CN109616427B - Semiconductor material attachment method - Google Patents
Semiconductor material attachment method Download PDFInfo
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- CN109616427B CN109616427B CN201811074331.4A CN201811074331A CN109616427B CN 109616427 B CN109616427 B CN 109616427B CN 201811074331 A CN201811074331 A CN 201811074331A CN 109616427 B CN109616427 B CN 109616427B
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- 239000000463 material Substances 0.000 title claims abstract description 162
- 239000004065 semiconductor Substances 0.000 title claims abstract description 161
- 238000000034 method Methods 0.000 title claims abstract description 87
- 239000011159 matrix material Substances 0.000 claims abstract description 14
- 230000008569 process Effects 0.000 claims description 36
- 238000004544 sputter deposition Methods 0.000 claims description 36
- 230000000007 visual effect Effects 0.000 claims description 24
- 230000002159 abnormal effect Effects 0.000 claims description 5
- 238000003384 imaging method Methods 0.000 claims description 5
- 238000007689 inspection Methods 0.000 description 33
- 239000011295 pitch Substances 0.000 description 31
- 235000012431 wafers Nutrition 0.000 description 24
- 239000000853 adhesive Substances 0.000 description 16
- 230000001070 adhesive effect Effects 0.000 description 16
- 239000000758 substrate Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 9
- 238000012546 transfer Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 238000011179 visual inspection Methods 0.000 description 3
- 238000012935 Averaging Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005477 sputtering target Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/80001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by connecting a bonding area directly to another bonding area, i.e. connectorless bonding, e.g. bumpless bonding
- H01L2224/8012—Aligning
- H01L2224/80121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
- H01L2224/80122—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors by detecting inherent features of, or outside, the semiconductor or solid-state body
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- Condensed Matter Physics & Semiconductors (AREA)
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Abstract
The present invention relates to an attaching method of a semiconductor material attaching device that can quickly and accurately correct a positional error of an attaching position in attaching a semiconductor material. The present invention is characterized in that a vision or a table is moved by an interval calculated from matrix information of an attachment region to which a material detected within a view angle of a vision unit is attached, and a plurality of images of each target attachment region at mutually different positions are acquired, and the positions of the target attachment regions are judged from the images.
Description
Technical Field
The invention relates to a semiconductor material attachment method. In more detail, the present invention relates to a method of attaching (Semiconduct or Device Attaching Method) a semiconductor material attaching device that improves inspection accuracy by accurately detecting an attaching position of a semiconductor material.
Background
In the semiconductor material attaching apparatus, the individualized semiconductor material must first accurately grasp a preset attachment position of the attachment object in order to attach the attachment object for a subsequent process.
Such attachment means may be an adhesive means for adhering a plurality of semiconductor materials to a substrate, or may be an attachment means for attaching to a tape for other subsequent processes. And, it may be an attaching means attaching the semiconductor material to the tape so as to receive a spherical surface of the semiconductor material in the tape perforated with the semiconductor material for electromagnetic compatibility (EMI) sputtering for shielding electromagnetic waves.
In particular, in the attachment device for electromagnetic compatibility sputtering, when attaching a semiconductor material on a tape, it is necessary to accurately detect the position of the hole of the tape and attach at the correct position to be able to accommodate the spherical surface (bump) of the semiconductor material at the portion where the hole is formed, thereby protecting the bump from the electromagnetic wave shielding material. If the semiconductor material does not adhere to the correct location of the hole, the portion passing through the leak is also sputtered to the bump of semiconductor material, thereby adversely affecting the electrical characteristics of the semiconductor material.
Therefore, since the optical offset values (X-axis, Y-axis, Z-axis) caused by the vision camera for detecting the attachment stage or position are reflected in the accuracy by the positional errors on the plane, the positional errors of the offset on the θ -axis, or the like, it is very important to accurately detect a plurality of attachment positions on the attachment object for the attachment process.
In order to solve these problems, when each attachment position is photographed by the vision unit at the upper part of the attachment position, respectively, a plurality of times for accuracy judgment of one attachment position, only a lot of time can be consumed in accuracy inspection.
On the other hand, in recent years, semiconductor process performance has been improved, high-speed, high-resolution cameras have increased, and the size of semiconductor materials has gradually tended to become smaller, and therefore, the number of materials entering into the field of view (FOV) has increased.
Therefore, although all materials entering into the angle of view are inspected one by one in order to improve productivity, mechanical error values of the attachment table and the vision camera have to be reflected in accuracy.
Disclosure of Invention
In order to solve the above-mentioned problems, the present invention provides an attaching method of a semiconductor material attaching device capable of rapidly and accurately detecting an attaching position of a semiconductor material.
In order to solve the above-described problems, the present invention may provide a semiconductor material attaching method of a semiconductor material attaching device having a circuit substrate formed with a bonding region where a plurality of semiconductor materials are bonded, a stage for placing the circuit substrate, and a vision unit for photographing the bonding region of the circuit substrate, the semiconductor material attaching method including: a first photographing step of photographing a target bonding region to be bonded of the semiconductor material and a plurality of adjacent bonding regions with a single lens (shot) using the vision unit; a step of transferring the vision unit or the table at intervals calculated from matrix information of the bonding region entering the viewing angle of the vision unit so that the target bonding region enters another position within the viewing angle of the vision unit after the target bonding region is photographed; a second photographing step of photographing the target adhesion region by using the vision unit in a state that the vision unit or the table is transferred at the calculated interval; a step of obtaining a plurality of images of the target bonding areas in different positions from each other in the view angle of the vision unit by repeating the transferring step and the second photographing step a plurality of times; and determining the position of the target bonding region from the acquired images of the plurality of target bonding regions.
In order to solve the above-described problems, the present invention provides a semiconductor material attaching method of a semiconductor material attaching device having a tape formed with a plurality of through holes for accommodating bumps of a semiconductor material and attached to a template for a sputtering process of the semiconductor material, a stage for placing the tape, and a vision unit for photographing the through holes of the tape, the semiconductor material attaching method including: a first photographing step of photographing a target through hole in which the bump of the semiconductor material is to be accommodated and a plurality of adjacent through holes with a single lens (shot) using the vision unit; a step of transferring the vision unit or the table by taking the image of the target through hole and calculating an interval from the matrix information of the through hole entering the view angle of the vision unit so that the target through hole enters another position within the view angle of the vision unit; a second photographing step of photographing the target through hole by using the vision unit in a state that the vision unit or the table is transferred at the calculated interval; a step of obtaining a plurality of images of the target through holes at different positions from each other in the view angle of the vision unit by repeating the transferring step and the second photographing step a plurality of times; and determining the position of the target through hole from the acquired images of the plurality of target through holes.
