CN102790001A - Chip sorting device and chip sorting method - Google Patents
Chip sorting device and chip sorting method Download PDFInfo
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- CN102790001A CN102790001A CN2012101563688A CN201210156368A CN102790001A CN 102790001 A CN102790001 A CN 102790001A CN 2012101563688 A CN2012101563688 A CN 2012101563688A CN 201210156368 A CN201210156368 A CN 201210156368A CN 102790001 A CN102790001 A CN 102790001A
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Abstract
The invention relates to a chip sorting device and a chip sorting method. Chip sorting time can be shortened and chip sorting accuracy can be improved. The chip sorting device (1) moves LED chips to an arranging work bench (4) through a conveying arm (2) from a supply workbench (3) which is carried with a plurality of LED chips being used as semiconductor chips after a wafer is cut. The length of the conveying arm (2) is at least half of the combined length of a radius of the supply workbench (3) and half of the length of a long edge of the arranging work bench (4). The supply workbench (3) moves along X-Y direction and selects a conveyed LED chip and rotates a regulated angle (90DEG), and thereby a selection area of the conveyed LED chip can be set. The supply workbench (3) and the arranging work bench (4) are respectively provided with a rotation mechanism.
Description
Technical field
The present invention relates to be attached on the supply workbench of a plurality of semiconductor chips on the cohesive sheets after being cut off, successively semiconductor chip is moved to sorting chips device of arranging on the workbench and the sorting chips method of having utilized this sorting chips device from having carried.
Background technology
This sorting chips device in the past is on the XY plane that constitutes of X axle and Y axle at two axles by quadrature; Movably carrying cut wafer on the workbench; And differentiate the qualified, defective of semiconductor chip through CCD camera fixing on pedestal; Through this wafer of clampings such as robot, at first, it is last to transfer to position correction workbench fixing on the pedestal.The press section that on the both direction of quadrature, has benchmark; Be fixed in the positioning table of pedestal; On this both direction, mechanically push chip and after positioning; Again through other the transfering part clamping semiconductor chip of robot etc., thereby semiconductor chip transferred to the place of regulation.Foregoing is recorded in patent documentation 1.
Patent documentation 1: (Japan) spy opens flat 9-36203 communique
Above-mentioned sorting chips device in the past is for example under the situation that is used for led chip chemical industry preface; Shown in figure 16; With a plurality of semiconductor chips that are attached to after being cut off on the cohesive sheets; According to the coordinate data in the computer, for example according to the high grade A of luminosity, luminosity high uses such as grade B secondly, when moving on the sheet material of arranging on the workbench 101 successively based on the luminescent inspection result; Need be in the radius of turn that transmits with arm 102; Configuration is supplied with workbench 103 and is arranged workbench 101, and said supply workbench 103 has carried the ring of having pasted the wafer of the stretching after the sectionization with cohesive sheets, and said arrangement workbench 101 has carried the arrangement sheet material.In theory, shown in figure 17, transmission is with the length over half of the total of the long limit size of the diameter+arrangement workbench 101 of arm 102 needs supply workbench 103.That is, in theory, transmit the total size that needs only the length that when having rotated 180 °, can cover the diameter of supplying with workbench 103 and a limit of arranging side workbench 101 with the length of arm 102.In addition, in LED, led chip is closely attached on the cohesive sheets, but this cohesive sheets receives tension force through the metal parts that is called as ring on 360 ° of directions, thereby prevent on sheet material, to produce wrinkle.
Along with wafer size becomes big; And it is big that the size of the supply workbench 103 of the ring of object becomes; The transmission of sorting chips device in the past is elongated with the length of arm 102, and is elongated to the displacement of arranging workbench 101 from supplying with workbench 103, thereby has the elongated problem of time of classification.In addition, therewith likewise,, thereby there is the problem that the arrangement precision on the workbench 101 also descends of arranging because transmission is elongated with arm 102.
Summary of the invention
The present invention is used to solve above-mentioned problem in the past, and its purpose is, provides a kind of and has both shortened the sorting chips time, the sorting chips method that can also improve the sorting chips device of sorting chips precision and utilize this sorting chips device simultaneously.
Sorting chips device of the present invention is from the supply workbench that has carried a plurality of semiconductor chips after wafer cuts off; Pass through transferring arm; Successively this semiconductor chip is moved to and arrange on the workbench, wherein, the size of half of the total of half of the radius that the length of this transferring arm has this supplys workbench at least and the length on the long limit of this arrangement workbench; This supply workbench moves through the X-Y direction and selects to be transmitted semiconductor chip; And rotate 0 ° ~ 360 ° predetermined angulars in the rotation successively, thus set this selection that is transmitted semiconductor chip zone successively, thus achieve the above object.
In addition, preferably, the transferring arm in the sorting chips device of the present invention has the length of each center that arrives the said supply workbench be arranged and said arrangement workbench.
In addition, preferably, the rotation of the said predetermined angular in 0 ° ~ 360 ° rotations in the sorting chips device of the present invention is any in 45 °, 60 °, 90 °, 120 ° and 180 ° of the angles.
In addition, preferably, the X-Y direction of the supply workbench in sorting chips device of the present invention that links move with rotate in any, said arrangement workbench also carries out this X-Y direction and moves any in the rotation with the equal angular of this rotation.
In addition; Preferably; The rotation of the supply workbench in sorting chips device of the present invention links; The chuck of the front end of said transferring arm is carried out the rotation with this rotation equal angular, and linkage moves in the X-Y of this supply workbench direction, said arrangement workbench is also carried out this X-Y direction move.
In addition, preferably, the working range that the X-Y direction of the supply workbench in the sorting chips device of the present invention moves be on this supply workbench, carried said a plurality of semiconductor chips the object ring 1/2nd.
In addition; Preferably, under the anglec of rotation of the supply workbench in the sorting chips device of the present invention is 0 ° situation, a plurality of semiconductor chips of 1/4th of said wafer are classified; And the each 90 ° of ground rotations of the anglec of rotation three times will be supplied with successively workbench half-twist, 180 °, 270 °; Thereby a plurality of semiconductor chips to remaining 3/4ths are classified, and further half-twist, thereby return initial state.
In addition, preferably, in sorting chips device of the present invention; When handling next wafer; The state that said supply workbench is rotated to till the said anglec of rotation is 360 ° is 0 ° a situation as the anglec of rotation, a plurality of semiconductor chips of 1/4th of said wafer are classified, and to the direction of rotation rightabout of this anglec of rotation; Each-90 ° of ground rotations of the anglec of rotation three times should be supplied with-90 ° ,-180 ° ,-270 ° of workbench rotations successively; Thereby a plurality of semiconductor chips to remaining 3/4ths are classified, and are further rotated-90 °, thereby return initial state.
