CN117810131A - Accurate and effective die succession correction method, system and readable storage medium - Google Patents
Accurate and effective die succession correction method, system and readable storage medium Download PDFInfo
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Abstract
The invention discloses a precise and effective die succession correction method, a system and a readable storage medium, wherein the method comprises the following steps: sorting based on a single wafer die to batch into a wafer, wherein the wafer die and wafer chip box are loaded simultaneously; the wafer chip boxes are sequentially sorted to finish the sequential correction; and unloading the wafer crystal grains and the wafer chip boxes for subsequent correction after the sorting is finished. The error of the calculated angle offset is small, the accuracy of the continuous angle is ensured, the error is smaller than 5um by calculating the average position offset of the dot matrix of the boundary point of the initial position, the accuracy of the continuous position offset is ensured, and the rationality of the distance in calculating the angle is ensured by iteratively checking the position, so that the accuracy of the angle is ensured.
Description
Technical Field
The invention relates to the technical field of unmanned aerial vehicle operation, in particular to an accurate and effective die succession correction method, an accurate and effective die succession correction system and a readable storage medium.
Background
In the grain sorting production, the grains (such as mini-led) at the Wafer end are required to be transferred from the Wafer end to the Bi N (chip box) end, wherein Bi N maps are usually set at the Bi N end, and the crystallization is carried out according to the set Bi N maps, as shown in fig. 1, the grains of the same grade in the N wafers are usually required to be transferred to the same Bi N blue film, and in the process, how to ensure the position consistency of the Bi N end is a very critical problem to be solved.
Disclosure of Invention
The invention aims to provide an accurate and effective die splicing correction method, a system and a readable storage medium, wherein the calculated angle offset has small error, the accuracy of splicing angles is ensured, the error is smaller than 5um by calculating the average position offset of a dot matrix of a boundary point of a starting position, the accuracy of splicing position offset is ensured, and the rationality of distance in calculating angles is ensured by iteratively checking positions, so that the accuracy of angles is ensured.
The first aspect of the present invention provides an accurate and effective die attach correction method, comprising the steps of:
sorting is performed based on individual wafer dice for batching into a wafer, wherein,
simultaneously loading a wafer die and a wafer chip box;
the wafer chip boxes are sequentially sorted to finish the sequential correction;
and unloading the wafer crystal grains and the wafer chip boxes for subsequent correction after the sorting is finished.
In this scheme, the wafer chip box that continues specifically includes:
calculating an affine relationship of the reference coordinate system and the grain coordinate system, wherein,
establishing the reference coordinate system based on coordinates given by the wafer chip box map;
establishing the grain coordinate system based on actual grain locations on the thin film blue;
and calculating the angular deviation from the reference coordinate system to the grain coordinate system and the coordinate value offset deviation from the reference coordinate system to the grain coordinate system to obtain the affine relation.
In this scheme, the calculating the angular deviation from the reference coordinate system to the grain coordinate system specifically includes:
acquiring a starting position and an ending position;
obtaining a reference coordinate and an actual coordinate by combining the starting position and the ending position based on the reference coordinate system and the grain coordinate system;
calculating the angle deviation of the reference coordinates and the actual coordinates, wherein the calculation formula is as follows:
x0＝a0*y+b0*x+c0；
y0＝a1*y+b1*x+c1；
wherein the reference coordinates are (x, y), the actual coordinates are (x 0, y 0), and a0, a1, b0, b1, c0, and c1 are conversion coefficients.
In this scheme, obtain starting position and ending position, specifically include:
obtaining a starting position based on a first boundary point of the starting position or a lattice within a preset range of the first boundary point;
and selecting a second boundary point opposite to the initial position or a lattice within a preset range of the second boundary point to obtain the end position.
In this scheme, calculate the position deviation of initial position, specifically include:
extracting a rotation center (RotateX, rotateY), reference coordinates (x, y), actual coordinates (x 0, y 0) of the wafer cassette map, wherein,
dx＝(x-RotateX)*cos(daOffset)-(y-RotateY)*sin(daOffset)-x0；
dy＝(x-RotateX)*sin(daOffset)+(y-RotateY)*cos(daOffset)-y0；
xOffset＝average(dx)；
yOffset＝average(dy)；
where daOffset represents the angular offset of the reference coordinates to the actual coordinates, and (xOffset, yOffset) represents the positional offset.
