements are automatically excluded from the range of crystal grain sorting, and therefore, an excluded crystal grain set and a to-be-sorted crystal grain set are set.

And 104, selecting one crystal grain in the crystal grain set to be sorted as a target crystal grain.

And 105, moving the chip supply table to transfer the target crystal grain to the center of the thimble according to the center position coordinate of the target crystal grain, wherein the center of the thimble is aligned with the center of the lens. I.e. the center of the camera lens and the center of the thimble are cross-aligned.

And 106, driving the ejector pin to jack up and penetrate through the thin film to strip the target crystal grains.

And 107, driving the crystal grain transfer mechanism to grab the target crystal grain. In particular to a suction nozzle in a crystal grain transfer mechanism for sucking a target crystal grain.

Step 108, judging the deflection angle α of the target crystal grain in the step 107, if the deflection angle α of the target crystal grain is positive, as shown in fig. 4, driving the swing arm of the crystal grain transfer mechanism to rotate by 90 ° - α, and performing position compensation of a difference α deflection angle on the arrangement area to place the target crystal grain in the arrangement area; if the deflection angle α of the target crystal grain is negative, as shown in fig. 5, driving the swing arm of the crystal grain transfer mechanism to rotate 90 ° + α, and performing position compensation of multiple α deflection angles on the arrangement region to place the target crystal grain in the arrangement region; if the deflection angle α of the target crystal grain is 0 °, as shown in fig. 3, driving the swing arm of the crystal grain transfer mechanism to rotate 90 °, and directly placing the target crystal grain in the arrangement area; step 109 is continued.

Step 109, judging whether the grain set to be sorted has grains, if so, selecting the next grain in the grain set to be sorted as a target grain, and returning to step 105; otherwise, finishing the grain sorting.

Specifically, the position compensation in step 108 is specifically an X offset and a Y offset of the target die in the platform coordinate system of the arrangement region,

the X offset and the Y offset in the position compensation of the difference α deflection angle are calculated by the following formulas: $\left\{\begin{array}{c}X=R(\cos \mathrm{\β}-\cos (\mathrm{\β}+\mathrm{\α}))\\ Y=R(\sin (\mathrm{\β}+\mathrm{\α})-\sin \mathrm{\β})\end{array},\right.$

the X offset and the Y offset in the position compensation of the multiple alpha deflection angles are calculated by the following formulas: $\left\{\begin{array}{c}X=R(\cos (\mathrm{\β}-\mathrm{\α})-\cos \mathrm{\β})\\ Y=R(\sin \mathrm{\β}-\sin (\mathrm{\β}-\mathrm{\α})),\end{array}\right.$

wherein alpha is the deflection angle of the target crystal grain, beta is the initial angle of the swing arm, and R is the length of the swing arm. The starting angle beta of the swing arm is directly identified by a high-speed camera arranged in the arrangement area. In general, the start angle β of the swing arm after identification and the length R of the swing arm can be saved as parameters of the system without repeatedly adjusting the parameters of the system.

In addition, the position compensation amount X offset and Y offset may be reserved as system parameters for a long time.

Specifically, after the step 109 finishes the current grain sorting, the method further includes:

and 110, if the user is not satisfied with the grain sorting result, driving the chip film to rotate by a certain angle, and selecting one grain in the excluded grain set as a target grain.

And step 111, moving the chip supply table to transfer the central position coordinates of the target crystal grains to the center of the ejector pin, wherein the center of the ejector pin is aligned with the center of the lens.

And 112, driving the ejector pin to jack up and pierce the film, and stripping the target crystal grains.

And 113, driving the crystal grain transfer mechanism to grab the target crystal grain.

Step 114, judging whether the deflection angle alpha of the target crystal grain in the step M is positive or negative, if the deflection angle alpha of the target crystal grain is positive, driving a swing arm of the crystal grain transfer mechanism to rotate by 90-alpha, and simultaneously performing position compensation of difference alpha deflection angle on the arrangement area to place the target crystal grain in the arrangement area; if the deflection angle alpha of the target crystal grain is negative, driving a swing arm of the crystal grain transfer mechanism to rotate by 90 degrees + alpha, and simultaneously executing position compensation of multiple alpha deflection angles on the arrangement area to place the target crystal grain in the arrangement area; if the deflection angle alpha of the target crystal grains is 0 degrees, driving a swing arm of the crystal grain transfer mechanism to rotate 90 degrees, and directly placing the target crystal grains in an arrangement area; step 115 is continued.