In addition; Preferably; Transferring arm in the sorting chips device of the present invention is that the center is provided with two transferring arms in both sides with the rotating shaft on plane angle; Said supply workbench is that point-symmetric position on plane visual, center is provided with two with the rotating shaft of this transferring arm, and said arrangement workbench is that point-symmetric position on plane visual, center is provided with two with the rotating shaft of this transferring arm, thereby implements the classification of two wafers simultaneously.
Sorting chips method of the present invention is from the supply workbench that has carried a plurality of semiconductor chips after wafer cuts off; Pass through transferring arm; Successively this semiconductor chip is moved to and arrange on the workbench, wherein, the size of half of the total of half of the radius that the length of this transferring arm has this supplys workbench at least and the length on the long limit of this arrangement workbench; This supply workbench moves through the X-Y direction and selects to be transmitted semiconductor chip; And rotate 0 ° ~ 360 ° predetermined angulars in the rotation successively, thus set this selection that is transmitted semiconductor chip zone successively, thus achieve the above object.
According to said structure, below, effect of the present invention is described.
In the present invention; The sorting chips device is from the supply workbench that has carried a plurality of semiconductor chips after wafer cuts off; Through transferring arm, this semiconductor chip is moved to arrange on the workbench, wherein successively; The length of transferring arm has the radius of supply workbench and the half the size of the half the total of the length on the long limit of arranging workbench at least; The supply workbench moves through the X-Y direction selects to be transmitted semiconductor chip, and rotates 0 ° ~ 360 ° predetermined angulars in the rotation successively, thereby sets the selection zone that is transmitted semiconductor chip successively.
Like this, supply with workbench, utilize roughly the size of the transferring arm of the length about in the past half just can carry out sorting chips through rotation.Therefore, the sorting chips time can be shortened, and the sorting chips precision can also be improved.
Through above explanation, according to the present invention, supply with workbench through rotation, utilize roughly the size of the transferring arm of the length about in the past general just can carry out sorting chips, so can shorten the sorting chips time, and can also improve the sorting chips precision.
Description of drawings
Fig. 1 is the side view that schematically shows the major part structure example of the sorting chips device in the execution mode 1 of the present invention.
Fig. 2 schematically shows the transferring arm of sorting chips device of Fig. 1 with respect to supplying with the plane graph of workbench with the position relation of arranging workbench.
Fig. 3 is that the transferring arm that is shown schematically in Fig. 2 concerns down with the position of arranging workbench that with respect to supplying with workbench the length of transferring arm becomes the plane graph of the shortest position relation.
Fig. 4 is the plane graph of the transferring arm of the Fig. 2 when being shown schematically in 0 ° of rotation with respect to the position relation of supplying with workbench and arrangement workbench.
Fig. 5 is the plane graph of the transferring arm of the Fig. 2 when being shown schematically in 90 ° of rotations with respect to the position relation of supplying with workbench and arrangement workbench.
Fig. 6 is the plane graph of the transferring arm of the Fig. 2 when being shown schematically in 180 ° of rotations with respect to the position relation of supplying with workbench and arrangement workbench.
Fig. 7 is the plane graph of the transferring arm of the Fig. 2 when being shown schematically in 270 ° of rotations with respect to the position relation of supplying with workbench and arrangement workbench.
Fig. 8 is shown schematically in the variation of Fig. 2, and the transferring arm during 0 ° of rotation is with respect to supplying with the plane graph of workbench with the position relation of arranging workbench.
Fig. 9 is shown schematically in the variation of Fig. 2, and the transferring arm during 90 ° of rotations is with respect to supplying with the plane graph of workbench with the position relation of arranging workbench.
Figure 10 is shown schematically in the variation of Fig. 2, and the transferring arm during 180 ° of rotations is with respect to supplying with the plane graph of workbench with the position relation of arranging workbench.
Figure 11 is shown schematically in the variation of Fig. 2, and the transferring arm during 270 ° of rotations is with respect to supplying with the plane graph of workbench with the position relation of arranging workbench.
Figure 12 schematically shows the plane graph of the transferring arm of the sorting chips device in the embodiments of the invention 2 with respect to the position relation of two supply workbench and two arrangement workbench.
Figure 13 is shown schematically among Figure 12, and two transferring arms during 90 ° of rotations are with respect to the plane graph of the position relation of two supply workbench and two arrangement workbench.
Figure 14 is shown schematically among Figure 12, and two transferring arms during 180 ° of rotations are with respect to the plane graph of the position relation of two supply workbench and two arrangement workbench.
Figure 15 is shown schematically among Figure 12, and two transferring arms during 270 ° of rotations are with respect to the plane graph of the position relation of two supply workbench and two arrangement workbench.
Figure 16 is the plane graph that the transferring arm in the sorting chips device that schematically shows in the past concerns with respect to the position of supplying with workbench and arrangement workbench.
The plane graph of Figure 17 position relation that to be the transferring arm that is shown schematically in Figure 17 the shortest with respect to the length of supplying with the transferring arm in workbench and the position relation of arranging workbench.
Label declaration
1,1A ~ 1C sorting chips device
2,2A ~ 2C transferring arm
2a, 2b chuck (collet)
21 arm Z axles are used motor
Motor is used in 22 arm θ rotation
3 supply with workbench
31 supply with workbench X axle uses motor
32 supply with workbench Y axle uses motor
33 supply with workbench θ rotation uses motor
4 arrange workbench
41 arrange workbench X axle uses motor
42 arrange workbench Y axle uses motor
43 arrange workbench θ rotation uses motor
Embodiment
Below, the execution mode 1,2 of the sorting chips device that present invention will be described in detail with reference to the accompanying.In addition, from the viewpoint that accompanying drawing is made, separately thickness of the structure member among each figure, length etc. are not limited to illustrated structure.
(execution mode 1)
Fig. 1 is the side view that schematically shows the major part configuration example of the sorting chips device in the execution mode 1 of the present invention.
In Fig. 1; In the sorting chips device 1 of this execution mode 1; With free rotation mode and at above-below direction transferring arm 2 is set with moving freely; Said transferring arm 2 is provided with chuck 2a at leading section, and said chuck 2a can attract and keep a chip, said a plurality of led chips from a plurality of led chips is after wafer is cut off, to be attached to a plurality of led chips on the cohesive sheets.The arm Z axle that moves through of the above-below direction of transferring arm 2 drives with the rotation of motor 21, carries out via rack and pinion.In addition, the spinning movement of transferring arm 2 drives through the rotation of arm θ rotation with motor 22, carries out via gear.