In this case, the first photographing step and the second photographing step are repeated for a plurality of times at the respective positions, and the positions can be determined using the average value of the plurality of position values obtained by the repeated photographing.
When a specific abnormal position value is found from among the position value of the first photographing step and the position values obtained by repeating the plurality of second photographing steps, the corresponding data is filtered, and when different deviations occur in each of the position value of the first photographing step and the position values obtained by repeating the plurality of second photographing steps, recalibration or regarding the corresponding position value as bad can be performed.
In the second photographing step, the target bonding region may be photographed while shifting an interval of M/2 columns when M is an even number, the target bonding region may be photographed while shifting an interval of (m+1)/2 columns when M is an odd number, the target bonding region may be photographed while shifting an interval of N/2 columns when N is an even number, and the target bonding region may be photographed while shifting an interval of (n+1)/2 columns when N is an odd number.
In the second photographing step, the through holes entering the view angle of the vision unit may be formed in M rows×n columns, the M, N may be an integer, the target through holes may be photographed while shifting an M/2 column interval when M is an even number, the target through holes may be photographed while shifting an (m+1)/2 column when M is an odd number, the target through holes may be photographed while shifting an N/2 column interval when N is an odd number, and the target through holes may be photographed while shifting an (n+1)/2 column interval when N is an odd number.
The target bonding area may be photographed by the vision unit while moving a pitch interval along with the vision unit or the table.
The target through hole may be photographed by the vision unit while moving a pitch interval along with the vision unit or the stage.
In the step of acquiring a plurality of images in which the target adhesion regions are located at different positions, the images may be acquired by capturing images with the vision unit at intervals calculated so that the images of the target adhesion regions located at the upper left, upper right, lower left and lower right with respect to the center of the vision unit may be acquired.
In the step of acquiring a plurality of images of the target through hole at different positions, the images are acquired by the vision unit while moving the vision unit or the table at intervals calculated so that the images of the target through hole at the upper left, upper right, lower left and lower right with respect to the center of the vision unit can be acquired.
In the visual unit photographing step, the template may have a plurality of through holes larger than the through holes of the tape in positions corresponding to the through holes of the tape, and the tolerance between the through holes of the template and the through holes of the tape may be obtained by extracting images of the outer periphery of the through holes of the template and the outer periphery of the through holes of the tape, and it may be confirmed whether the obtained tolerance is within an initial setting range.
The template has a plurality of through holes larger than the through holes of the tape at positions corresponding to the through holes of the tape, and after the bumps of the semiconductor material are accommodated in the through holes of the tape, the adhesion state of the semiconductor material can be inspected by comparing the tolerance between the through holes of the template and the through holes of the tape with the positions of the bumps of the semiconductor material.
According to the attaching method of the semiconductor material attaching device of the present invention, even if the semiconductor material of the semiconductor chip or the like and the size of the attaching position (circuit board, tape) to which the semiconductor material is to be attached are miniaturized, the position error of the attaching position can be accurately judged, and the accuracy can be improved.
Further, according to the semiconductor material attaching method of the present invention, since a plurality of attachment positions are arranged in the view angle of the vision unit and positions of the target attachment positions therein are arranged at mutually different positions in the view angle, the positional error of the target attachment positions is determined by the plurality of captured images, and thus the accuracy of the determination of the positional error can be improved.
Further, according to the semiconductor material attaching method of the present invention, as moving at the optimum pitch interval calculated from the matrix information of the attached object detected in the angle of view, and by the superimposed images acquired in the respective inspections, the image information detected by one target attached position in the respective other positions of the upper left, lower right, lower left and lower right with respect to the center of vision is acquired, and therefore, not only the multi-lens effect for one target attached position but also defects in mechanical, imaging, positional properties at the time of visual inspection can be eliminated, and thus defective images can be reduced and reliable image information can be acquired.
Also, according to the semiconductor material attaching method of the present invention, in the case where the number of attachment objects (materials) detected in the view angle increases due to the small size of the semiconductor material, the vision is moved at the optimum pitch interval calculated from the matrix information of the attachment objects detected in the view angle so that the vision inspection positions are made different, whereby the vision inspection speed can be shortened to increase the Unit Per Hour (UPH).
And, all attachment positions detectable within the angle of view are checked and detected by overlapping the checked target attachment positions between the lenses, whereby a multi-lens effect for one material can be achieved, and an average value can be found for a plurality of positions detected by the multi-lens and an accurate position value can be calculated, whereby a mechanical error value can be confirmed and the influence of the error value can be eliminated.
When the detected photographed images of the plurality of lenses have a poor photographed value at a specific position, the corresponding data is used by filtering, or when the specific position value is repeatedly abnormal, it can be judged that there is a problem with the image surface (illuminance) at the specific position, and therefore, by reflecting the problem, an accurate position value is calculated, or when different deviations are generated from all the images of the plurality of lenses, the corresponding position is recalibrated or considered as bad and is excluded in the subsequent process, so that the bad phenomenon can be prevented in advance.
Further, according to other embodiments of the attaching method of the semiconductor material attaching device of the present invention, the offset inspection and the post-adhesion inspection (PBI, post Bonding Inspection) of the material may also be performed.
Drawings
Fig. 1 is a plan view showing an attachment object having a plurality of attachment positions to which semiconductor materials are attached in a first embodiment of the present invention.
Fig. 2 is a view showing a state in which the vision unit photographs an attachment position before an attachment process in the first embodiment of the present invention.
Fig. 3 is a view showing a process in which an attachment table for placing a vision unit and an attachment object is relatively moved, and a plurality of images including the target attachment position are photographed in a state of being arranged at mutually different positions in the first embodiment of the present invention.
Fig. 4 is a view showing an image in which a target attachment position among a plurality of images photographed by the vision unit of fig. 3 is overlapped in the first embodiment of the present invention.