In this scheme, a transformation relation of affine transformation, namely rotation offset transformation, is established through the angle deviation and the position deviation, wherein the transformation formula is as follows:
f(x)＝a0*y'+b0*x'+c0；
f(y)＝a1*y'+b1*x'+c1；
where f (·) represents a conversion relation, (x ', y') represents arbitrary coordinates, and a0, a1, b0, b1, c0, and c1 are conversion coefficients.
The second aspect of the present invention also provides an accurate and efficient die attach correction system, comprising a memory and a processor, wherein the memory includes an accurate and efficient die attach correction method program, and the accurate and efficient die attach correction method program when executed by the processor implements the steps of:
sorting is performed based on individual wafer dice for batching into a wafer, wherein,
simultaneously loading a wafer die and a wafer chip box;
the wafer chip boxes are sequentially sorted to finish the sequential correction;
and unloading the wafer crystal grains and the wafer chip boxes for subsequent correction after the sorting is finished.
In this scheme, the wafer chip box that continues specifically includes:
calculating an affine relationship of the reference coordinate system and the grain coordinate system, wherein,
establishing the reference coordinate system based on coordinates given by the wafer chip box map;
establishing the grain coordinate system based on actual grain locations on the thin film blue;
and calculating the angular deviation from the reference coordinate system to the grain coordinate system and the coordinate value offset deviation from the reference coordinate system to the grain coordinate system to obtain the affine relation.
In this scheme, the calculating the angular deviation from the reference coordinate system to the grain coordinate system specifically includes:
acquiring a starting position and an ending position;
obtaining a reference coordinate and an actual coordinate by combining the starting position and the ending position based on the reference coordinate system and the grain coordinate system;
calculating the angle deviation of the reference coordinates and the actual coordinates, wherein the calculation formula is as follows:
x0＝a0*y+b0*x+c0；
y0＝a1*y+b1*x+c1；
wherein the reference coordinates are (x, y), the actual coordinates are (x 0, y 0), and a0, a1, b0, b1, c0, and c1 are conversion coefficients.
In this scheme, obtain starting position and ending position, specifically include:
obtaining a starting position based on a first boundary point of the starting position or a lattice within a preset range of the first boundary point;
and selecting a second boundary point opposite to the initial position or a lattice within a preset range of the second boundary point to obtain the end position.
In this scheme, calculate the position deviation of initial position, specifically include:
extracting a rotation center (RotateX, rotateY), reference coordinates (x, y), actual coordinates (x 0, y 0) of the wafer cassette map, wherein,
dx＝(x-RotateX)*cos(daOffset)-(y-RotateY)*sin(daOffset)-x0；
dy＝(x-RotateX)*sin(daOffset)+(y-RotateY)*cos(daOffset)-y0；
xOffset＝average(dx)；
yOffset＝average(dy)；
where daOffset represents the angular offset of the reference coordinates to the actual coordinates, and (xOffset, yOffset) represents the positional offset.
In this scheme, a transformation relation of affine transformation, namely rotation offset transformation, is established through the angle deviation and the position deviation, wherein the transformation formula is as follows:
f(x)＝a0*y'+b0*x'+c0；
f(y)＝a1*y'+b1*x'+c1；
where f (·) represents a conversion relation, (x ', y') represents arbitrary coordinates, and a0, a1, b0, b1, c0, and c1 are conversion coefficients.
A third aspect of the present invention provides a computer readable storage medium having embodied therein a precisely and effectively die attach correction method program for a machine, which when executed by a processor, implements the steps of a precisely and effectively die attach correction method as described in any of the above.
The accurate and effective die splicing correction method, the system and the readable storage medium have the advantages that the calculated error of the angle offset is small, the accuracy of splicing angles is ensured, the error is smaller than 5um by calculating the average position offset of the dot matrix of the boundary point of the initial position, the accuracy of splicing position offset is ensured, and the rationality of the distance in calculating the angles is ensured by iteratively checking the positions, so that the accuracy of the angles is ensured.