Step 115, judging whether the excluded grain set has grains, if so, selecting the next grain in the excluded grain set as a target grain, and returning to the step K; otherwise, finishing all grain sorting.

The step 110 may also be: if the user is not satisfied with the current grain sorting result, the deflection range parameter of the allowable grain angle in the chip sorting system can be reset, and the remaining grains on the chip film are sorted again.

In addition, the following optimized sorting steps can be further included between step 108 and step 109:

recording the position coordinate Pg (X) of the target crystal grain arrangement area_g，Y_g)；

Let the coordinate of the lens center position of the arrangement region be C (X)_c，Y_c) And the crystal grain transfer mechanism leaves the arrangement area after being placed, and simultaneously drives a platform coordinate system of the arrangement area, wherein the movement distance according to the X axis of the platform coordinate system is as follows: x_c-X_gThe Y-axis moving distance is as follows: y is_c-Y_gMoving the target crystal grains to the central position of a lens of the arrangement area;

driving the image recognition system in the arrangement area to scan the target crystal grains, and if the target crystal grains are arranged in order, continuing to execute step 109; if the target crystal grains are not regularly arranged, translation compensation can be further performed through an image recognition system.

Example 2:

fig. 2 shows another flowchart of a method for correcting a die angle applied to a chip sorting system according to another embodiment of the present invention.

Specifically, the crystal grain angle correction method applied to the chip sorting system comprises an image recognition system, a chip supply table, a crystal grain transfer mechanism and an arrangement area, wherein the image recognition system comprises a high-speed camera, the chip supply table comprises an XY cross platform, a thimble and a Z-axis rotary platform, and the method comprises the following steps:

step 201, setting a deflection range parameter of an allowable grain angle in the chip sorting system.

Step 202, selecting one of the crystal grains on the chip film as a target crystal grain.

And 203, driving an XY cross platform of the chip supply table to transfer the target crystal grain to an identification area of a lens of the high-speed camera, identifying through machine vision, and acquiring the center position coordinate and the deflection angle alpha of the target crystal grain. The identification area is completely dependent on the position of the lens, and the center of the identification area is coincident with the center of the lens and does not change along with the position change of the tray. Wherein the center position coordinates of the die are physically offset from the center of the lens.

Step 204, judging whether the deflection angle alpha of the target crystal grain exceeds the deflection range of the crystal grain angle allowed in the chip sorting system, if so, attributing the target crystal grain to the excluded crystal grain set, and executing the following step 209; otherwise, the following step 205 is performed on the target die; the deflection range of the allowed crystal grain angle preset by the system can select different deflection range values according to the requirements of users, and the deflection range of the allowed crystal grain angle commonly used in industry is-15 degrees to +15 degrees or-9 degrees to +9 degrees. The crystal grains with larger deflection angle alpha can be missed to be detected during chip detection, so that the crystal grains with larger deflection angle alpha do not have detection parameters, and therefore, the crystal grains with larger deflection angle alpha which do not meet the requirement are automatically excluded from the range of crystal grain sorting during chip sorting, and a crystal grain set is set to be excluded.

Step 205, moving the chip supply table to transfer the target die to the center of the lens and the center of the thimble according to the center position coordinates of the target die. I.e. the center of the camera lens and the center of the thimble are cross-aligned.

And step 206, driving the ejector pin to jack up and pierce the film to strip the target crystal grains.

And step 207, driving the die transfer mechanism to grab the target die. In particular to a suction nozzle in a crystal grain transfer mechanism for sucking a target crystal grain.

Step 208, determining whether the deflection angle α of the target crystal grain in the step 207 is positive or negative, if the deflection angle α of the target crystal grain is positive, as shown in fig. 4, driving a swing arm of the crystal grain transfer mechanism to rotate by 90 ° - α, and performing position compensation of a difference α deflection angle on the arrangement area to place the target crystal grain in the arrangement area; if the deflection angle α of the target crystal grain is negative, as shown in fig. 5, driving the swing arm of the crystal grain transfer mechanism to rotate 90 ° + α, and performing position compensation of multiple α deflection angles on the arrangement region to place the target crystal grain in the arrangement region; if the deflection angle α of the target crystal grain is 0 °, as shown in fig. 3, driving the swing arm of the crystal grain transfer mechanism to rotate 90 °, and directly placing the target crystal grain in the arrangement area; step 209 is continued.

