JPH0936203A - Transfer body device and its control method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a transfer body device which can transfer a chip on a scribed wafer to a specific target position at high precision, and which has a simple structure, and its control method. SOLUTION: An XY table is moved so that an objective wafer chip can enter an image area of a CCD camera (S1), and the position of the objective wafer chip is calculated (S2). A vacuum finger is rotated on the objective wafer chip (S3), and the objective wafer chip is grasped at the top end of a finger by vacuum (S4 to S7). The vacuum finger is rotated by (180+θ) deg. such that a calculated misalignment (rotation angle θ of a chip) is corrected (S8), and simultaneously the XY table is moved so that a recess that the objective wafer chip on a tray should be received is located just under the top end of the finger (S9). The wafer chip is released from the top end of the vacuum finger and received in the recess on the tray to complete the processing (S10 to S13).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a transfer device which is a mobile device, and more particularly to a mobile device suitable for use as a chip sorter for transferring wafer chips that have been cut and attached to an adhesive film to a tray. It is a thing.

[0002]

2. Description of the Related Art In a conventional chip sorter, a cut wafer is mounted on a movable table on an XY plane formed by two orthogonal axes, that is, an X axis and a Y axis, and the wafer is fixed to a pedestal. A CCD camera discriminates whether the wafer chip is good or bad, a robot or the like grips the wafer, and first transfers the wafer once to a position correction table fixed to a pedestal. Then, after a chip is mechanically pressed in the two directions with a positioning table having reference pressing parts in two directions orthogonal to each other and fixed to a pedestal, the transfer means of another robot or the like is newly provided. In general, the wafer chip is gripped and transferred to a predetermined place.

[0003]

However, in the above-mentioned conventional method, two transfer means are required, and the apparatus becomes expensive.

When the wafer chip is positioned with high accuracy, the wafer chip is mechanically pressed against the reference surface, which makes it difficult to perform high-precision positioning. In addition, since the chip is made of glass or the like, chips or the like are generated and defective products frequently occur.

Since the position correction table is indispensable, the device becomes complicated. There was a disadvantage.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a moving body device having a simple structure and a method of controlling the same, which can transfer a chip on a cut wafer to a predetermined target position with high accuracy. .

[0007]

As a constitution of the present invention to achieve the above-mentioned target, claim 1 is directed to a position measuring means for detecting a position and an angle of a work with respect to a reference point, and moving the work to a target position. A moving body device having moving means for moving the first moving means on the XY plane;
Gripping the work present on the first moving means,
A second moving means capable of rotating about a Z axis perpendicular to the XY plane and moving parallel to the Z axis, and simultaneously controlling the first and second moving means while holding the workpiece. Then, the moving body device is provided with a control means for moving the work to the target position located on the first moving means.

As a result, the movement of the work is continuously processed at high speed by using only two types of moving means.

The target position according to claim 2 is located parallel to the X-axis and the Y-axis, and the second moving means corrects the angle of the workpiece with respect to the reference point by rotation, and further 180 The mobile device according to claim 1, wherein the mobile device rotates once.

As a result, the moving distance of the second moving means is shortened, and the movement of the work and the angle correction are performed at the same time, so that the processing can be performed at higher speed.

According to a third aspect of the present invention, the position measuring means includes an image pickup means for picking up the image of the work, and an image processing means for processing the picked-up image data. .

With this, the position and angle of the work with respect to the reference point are calculated.

According to a fourth aspect of the present invention, there is provided the movable body apparatus according to the first aspect, wherein the position measuring means is provided above a fixed point on the XY plane for gripping the work by the second moving means. is there.

As a result, the influence of the vibration caused by the first and second moving means can be eliminated from the position measuring means.

The movable body device according to claim 1, wherein the work in claim 5 is a plurality of wafer chips cut on a pressure sensitive adhesive film in a matrix.

Since the second moving means is operated on the XY plane, a plurality of works arranged in a matrix can be continuously processed.

According to a sixth aspect of the present invention, when the position and the angle are calculated by the position measuring means, the wafer chip premarked is also identified at the same time, and the second mark is obtained according to the result.
The moving body apparatus according to claim 5, wherein it is determined whether or not the moving means holds the moving body.

Thus, it is possible to select and move the works at the same time.

As another configuration of the present invention to achieve the same target, claim 7 has a position measuring step for detecting the position and angle of the work with respect to the reference point, and a moving step for moving the work to the target position. In a method of controlling a mobile device, a first moving step of moving the work on an XY plane, holding the work, rotating about a Z axis perpendicular to the XY plane, and parallel to the Z axis. The second moving step of moving and the first and second moving steps are performed at the same time while holding the work, and the work is moved to the target position that moves following the first moving step. A method of controlling a mobile device is characterized by the above.