Fig. 5 is a cross-sectional view showing a state in which a die plate member to which a sputtering tape for a sputtering process is attached to a semiconductor chip of a Ball Grid Array (BGA) system, which is a sputtering target, in the attachment hole.
Fig. 6 is a view showing a state in which a vision unit of the semiconductor material attaching device according to the second embodiment of the present invention photographs an adhesive region before an attaching process.
Fig. 7 is a view showing a process in which a wafer table for placing a vision unit and a wafer of a semiconductor material attaching device according to a second embodiment of the present invention is relatively transferred, and a plurality of images including a target bonding region are photographed in a state in which the target bonding region is arranged at different positions from each other.
Fig. 8 is a view showing an image in which target adhesion areas among a plurality of images photographed by the vision unit of fig. 7 are overlapped in the second embodiment of the present invention.
Fig. 9 is an image of a vision unit of a semiconductor material attaching device according to a second embodiment of the present invention photographing and overlapping an adhesive region while moving in an X-axis direction at a calculated pitch interval before an attaching process.
Description of the reference numerals
100: attachment object 100': wafer with a plurality of wafers
110: attachment location 110': adhesive region
tap: target attachment location (target adhesive location)
200. 200': visual unit
fov: viewing angle
sp: semiconductor chip
Detailed Description
Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein, but can be embodied in different manners. Rather, the embodiments described herein are provided so that this disclosure will be thorough and complete, and so that the concepts of the invention will fully convey the scope of the invention to those skilled in the art to which the invention pertains. Like reference numerals refer to like elements throughout the specification.
Fig. 1 is a plan view showing an attachment object 100 having a plurality of attachment positions 110 by picking up and attaching a semiconductor material according to a semiconductor material attaching apparatus (attaching device) having an attachment unit of a first embodiment of the present invention, and fig. 2 is a state in which a vision unit 200 in the first embodiment of the present invention is photographed in order to judge a position error of the attachment position 110 before an attaching process.
The semiconductor material attaching device used in the semiconductor material attaching method of the present invention is, for example, an adhesive device that adheres a semiconductor material to be adhered to a substrate, or an attaching device that attaches a semiconductor material to a tape for a subsequent process. The present invention is not limited to this, and may be applied to a case where a semiconductor material is attached to the attachment object 100 in a semiconductor process, although a semiconductor material attaching device used for adhering or attaching a semiconductor material to the sputtering component S to which the sputtering tape t is attached in the sputtering process may be used.
The semiconductor material attaching method of the present invention can be broadly divided into a first attaching method for bonding a semiconductor material to a substrate or wafer and a second attaching method for attaching a semiconductor material to a tape.
First, the semiconductor material attaching device used in the first attaching method of the present invention includes: a circuit substrate formed with an adhesion region for adhering a plurality of semiconductor materials; the workbench is used for placing the circuit substrate; and a vision unit that photographs a target bonding region to which the semiconductor material is to be bonded and a plurality of adjacent bonding regions in a single lens (shot) and photographs a plurality of times such that the target bonding region is detected in other positions through the plurality of lenses, the semiconductor material attaching apparatus being characterized in that the circuit substrate and the vision unit are movable by relative movement, the vision unit moves and photographs the bonding regions at pitch intervals calculated from matrix information of an attached object detected in the view angle fov.
Here, the circuit board may be a rectangular board or a wafer.
In the present invention, the circuit substrate and the vision unit can be moved and photographed by means of relative motion. In this case, the visual unit may be fixed in a state where the circuit board and the visual unit are provided so as to be movable in the X-axis and Y-axis directions, whereas the circuit board may be fixed in a state where the visual unit is provided so as to be movable in the X-axis and Y-axis directions, and the circuit board may be movable in the X-axis (or Y-axis) direction, and the visual unit may be provided so as to be movable in the Y-axis (or X-axis) direction, so that the circuit board and the visual unit perform imaging with the relative movement in the respective uniaxial directions.
This structure can be appropriately modified and utilized according to the structure of the worker and the equipment.
In the present invention, detecting the target bonding region at other positions through a plurality of lenses by photographing a plurality of times may refer to the target bonding region (attachment region) located respectively at the upper left, lower right and lower right with respect to the viewing angle into the vision unit, that is, photographing a plurality of times by the relative movement of the vision unit and the circuit substrate such that the target bonding region is located near the upper left (upper left), lower right (upper right), lower left (lower left) and lower right (lower right) with respect to the vision center with respect to the same target bonding region, and the position of the target bonding region can be accurately detected by these images.
The semiconductor material attaching device used in the second attaching method of the present invention includes: a tape which is formed with a plurality of through holes for accommodating the bumps of the semiconductor material and is attached to the template for a sputtering process of the semiconductor material; a table for placing the tape; and a vision unit that photographs a target through hole to be inspected and a plurality of adjacent through holes among the plurality of through holes with a single lens, and that photographs a plurality of times so that the target through hole is detected at other positions via the plurality of lenses, the semiconductor material attaching device being characterized in that the stage and the vision unit are provided so as to be movable with respect to each other, the vision unit photographing the through holes at a pitch interval calculated from matrix information of an attaching object detected within a viewing angle.
In the semiconductor material attaching device used in the first attaching method and the second attaching method of the present invention, when the target adhesion region or the target through hole is detected at another position by photographing a plurality of times with the vision unit via the plurality of lenses, photographing may be repeated two or more times at each position. When photographing is repeated two or more times at one position, the influence of vibration applied to the apparatus due to the apparatus driving or external factors can be eliminated, and thus an accurate position value with more reliability can be obtained.
In recent years, the size of semiconductor materials such as semiconductor chips has been miniaturized, and in the case of attaching the semiconductor materials to the attachment object 100 (circuit board or tape), the accuracy of the attaching process has been demanded due to the miniaturization of the size of terminals and the like of the board.
As described above, in order to precision of the attaching process, the semiconductor material attaching device of the semiconductor material generally has the vision unit 200 for extracting the image including the attaching position 110 by photographing the target attaching position 110 (target bonding area or target through hole) to which the semiconductor material is to be attached, and before attaching the semiconductor material to the attaching object 100, the control part of the semiconductor material attaching device moves the vision unit 200 or the attaching table by a preset standard value and photographs the target attaching position. At this time, even if a preset standard value is moved, an error may occur in the viewing angle of the vision unit according to each working position due to the deviation (straightness), flatness (flatness), rolling (pitching), yaw (yawing)) of the X-axis, Y-axis, and Z-axis of the vision unit or the attachment table, and a problem of a visual inspection error and an incorrect adhesion of the semiconductor material may be caused due to a mechanical error or a variable of an external environment.