Step 209, judging whether the chip film has a crystal grain, if so, selecting the next crystal grain on the chip film as a target crystal grain, and returning to step 203; otherwise, finishing the grain sorting.

Specifically, the position compensation in step 208 is specifically an X offset and a Y offset of the target die in the platform coordinate system of the arrangement region,

the X offset and the Y offset in the position compensation of the difference α deflection angle are calculated by the following formulas: $\left\{\begin{array}{c}X=R(\cos \mathrm{\β}-\cos (\mathrm{\β}+\mathrm{\α}))\\ Y=R(\sin (\mathrm{\β}+\mathrm{\α})-\sin \mathrm{\β})\end{array},\right.$

the X offset and the Y offset in the position compensation of the multiple alpha deflection angles are calculated by the following formulas: $\left\{\begin{array}{c}X=R(\cos (\mathrm{\β}-\mathrm{\α})-\cos \mathrm{\β})\\ Y=R(\sin \mathrm{\β}-\sin (\mathrm{\β}-\mathrm{\α})),\end{array}\right.$

wherein alpha is the deflection angle of the target crystal grain, beta is the initial angle of the swing arm, and R is the length of the swing arm. The starting angle beta of the swing arm is directly identified by a high-speed camera arranged in the arrangement area. In general, the start angle β of the swing arm after identification and the length R of the swing arm can be saved as parameters of the system without repeatedly adjusting the parameters of the system.

In addition, the position compensation amount X offset and Y offset may be reserved as system parameters for a long time.

Specifically, the step 209 further includes:

step 210, if the user is not satisfied with the current die sorting result, the chip film may be driven to rotate by a certain angle, and one of the dies in the excluded die set is used as a target die.

And step 211, moving the chip supply table to transfer the target crystal grain to the center of the thimble according to the center position coordinate of the target crystal grain, wherein the center of the thimble is aligned with the center of the lens.

And step 212, driving the ejector pin to jack up and penetrate through the thin film, and stripping the target crystal grains.

Step 213, driving the die transfer mechanism to grasp the target die.

Step 214, determining the deflection angle α of the target crystal grain in the step G, if the deflection angle α of the target crystal grain is positive, driving the swing arm of the crystal grain transfer mechanism to rotate by 90 ° - α, and performing position compensation of a difference α deflection angle on the arrangement area to place the target crystal grain in the arrangement area; if the deflection angle alpha of the target crystal grain is negative, driving a swing arm of the crystal grain transfer mechanism to rotate by 90 degrees + alpha, and simultaneously executing position compensation of multiple alpha deflection angles on the arrangement area to place the target crystal grain in the arrangement area; if the deflection angle alpha of the target crystal grains is 0 degrees, driving a swing arm of the crystal grain transfer mechanism to rotate 90 degrees, and directly placing the target crystal grains in an arrangement area; proceed to step 214.

Step 215, judging whether the excluded grain set has grains, if so, selecting the next grain in the excluded grain set as a target grain; otherwise, finishing all grain sorting.

In addition, the following optimized sorting steps can be further included between the step 208 and the step 209:

recording the position coordinate Pg (X) of the target crystal grain arrangement area_g，Y_g)；

Let the coordinate of the lens center position of the arrangement region be C (X)_c，Y_c) And the crystal grain transfer mechanism leaves the arrangement area after being placed, and simultaneously drives a platform coordinate system of the arrangement area, wherein the movement distance according to the X axis of the platform coordinate system is as follows: x_c-X_gThe Y-axis moving distance is as follows: y is_c-Y_gMoving the target crystal grains to the central position of a lens of the arrangement area;

driving the image recognition system in the arrangement area to scan the target crystal grains, and if the target crystal grains are arranged in order, continuing to execute step 209; if the target crystal grains are not regularly arranged, translation compensation can be further performed through an image recognition system.

The invention compensates the angle deviation of the crystal grains by combining the rotary motion of the crystal grain transfer mechanism and the translational motion of the arrangement area, carries out parallel scheduling between the position compensation of the feeding area and the arrangement area, and realizes the self-correction of the crystal grain angle under the condition of not reducing the transfer speed.

Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.