As a result, the movement of the work is continuously processed at a high speed by only two kinds of moving steps.

The target position of claim 8 is located parallel to the X-axis and the Y-axis, and in the second moving step, the angle of the workpiece with respect to the reference point is corrected by rotation, and at the same time, 180 The method for controlling a mobile device according to claim 7, wherein the method is to rotate the mobile device.

As a result, the moving distance of the second moving means is shortened, and the movement of the work and the angle correction are performed at the same time, so that the processing can be performed at higher speed.

The control of the moving body apparatus according to claim 7, wherein the position measuring step in claim 9 includes an image pickup step for picking up an image of the work and an image processing step for processing the picked-up image data. Is the way.

Thus, the position and angle of the work with respect to the reference point are calculated.

According to a tenth aspect of the present invention, the position measuring step is performed above the fixed point on the XY plane for gripping the work by the second moving step. It is a control method.

As a result, it is possible to eliminate the consideration of the position measuring process against the influence of vibration.

The work according to claim 11 is a method for controlling a moving body apparatus according to claim 7, wherein the work is a plurality of wafer chips that are cut in a matrix and are stuck on an adhesive film.

Since the second moving means is operated on the XY plane, a plurality of works arranged in a matrix can be continuously processed.

According to a twelfth aspect, when the position and the angle are calculated in the position measuring step, the wafer chip with a mark is also identified at the same time, and it is determined whether or not the wafer chip is gripped in the second moving step according to the result. The method for controlling a mobile device according to claim 11, wherein:

Thus, the works can be selected and moved at the same time.

[0031]

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings.

First, a chip sorter as an embodiment of the present invention will be described with reference to FIGS.

FIG. 1 is a block diagram of a tip sorter as an embodiment of the present invention.

In the figure, reference numeral 1 is a mount for mounting a chip sorter according to the present embodiment, which is fixed to the ground. Two guide rails 2 are attached in parallel on the plane of the gantry 1. Four ball screws 3 are provided in the center of the two guide rails 2 in parallel with the guide rails 2, and both ends are rotatably attached to the mount 1. A servo motor 5 having an encoder (not shown) is attached to one end of the ball screw 3 by a coupling (not shown). The nut of the ball screw 3 is fixed to the X table 4 and when the servo motor 5 rotates, the X table 4 moves in the X axis direction with respect to the pedestal 1, and the amount of movement is determined by the encoder of the servo motor 5. To be detected. Similar to the structure described above, two guide rails are mounted on the X table 4 in parallel with the Y axis, and 7 ball screws are fixed to the X table 4 in a state in which both ends can rotate in parallel with the Y axis. Has been done. At one end of the ball screw 7,
A servo motor with an encoder for the Y table 8 is attached by a coupling (not shown). Further, the nut of the ball screw 7 is fixed to the Y table 9 and the Y table 9 is guided by the guide rail 6 to move by the rotation of the Y table servo motor 8, and the movement amount is determined by the encoder of the servo motor 8. To be detected. The guide rail 2 and the guide rail 6 are positioned orthogonally to each other, and the Y table 9 is moved to XY by the rotation of the servomotors 5 and 8.
It can be moved to any point on the plane. Further, the wafer 10 and the tray 11 are detachably mounted on the Y table 9. To simplify the processing described later, the end of the tray 11 is positioned parallel to the X axis and the Y axis. 12 is
13 with a shaft that integrates a ball screw and spline
Nut A and nut B of 14 are fitted. The nut A13 moves up and down the shaft 12 by rotating an elevator servomotor 15 with an encoder (not shown). The ascending / descending distance can be detected by the encoder of the servomotor 15. The nut B14 can rotate the ball screw spline 12 around its central axis by rotationally driving a servomotor with an encoder for rotation of 16, and the rotation angle can be detected by the encoder of the servomotor 16. The nut A13 is rotatably supported on the mount 1 by a frame (not shown). At the lower end of the ball screw spline 12, a vacuum finger 1 having a tip displaced from the central axis of the ball screw spline 12 is formed.
7 is attached. Vacuum finger 17
Can be moved in the Z-axis direction and rotated about the central axis of the ball screw spline 12 by the servomotors 15 and 16. Reference numeral 18 denotes an ITV camera with a CCD, which can take an area on the wafer 10 into the image processing apparatus 19. Reference numeral 20 denotes a control device of the present chip sorter, which includes the four servo motors, the encoder, and the image processing device 1 described above.
9 is connected via communication, and not only can each motor be rotationally controlled by a required amount, but also four servo motors can be rotationally driven by a required amount based on position information input from the image processing device 19. is there.