In addition; In sorting chips device 1; Carry and to have put the supply workbench 3 that is used to carry from being attached to the ring of a plurality of led chips on the cohesive sheets after wafer cuts off and be constituted as, move freely, and to be constituted as with this workbench center be that pivot rotates freely in X-direction and Y direction.Supply with the moving through of X-direction of workbench 3 and supply with of the rotation driving of workbench X axle, carry out in the lump with moving of pedestal with the X axle that has carried supply workbench 3 with motor 31.In addition, supply with the moving through of Y direction of workbench 3 and supply with workbench Y axle and drive, supply with workbench 3 and X axle and carry out in the lump with the mobile of pedestal with having carried with the Y axle of pedestal with the rotation of motor 32.In addition, the spinning movement of supplying with workbench 3 drives with the rotation of motor 33 through supplying with workbench θ rotation, supplies with workbench 3, X axle and rotates with the θ of pedestal with pedestal and Y axle and carry out in the lump with the rotation of pedestal with having carried.
In addition; In sorting chips device 1, arrange workbench 4 and be constituted as, move freely in X-direction and Y direction; And being constituted as with this workbench center is that pivot rotates freely; Said arrangement workbench 4 will be equipped on a plurality of wafer chip of supplying with workbench 3 and pass through transferring arm 2, for example according to the high grade A of luminosity, next high use such as grade B of luminosity, move successively.Arrange the moving through of X-direction of workbench 4 and arrange of the rotation driving of workbench X axle, carry out in the lump with the moving of X-direction of pedestal with the X axle that has carried arrangement workbench 4 with motor 41.In addition, arrange the moving through of Y direction of workbench 4 and arrange workbench Y axle and drive, and carried arrangement workbench 4 and X axle thereof and move in the lump with the Y direction of pedestal with the Y axle of pedestal and carry out with the rotation of motor 42.In addition, the spinning movement of arranging workbench 4 drives with the rotation of motor 43 through arranging workbench θ rotation, with carried arrange workbench 4 and X axle thereof with pedestal with and the Y axle rotate with the θ of pedestal and carry out in the lump with the rotation of pedestal.
Here, utilize Fig. 2 and Fig. 3 that the feature structure of the sorting chips device 1 of this execution mode 1 is described.
Fig. 2 schematically shows the transferring arm 2 of sorting chips device 1 of Fig. 1 with respect to the plane graph of supplying with workbench 3 and arranging workbench 4 positions relation.
In Fig. 2; The sorting chips device 1 of this execution mode 1 has the workbench 3 of supply, arranges workbench 4 and transferring arm 2; Thereby said supply workbench 3 has a plurality of led chips of carrying object of classification to be moved and the table top of 360 ° of rotations for example in the X-Y direction; Thereby said arrangement workbench 4 has to link to move with rotating with the X-Y direction in the X-Y direction of supplying with workbench 3 and moves the table top that together rotates equal angular, and the chuck 2a that said transferring arm 2 has its leading section arrives sizes that these are supplied with workbench 3 and arrange the center of workbench 4.
Generally speaking; Sorting chips device 1 has transferring arm 2, supplies with workbench 3 and arranges workbench 4; Said transferring arm 2 has the length that arrives the roughly radial location (center) that is equipped on the ring (having carried a plurality of led chips here) on the supply workbench 3; Said supply workbench 3 is used to make this ring to move and 0 ° ~ 360 ° rotations in the X-Y direction; Said arrangement workbench 4 links and moves and rotate in the X-Y direction of supplying with workbench 3, carries out that the X-Y direction moves and 0 ° ~ 360 ° rotations.Supply with workbench 3 and move, select to be transmitted semiconductor chip, and rotate 0 ° ~ 360 ° predetermined angulars (being 90 ° here) in the rotation successively, thereby set the selection zone that is transmitted semiconductor chip through the X-Y direction.Arrange workbench 4 link in the X-Y direction of supplying with workbench 3 move with rotate in each, carry out that corresponding X-Y direction moves and with its rotation equal angular in any one driving.
Pass through said structure; When using sorting chips device 1 in the led chip chemical industry preface; Make transferring arm 2 rotation, thereby in the ring on supplying with workbench 3, from the cohesive sheets of the ring that has been adjacent to a plurality of led chips; The chuck 2a of the leading section through transferring arm 2, absorption led chip and move to the arrangement sheet material of arranging on the workbench 4 successively.
At this moment, make to supply with workbench 3 and arrange workbench 4 to cooperate the action of transferring arms 2 and carry out the X-Y direction and move and rotate, thereby the size of the transferring arm 2 of the roughly length about half through in the past just can be carried out sorting chips.Like this, through shortening the transferring arm 2 of sorting chips device 1, the sorting chips time can significantly be shortened.
For example as shown in Figure 3; The length minimum of transferring arm 2 can be to supply with half half of total size on long limit of radius+the arrangements workbench 4 of the object ring on the workbench 3; Supply with the each half-twist angle of table top and the half-twist, 180 °, 270 ° successively of workbench 3 sides; Thereby carry wafer in the ring on it also from center wafer half-twist, 180 °, 270 °, the chuck 2a of the leading section of the transferring arm 2A of weak point that can be through can only reaching the center picks up all led chips that transmit wafer.Generally speaking; The length of transferring arm 2A has the half the size of the half the total of the radius of supplying with workbench 3 and the long edge lengths of arranging workbench 4 at least, rotate successively 0 ° ~ 360 ° in the rotation predetermined angular (being 90 ° here) and to set the selection that is transmitted led chip successively regional.Here, transferring arm 2A has the length that reaches the supply workbench 3 that is arranged and arrange each center of workbench 4.As stated, the center of supply workbench 3 is centers of supplying with the object ring on the workbench 3.The center of arranging workbench 4 is that plane visual is dimetric intersection of diagonal position.
In addition, the arrangement workbench 4 of the led chip that picked up of being used to classify also links in the rotation of supplying with workbench 3,90 °, 180 °, 270 of only rotating equal angular, thus can be made as the classification direction identical.
Below, through said structure, specify the action of the sorting chips device 1 of this execution mode 1.
Fig. 4 is shown schematically among Fig. 2, and the transferring arm 2 during 0 ° of rotation is with respect to supplying with the plane graph of workbench 3 with the position relation of arranging workbench 4.
As shown in Figure 4,0 ° of when rotation, the four-quadrant (lower right area) of the X/Y coordinate of supplying with workbench 3 is set at a plurality of selection zones that are transmitted led chip.In the selection zone of this lower right area, supply with workbench 3 and carry out the X-Y direction and move and select to be transmitted led chip.Transferring arm 2 descends; Thereby after being adsorbed led chip, the chuck 2a through its leading section rises to assigned position; Transferring arm 2 rotates predetermined angular to the assigned position of arranging workbench 4 under the state that has adsorbed led chip, and then transferring arm 2 and led chip are together lowered; Thereby, accomplish and transmit arranging the absorption of removing led chip on the workbench 4.At this moment; The arrangement workbench 4 of the led chip that picked up of being used to classify also links and rotate equal angular (here be 0 ° rotation) in the rotation (being 0 ° of rotation) of supplying with workbench 3 here, thereby it is regional that the third quadrant (left lower area) of X/Y coordinate is set at a plurality of selections that are transmitted led chip.In addition, arrange workbench 4 and carry out the X-Y direction and move, and implement anglec of rotation adjustment as required so that the led chip that is picked up fitly arranges successively, thereby the direction of will classifying be made as identical after, carry successively and put the transmission led chip.Move through the X-Y direction, transferring arm 2 transmits a plurality of led chips in the selection zone of supplying with workbench 3 successively, thereby moves and anglec of rotation adjustment through the X-Y direction, a plurality of led chips is fitly carried successively place in the selection zone of arranging workbench 4.Thus, qualified product in a plurality of led chips of the four-quadrant (lower right area) of the X/Y coordinate of supply workbench 3 or regulation grade article all are sent to the assigned position in the selection zone (arrange regional) of arranging on the workbench 4.