Drawings
FIG. 1 shows a schematic diagram of a prior art grain-solidified blue film;
FIG. 2 is a flow chart of an accurate and efficient die attach correction method of the present invention;
FIG. 3 is a flow chart of an accurate and efficient die attach correction method of the present invention;
FIG. 4 is a flow chart of an accurate and efficient die attach correction method of the present invention;
FIG. 5 is a schematic diagram showing the start and end positions of a blue film in an accurate and efficient die attach correction method of the present invention;
FIG. 6 is a schematic view showing the traversal of the start and end positions of the blue film of an accurate and efficient die attach correction method of the present invention;
fig. 7 shows a block diagram of an accurate and efficient die attach correction system of the present invention.
Detailed Description
In order that the above-recited objects, features and advantages of the present invention will be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those described herein, and therefore the scope of the present invention is not limited to the specific embodiments disclosed below.
Fig. 2 shows a flow chart of an accurate and efficient die attach correction method of the present application.
As shown in fig. 2, the present application discloses an accurate and effective die attach correction method, which includes the following steps:
s202, sorting based on single sheet crystal grains to batch into a wafer;
s204, loading the wafer crystal grains and the wafer chip boxes simultaneously;
s206, closing the wafer crystal grains, and sequentially sorting the wafer chip boxes to finish sequential correction;
s208, unloading the wafer crystal grains and the wafer chip boxes for subsequent correction after the sorting is completed.
It should be noted that, in this embodiment, as shown in fig. 3 and fig. 4, a flow chart for correcting N wafers is shown, in which, in fig. 3, a process of sorting based on a single Wafer die to batch into a Wafer is specifically described, and batch-by-batch refers to sorting and picking the same grade of die in N wafers onto the corresponding blue film, and completing the bin map of the whole blue film, in which, as shown in fig. 4, loading the Wafer die and the Wafer chip box at the same time, closing the Wafer die, sorting the Wafer chip box successively to complete the successive correction, and unloading the Wafer die and the Wafer chip box after sorting is completed for subsequent correction.
According to an embodiment of the present invention, the connection of the wafer cassettes specifically includes:
calculating an affine relationship of the reference coordinate system and the grain coordinate system, wherein,
establishing the reference coordinate system based on coordinates given by the wafer chip box map;
establishing the grain coordinate system based on actual grain locations on the thin film blue;
and calculating the angular deviation from the reference coordinate system to the grain coordinate system and the coordinate value offset deviation from the reference coordinate system to the grain coordinate system to obtain the affine relation.
In this embodiment, bin connection refers to establishing an affine relationship between a reference coordinate and an actual coordinate, and converting a position on the reference coordinate into a coordinate on the actual coordinate through affine transformation; wherein, reference coordinates: the method comprises the steps of setting a reference coordinate system through coordinates given by a bin map; grain coordinates: the actual grain position on the blue film, and a coordinate system of the grain; the subsequent calculation is to calculate the angle deviation from the reference coordinate to the actual coordinate and the coordinate value XY offset deviation from the reference coordinate to the actual coordinate.
According to an embodiment of the present invention, the calculating the angular deviation from the reference coordinate system to the die coordinate system specifically includes:
acquiring a starting position and an ending position;
obtaining a reference coordinate and an actual coordinate by combining the starting position and the ending position based on the reference coordinate system and the grain coordinate system;
calculating the angle deviation of the reference coordinates and the actual coordinates, wherein the calculation formula is as follows:
x0＝a0*y+b0*x+c0；
y0＝a1*y+b1*x+c1；
wherein the reference coordinates are (x, y), the actual coordinates are (x 0, y 0), and a0, a1, b0, b1, c0, and c1 are conversion coefficients.
In this embodiment, since the reference coordinates and the actual coordinates of the crystal grains at the start position and the end position are used, the start position and the end position need to be obtained first, and further, the angular deviation (daOffset) from the reference coordinates to the actual coordinates is calculated as follows:
x0＝a0*y+b0*x+c0；
y0＝a1*y+b1*x+c1；
where the reference coordinates are (x, y), the actual coordinates are (x 0, y 0), and a0, a1, b0, b1, c0, and c1 are conversion coefficients, and the angular offset (daOffset) from the reference coordinates to the actual coordinates can be calculated by the reflection conversion formula.