Therefore, when inspecting semiconductor material entering into the viewing angle, different error values may be generated according to the inspection position or the inspection area within the viewing angle area inspected with mechanical error values, so that the average error value can be ensured by multi-position inspection in the present invention.
Therefore, if the average or compensation value of the plurality of offsets detected for each position is obtained, the influence of errors generated in the mechanical portion can be reduced and the accuracy can be ensured.
The inspection method of the present invention is useful especially when the visual inspection is not performed with respect to correction due to the absence of a reference value (reference) or a reference value (reference). The position error of the target attachment position is repeatedly obtained, and the compensation value of the error value detected for each position is calculated, and the obtained compensation value is used, so that the error generated in the mechanical part can be eliminated.
Here, the target attachment position refers to a target attachment position to which the semiconductor material is to be attached, among a plurality of attachment positions to which the semiconductor material is to be attached, in a specific order, through the attachment unit, and the plurality of attachment positions may potentially be target attachment positions. In the present invention, the target attachment position may be referred to as a target adhesive region or a target through hole.
Recently, since the size of semiconductor materials is gradually becoming smaller due to improvement of pixels, resolution, viewing angle of a lens, or the like of an image device or the like constituting the vision unit 200, the number of materials entering into the viewing angle is increasing, and thus a method of precisely detecting a wide area using vision is continuously being developed.
Conventionally, when the target attachment position is photographed by the vision unit 200 in order to determine the position error of the attachment position for attaching the semiconductor material, a method of determining the position error of the target attachment position by photographing a plurality of times in a state where one target attachment position is disposed at the center portion within one angle of view fov is used due to a deviation in quality of the photographing result, but there is a possibility that the factors such as the direction of light and shadow are not easily changed during photographing, and thus an image for accurately determining the position error cannot be obtained even if the same target attachment position is photographed a plurality of times. And, as each target attachment position is photographed a plurality of times, respectively, considerable time is consumed in checking many target attachment positions a plurality of times.
However, the semiconductor material attaching device of the present invention inspects all semiconductor materials that enter into the viewing angle fov of the vision unit, and can further improve accuracy and reliability by utilizing the multi-lens of the inspection overlapped in a state of shifting each pitch. That is, the present invention photographs a target attachment position to be inspected and a plurality of adjacent attachment positions with a single lens, and photographs a plurality of times as each pitch is moved, so that the target attachment position can be detected via the plurality of lenses on other positions (left upper part, right upper part, left lower part, and right lower part centering on the visual center), so that the irradiation surface and the working position are changed at the time of photographing, the same detection error can be eliminated, and inspection with reliability can be realized.
Accordingly, in order to accurately judge the position error of the target attachment position 110, the semiconductor material attachment apparatus of the present invention may include a vision unit 200 that photographs the target attachment position to be inspected and the adjacent plurality of target attachment positions in the above-described attached object 100 in a single lens and photographs a plurality of times so that the target attachment position is detected at other positions via the plurality of lenses, and that moves a distance equivalent to a pitch calculated from matrix information of the attached object detected in the angle of view and photographs so that the above-described target attachment position is detected at other positions via the plurality of lenses, and thus, an overlapping image of the inspected attachment position between the lenses may be acquired, whereby an accurate position value may be calculated between the target attachment positions.
Hereinafter, as a semiconductor material attaching device according to a first embodiment of the present invention, description is made with reference to fig. 1 to 5. The first embodiment will be described with reference to a second attaching means for attaching a semiconductor material in a tape.
The attachment target may be a circuit board or a wafer, or may be a ring frame to which a tape is attached, or may be a sputtering member or a template member to which a sputtering tape used in a sputtering process of a semiconductor material is attached, but may be referred to as a tape 100 in fig. 1. In the tape, the plurality of through holes 110 may be configured in a plurality of columns and rows. Here, the tape is a sputtering tape used in a sputtering process of a semiconductor material, is attached to a sputtering member or a template for supporting the tape, and can be supplied in a state of being placed on a tape table.
As shown in the drawing, 4 through holes 110 are photographed in the view angle fov of the vision unit 200 of the semiconductor material attaching apparatus according to the first embodiment of the present invention, and 4 through holes 110 are photographed together included in one photographed image.
In the above through hole, in a state where the spherical surface (bump) of the semiconductor material is accommodated, the frame portion of the semiconductor material is attached to the tape. The through holes 110 photographed by the vision unit may be configured with 4 in the view angle of the vision unit 200 as shown in fig. 2, and as each pitch is moved and the through holes are photographed by a method of moving one of the vision units 200 or a table for placing a tape, the through holes are overlapped between the respective lenses to perform inspection, meaning that photographing in such a manner that one through hole is detected in other positions through a plurality of lenses is possible.
That is, when the image of the target through hole is inaccurate due to the presence of foreign matter, interference, light direction, shadow, or the like, vibration generated in the device, or the like, the position error information of the target through hole is accurately determined by photographing after transferring the image so as to change the position of the target through hole within the angle of view shown in fig. 2.
For example, the position error is determined by averaging the position errors of the target through holes from a plurality of images, or an image having a particularly large error value is regarded as an error generated during photographing and is excluded or filtered, and only good data is used as judgment data of the position error.
In the first embodiment of the present invention, the angle of view of the vision unit can detect images of 4 through holes with 2 rows by 2 columns of single lenses, and thus, images overlapped per one shift are acquired, but the photographing interval may be different according to matrix information of the through holes once entering the angle of view of the vision unit.
Fig. 3 is a view showing a vision unit 200 of the semiconductor material attaching apparatus and a stage transfer on which the tape 100 is placed according to the first embodiment of the present invention, and a process of capturing a plurality of images including the target through-holes tap formed in the tape in a state where the target through-holes tap are arranged at mutually different positions.
As a method for changing the position of the target through-hole tap in the angle fov of the vision unit 200, at least one of the stage and the vision unit 200 may be transferred on the X-Y plane.