Fig. 5 is shown schematically among Fig. 2, and the transferring arm 2 during 90 ° of rotations is with respect to supplying with the plane graph of workbench 3 with the position relation of arranging workbench 4.
As shown in Figure 5, supply with workbench 3 half-twists, thereby the four-quadrant zone (lower right area) of X/Y coordinate is set at following a plurality of selection zones that are transmitted led chip.Arrange workbench 4 and also link in the rotation of supplying with workbench 3, the rotation equal angular, thus the third quadrant (left lower area) of X/Y coordinate is set at a plurality of next ones selection zones that are transmitted led chip.Move through the X-Y direction, transferring arm 2 transmits a plurality of led chips in the selection zone of supplying with workbench 3 successively, thereby in the selection zone of arranging workbench 4, moves and anglec of rotation adjustment through the X-Y direction, and neat successively carrying put a plurality of led chips.Thus, a plurality of led chips of the four-quadrant (lower right area) of the X/Y coordinate of supply workbench 3 all are transferred into the assigned position in the selection zone (arrange regional) of arranging on the workbench 4.
Fig. 6 is shown schematically among Fig. 2, and the transferring arm 2 during 180 ° of rotations is with respect to supplying with the plane graph of workbench 3 with the position relation of arranging workbench 4.
As shown in Figure 6, as 180 ° of rotation situation, supply with workbench 3 and be further rotated 90 °, thereby the four-quadrant (lower right area) of X/Y coordinate is set at following a plurality of selection zones that are transmitted led chip.Arrange workbench 4 and also link in the rotation of supplying with workbench 3, the rotation equal angular, thus the third quadrant (left lower area) of X/Y coordinate is set at following a plurality of selection zones that are transmitted led chip.Move through the X-Y direction, transferring arm 2 transmits a plurality of led chips in the selection zone of supplying with workbench 3 successively, thereby in the selection zone of arranging workbench 4, moves and anglec of rotation adjustment through the X-Y direction, and neat successively carrying put a plurality of led chips.Thus, a plurality of led chips of the four-quadrant (lower right area) of the X/Y coordinate of supply workbench 3 all are transferred into the assigned position in the selection zone (arrange regional) of arranging on the workbench 4.
Fig. 7 is shown schematically among Fig. 2, and the transferring arm 2 during 270 ° of rotations is with respect to supplying with the plane graph of workbench 3 with the position relation of arranging workbench 4.
As shown in Figure 7, as the situation of 270 ° of rotations, supply with workbench 3 and be further rotated 90 °, thereby the four-quadrant (lower right area) of X/Y coordinate is set at following a plurality of selection zones that are transmitted led chip.Arrange workbench 4 and also link in the rotation of supplying with workbench 3, the rotation equal angular, thus the third quadrant (left lower area) of X/Y coordinate is set at following a plurality of selection zones that are transmitted led chip.Move through the X-Y direction, transferring arm 2 moves a plurality of led chips in the selection zone of supplying with workbench 3 successively, thereby in the selection zone of arranging workbench 4, moves and anglec of rotation adjustment through the X-Y direction, and neat successively carrying put a plurality of led chips.Thus, a plurality of led chips of the four-quadrant (lower right area) of the X/Y coordinate of supply workbench 3 all are transferred into the assigned position in the selection zone (arrange regional) of arranging on the workbench 4.
Like this; Be under 0 ° the state in the θ direction; X-Y direction through supplying with workbench 3 and arranging workbench 4 moves, and a plurality of led chips in 1/4th the selection zone of wafer is classified, and will supply with workbench 3 and rotate three times and half-twist, 180 °, 270 ° successively with arranging 90 ° of workbench 4 each angles; Thereby a plurality of led chips in the zone to remaining 3/4ths are classified, and further half-twist (360 °) and return initial state.Thus; Based on the data in the computer (being address date here) as the qualified product/substandard products of check result, give level data (being address date here), the led chip of qualified product or same levels article is fitly arranged and is arranged on the arrangement sheet material on the workbench 4.
After this, supplying with on the workbench 3, lift-launch has been adjacent to from the ring of the cut a plurality of led chips of wafer once more, perhaps carries out the transmission of next grade article.Be arranged in the lift-launch of arranging on the workbench 4 the arrangement sheet material of a plurality of led chips be removed, thereby implement the next preparation that transmits.
According to above explanation; Through this execution mode 1; On the supply workbench 3 of the led chip of a plurality of semiconductor chips after cutting off as wafer from lift-launch; Successively led chip is moved in the sorting chips device of arranging on the workbench 41 through transferring arm 2, the length of transferring arm 2 has the radius of supply workbench 3 and the half the size of the half the total of the long edge lengths of arranging workbench 4 at least, and supply workbench 3 moves through the X-Y direction and selects to be transmitted led chip; And rotate 0 ° ~ 360 ° predetermined angulars (being 90 ° of angles here) in the rotation successively, thereby set the selection zone that is transmitted led chip.Like this, supply workbench 3 and arrangement workbench 4 have rotating mechanism.
Like this; With the classification of identical in the past wafer size in, supply with workbench 3 and arrange workbench 4 and have rotating mechanism, thereby can shorten the length of transferring arm 2; Shorten its displacement; Thereby can significantly shorten the sorting chips time, and, can also improve arranging the transmission precision of workbench 4 through shortening the length of transferring arm 2.At this moment, be used for also can becoming 1/2nd (being 1/4th on the area) to the working range of the mechanism that X axle, Y direction move with supplying with workbench 3 and arranging workbench 4.
In addition, in this execution mode 1, the rotation that links in supplying with workbench 3 has been described; Arrange the situation of also 0 ° ~ 360 ° of rotations of workbench 4; But be not limited thereto,, constitute the rotation that links in supplying with workbench 3 as sorting chips device 1B; With 0 ° ~ 360 ° of the chuck rotations of the front end of transferring arm 2, also can obtain the effect roughly the same with the effect of above-mentioned execution mode 1.