According to an embodiment of the present invention, the acquiring the start position and the end position specifically includes:
obtaining a starting position based on a first boundary point of the starting position or a lattice within a preset range of the first boundary point;
and selecting a second boundary point opposite to the initial position or a lattice within a preset range of the second boundary point to obtain the end position.
It should be noted that, in this embodiment, as shown in fig. 5, a schematic diagram of a start position and an end position is displayed, where, in a conventional continuous start position, a boundary point (leftmost point, rightmost point, uppermost point, lowermost point) of the start position is often selected, and an end position is often selected, and in comparison with the prior art, a boundary point (leftmost point, rightmost point, uppermost point, lowermost point) opposite to the start boundary point is often selected, and in this embodiment, a boundary point of the start position and a lattice in the range of n×n near the boundary point are often selected, and in this embodiment, a boundary point opposite to the start boundary point and a lattice in the range of n×n near the boundary point are often selected, and if the boundary point distance between the boundary point of the start position and the end position is smaller than a limit value, a boundary point meeting requirements is sequentially added, and correspondingly, in this embodiment, a boundary point meeting requirements is a boundary point of n×n near the boundary point instead of the boundary point in the boundary point, and a boundary point meeting requirements is not just the boundary point in this embodiment.
According to an embodiment of the present invention, calculating the position deviation of the starting position specifically includes:
extracting a rotation center (RotateX, rotateY), reference coordinates (x, y), actual coordinates (x 0, y 0) of the wafer cassette map, wherein,
dx＝(x-RotateX)*cos(daOffset)-(y-RotateY)*sin(daOffset)-x0；
dy＝(x-RotateX)*sin(daOffset)+(y-RotateY)*cos(daOffset)-y0；
xOffset＝average(dx)；
yOffset＝average(dy)；
where daOffset represents the angular offset of the reference coordinates to the actual coordinates, and (xOffset, yOffset) represents the positional offset.
In this embodiment, the reference coordinate and the actual coordinate of the starting position, and the angular deviation obtained in the above description can calculate the position deviation (xOffset, yOffset) of the starting position, and the calculation formula is as follows:
knowing the rotation center RotateX, rotateY of Bin, the reference coordinates x, y, the actual coordinates x0, y0, the formula of this patent:
dx＝(x-RotateX)*cos(daOffset)-(y-RotateY)*sin(daOffset)-x0；
dy＝(x-RotateX)*sin(daOffset)+(y-RotateY)*cos(daOffset)-y0；
xOffset＝average(dx)；
yOffset＝average(dy)；
where daOffset represents the angular offset from the reference coordinate to the actual coordinate, (xOffset, yOffset) represents the positional offset, (RotateX, rotateY) is the rotation center, (x, y) is the reference coordinate, and (x 0, y 0) is the actual coordinate.
According to the embodiment of the invention, a conversion relation of affine transformation, namely rotation offset conversion is established through the angle deviation and the position deviation, wherein the conversion formula is as follows:
f(x)＝a0*y'+b0*x'+c0；
f(y)＝a1*y'+b1*x'+c1；
where f (·) represents a conversion relation, (x ', y') represents arbitrary coordinates, and a0, a1, b0, b1, c0, and c1 are conversion coefficients.
It should be noted that, by the angular deviation and the positional deviation, a conversion relation of affine transformation, that is, rotation offset conversion is established, and accordingly, the conversion formula is as described above.
It is worth mentioning that the method further comprises: traversing the starting point and the ending point, and calculating the distance between the starting point and the ending point to compare with a set value so as to judge whether to add the corresponding point as the starting point or the ending point of the current column.
It should be noted that, as shown in fig. 6, the starting point and the ending point of the current blue film are traversed, by calculating the distance between the two points, for example, the distance is too short, traversing from left to right according to fig. 6, calculating the starting point and the ending point of each column, comparing whether the distance between the two points is greater than a set value, if yes, ending the traversing, and adding the starting point and the ending point of the column.