Claims (8)

1. A crystal grain angle correction method applied to a chip sorting system, wherein the chip sorting system comprises an image recognition system, a chip feeding table, a crystal grain conveying mechanism and an arrangement area, the image recognition system comprises a high-speed camera, the chip feeding table comprises an XY cross platform, a thimble and a Z-axis rotating platform, and the method is characterized by comprising the following steps of:

A. setting a deflection range parameter of an allowable grain angle in the chip sorting system;

B. driving the XY cross platform of the chip feeding table to feed the chipAll crystal grains on the film are respectively transferred to an identification area of a lens of the high-speed camera and identified through machine vision, and the central position coordinates and the deflection angles of all the crystal grains are obtained

；

C. The deflection angle is adjusted

The grains beyond the deflection range of the allowed grain angle belong to an excluded grain set, and the rest grains belong to a grain set to be sorted;

D. selecting one crystal grain in the crystal grain set to be sorted as a target crystal grain;

E. moving the chip supply table to transfer the target crystal grains to the centers of the thimbles according to the central position coordinates of the target crystal grains, wherein the centers of the thimbles are aligned with the center of the lens;

F. driving the thimble to jack up and pierce the film, and stripping the target crystal grains;

G. driving the crystal grain transfer mechanism to grab the target crystal grain;

H. deflection angle to the target grain in step G

Judging if the deflection angle of the target crystal grainIf the time is positive, the swing arm of the crystal grain transfer mechanism is driven to rotate

-

While performing a difference on the arrangement region

Position compensation of deflection angle, placing the target crystal grains in an arrangement area;

if the deflection angle of the target crystal grainWhen the voltage is negative, the swing arm of the crystal grain transfer mechanism is driven to rotate

+

While performing a plurality of operations on the arrangement regionPosition compensation of deflection angle, placing the target crystal grains in an arrangement area;

if the deflection angle of the target crystal grain

Is composed of

Then the swing arm of the crystal grain transfer mechanism is driven to rotate

Directly placing the target crystal grains in an arrangement area;

continuing the step I;

I. judging whether the grain set to be sorted has grains or not, if so, selecting the next grain in the grain set to be sorted as a target grain, and returning to the step E; otherwise, finishing the grain sorting;

wherein, the position in the step HThe compensation being in particular in the platform coordinate system of the arrangement zone

Offset sum

The amount of the offset is such that,

said difference

In position compensation of deflection angle

Offset sum

The offset is calculated by the following equation:

，

said plurality

In position compensation of deflection angle

Offset sum

The offset is calculated by the following equation:

，

wherein,is the angle of deflection of the target grain,

is the starting angle of the swing arm,is the length of the swing arm.

2. The die angle correction method applied to a chip sorting system according to claim 1,

the step I further includes, after the grain sorting is finished:

step J, if the user is not satisfied with the grain sorting result, driving the chip film to rotate for a certain angle, and selecting one grain in the excluded grain set as a target grain;

step K, moving the chip supply table to transfer the central position coordinates of the target crystal grains to the center of the ejector pin, wherein the center of the ejector pin is aligned with the center of the lens;

step L, driving the thimble to jack up and pierce the film, and stripping the target crystal grains;

step M, driving the crystal grain transfer mechanism to grab the target crystal grain;

step N of judging the deflection angle of the target crystal grain in the step M

If the deflection angle of the target crystal grain is positive or negative

If the time is positive, the swing arm of the crystal grain transfer mechanism is driven to rotate-

At the same timePerforming a difference on the arrangement region

Position compensation of deflection angle, placing the target crystal grains in an arrangement area;

if the deflection angle of the target crystal grain

When the voltage is negative, the swing arm of the crystal grain transfer mechanism is driven to rotate

+

While performing a plurality of operations on the arrangement region

Position compensation of deflection angle, placing the target crystal grains in an arrangement area;

if the deflection angle of the target crystal grain

Is composed of

Then the swing arm of the crystal grain transfer mechanism is driven to rotate

Directly placing the target crystal grains in an arrangement area;

continuing the step O;

step O, judging whether the excluded grain set has grains or not, if so, selecting the next grain in the excluded grain set as a target grain, and returning to the step K; otherwise, finishing all grain sorting.