FIG. 2 is a block diagram of a chip sorter as an embodiment of the present invention.

In the figure, 28 is a CR in the controller 20.
With T, it is possible to monitor the operating status and display programs. Reference numeral 29 denotes a keyboard, which can be used to input, start, stop, etc. an operation program. The input program and fixed parameters are stored in the ROM 26. Also 2
A RAM 5 is used for temporary storage as various parameters and a working area. Servomotors 5, 8, 15, and 16 with encoders are connected via a servo system interface 23 and a servo output circuit 24, respectively, and their operations can be controlled by a CPU 27.

In the image processing device 19, the input from the CCD camera 18 is image-processed by the CPU 31, and the position of the wafer chip can be calculated. A CRT 34 is capable of monitoring the operating state and displaying a program.
A keyboard 35 is capable of inputting, starting, stopping, and the like of an operation program. The input program and fixed parameters are stored in the ROM 33. Also, 32 is
It is a RAM and is used as temporary storage for various parameters and a working area. 22 is an external monitor.

The communication interface 36 of the image processing device 19 and the communication interface 30 of the control device 20 are connected via a communication cable 21, and the position data of the wafer chip obtained by the image processing and the operation control signal are mutually exchanged. Communication is possible. As the communication means, either bus connection or serial communication can be used.

Next, the structure of the wafer 10 set on the Y table 9 will be described with reference to FIGS.

FIG. 3 is a block diagram of a wafer as an embodiment of the present invention.

In the figure, inside the frame member 10a, a plurality of wafer chips 10c cut in a matrix are attached on the film 10b. Each wafer chip 10c has its own adhesive film 1
It is attached with an adhesive of 0b and can be peeled off by an external force. Reference numeral 10e is a defect mark, and a "x" is given as a defect mark to a chip which is determined to be defective when inspected in the wafer manufacturing process.

FIG. 4 is a view showing a part of a wafer cross section as one embodiment of the present invention.

In the figure, the adhesive film 10b is the frame member 10
The periphery is fixed to a, and the adhesive film 10b is in a state with almost no slack due to tension. 10c
Is one of the wafer chips, and is attached by the adhesive film 10b. Reference numeral 10d denotes a cut portion when the wafer is cut, and each wafer chip 10c is in an independent state by the cutting portion 10d.

Next, the tray 11 set on the Y table 9 will be described with reference to FIGS.

FIG. 5 is an outline view of a tray as an embodiment of the present invention.

In the figure, the tray 11 has a rectangular outer shape and has a plurality of recesses therein. The size of the recess is slightly larger (about +0.3 mm) than the size of the wafer chip, and the wafer chip 10c can be inserted into each recess.

FIG. 6 is a view showing a part of the cross section of the tray according to the embodiment of the present invention, and shows a state in which the wafer chips 10c are accommodated in the tray 11.

Next, the structure of the finger portion of this chip sorter will be described with reference to FIG.

FIG. 7 is a sectional view of a finger portion as an embodiment of the present invention.

In the figure, a vacuum finger 17 is fixed to the lower end of the ball screw spline 12 by a bolt 38, and can be moved up and down and rotated together with the ball screw spline 12. The central portion of the ball screw spline 12 has a hollow structure, and air is drawn through the vacuum pipe 37 and the vacuum hole 17a by the negative pressure generated by the negative pressure generating means (not shown). Can be held at the tip of the vacuum finger 17. By controlling the turning on / off of the negative pressure with the control device 20, the wafer chip 10c can be gripped / released. By the operation of the vacuum finger 17 and the operations of the X table 4 and the Y table 9, one wafer chip 10c is gripped on the wafer 10 and then the vacuum finger 17 is raised.
Next, the vacuum finger 17 is rotated by about 180 °, and the tray 11 on the Y table 9 is lifted by raising and lowering the X table 4, the Y table 9 and the ball screw spline 12.
It is possible to reprint.

Next, the actual operation of the present chip sorter from gripping the chip to opening the chip will be described with reference to FIGS. 8 and 9.

FIG. 8 is a sketch of the X table from above as an embodiment of the present invention.