Fig. 8 is shown schematically among the sorting chips device 1B of variation of Fig. 2, and the transferring arm 2B during 0 ° of rotation is with respect to supplying with the plane graph of workbench 3 with the position relation of arranging workbench 4.
As shown in Figure 8, under the situation of 0 ° of rotation, the four-quadrant (lower right area) of the X/Y coordinate of supplying with workbench 3 is set at a plurality of selection zones that are transmitted led chip.In the selection zone of this lower right area, supply with workbench 3 and carry out the X-Y direction and move and select to be transmitted led chip.Transferring arm 2B descends; Rise to assigned position after thereby the chuck 2b through its leading section is adsorbed led chip, transferring arm 2B is under the state that has adsorbed led chip, to the assigned position of arranging workbench 4; Transferring arm 2B rotates predetermined angular; And then transferring arm 2 and led chip together lowered, thereby, accomplish and transmit arranging the absorption of removing led chip on the workbench 4.At this moment; Equal angular rotate in the rotation (being 0 ° of rotation here) that the arrangement workbench 4 of the led chip that picked up of being used to classify need not as above-mentioned execution mode 1, to link in supplying with workbench 3, and arrangement workbench 4 moves through the X-Y direction sets the loading position that is transmitted led chip.In addition; Transferring arm 2B rotates and enforcement angle adjustment (being 0 ° of rotation here) when the chuck 2b of its front end is moved under the state that has adsorbed led chip; So that fitly arranged successively by the led chip that picked up, thus the direction of will classify be made as identical after, put the transmission led chip in neat successively year.Move through the X-Y direction; Transferring arm 2 transmits a plurality of led chips in the selection zone of supplying with workbench 3 successively; Thereby move the anglec of rotation adjustment (being 0 ° of rotation) with the chuck 2b of the front end of this transferring arm 2B here through the X-Y direction, a plurality of led chips are fitly carried successively place in the selection zone of arranging workbench 4.Thus, qualified product in a plurality of led chips of the four-quadrant (lower right area) of the X/Y coordinate of supply workbench 3 or regulation grade article all are sent to the assigned position in the selection zone (arrange regional) of arranging on the workbench 4.
Fig. 9 is shown schematically among the sorting chips device 1B of variation of Fig. 2, and the transferring arm 2 during 90 ° of rotations is with respect to supplying with the plane graph of workbench 3 with the position relation of arranging workbench 4.
As shown in Figure 9, supply with workbench 3 half-twists, thereby the four-quadrant (lower right area) of X/Y coordinate is set at following a plurality of selection zones that are transmitted led chip.For the led chip that will be picked up is classified to equidirectional; Link in the rotation of supplying with workbench 3; Chuck 2b and the led chip of transferring arm 2B together rotate equal angular, thereby transmit and be equipped on the selection zone that is transmitted led chip of the third quadrant (left lower area) of the X/Y coordinate of arranging workbench 4.Move through the X-Y direction; Transferring arm 2 transmits a plurality of led chips in the selection zone of supplying with workbench 3 successively; Thereby move the anglec of rotation adjustment with the chuck 2b of transferring arm 2B through the X-Y direction, a plurality of led chips are fitly carried place in the selection zone of arranging workbench 4 successively.Thus, qualified product in a plurality of led chips of the four-quadrant (lower right area) of the X/Y coordinate of supply workbench 3 or regulation grade article all are transmitted in the assigned position in the selection zone (arrange regional) of arranging on the workbench 4.
Figure 10 is shown schematically among the sorting chips device 1B of variation of Fig. 2, and the transferring arm 2 during 180 ° of rotations is with respect to supplying with the plane graph of workbench 3 with the position relation of arranging workbench 4.
Shown in figure 10, as the situation of 180 ° of rotations, supply with workbench 3 and be further rotated 90 °, thereby the four-quadrant (lower right area) of X/Y coordinate is set at following a plurality of selection zones that are transmitted led chip.The chuck 2b of transferring arm 2B and led chip are together; For the led chip that will be picked up is classified to equidirectional; Link in the rotation of supplying with workbench 3; Rotation equal angular, thereby the selection zone that is transmitted led chip of transmitting and being equipped on the third quadrant (left lower area) of the X/Y coordinate of arranging workbench 4.Move through the X-Y direction; Transferring arm 2 transmits a plurality of led chips in the selection zone of supplying with workbench 3 successively; Thereby move the anglec of rotation adjustment with the chuck 2b of transferring arm 2B through the X-Y direction, a plurality of led chips are fitly carried successively place in the selection zone of arranging workbench 4.Thus, qualified product in a plurality of led chips of the four-quadrant (lower right area) of the X/Y coordinate of supply workbench 3 or regulation grade article all are transmitted in the assigned position in the selection zone (arrange regional) of arranging on the workbench 4.
Figure 11 is shown schematically in the sorting chips device 1 of variation of Fig. 2, and the transferring arm 2 during 270 ° of rotations is with respect to supplying with the plane graph of workbench 3 with the position relation of arranging workbench 4.
Shown in figure 11, as the situation of 270 ° of rotations, supply with workbench 3 and be further rotated 90 °, thereby the four-quadrant (lower right area) of X/Y coordinate is set at following a plurality of selection zones that are transmitted led chip.The chuck 2b of transferring arm 2B and led chip are together; For the led chip that will be picked up is classified to equidirectional; Link in the rotation of supplying with workbench 3; Rotation equal angular, thereby the selection zone that is transmitted led chip of transmitting and being equipped on the third quadrant (left lower area) of the X/Y coordinate of arranging workbench 4.Move through the X-Y direction; Transferring arm 2 transmits a plurality of led chips in the selection zone of supplying with workbench 3 successively; Thereby move the anglec of rotation adjustment with the chuck 2b of transferring arm 2B through the X-Y direction, a plurality of led chips are fitly carried successively place in the selection zone of arranging workbench 4.Thus, qualified product in a plurality of led chips of the four-quadrant (lower right area) of the X/Y coordinate of supply workbench 3 or regulation grade article all are transmitted in the assigned position in the selection zone (arrange regional) of arranging on the workbench 4.
Like this; Be under 0 ° the state in the θ direction; X-Y direction through supplying with workbench 3 and arranging workbench 4 moves, and a plurality of led chips in 1/4th the selection zone of wafer is classified, and will supply with that workbench 3 rotates three times by each 90 ° and half-twist, 180 °, 270 ° successively; Thereby a plurality of led chips in the zone to remaining 3/4ths are classified, and further half-twist (360 °) and return initial state.Thus; Based on the data (being address date here) as the qualified product/substandard products of check result in the computer, rank data (being address date here), the corresponding led chip in the address on the eyeglass of qualified product or same levels article is concentrated on the arrangement sheet material that fitly is arranged on the arrangement workbench 4.
After this,, carry once more, perhaps carry out the transmission of next grade article from the cut a plurality of led chips of wafer supplying with on the workbench 3.Be arranged in the lift-launch of arranging on the workbench 4 a plurality of led chips be removed, thereby implement the next preparation that transmits.