Specifically, in the existing connection, the initial position and the end position are only 2 points, and often because the actual die-bonding position is offset, the calculated angle deviation is abnormal, so that the whole Lan Mo sheet is scrapped; the position deviation is calculated through a boundary point of the starting point position, if the actual solid crystal of the boundary crystal grain of the starting point position has deviation (more than 30 um), the position deviation of the whole blue film is caused, in addition, the starting point position and the ending point position are too close, the calculated angle is often abnormal, and the whole Lan Mo is scrapped; the dot matrix near the initial position and the end position in the application has small error of calculated angle offset (less than 0.001 degree), so that the accuracy of the continuous angle is ensured; and by calculating the average position deviation of the dot matrix of the boundary points of the initial position, the error is small (less than 5 um), thereby ensuring the accuracy of the continuous position deviation; in addition, through iterative position checking, the rationality of the distance in calculating the angle is ensured, thereby ensuring the accuracy of the angle.
Fig. 7 shows a block diagram of an accurate and efficient die attach correction system of the present invention.
As shown in fig. 7, the present invention discloses a precise and effective die attach correction system, which comprises a memory and a processor, wherein the memory comprises a precise and effective die attach correction method program, and the precise and effective die attach correction method program realizes the following steps when being executed by the processor:
sorting is performed based on individual wafer dice for batching into a wafer, wherein,
simultaneously loading a wafer die and a wafer chip box;
the wafer chip boxes are sequentially sorted to finish the sequential correction;
and unloading the wafer crystal grains and the wafer chip boxes for subsequent correction after the sorting is finished.
It should be noted that, in this embodiment, as shown in fig. 3 and fig. 4, a flow chart for correcting N wafers is shown, in which, in fig. 3, a process of sorting based on a single Wafer die to batch into a Wafer is specifically described, and batch-by-batch refers to sorting and picking the same grade of die in N wafers onto the corresponding blue film, and completing bi N map of the whole blue film, in which, as shown in fig. 4, loading the Wafer die and Wafer chip box simultaneously, closing the Wafer die, sorting the Wafer chip box successively to complete the successive correction, and unloading the Wafer die and Wafer chip box after sorting is completed for subsequent correction.
According to an embodiment of the present invention, the connection of the wafer cassettes specifically includes:
calculating an affine relationship of the reference coordinate system and the grain coordinate system, wherein,
establishing the reference coordinate system based on coordinates given by the wafer chip box map;
establishing the grain coordinate system based on actual grain locations on the thin film blue;
and calculating the angular deviation from the reference coordinate system to the grain coordinate system and the coordinate value offset deviation from the reference coordinate system to the grain coordinate system to obtain the affine relation.
In this embodiment, bin connection refers to establishing an affine relationship between a reference coordinate and an actual coordinate, and converting a position on the reference coordinate into a coordinate on the actual coordinate through affine transformation; wherein, reference coordinates: the method comprises the steps of setting a reference coordinate system through coordinates given by a bin map; grain coordinates: the actual grain position on the blue film, and a coordinate system of the grain; the subsequent calculation is to calculate the angle deviation from the reference coordinate to the actual coordinate and the coordinate value XY offset deviation from the reference coordinate to the actual coordinate.
According to an embodiment of the present invention, the calculating the angular deviation from the reference coordinate system to the die coordinate system specifically includes:
acquiring a starting position and an ending position;
obtaining a reference coordinate and an actual coordinate by combining the starting position and the ending position based on the reference coordinate system and the grain coordinate system;
calculating the angle deviation of the reference coordinates and the actual coordinates, wherein the calculation formula is as follows:
x0＝a0*y+b0*x+c0；
y0＝a1*y+b1*x+c1；
wherein the reference coordinates are (x, y), the actual coordinates are (x 0, y 0), and a0, a1, b0, b1, c0, and c1 are conversion coefficients.
In this embodiment, since the reference coordinates and the actual coordinates of the crystal grains at the start position and the end position are used, the start position and the end position need to be obtained first, and further, the angular deviation (daOffset) from the reference coordinates to the actual coordinates is calculated as follows:
x0＝a0*y+b0*x+c0；
y0＝a1*y+b1*x+c1；
where the reference coordinates are (x, y), the actual coordinates are (x 0, y 0), and a0, a1, b0, b1, c0, and c1 are conversion coefficients, and the angular offset (daOffset) from the reference coordinates to the actual coordinates can be calculated by the reflection conversion formula.