One mechanism of the table and the vision unit 200 may be configured to be movable on an X-Y plane, but the vision unit 200 may be movable in an X-axis (or Y-axis) direction, and the table may be movable in a Y-axis (or X-axis) direction, so that the vision unit and the table can move relative to each other.
In the embodiment shown in fig. 3, the case where the above-described vision unit 200 is capable of X-axis transfer and the attaching table on which the above-described tape 100 is placed is capable of Y-axis transfer is exemplified.
Fig. 3 is a view showing a process of photographing the target through-holes tap while changing the positions of the target through-holes tap according to the transfer of the vision unit 200 or the table in the case where the target through-holes tap are photographed as 4 in 2 rows and 2 columns within the view angle fov of the vision unit 200, and fig. 4 is a view showing an image in which a plurality of images photographed in fig. 3 are overlapped centering on the target through-holes 110.
Fig. 3 (a) shows a state in which the target through hole tap is disposed at the right lower portion in the initial condition, fig. 3 (b) shows a state in which the vision unit 200 is transferred to the right in the X-axis direction and the target through hole tap is displaced to the left lower portion in the state shown in fig. 3 (a), fig. 3 (c) shows a state in which the attachment table is transferred to the lower direction in the Y-axis direction and the target through hole tap is displaced to the left upper portion in the state shown in fig. 3 (b), and fig. 3 (d) shows a state in which the vision unit 200 is transferred to the left in the X-axis direction and the target through hole tap is displaced to the right upper portion in the state shown in fig. 3 (c).
That is, when this is expressed in terms of coordinates, the effect that the coordinates of the target attachment hole tap in fig. 3 (a), 3 (b), 3 (c), and 3 (d) move to 4 coordinates of (1, 2), (1, 1), (2, 1), and (2, 2) is obtained when the position coordinates of the lower left part in the view angle are assumed to be (1, 1).
Referring to fig. 2 to 4 as a first embodiment of the present invention, in the case where the viewing angle of the vision unit is 2 rows×2 columns, photographing is performed every 1 pitch movement, and a multi-lens effect of 4 times per target through-hole can be provided by overlapping the respective through-holes. If the viewing angle of the vision unit is 3 rows×3 columns due to the smaller size of the material to be attached, overlapping by the respective through holes at the time of photographing every 1 pitch movement may have a multi-lens effect of 9 times per target through hole.
As described above, in the present invention, since one target through hole tap is arranged at a different position from each other in one view angle, preferably at 4 positions (upper left, lower right, lower left and lower right) on the upper, lower left and right sides with respect to the visual center, the accuracy of the determination of the position error can be improved when the position error of the target through hole is determined by acquiring a plurality of images and taking this as a reference.
That is, when a plurality of images are photographed in a state where the target through holes 110 are arranged at the same position inside the viewing angle, there is a high possibility that the influence of foreign matter, light quantity, direction of light, shadow, or the like is also large, but when a plurality of through holes 110 are photographed together in the viewing angle of the vision unit 200, as shown in fig. 3, the position of the target through hole tap can be changed in the viewing angle of the vision unit 200, and a more accurate position of the target through hole can be judged by a plurality of images including the target attachment position tap.
As shown in fig. 4, the relative positions of the above-mentioned target through holes tap are different from each other in total 4 photographed images, but errors reflected in the respective images are comparatively analyzed by photographing the positions of the target through holes 110 arranged at the positions different from each other, and the positional errors can be modified and attached in the process of attaching the semiconductor material.
Therefore, in the above example, the vision unit 200 may capture the 2 rows by 2 columns of the through holes 110 with one image, and the vision unit may acquire 4 images of the target through holes 110 in a state of being disposed at the respective 4 positions of the 2 rows by 2 columns and compare their positions with the set standard values, thereby acquiring 4 position error values. In some of the position error values, particularly when the value obtained at a specific position is out of the error range or an error occurs, the value is regarded as an error generated by external factors such as uneven driving or detection surface of the device or particles at the time of photographing at the corresponding position, and the corresponding position value is filtered and used. If the 4 position error values are all deviated, the inspection is performed again or considered to be problematic in the corresponding positions, and the subsequent semiconductor material adhesion is omitted in the corresponding positions, so that the material waste and the defects can be minimized.
In summary, a method of attaching a semiconductor material according to a first embodiment of the present invention includes: a visual unit photographing step of photographing with a visual unit in a state of being disposed within a viewing angle of the visual unit, a target through hole (bonding region) to which a semiconductor material is to be attached and an attachment target through hole (bonding region) adjacent to the target through hole (bonding region); a target transfer step of transferring the target through hole (adhesive region) to another position within the view angle of the vision unit; a position error determination step of determining a position error of the target through hole (adhesion region) by the image captured in the visual unit capturing step; and a semiconductor material attaching step of attaching the semiconductor material based on a result of the determination of the position error determining step, wherein the vision unit photographing step and the target transfer step are repeatedly performed a plurality of times, and the position error determining step determines a position of the target through hole (adhesive region) by averaging position values of a plurality of images obtained based on a plurality of images photographed in the vision unit photographing step, thereby improving accuracy of position determination and attaching the semiconductor material accurately.
In this case, an average of a plurality of position values obtained by repeating the vision unit imaging step a plurality of times is calculated, and the position value can be set as the position value, and the position error value can be calculated from the position values, and the position compensation value can be obtained from this.
On the other hand, when a specific abnormal position value is found among a plurality of position values obtained by repeating the vision unit photographing step a plurality of times, the corresponding value can be filtered, and when the specific position value is repeatedly abnormal, it can be known that the image surface (illuminance) at the specific position is problematic, and therefore, by reflecting this, an accurate position value is calculated, and when a deviation occurs among the plurality of values, the corresponding position value can be rechecked or regarded as defective.
Fig. 5 is a sectional view showing attachment holes of a stencil member S to which a sputtering tape t for a sputtering process is attached according to a first embodiment of the present invention and a state of a semiconductor chip of a solder ball array package type to which a semiconductor material as a sputtering target is attached through the above-described attachment holes by the semiconductor material attaching device according to the first embodiment of the present invention.
As described above, the semiconductor material is a Ball Grid Array (BGA) type semiconductor material having Ball electrodes on the bottom surface, the tape 100 is a stencil member S to which a sputtering tape t for a sputtering process of the semiconductor material is attached, and the through holes 110 may be a plurality of holes formed so as to penetrate the Ball electrode surfaces of the semiconductor material formed together with the sputtering tape t and the stencil member S.