In addition; In above-mentioned execution mode 1, in sorting chips device 1, constitute following structure: be under 0 ° the situation when the anglec of rotation of supplying with workbench 3, the led chip as a plurality of semiconductor chips of 1/4th of wafer is classified; And will supply with the each 90 ° of ground rotations of workbench 3 anglecs of rotation three times and half-twist, 180 °, 270 ° successively; Thereby a plurality of led chips to remaining 3/4ths are classified, and further half-twist and return initial state, but are not limited thereto; Also can be made as following structure: under the situation of then handling next wafer; Rotate to state till the anglec of rotation is 360 ° as the state of 0 ° of the initial anglec of rotation with supplying with workbench 3, the led chip as a plurality of semiconductor chips of 1/4th of wafer classified, and to the direction of rotation rightabout of the anglec of rotation of supplying with workbench 3; To supply with the each 90 ° of ground rotations of workbench 3 anglecs of rotation three times and rotate-90 ° ,-180 ° ,-270 ° successively; Thereby a plurality of led chips to remaining 3/4ths are classified, and are further rotated-90 °, thereby return initial state.
(execution mode 2)
In above-mentioned execution mode 1; Explained through transferring arm 2,2A or a 2B; Be equipped on the situation that on an arrangement workbench, moves led chip on the supply workbench on the ring successively from a plurality of led chips; Wherein said a plurality of led chip is a plurality of led chips after cutting off from wafer; But in this execution mode 2, the situation below explaining: at opposition side transferring arm 2,2A or a 2B are set also, thereby pass through totally two transferring arm 2C; Be equipped on the supply workbench on the ring from a plurality of led chips and on an arrangement workbench, move led chip successively; And conduct another group different with this, carrying out simultaneously being equipped on the action of on an arrangement workbench, moving led chip on the supply workbench on the ring successively from a plurality of led chips, wherein said a plurality of led chips are a plurality of led chips after cutting off from wafer.
Figure 12 is the transferring arm 2C that schematically shows the sorting chips device 1C in the execution mode 2 of the present invention with respect to the plane graph of the position relation of two supply workbench 3,3C and two arrangement workbench 4,4C.
In Figure 12, in the sorting chips device 1C of this execution mode 2, be that with the difference of the situation of above-mentioned execution mode 1 transferring arm 1C is that the center also is arranged at opposition side with its rotating shaft, implements the classification of two wafers simultaneously.Sorting chips device 1C is the center with the rotating shaft; Two transferring arm 1C are set in both sides on plane visual; Two supply workbench 3,3C are the center with the rotating shaft of transferring arm 2C, and point-symmetric position is provided with two on plane visual, and two arrangement workbench 4,4C are the center with the rotating shaft of transferring arm 2C; Point-symmetric position is provided with two on plane visual, thereby implements the classification of two wafers simultaneously.
Pass through said structure; Under the situation of 0 ° of rotation; Shown in figure 12; The four-quadrant (lower right area) of the X/Y coordinate of supplying with workbench 3 is set at a plurality of selection zones that are transmitted led chip, and second quadrant area (top left region) that will supply with the X/Y coordinate of workbench 3C to be set at a plurality of selections that are transmitted led chip regional.In the selection zone of this lower right area, supply with workbench 3 and carry out the X-Y direction and move and select to be transmitted led chip, and in the selection zone of this top left region, supply with workbench 3 and carry out the X-Y direction and move and select to be transmitted led chip.Article two, transferring arm 2C descends; Thereby after being adsorbed led chip respectively, the chuck 2a through its leading section rises to assigned position; Article two, transferring arm 2C to each assigned position rotation predetermined angular of arranging workbench 4,4C, and further makes two transferring arm 2C and led chip lower in the lump under the state that adsorbs led chip respectively; Thereby arranging workbench 4, the last absorption of removing led chip respectively of 4C, transmitting when accomplishing two led chips.
At this moment; Arrangement workbench 4, the 4C of two led chips being picked up of being used to classify also links in the rotation (being 0 ° of rotation here) of supplying with workbench 3,3C; Rotation equal angular (being 0 ° of rotation here); Thereby the third quadrant zone (left lower area) with the X/Y coordinate in arranging workbench 4 is set at a plurality of selection zones that are transmitted led chip, and in arranging workbench 4C, the first quartile zone (right regions) of X/Y coordinate is set at a plurality of selection zones that are transmitted led chip.In addition, arrange workbench 4,4C implements the X-Y direction respectively and moves, and implement anglec of rotation adjustment as required, make that the led chip that is picked up is fitly arranged successively, put the transmission led chip thereby the direction of will classifying is made as to carry successively after identical.Move through the X-Y direction; Article two, transferring arm 2C transmits a plurality of led chips in the selection zone of supplying with workbench 3,3C successively; Thereby move and anglec of rotation adjustment through the X-Y direction, a plurality of led chips are fitly carried to place successively arrange respectively selecting in the zone of workbench 4,4C.Thus, the four-quadrant zone of the X/Y coordinate of supply workbench 3,3C, the qualified product in each a plurality of led chip in second quadrant area (lower right area, top left region) or regulation grade article all are transmitted in and arrange workbench 4, the last interior assigned position in selection zone (arrange regional) of 4C.
Figure 13 is shown schematically among Figure 12, the plane graph that two transferring arm 2C in 90 ° of whens rotation concern with respect to the position of two supply workbench 3,3C and two arrangement workbench 4,4C.
Shown in figure 13; Supply with together half-twist of workbench 3,3C; Thereby in supplying with workbench 3; The four-quadrant of X/Y coordinate zone (lower right area) is set at a plurality of next ones that are transmitted led chip selects the zone, and in supplying with workbench 3C, second quadrant (top left region) of X/Y coordinate is set at a plurality of next ones that are transmitted led chip selects the zone.Arrangement workbench 4,4C also link in the rotation of supplying with workbench 3,3C; On identical direction of rotation, rotate equal angular; Thereby in arranging workbench 4; The third quadrant (left lower area) of X/Y coordinate is set at a plurality of next ones that are transmitted led chip selects the zone, and in arranging workbench 4C, the first quartile zone (right regions) of X/Y coordinate is set at a plurality of next ones that are transmitted led chip selects the zone.Move through each X-Y direction; Article two, transferring arm 2C transmits a plurality of led chips in each selection zone of supplying with workbench 3,3C successively; Thereby move and each anglec of rotation adjustment through each X-Y direction, a plurality of transmission led chips are fitly carried to place simultaneously successively arrange respectively selecting in the zone of workbench 4,4C.Thus, the four-quadrant zone of the X/Y coordinate of supply workbench 3,3C, the qualified product in each a plurality of led chip in second quadrant area (lower right area, top left region) or regulation grade article all are transmitted in and arrange workbench 4, the last interior assigned position in selection zone (arrange regional) of 4C.