First, a specific one of the wafer chips 10c on the wafer 10 is imaged by the CCD camera 18, and the finger 17 is rotated by about 180 ° and the tray 11 is rotated.
8 will be described with reference to FIG.

In the figure, the wafer chip 10c is cut and attached to the adhesive film 10b. The area imaged by the CCD camera 18 is represented by 18a. The image processing device 19 uses the known image processing method to set the reference point 5
The position of the wafer chip 10c is obtained by calculating the positions x and y from 0 and the rotation angle θ. The calculated position data (x, y, θ) is transmitted from the image processing device 19 to the control device 20 using the communication means. Control device 20
Controls the rotation angle θ of the vacuum finger 17 by the rotation angle of the rotation servomotor 16 and the movement amount of the XY table by the rotation angles of the servomotors 5 and 8 based on the received position data of x, y, θ. Then, the tray 11 is moved to a position where the wafer chip held by the fingers enters the target concave portion of the tray 11. That is, when θ is 10 °, 1
The fingers of 7 are rotated by 180 ° + 10 ° (190 °) so that the wall of the recess of the tray 11 and the four sides of the wafer chip are parallel to each other.
Just move and position it on the table. By continuously performing the above operations, the plurality of wafer chips 10c attached to the adhesive film 10b of the wafer 10 can be transferred to the tray 11.

The above operation will be described with reference to the flowchart of FIG.

FIG. 9 is a flowchart showing the processing of the transfer operation as an embodiment of the present invention.

In the figure, in step S1, the target wafer chip 10 is placed in the image pickup area 18a of the CCD camera 18.
Move the XY table so that c can be entered, and step S2
At, the target position of the wafer chip 10c is calculated. In step S3, the vacuum finger 17
Is rotated onto the target wafer chip 10c, and in step S4, it is lowered to the extent that the tips of the fingers contact the surface of the target wafer chip 10c.
In step S5, the air in the vacuum hole 17a and the vacuum pipe 37 is started to be drawn, and the predetermined time (that is, the air in the pressure guiding tube is sufficient to hold the target wafer chip 10c by the timer in step S6). Wait for the passage). Then, in step S7, the target wafer chip 10 is attached to the tip of the finger.
Raise the vacuum finger 17 while holding c. In step S8, the vacuum finger 17 is rotated by (180 + θ) ° at an angle corrected for the deviation (chip rotation angle θ) calculated in step S2, and at the same time, in step S9, the target wafer chip 10 of the tray 11 is rotated.
The XY table is moved so that the concave portion in which c is to be stored is located directly below the tip of the finger. Step S10
At step S11, the vacuum finger 17 is lowered while holding the chip, and at step S11, the vacuum finger 17 is stopped. When the timer finishes counting and the chip can be released at step S12, the vacuum finger 17 is moved up at step S13. .

The items to be stored are not limited to wafers,
It is possible to store things arranged with a shift in a tray or the like.

Further, the present invention may be applied to a system composed of a plurality of devices or an apparatus composed of a single device. Needless to say, the present invention can be applied to a case where the present invention is achieved by supplying a program to a system or an apparatus. In this case, the storage medium storing the program according to the present invention constitutes the present invention. Then, by reading the program from the storage medium to the system or device, the system or device can operate in a predetermined manner.

<Effects of Embodiment> (1) Wafer 1 cut on one XY table
0 and a tray 11 for accommodating the wafer chip 10c are mounted, and good / defective and a position of the wafer chip 10c are simultaneously discriminated and calculated from the image data of the CCD camera 18, and the XY table is moved based on the calculated result. By obtaining and moving the correction amount of (1) and the correction amount of the rotation angle of the finger 17 to be gripped, it becomes possible to take in the deviation of the wafer chip 10c, correct the position, and store it. This makes it possible to significantly reduce the occurrence of defective products without chipping of chips. (2) The rotation angle of the fingers is set to about 180 degrees, the wafer 10 and the tray 11 are mounted on the first moving means, and the movement and the correction are performed at the same time, so that the rapid transfer processing is easily realized. This made it possible to reduce the size of the device and make it economically superior. (3) Chips which are cut and have a defective mark are discriminated by an image and sorted by controlling the movements of the X and Y tables, so that the chips are not stored in the tray 11 but left on the adhesive film 10b. It became possible to keep it.

[0061]

As described above, according to the present invention,
It is possible to provide a movable body device having a simple structure and a method of controlling the movable body, which can transfer a cut chip on a wafer to a predetermined target position with high accuracy.

[0062]

[Brief description of drawings]

FIG. 1 is a configuration diagram of a chip sorter as an embodiment of the present invention.