The template member and the sputtering tape t are formed with holes th, sh in the corresponding positions shown in part (a) of fig. 5, and with through holes as target attachment positions 110. Holes formed in the above-mentioned stencil member and the above-mentioned sputtering zone t are formed in the corresponding positions and through holes are formed, but leakage from gaps formed in the holes of the zone during the sputtering operation and sputtering on the spherical surface of the material are prevented by making the size of the holes formed in the sputtering zone t smaller, and contamination of the stencil member by the leaked sputtering deposition agent is prevented.
In a sputtering process of a semiconductor material of Ball Grid Array (BGA) type, in order to prevent a Ball electrode or a Ball electrode surface on a lower surface of a semiconductor chip from being sputtered, a through hole is formed in a sputtering tape t coated with an adhesive substance, a bottom surface frame of the semiconductor chip is attached to a periphery of the through hole, and the Ball electrode is allowed to be exposed downward through the through hole.
That is, as shown in part (b) of fig. 5, it is preferable that the size of the above-mentioned semiconductor chip is larger than the size of the through hole of the sputtering belt so that the spherical bump of the lower face of the semiconductor chip is not sputtered and the frame portion of the semiconductor chip is easily attached in the sputtering belt. A plurality of through holes slightly larger than the belt holes are provided in the sputtering component at positions corresponding to the through holes of the belt, and the through holes of the sputtering component and the through holes of the belt are rectangular openings. The thickness of the sputtering component is substantially the same as or slightly thicker than the thickness of the bump of the semiconductor chip.
On the other hand, in the present invention, when the semiconductor chip is attached in the hole of the tape, the hole of the tape cannot be detected because the size of the semiconductor chip is larger than the size of the tape. For this reason, after the semiconductor material is attached, when the attached material is lifted, both the frame of the template and the frame of the sputtering belt can be detected, so that by extracting the peripheries of the template and the belt, respectively, their tolerances can be detected and re-inspection can be performed. Further, bumps of the semiconductor chip are inspected together from the periphery of the die plate, so that post-bonding automatic inspection (PBI, post Bonding Inspection) can also be realized.
In the visual unit photographing step, a tolerance between the through hole of the template and the through hole of the strap is obtained by extracting images of the periphery of the through hole of the template and the periphery of the through hole of the strap, and whether the obtained tolerance is within an initial setting range is confirmed. When the band-pass hole is within the range within the initially set range, it can be judged whether or not the band-pass hole is appropriate in the through hole of the template. When the through hole is out of the initial setting range, the belt through hole in the through hole of the template is bad or is in the condition of visual shooting error, so that the inspection is rechecked. After the re-inspection, when the tolerance of the through hole and the through hole with the template is improper, it is regarded as bad, and the semiconductor material is not adhered in the through hole.
After the semiconductor material is attached to the through holes of the tape, the post-bonding automatic inspection (PBI, post bonding inspection) of the attached state of the semiconductor material can be performed by comparing the tolerance between the through holes of the template and the through holes of the tape with the positions of the ball electrodes of the semiconductor material. When performing automatic inspection after welding or when pre-extracting the periphery of the template and the belt, the brightness during inspection is adjusted by using compound illumination, so that a clearer image can be obtained.
Hereinabove, the semiconductor material attaching device according to the first embodiment of the present invention is described with reference to fig. 1 to 5, but hereinafter the semiconductor material attaching device according to the second embodiment of the present invention is described with reference to fig. 6 to 9.
The second embodiment of the present invention is an optimal inspection method in which, when a plurality of attachment areas enter into the viewing angle of the vision unit because the size of the material to be bonded is small, as described in the first embodiment, images for the respective bonding areas are sequentially moved by each pitch and images are acquired, which requires a lot of inspection time, and thus images can be sequentially moved and acquired at intervals of pitches calculated from the matrix information of the bonding areas where the material is bonded.
For reference, the attaching method of the second attaching means for attaching the semiconductor material in the tape is described in the first embodiment, but in the second embodiment, the attaching method of the first attaching means for bonding the semiconductor material in the wafer 100' is pre-exemplified.
In the first embodiment, the attached objects of 2 rows by 2 columns are detected with a single lens in the angle of view fov of the visual unit, but in the second embodiment, the case where the attached objects of 3 rows by 3 columns are detected with a single lens is shown. The duplicate of the first embodiment is omitted.
As shown in fig. 6, 9 bonding regions 110' are photographed in 3 rows×3 columns within the viewing angle fov of the vision unit 200' of the semiconductor material attaching device according to the second embodiment of the present invention, and 9 bonding regions 110' are included in one photographed image to be photographed together.
In the above-described bonding region 110', accurate electrical connection is made between the wafer (or substrate) and the chip (material) at the position where the respective semiconductor chips or semiconductor materials are attached, and therefore, in order to precisely and accurately bond, it is important to detect accurate positional information of the bonding region (attachment position). However, as described above, when the respective adhesion areas are photographed one by one for the purpose of accuracy judgment of the adhesion areas, the precision inspection can only take a lot of time, and the image detected from the position of the target adhesion area tap by the working position, the illumination or the mechanical error value has defects, so that all the adhesion areas 110' detectable in the view angle are inspected, and the inspected target adhesion areas are overlapped between lenses to be detected, whereby the multi-lens effect on the target adhesion areas can be obtained.
Fig. 7 is a view showing a process of photographing a plurality of images including a target bonding region in a state in which bonding regions formed on a wafer within a view angle of a vision unit are arranged at mutually different positions in a semiconductor material attaching device according to a second embodiment of the present invention.
At this time, at least one of the wafer stage on which the wafer is placed and the vision unit is transferred on the X-Y plane by a method of changing the position of the target bonding region within the view angle of the vision unit.
One of the wafer stage and the vision unit 200 'may be configured to be movable in the X-Y plane, and may be configured to be movable in the Y-axis (or X-axis) direction by the wafer stage and the vision unit 200' in the X-axis (or Y-axis) direction. Thus, the vision unit and wafer table are movable relative to each other.