According to an embodiment of the present invention, the acquiring the start position and the end position specifically includes:
obtaining a starting position based on a first boundary point of the starting position or a lattice within a preset range of the first boundary point;
and selecting a second boundary point opposite to the initial position or a lattice within a preset range of the second boundary point to obtain the end position.
It should be noted that, in this embodiment, as shown in fig. 5, a schematic diagram of a start position and an end position is displayed, where, in a conventional continuous start position, a boundary point (leftmost point, rightmost point, uppermost point, lowermost point) of the start position is often selected, and an end position is often selected, and in comparison with the prior art, a boundary point (leftmost point, rightmost point, uppermost point, lowermost point) opposite to the start boundary point is often selected, and in this embodiment, a boundary point of the start position and a lattice in the range of n×n near the boundary point are often selected, and in this embodiment, a boundary point opposite to the start boundary point and a lattice in the range of n×n near the boundary point are often selected, and if the boundary point distance between the boundary point of the start position and the end position is smaller than a limit value, a boundary point meeting requirements is sequentially added, and correspondingly, in this embodiment, a boundary point meeting requirements is a boundary point of n×n near the boundary point instead of the boundary point in the boundary point, and a boundary point meeting requirements is not just the boundary point in this embodiment.
According to an embodiment of the present invention, calculating the position deviation of the starting position specifically includes:
extracting a rotation center (RotateX, rotateY), reference coordinates (x, y), actual coordinates (x 0, y 0) of the wafer cassette map, wherein,
dx＝(x-RotateX)*cos(daOffset)-(y-RotateY)*sin(daOffset)-x0；
dy＝(x-RotateX)*sin(daOffset)+(y-RotateY)*cos(daOffset)-y0；
xOffset＝average(dx)；
yOffset＝average(dy)；
where daOffset represents the angular offset of the reference coordinates to the actual coordinates, and (xOffset, yOffset) represents the positional offset.
In this embodiment, the reference coordinate and the actual coordinate of the starting position, and the angular deviation obtained in the above description can calculate the position deviation (xOffset, yOffset) of the starting position, and the calculation formula is as follows:
knowing the rotation center RotateX, rotateY of Bin, the reference coordinates x, y, the actual coordinates x0, y0, the formula of this patent:
dx＝(x-RotateX)*cos(daOffset)-(y-RotateY)*sin(daOffset)-x0；
dy＝(x-RotateX)*sin(daOffset)+(y-RotateY)*cos(daOffset)-y0；
xOffset＝average(dx)；
yOffset＝average(dy)；
where daOffset represents the angular offset from the reference coordinate to the actual coordinate, (xOffset, yOffset) represents the positional offset, (RotateX, rotateY) is the rotation center, (x, y) is the reference coordinate, and (x 0, y 0) is the actual coordinate.
According to the embodiment of the invention, a conversion relation of affine transformation, namely rotation offset conversion is established through the angle deviation and the position deviation, wherein the conversion formula is as follows:
f(x)＝a0*y'+b0*x'+c0；
f(y)＝a1*y'+b1*x'+c1；
where f (·) represents a conversion relation, (x ', y') represents arbitrary coordinates, and a0, a1, b0, b1, c0, and c1 are conversion coefficients.
It should be noted that, by the angular deviation and the positional deviation, a conversion relation of affine transformation, that is, rotation offset conversion is established, and accordingly, the conversion formula is as described above.
It is worth mentioning that the method further comprises: traversing the starting point and the ending point, and calculating the distance between the starting point and the ending point to compare with a set value so as to judge whether to add the corresponding point as the starting point or the ending point of the current column.
It should be noted that, as shown in fig. 6, the starting point and the ending point of the current blue film are traversed, by calculating the distance between the two points, for example, the distance is too short, traversing from left to right according to fig. 6, calculating the starting point and the ending point of each column, comparing whether the distance between the two points is greater than a set value, if yes, ending the traversing, and adding the starting point and the ending point of the column.