FIG. 2 is a block configuration diagram of a chip sorter as an embodiment of the present invention.

FIG. 3 is a configuration diagram of a wafer as an embodiment of the present invention.

FIG. 4 is a diagram showing a part of a wafer cross section as one embodiment of the present invention.

FIG. 5 is an external view of a tray as an embodiment of the present invention.

FIG. 6 is a diagram showing a part of a tray cross section as one embodiment of the present invention.

FIG. 7 is a sectional view of a finger portion as one embodiment of the present invention.

FIG. 8 is a sketch of the X table from the top as one embodiment of the present invention.

FIG. 9 is a flowchart showing a transfer operation process according to an embodiment of the present invention.

[Explanation of symbols]

 1 Stand 2 Guide Rail 3 Ball Screw 5 Servo Motor with X Table Encoder 4 X Table 7 Ball Screw 8 Servo Motor with Y Table Encoder 9 Y Table 10 Wafer 10a Frame Member 10b Adhesive Film 10c Wafer Chip 10d Cutting Section 10e Bad Mark 11 Tray 12 Ball Screw Spline 12a Finger Rotation Center 13 Nut A 14 Nut B 15 Encoder Elevating Servo Motor 16 Encoder Rotating Servo Motor 17 Vacuum Finger 17a Vacuum Hole 18 CCD Camera 18a CCD Camera Imaging Area 19 Image Processor 20 Control Device 21 Communication cable 22 Monitor 23 Servo system interface 24 Servo output circuit 25 RAM 26 ROM 27 CPU 28 model Ter 29 Keyboard 30 communication interface 31 CPU 32 RAM 33 ROM 35 keyboard 36 for the communication interface 37 Vacuum pipe 38 bolt 50 reference point

Claims (12)

[Claims] 1. A first moving unit capable of moving on an XY plane in a moving body apparatus comprising position measuring means for detecting the position and angle of a work with respect to a reference point, and moving means for moving the work to a target position. Means for gripping the work present on the first moving means,
Second moving means capable of rotating about a Z axis perpendicular to the XY plane and moving parallel to the Z axis; and simultaneously controlling the first and second moving means while holding the workpiece. Then, the moving body apparatus is provided with a control means for moving the work to the target position located on the first moving means. 2. The target position is located parallel to the X-axis and the Y-axis, and the second moving means corrects the angle of the workpiece with respect to the reference point at the same time,
The mobile device according to claim 1, further rotating by 180 degrees. 3. The mobile device according to claim 1, wherein the position measuring unit includes an image capturing unit that captures the work, and an image processing unit that processes the captured image data. 4. The moving body apparatus according to claim 1, wherein the position measuring means is provided above a fixed point on the XY plane for gripping the work by the second moving means. 5. The movable body apparatus according to claim 1, wherein the work is a plurality of wafer chips that are cut into a matrix and are attached to an adhesive film. 6. When the position and the angle are calculated by the position measuring means, the premarked wafer chips are also identified at the same time, and whether or not the second moving means holds the wafer chip is determined according to the result. The mobile device according to claim 5, which is characterized in that: 7. A method of controlling a moving body apparatus, comprising: a position measuring step of detecting a position and an angle of a work with respect to a reference point; and a moving step of moving the work to a target position, wherein the work is moved on an XY plane. A first moving step; a second moving step of holding the work, rotating about a Z axis perpendicular to the XY plane, and moving in parallel to the Z axis; A method of controlling a moving body apparatus, wherein the first and second moving steps are performed simultaneously, and the work is moved to the target position that moves following the first moving step. 8. The target position is located parallel to the X-axis and the Y-axis, and the second moving step corrects the angle of the workpiece with respect to a reference point at the same time,
The method for controlling a mobile device according to claim 7, further comprising rotating 180 degrees. 9. The method for controlling a mobile device according to claim 7, wherein the position measuring step includes an image pickup step of picking up the work, and an image processing step of processing the picked-up image data. 10. The method for controlling a moving body apparatus according to claim 7, wherein the position measuring step is performed above a fixed point on the XY plane that grips the workpiece in the second moving step. 11. The method of controlling a moving body apparatus according to claim 7, wherein the work is a plurality of wafer chips that are cut in a matrix and are stuck on an adhesive film. 12. When the position and the angle are calculated by the position measuring step, the pre-marked wafer chips are also identified at the same time, and whether or not the wafer chip is gripped in the second moving step is determined according to the result. The method for controlling a mobile device according to claim 11, which is characterized in that.