3. The die angle correction method applied to a chip sorting system according to claim 2,

the allowable deflection range of the grain angle in the step A is

～

。

4. The die angle correction method applied to a chip sorting system according to claim 2,

the allowable deflection range of the grain angle in the step A is

～

。

5. A crystal grain angle correction method applied to a chip sorting system, wherein the chip sorting system comprises an image recognition system, a chip feeding table, a crystal grain conveying mechanism and an arrangement area, the image recognition system comprises a high-speed camera, the chip feeding table comprises an XY cross platform, a thimble and a Z-axis rotating platform, and the method is characterized by comprising the following steps of:

A. setting a deflection range parameter of an allowable grain angle in the chip sorting system;

B. selecting one of crystal grains on the chip film as a target crystal grain;

C. driving an XY cross platform of the chip supply table, transferring the target crystal grain to an identification area of a lens of the high-speed camera, identifying through machine vision, and acquiring a central position coordinate and a deflection angle of the target crystal grain

；

D. Judging the deflection angle of the target crystal grain

Whether the deflection range of the crystal grain angle allowed in the chip sorting system is exceeded or not, if yes, the target crystal grain is assigned to an excluded crystal grain set, and the following step I is executed; otherwise, executing the following step E on the target crystal grain;

E. moving the chip supply table to transfer the target crystal grains to the centers of the thimbles according to the central position coordinates of the target crystal grains, wherein the centers of the thimbles are aligned with the center of the lens;

F. driving the thimble to jack up and pierce the film, and stripping the target crystal grains;

G. driving the crystal grain transfer mechanism to grab the target crystal grain;

H. deflection angle to the target grain in step G

Judging if the deflection angle of the target crystal grain

If the time is positive, the swing arm of the crystal grain transfer mechanism is driven to rotate

-

While performing a difference on the arrangement region

Position compensation of deflection angle, placing the target crystal grains in an arrangement area;

if the deflection angle of the target crystal grain

When the voltage is negative, the swing arm of the crystal grain transfer mechanism is driven to rotate

+

While performing a plurality of operations on the arrangement region

Position compensation of deflection angle, placing the target crystal grains in an arrangement area;

if the deflection angle of the target crystal grainIs composed of

Then the swing arm of the crystal grain transfer mechanism is driven to rotate

Directly placing the target crystal grains in an arrangement area;

continuing the step I;

I. judging whether the chip film has crystal grains, if so, selecting the next crystal grain on the chip film as a target crystal grain, and returning to the step C; otherwise, finishing the grain sorting;

wherein the position compensation in step H is specifically that of the target crystal grain in the platform coordinate system of the arrangement area

Offset sum

The amount of the offset is such that,

said differenceIn position compensation of deflection angle

Offset sum

The offset is calculated by the following equation:

，

said plurality

In position compensation of deflection angleOffset sum

The offset is calculated by the following equation:

，

wherein,is the angle of deflection of the target grain,

is the starting angle of the swing arm,

is the length of the swing arm.

6. The die angle correction method applied to a chip sorting system according to claim 5,

the step I further includes, after the grain sorting is finished:

step J, if the user is not satisfied with the grain sorting result, driving the chip film to rotate for a certain angle, and taking one grain in the excluded grain set as a target grain;

step K, moving the chip supply table to transfer the target crystal grains to the centers of the ejector pins according to the center position coordinates of the target crystal grains, wherein the centers of the ejector pins are aligned with the center of the lens;

step L, driving the thimble to jack up and pierce the film, and stripping the target crystal grains;

step M, driving the crystal grain transfer mechanism to grab the target crystal grain;

step N of deflecting the target crystal grain in the step M

Judging if the deflection angle of the target crystal grain

If the time is positive, the swing arm of the crystal grain transfer mechanism is driven to rotate

-

While performing a difference on the arrangement region

Position compensation of deflection angle, placing the target crystal grains in an arrangement area;

if the deflection angle of the target crystal grain

When the voltage is negative, the swing arm of the crystal grain transfer mechanism is driven to rotate

+

While performing a plurality of operations on the arrangement region

Position compensation of deflection angle, placing the target crystal grains in an arrangement area;

if the deflection angle of the target crystal grain

Is composed of

Then the swing arm of the crystal grain transfer mechanism is driven to rotate

Directly placing the target crystal grains in an arrangement area;

continuing the step O;

step O, judging whether the excluded grain set has grains or not, if so, selecting the next grain in the excluded grain set as a target grain; otherwise, finishing all grain sorting.

7. The die angle correction method applied to a chip sorting system according to claim 6,

the allowable deflection range of the grain angle in the step A is

～

。

8. The die angle correction method applied to a chip sorting system according to claim 7,

the allowable deflection range of the grain angle in the step A is

～

。

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