Specifically, in the existing connection, the initial position and the end position are only 2 points, and often because the actual die-bonding position is offset, the calculated angle deviation is abnormal, so that the whole Lan Mo sheet is scrapped; the position deviation is calculated through a boundary point of the starting point position, if the actual solid crystal of the boundary crystal grain of the starting point position has deviation (more than 30 um), the position deviation of the whole blue film is caused, in addition, the starting point position and the ending point position are too close, the calculated angle is often abnormal, and the whole Lan Mo is scrapped; the dot matrix near the initial position and the end position in the application has small error of calculated angle offset (less than 0.001 degree), so that the accuracy of the continuous angle is ensured; and by calculating the average position deviation of the dot matrix of the boundary points of the initial position, the error is small (less than 5 um), thereby ensuring the accuracy of the continuous position deviation; in addition, through iterative position checking, the rationality of the distance in calculating the angle is ensured, thereby ensuring the accuracy of the angle.
A third aspect of the present invention provides a computer readable storage medium having embodied therein a precisely and effectively die attach correction method program which, when executed by a processor, performs the steps of a precisely and effectively die attach correction method as described in any of the preceding claims.
The accurate and effective die splicing correction method, the system and the readable storage medium have the advantages that the calculated error of the angle offset is small, the accuracy of splicing angles is ensured, the error is smaller than 5um by calculating the average position offset of the dot matrix of the boundary point of the initial position, the accuracy of splicing position offset is ensured, and the rationality of the distance in calculating the angles is ensured by iteratively checking the positions, so that the accuracy of the angles is ensured.
In the several embodiments provided in this application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above described device embodiments are only illustrative, e.g. the division of the units is only one logical function division, and there may be other divisions in practice, such as: multiple units or components may be combined or may be integrated into another system, or some features may be omitted, or not performed. In addition, the various components shown or discussed may be coupled or directly coupled or communicatively coupled to each other via some interface, whether indirectly coupled or communicatively coupled to devices or units, whether electrically, mechanically, or otherwise.
The units described above as separate components may or may not be physically separate, and components shown as units may or may not be physical units; can be located in one place or distributed to a plurality of network units; some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in each embodiment of the present invention may be integrated in one processing unit, or each unit may be separately used as one unit, or two or more units may be integrated in one unit; the integrated units may be implemented in hardware or in hardware plus software functional units.
Those of ordinary skill in the art will appreciate that: all or part of the steps for implementing the above method embodiments may be implemented by hardware related to program instructions, and the foregoing program may be stored in a computer readable storage medium, where the program, when executed, performs steps including the above method embodiments; and the aforementioned storage medium includes: a mobile storage device, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk or an optical disk, or the like, which can store program codes.
Alternatively, the above-described integrated units of the present invention may be stored in a computer-readable storage medium if implemented in the form of software functional modules and sold or used as separate products. Based on such understanding, the technical solutions of the embodiments of the present invention may be embodied in essence or a part contributing to the prior art in the form of a software product stored in a storage medium, including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the methods described in the embodiments of the present invention. And the aforementioned storage medium includes: a removable storage device, ROM, RAM, magnetic or optical disk, or other medium capable of storing program code.
Claims (10)
1. An accurate and effective die attach correction method, comprising the steps of:
sorting based on a single wafer die to batch into a wafer, wherein the wafer die and wafer chip box are loaded simultaneously;
the wafer chip boxes are sequentially sorted to finish the sequential correction;
and unloading the wafer crystal grains and the wafer chip boxes for subsequent correction after the sorting is finished.
2. The method for accurate and efficient die attach calibration as defined in claim 1, wherein said attaching said wafer cassettes comprises:
calculating an affine relationship of the reference coordinate system and the grain coordinate system, wherein,
establishing the reference coordinate system based on coordinates given by the wafer chip box map;
establishing the grain coordinate system based on actual grain locations on the thin film blue;
and calculating the angular deviation from the reference coordinate system to the grain coordinate system and the coordinate value offset deviation from the reference coordinate system to the grain coordinate system to obtain the affine relation.