The case where the above-described vision unit 200' is movable to the X-axis and the wafer stage on which the wafer is placed is movable to the Y-axis is illustrated in the second embodiment shown in fig. 7.
Fig. 7 is a view showing a process of photographing the target bonding region while changing the position of the target bonding region and photographing it while transferring the vision unit or the wafer stage when the target bonding region is photographed in total 9 lines×3 columns within the view angle fov of the vision unit 200', and fig. 8 is a view showing an image in which a plurality of images photographed in fig. 7 are overlapped centering on the target bonding region.
Fig. 7 (a) is a view showing a state in which the target adhesive region is arranged in the lower right portion in the initial condition,
fig. 7 (b) is a view showing a state in which the vision unit 200' is transferred to the right in the X-axis direction by 2 pitches and the target adhesive region is arranged at the lower left in the state shown in fig. 7 (a),
fig. 7 (c) is a view showing a state in which the wafer stage is transferred by 2 pitches downward in the Y-axis direction and the target bonding region is arranged at the upper left in the state shown in fig. 7 (b),
fig. 7 (d) shows a state in which the vision unit is transferred to the left side in the X-axis direction by 2 pitches and the target bonding area is arranged at the upper right in the state shown in fig. 7 (c).
That is, when this is expressed as coordinates, the following effects can be obtained: when the target adhesion area assumes the coordinates of the position of the lower left part within the view angle to be (1, 1), fig. 7 (a) moves to 4 coordinates of (1, 3), (1, 1), (3, 1) and (3, 3).
In the above, in the first embodiment according to fig. 1 to 4, the case where the viewing angle of the vision unit 200 is 2 rows×2 columns is illustrated, and thus the respective through holes overlap and each bonding region 110 'has a 4-times multi-lens effect, the second embodiment according to fig. 6 to 9 is the case where the viewing angle of the vision unit 200' is 3 rows×3 columns.
In the case of 3 rows by 3 columns, each bonding region 110 'is overlapped and each target bonding region has the same 4-shot effect as the viewing angle of the vision unit 200' is shifted every 2 pitches and photographed. In this case, 4 times means that images positioned in the upper, lower, left, right, lower, left, and lower right (upper, lower, right, left, lower, right) with respect to the visual center are acquired in order to detect the same target adhesion region at different positions.
In the case of the adhesive region 110' located on the visual center line, an accurate position value can be obtained because the offset value according to the working position is small, but the adhesive region 110' located on each periphery can generate mechanical and optical offset values according to the position, and therefore, a plurality of images obtained from each position in a state where the same adhesive region 110' is arranged at mutually different positions (upper left, lower right, lower left and lower right) are superimposed to obtain accurate position information for the corresponding target adhesive region. In addition, a plurality of images detected at different positions can be acquired in the target adhesion region. Therefore, as the image is acquired while moving at the pitch intervals calculated from the matrix information of the bonding areas, the inspection time can be shortened, the number of hours (UPH) can be increased, and the fine position determination of each bonding area with respect to the bonding area 110' can be realized.
On the other hand, the method of calculating the pitch in the second embodiment of the present invention is as follows. In general, fov detects images in the form of square circles, and the material detected at fov can acquire images of M rows×n columns according to the shape of the material.
In this case, M and N may be integers, or may be even or odd.
When M is even, the image of the target bonding area can be acquired with the movement of the M/2 row interval, and when M is odd, the image of the target position can be acquired with the movement of the (M+1)/2 row interval. Similarly, when N is an even number, the image of the target bonding region may be obtained with the shift of N/2 line intervals, and when N is an odd number, the image of the target bonding region may be obtained with the shift of (n+1)/2 line intervals.
In the second embodiment of the present invention, the images of the target bonding areas are obtained with (3+1)/2=2 pitches, in the case of 3 rows×3 columns, respectively, which are odd numbers of 3.
In the same way, in the case of 4 rows×4 columns, images can be acquired every 2 pitches with the movement, and in the case of 5 rows×5 columns, images can be acquired every 3 pitches with the movement.
For reference, the number of M rows and the number of N columns detected by the visual angle may be different from each other according to the morphology of the material. That is, in the case of detecting an image of 4 rows by 3 columns, the column interval is detected with every 4/2=2 pitches of movement due to the even number of M, and the row interval is detected with every (3+1)/2=2 pitches of movement due to the odd number of N, so that an overlapped image can be obtained.
On the other hand, as shown in fig. 9, in the semiconductor material attaching device according to the second embodiment of the present invention, before the bonding of the vision unit idles, the images of the target bonding regions according to the intervals at which the bonding regions 110' are photographed are overlapped, the vision unit 200' performs the pitch movement of the photographed images in the X-axis direction at 2-pitch intervals calculated from the matrix information of the bonding regions 110 '.
In the second embodiment of the present invention, 3 rows by 3 columns of images are acquired in one view fov, and M is an odd number, so images are acquired with pitch shifting at (3+1)/2=2 column intervals. After all images of 1 to 3 rows with respect to the wafer are acquired by moving the stage in the X-axis direction (right side), since N is an odd number, the stage is moved 2 pitches in the Y-axis direction (lower side) at (3+1)/2=2 row intervals, and then the vision camera is moved in the X-axis direction (left side) and is moved at a pitch of 2 columns at intervals, so that images of the bonding region of 3 to 5 rows with respect to the wafer are acquired. This process is repeated in sequence, and as images of the bonding regions of the wafer are collected, overlapping images for each target bonding region can be acquired.
For reference, in the first and second embodiments of the present invention, the description is made with reference to the target bonding regions located in 3 rows for convenience of description, but for checking the target bonding regions located in 1,2 rows, photographing may be started from the peripheral region where the bonding region 110' does not exist, so that images of the target bonding regions located in 1,2 rows located in upper left, lower right, lower left and lower right with reference to the visual center can be acquired.
The attachment method of the semiconductor material attaching device of the present invention uses the vision unit 200 'to judge the positional error of the bonding region 110' of the semiconductor material of such miniaturized size and allows the positional error to be modified during the attachment process, thereby minimizing defects and the like of the product in the subsequent processes of the attachment process, for example, the bonding process or the sputtering process of the semiconductor material.