Figure 14 is shown schematically among Figure 12, the plane graph that two transferring arm 2C in 180 ° of whens rotation concern with respect to the position of two supply workbench 3,3C and two arrangement workbench 4,4C.
Shown in figure 14; As situation 180 ° of rotations; Supply with together half-twist of workbench 3,3C, thereby in supplying with workbench 3, the four-quadrant zone (lower right area) of X/Y coordinate is set at following a plurality of selection zones that are transmitted led chip; And in supplying with workbench 3C, second quadrant (top left region) of X/Y coordinate is set at following a plurality of selection zones that are transmitted led chip.Arrangement workbench 4,4C also link in the rotation of supplying with workbench 3,3C; On identical direction of rotation, rotate equal angular; Thereby in arranging workbench 4; The third quadrant (left lower area) of X/Y coordinate is set at following a plurality of selection zones that are transmitted led chip, and in arranging workbench 4C, the first quartile zone (right regions) of X/Y coordinate is set at following a plurality of selection zones that are transmitted led chip.Move through each X-Y direction; Article two, transferring arm 2C transmits a plurality of led chips in each selection zone of supplying with workbench 3,3C successively; Thereby move and each anglec of rotation adjustment through each X-Y direction, a plurality of transmission led chips are fitly carried to place successively simultaneously arrange respectively selecting in the zone of workbench 4,4C.Thus, the four-quadrant zone of the X/Y coordinate of supply workbench 3,3C, the qualified product in each a plurality of led chip in second quadrant area (lower right area, top left region) or regulation grade article all are transmitted in and arrange workbench 4, the last interior assigned position in selection zone (arrange regional) of 4C.
Figure 15 is shown schematically among Figure 12, the plane graph that two transferring arm 2C in 270 ° of whens rotation concern with respect to the position of two supply workbench 3,3C and two arrangement workbench 4,4C.
Shown in figure 15; Situation as 270 ° of rotations; Supply with workbench 3,3C together is further rotated 90 °, thereby in supplying with workbench 3, the four-quadrant zone (lower right area) of X/Y coordinate is set at following a plurality of selection zones that are transmitted led chip; And in supplying with workbench 3C, second quadrant (top left region) of X/Y coordinate is set at the following selection zone that is transmitted led chip.Arrangement workbench 4,4C also link in the rotation of supplying with workbench 3,3C; On identical direction of rotation, rotate equal angular; Thereby in arranging workbench 4; The third quadrant (left lower area) of X/Y coordinate is set at following a plurality of selection zones that are transmitted led chip, and in arranging workbench 4C, the first quartile zone (right regions) of X/Y coordinate is set at following a plurality of selection zones that are transmitted led chip.Move through each X-Y direction; Article two, transferring arm 2C transmits a plurality of led chips in each selection zone of supplying with workbench 3,3C successively; Thereby move and each anglec of rotation adjustment through each X-Y direction, a plurality of transmission led chips are fitly carried to place successively simultaneously arrange respectively selecting in the zone of workbench 4,4C.Thus, the four-quadrant zone of the X/Y coordinate of supply workbench 3,3C, the qualified product in each a plurality of led chip in second quadrant area (lower right area, top left region) or regulation grade article all are transmitted in and arrange workbench 4, the last interior assigned position in selection zone (arrange regional) of 4C.
Like this; Be under 0 ° the state in the θ direction; X-Y direction through supplying with workbench 3,3C and arrangement workbench 4,4C moves; To each wafer 1/4th each select a plurality of led chips in the zone to classify, and will supply with workbench 3,3C and arrange workbench 4,4C and select three times and half-twist, 180 °, 270 ° successively on 90 ° of ground of each angle respectively, thereby each regional a plurality of led chip of remaining 3/4ths will be classified respectively; And further distinguish half-twist (360 °), thereby return initial state.Thus; Based on the data (being address date here) as the qualified product/substandard products of check result in the computer, rank data (being address date here), a plurality of led chips of qualified product or same levels article fitly are arranged in arrangement workbench 4, last respectively the arranging on the sheet material of 4C.
After this, supply with workbench 3,3C is last, carries the ensuing a plurality of led chips that cut off from wafer once more respectively, transmission when perhaps carrying out next grade article.Take off after arranging workbench 4, the last a plurality of led chips arranged of 4C, implement the next preparation that transmits.
Through above explanation, according to this execution mode 2, with the classification of identical in the past wafer size in; Supply workbench 3,3C and arrangement workbench 4,4C are had each rotating mechanism; Thereby can shorten the length of two transferring arms 2,2C respectively, shorten its displacement, thereby can significantly shorten each sorting chips time; And, can also improve arranging the transmission precision of workbench 4,4C through shortening the length of two transferring arms 2,2C simultaneously.At this moment, two transferring arms 2,2C are set, thereby can transmit led chip simultaneously, thereby significantly improve the transmission efficiency of led chip arrangement workbench 4,4C from supply workbench 3,3C.
In addition, in this execution mode 2, the rotation that links in supplying with workbench 3,3C has been described; Arrangement workbench 4,4C also rotate 0 ° ~ 360 ° situation; But be not limited thereto,, constitute the rotation that links in workbench 3,3C as the sorting chips device; With 0 ° ~ 360 ° of each chuck 2b rotations of the front end of transferring arm 2C, also can obtain the effect roughly the same with the effect of above-mentioned execution mode 2.
In addition; In this execution mode 2; In sorting chips device 1C, constitute following structure: be under 0 ° the situation when the anglec of rotation of supplying with workbench 3,3C; Led chip to as a plurality of semiconductor chips of 1/4th of wafer carries out two groups classification, and will supply with 90 ° of ground rotations of the each successively anglec of rotation of workbench 3,3C three times and half-twist, 180 °, 270 ° successively, thereby a plurality of led chips of remaining 3/4ths are carried out two groups classification; And further will supply with workbench 3,3C half-twist and return initial state; But be not limited thereto, also can be made as following structure: under the situation of then handling next wafer, rotate to state till the anglec of rotation is 360 ° as the state of 0 ° of the initial anglec of rotation supplying with workbench 3,3C; Led chip to as a plurality of semiconductor chips of 1/4th of wafer carries out two groups classification; And to the direction of rotation rightabout of the anglec of rotation of supplying with workbench 3,3C, will supply with workbench 3, each-90 ° of ground rotations of the 3C anglec of rotation three times and rotate-90 ° ,-180 ° ,-270 ° successively, thereby a plurality of led chips of remaining 3/4ths will be carried out two groups classification; And further will supply with-90 ° of workbench 3,3C rotations, thereby return initial state.
In addition; In above-mentioned execution mode 1,2, though do not specify, to the situation of LED; Basically upload at the supply workbench and put " ring that has been adjacent to led chip "; But if in wide scope, become semiconductor device, then be not limited to use ring, but semiconductor chip is reprinted to arranging workbench from supplying with workbench.