3. The method of claim 2, wherein calculating the angular deviation from the reference coordinate system to the die coordinate system comprises:
acquiring a starting position and an ending position;
obtaining a reference coordinate and an actual coordinate by combining the starting position and the ending position based on the reference coordinate system and the grain coordinate system;
calculating the angle deviation of the reference coordinates and the actual coordinates, wherein the calculation formula is as follows:
x0＝a0*y+b0*x+c0；
y0＝a1*y+b1*x+c1；
wherein the reference coordinates are (x, y), the actual coordinates are (x 0, y 0), and a0, a1, b0, b1, c0, and c1 are conversion coefficients.
4. The method for accurate and efficient die attach correction according to claim 3, wherein said obtaining a start position and an end position comprises:
obtaining a starting position based on a first boundary point of the starting position or a lattice within a preset range of the first boundary point;
and selecting a second boundary point opposite to the initial position or a lattice within a preset range of the second boundary point to obtain the end position.
5. A method for accurate and efficient die attach correction according to claim 3, characterized in that calculating the positional deviation of the start position comprises:
extracting a rotation center (RotateX, rotateY), reference coordinates (x, y), actual coordinates (x 0, y 0) of the wafer cassette map, wherein,
dx＝(x-RotateX)*cos(daOffset)-(y-RotateY)*sin(daOffset)-x0；
dy＝(x-RotateX)*sin(daOffset)+(y-RotateY)*cos(daOffset)-y0；
xOffset＝average(dx)；
yOffset＝average(dy)；
where daOffset represents the angular offset of the reference coordinates to the actual coordinates, and (xOffset, yOffset) represents the positional offset.
6. The accurate and effective die attach correction method according to claim 5, wherein a conversion relation of affine transformation, namely rotation offset conversion, is established by the angle deviation and the position deviation, wherein the conversion formula is as follows:
f(x)＝a0*y'+b0*x'+c0；
f(y)＝a1*y'+b1*x'+c1；
where f (·) represents a conversion relation, (x ', y') represents arbitrary coordinates, and a0, a1, b0, b1, c0, and c1 are conversion coefficients.
7. An accurate and efficient die attach correction system comprising a memory and a processor, wherein the memory includes an accurate and efficient die attach correction method program that when executed by the processor performs the steps of: sorting based on a single wafer die to batch into a wafer, wherein the wafer die and wafer chip box are loaded simultaneously;
the wafer chip boxes are sequentially sorted to finish the sequential correction;
and unloading the wafer crystal grains and the wafer chip boxes for subsequent correction after the sorting is finished.
8. The accurate and efficient die attach calibration system according to claim 7, wherein said attaching said wafer cassettes comprises:
calculating an affine relationship of the reference coordinate system and the grain coordinate system, wherein,
establishing the reference coordinate system based on coordinates given by the wafer chip box map;
establishing the grain coordinate system based on actual grain locations on the thin film blue;
and calculating the angular deviation from the reference coordinate system to the grain coordinate system and the coordinate value offset deviation from the reference coordinate system to the grain coordinate system to obtain the affine relation.
9. The precisely and valid die attach correction system of claim 8, wherein said calculating the angular offset from the reference coordinate system to the die coordinate system comprises:
acquiring a starting position and an ending position;
obtaining a reference coordinate and an actual coordinate by combining the starting position and the ending position based on the reference coordinate system and the grain coordinate system;
calculating the angle deviation of the reference coordinates and the actual coordinates, wherein the calculation formula is as follows:
x0＝a0*y+b0*x+c0；
y0＝a1*y+b1*x+c1；
wherein the reference coordinates are (x, y), the actual coordinates are (x 0, y 0), and a0, a1, b0, b1, c0, and c1 are conversion coefficients.
10. A computer readable storage medium, characterized in that the computer readable storage medium comprises a precisely and effectively die attach correction method program, which, when executed by a processor, implements the steps of a precisely and effectively die attach correction method according to any of claims 1 to 6.
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| CN202311863633.0A CN117810131A (en) | 2023-12-29 | 2023-12-29 | Accurate and effective die succession correction method, system and readable storage medium |
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| CN202311863633.0A CN117810131A (en) | 2023-12-29 | 2023-12-29 | Accurate and effective die succession correction method, system and readable storage medium |
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