That is, in embodiments 1 and 2 of the present invention, the bonded regions of the respective wafers and the through holes of the tape are inspected before the semiconductor material is attached to the wafers or the tape, but after the semiconductor chips or the material is attached to the respective bonded regions, whether or not the semiconductor chips or the material is attached well is inspected by the same method in the inspection such as the post-solder automated inspection (PBI, post bonding inspection), and thus the inspection reliability can be improved.
In the present specification, the present invention has been described with reference to preferred embodiments thereof, but those skilled in the art to which the present invention pertains can make various modifications and changes without departing from the spirit and scope of the present invention described in the scope of the invention claimed below. Accordingly, as long as the modified embodiment basically includes the structural elements of the claimed invention, it is considered to be included in the technical scope of the invention.
Claims (12)
1. A semiconductor material attaching method which is an attaching method of a semiconductor material attaching device having a circuit board formed with a bonding region where a plurality of semiconductor materials are bonded, a stage for placing the circuit board, and a vision unit for photographing the bonding region of the circuit board, comprising:
a first photographing step of photographing a target bonding region to be bonded of the semiconductor material and a plurality of adjacent bonding regions with a single lens using the vision unit;
a step of transferring the vision unit or the table at intervals calculated from matrix information of the bonding region entering the viewing angle of the vision unit so that the target bonding region enters another position within the viewing angle of the vision unit after the target bonding region is photographed;
a second photographing step of photographing the target adhesion region by using the vision unit in a state that the vision unit or the table is transferred at the calculated interval;
a step of obtaining a plurality of images of the target bonding areas at different positions from each other in the view angle of the vision unit by repeating the transferring step and the second photographing step a plurality of times; and
And judging the position of the target bonding area from the acquired images of the plurality of target bonding areas.
2. A semiconductor material attaching method having a tape formed with a plurality of through holes for accommodating bumps of a semiconductor material and attached to a template for a sputtering process of the semiconductor material, a stage for placing the tape, and a vision unit for photographing the through holes of the tape, the attaching method comprising:
a first photographing step of photographing a target through hole for accommodating the bump of the semiconductor material and a plurality of adjacent through holes with a single lens by using the vision unit;
a step of transferring the vision unit or the workbench according to the interval calculated by the matrix information of the through holes entering the visual angle of the vision unit in order to make the target through holes enter other positions in the visual angle of the vision unit after shooting the target through holes;
a second photographing step of photographing the target through hole by using the vision unit in a state that the vision unit or the table is transferred at the calculated interval;
a step of obtaining a plurality of images of the target through holes at different positions from each other in the view angle of the vision unit by repeating the transferring step and the second photographing step a plurality of times; and
And judging the position of the target through hole from the acquired images of the plurality of target through holes.
3. The method for attaching a semiconductor material according to claim 1 or 2, wherein the first photographing step and the second photographing step are repeated at respective positions to perform photographing,
the step of determining the position from the plurality of acquired images is to determine the position by repeating the photographing of the average value of the plurality of acquired position values by the first photographing step and the second photographing step.
4. The method for attaching a semiconductor material according to claim 1 or 2, wherein,
when a specific abnormal position value is found from among the position values of the first photographing step and the position values obtained by repeating the second photographing step a plurality of times, the corresponding data is filtered,
when different deviations are generated from the position value of the first photographing step and a plurality of data among a plurality of position values obtained by repeating the second photographing step a plurality of times, recalibration is performed or the corresponding position value is regarded as bad.
5. The method for attaching a semiconductor material according to claim 1, wherein,
The bonding areas entering the viewing angle of the above-described visual unit are formed as M rows by N columns,
the above-mentioned M, N is an integer,
in the above-described second photographing step,
imaging the target bonding region while shifting an M/2 column interval when M is an even number, imaging the target bonding region while shifting an (M+1)/2 column interval when M is an odd number,
when N is even, the target bonding area is photographed while shifting N/2 line intervals, and when N is odd, the target bonding area is photographed while shifting (N+1)/2 line intervals.
6. The method for attaching a semiconductor material according to claim 2, wherein,
the through holes entering the viewing angle of the above-described visual unit are formed in M rows by N columns,
the above-mentioned M, N is an integer,
in the above-described second photographing step,
photographing the target through hole while shifting an M/2 column interval when the M is even, photographing the target through hole while shifting an (M+1)/2 column interval when the M is odd,
and when N is even, the target through hole is shot while moving N/2 row interval, and when N is odd, the target through hole is shot while moving (N+1)/2 rows.
7. The method for attaching a semiconductor material according to claim 1, wherein,
the target bonding area is photographed by the vision unit while moving a pitch interval along with the vision unit or the table.
8. The method for attaching a semiconductor material according to claim 2, wherein,
the target through hole is photographed by the vision unit while moving a pitch interval along with the vision unit or the stage.
9. The method according to claim 1, wherein in the step of acquiring a plurality of images of the target bonding region at different positions from each other, the images are acquired by capturing images with the vision unit at intervals calculated so as to be able to acquire images of the target bonding region at an upper left portion, an upper right portion, a lower left portion, and a lower right portion with reference to the center of the vision unit.
10. The method according to claim 2, wherein in the step of acquiring a plurality of images of the target through-hole at different positions from each other, the images are acquired by moving the vision unit or the stage while taking the images with the vision unit at intervals calculated so as to be able to acquire the images of the target through-hole at the upper left, upper right, lower left and lower right with reference to the center of the vision unit.
11. The method for attaching a semiconductor material according to claim 2, wherein,
the template has a plurality of through holes larger than the through holes of the tape in positions corresponding to the through holes formed in the tape,
in the first photographing step or the second photographing step, a tolerance between the through hole of the template and the through hole of the strap is acquired by extracting images of the periphery of the through hole of the template and the periphery of the through hole of the strap, and whether the acquired tolerance is within an initial set range is confirmed.
12. The method for attaching a semiconductor material according to claim 2, wherein,
the template has a plurality of through holes larger than the through holes of the tape in positions corresponding to the through holes formed in the tape,
after the bumps of the semiconductor material are accommodated in the through holes of the tape, the adhesion state of the semiconductor material is inspected by comparing the tolerance between the through holes of the template and the through holes of the tape with the positions of the bumps of the semiconductor material.
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| KR1020180078142A KR102153168B1 (en) | 2017-09-29 | 2018-07-05 | Semiconductor Device Attaching Method |
| KR10-2018-0078142 | 2018-07-05 |
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