As described above, the present invention that utilized 1,2 illustrations preferred embodiment of the present invention, but the present invention should not be defined in this execution mode 1,2 and make an explanation.Be appreciated that the present invention should only explain its scope according to claims.This area staff is appreciated that based on record of the present invention and technological general knowledge according to concrete 1,2 record preferred embodiment of the present invention, can implements scope of equal value.Be appreciated that patent, patent application and the document quoted in this manual are equal to its content itself and are recorded in this specification particularly, should be as quoting its content for the reference of this specification.
The present invention is being attached on the supply workbench of a plurality of wafer chip on the cohesive sheets after being cut off from having carried; Successively wafer chip is moved in the field of the sorting chips method of arranging the sorting chips device on the workbench and having utilized this sorting chips device; Supply with workbench through rotation; Can utilize the size of the transferring arm of the length about half that is roughly in the past to classify, therefore can shorten the sorting chips time, and can also improve the sorting chips precision.
Claims (10)
1. sorting chips device from the supply workbench that has carried a plurality of semiconductor chips after wafer cuts off, through transferring arm, moves to this semiconductor chip successively and arranges on the workbench, wherein,
The length of this transferring arm has the half the size of half the total of length on long limit of radius and this arrangement workbench of this supply workbench at least; This supply workbench moves through the X-Y direction and selects to be transmitted semiconductor chip; And rotate 0 ° ~ 360 ° predetermined angulars in the rotation successively, thereby set this selection that is transmitted semiconductor chip zone successively.
2. sorting chips device as claimed in claim 1, wherein,
Said transferring arm has the length of each center that arrives the said supply workbench be arranged and said arrangement workbench.
3. sorting chips device as claimed in claim 1, wherein,
The rotation of the said predetermined angular in said 0 ° ~ 360 ° rotations is any in 45 °, 60 °, 90 °, 120 ° and 180 ° of the angles.
4. sorting chips device as claimed in claim 1, wherein,
Link in the X-Y of said supply workbench direction move with rotate in any, said arrangement workbench also carries out this X-Y direction and moves any in the rotation with the equal angular of this rotation.
5. sorting chips device as claimed in claim 1, wherein,
Link in the rotation of said supply workbench, the chuck of the front end of said transferring arm is carried out the rotation with this rotation equal angular, linkage moves in the X-Y of this supply workbench direction, said arrangement workbench is also carried out this X-Y direction move.
6. sorting chips device as claimed in claim 1, wherein,
The working range that the X-Y direction of said supply workbench moves be this supply workbench carried said a plurality of semiconductor chips the object ring 1/2nd.
7. sorting chips device as claimed in claim 1, wherein,
Be under 0 ° the situation when the anglec of rotation of said supply workbench; A plurality of semiconductor chips of/4th to said wafer are classified; And the each 90 ° of ground rotations of the anglec of rotation three times will be supplied with successively workbench half-twist, 180 °, 270 °; Thereby a plurality of semiconductor chips to remaining 3/4ths are classified, and further half-twist, thereby return initial state.
8. sorting chips device as claimed in claim 7, wherein,
When handling next wafer; S' 0 ° situation with said supply workbench the state till the said anglec of rotation is 360 ° of rotating to as the anglec of rotation; A plurality of semiconductor chips of/4th to said wafer are classified; And to the direction of rotation rightabout of this anglec of rotation, with each-90 ° of ground rotations of the anglec of rotation three times and should supply with workbench successively and rotate-90 ° ,-180 ° ,-270 °, thereby a plurality of semiconductor chips of remaining 3/4ths are classified; And be further rotated-90 °, thereby return initial state.
9. sorting chips device as claimed in claim 1, wherein,
Said transferring arm is that the center is provided with two transferring arms in both sides with the rotating shaft on plane angle; Said supply workbench is that point-symmetric position on plane visual, center is provided with two with the rotating shaft of this transferring arm; Said arrangement workbench is that point-symmetric position on plane visual, center is provided with two with the rotating shaft of this transferring arm, thereby implements the classification of two wafers simultaneously.
10. sorting chips method from the supply workbench that has carried a plurality of semiconductor chips after wafer cuts off, through transferring arm, moves to this semiconductor chip successively and arranges on the workbench, wherein,
The length of this transferring arm has the half the size of half the total of length on long limit of radius and this arrangement workbench of this supply workbench at least; This supply workbench moves through the X-Y direction and selects to be transmitted semiconductor chip; And rotate 0 ° ~ 360 ° predetermined angulars in the rotation successively, thereby set this selection that is transmitted semiconductor chip zone successively.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
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| JP2011111919A JP2012243920A (en) | 2011-05-18 | 2011-05-18 | Chip sorting device and chip sorting method |
| JP2011-111919 | 2011-05-18 |
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| CN102790001A true CN102790001A (en) | 2012-11-21 |
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| CN105762099A (en) * | 2014-12-17 | 2016-07-13 | 北京中电科电子装备有限公司 | Chip supplying and conveying mechanism and chip bonding machine |
| CN106311625A (en) * | 2015-06-17 | 2017-01-11 | 晶元光电股份有限公司 | Semiconductor element classification method |
| CN110690152A (en) * | 2019-08-28 | 2020-01-14 | 苏州均华精密机械有限公司 | Large-size wafer bonding device |
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| CN103744404B (en) * | 2014-01-22 | 2016-02-17 | 哈尔滨工业大学 | For controlling method that full-automatic chip mounter cantilever beams moves along Y-axis high-precise synchronization and device |
| CN108807237A (en) * | 2018-06-27 | 2018-11-13 | 深圳市矽谷科技有限公司 | A kind of die bond process structure, bonder and die bond control method |
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| KR20210007705A (en) | 2019-07-12 | 2021-01-20 | 삼성전자주식회사 | Led devices transferring method and display module manufactured threrby |
| CN111863685A (en) * | 2020-07-31 | 2020-10-30 | 深圳市踏路科技有限公司 | COB die bonder |
| CN113437005A (en) * | 2021-06-18 | 2021-09-24 | 深圳市卓兴半导体科技有限公司 | Variable-angle die bonding method and system and die bonding machine |
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| CN104253070A (en) * | 2013-06-27 | 2014-12-31 | 先进科技新加坡有限公司 | Processing equipment device and method of adjusting semiconductor component by using imaging device |
| CN105762099A (en) * | 2014-12-17 | 2016-07-13 | 北京中电科电子装备有限公司 | Chip supplying and conveying mechanism and chip bonding machine |
| CN106311625A (en) * | 2015-06-17 | 2017-01-11 | 晶元光电股份有限公司 | Semiconductor element classification method |
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| JP2012243920A (en) | 2012-12-10 |
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Application publication date: 20121121 |