CN107607064B - System and method for detecting coating flatness of LED fluorescent powder glue based on point cloud information - Google Patents
System and method for detecting coating flatness of LED fluorescent powder glue based on point cloud information Download PDFInfo
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Abstract
The invention discloses a system and a method for detecting LED fluorescent powder glue coating flatness based on point cloud information. The method comprises the following steps: 1) calibrating the laser ranging system 2) moving the laser ranging system at a high speed to scan a chip to be measured, and finally returning a point distance data set in a measuring range including the chip; 3) complete dense point cloud data of the LED chip to be detected can be obtained; 4) carrying out pose correction on the point cloud data set of the LED chip to be detected on the target; 5) each small LED fluorescent powder glue coating area on the chip is divided and analyzed independently; 6) and judging whether the coating flatness meets the standard or not by taking the thickness consistency, the point-to-point connection tightness and the shape goodness of fit as references. The invention and the system can better avoid the rapid detection errors caused by rotation, translation, scaling and the like, and have better stability and accuracy for the rapid detection of the coating flatness.
Description
Technical Field
The invention relates to a fluorescent powder glue coating detection technology, in particular to a system and a method for detecting LED fluorescent powder glue coating flatness based on point cloud information.
Background
Most LED light sources on the market are produced by a traditional glue dispensing process production line, but the LED light sources have the problems of uneven thickness of a fluorescent powder glue coating and easy turbidity caused by heating of silicon resin, so that the LED light efficiency is low, the space uniformity is poor, and the service life is short. The quality of most of the existing LED light sources is rapidly detected by observing light spots after packaging is finished, so that the labor is consumed, the efficiency is low, the accuracy is not high, and the LED yield is low. Many foreign advanced white light LED manufacturers have mature plane coating packaging production lines, and the production lines of the type are still in a blank stage in China, so that the development of an LED light source production line based on an LED self-adaptive plane coating process has great significance for the Chinese LED industry.
Disclosure of Invention
The invention aims to solve the problems and provides a method for rapidly detecting the coating flatness of the LED fluorescent powder adhesive based on point cloud information, which can better avoid rapid detection errors caused by rotation, translation, scaling and the like and has better stability and accuracy for rapidly detecting the coating flatness.
The invention also aims to provide a system for rapidly detecting the coating flatness of the LED fluorescent powder glue based on the point cloud information.
The purpose of the invention can be achieved by adopting the following technical scheme.
A method for rapidly detecting LED fluorescent powder glue coating flatness based on point cloud information comprises the following steps:
s1, calibrating the laser ranging system to adjust the final installation angle of the point laser generator;
s2, conveying the coated LED chip to be detected to a carrying platform of the system, moving the laser scanning chip at a high speed by the laser ranging system, and finally returning a point distance data set in a measuring range including the chip;
s3, sending the point distance data set to a coating flatness analysis system to be inversely calculated into a point three-dimensional coordinate data set under a world coordinate system;
s4, calculating the rotational and translational offsets of the pose of the LED chip to be detected of the target and the pose of the ideal LED chip to be detected, and correcting the pose of the point cloud data set of the LED chip to be detected of the target;
s5, obtaining complete dense point cloud data of the LED chip to be detected by threshold segmentation, and performing segmentation and independent analysis on each small LED fluorescent powder glue coating area on the chip;
and S6, according to the known shape type of the LED of the chip after the coating process, independently analyzing each small LED fluorescent powder glue coating area on the chip, and judging whether the coating flatness reaches the standard or not by taking the thickness consistency, the connection tightness among points and the shape goodness of fit as the reference.
As a preferred solution, the calibration in step S1 is different from the camera calibration in the field of machine vision, and the aim is to make the laser emission direction as perpendicular as possible to the working platform.
As a preferred solution, the calibration in step S1 can be understood as:
the error generated by the edge of the pixel in the process of gradual output can become an obstacle to the high precision of the CCD, so the Li-CCD with higher precision, higher speed and higher sensitivity is used;
the triangulation method is adopted in the target object measurement principle;
on the Li-CCD, the position of the reflected light moves along with the position change of the target object, and the distance quantity of the target object is measured by rapidly detecting the change;
the calibration of the laser ranging system refers to adjusting the installation angle of laser to enable the laser to scan a plurality of positioning points on a carrying platform without any object, and the difference between the returned distance values can be controlled within an error threshold value close to 0.
As a preferable scheme, in the step S2, the laser scanning is to place the coated LED chip to be detected on a loading platform, and the laser ranging system controls the laser to move at a high speed, so as to reduce the resources consumed by the round trip, and the space in the measuring range including the chip is measured according to the "Z" walking method.
As a preferred scheme, the step S3 of extracting the complete point cloud of the LED chip to be detected specifically includes:
after calibration, the laser emission direction is perpendicular to the carrying platform, so the carrying platform is taken as ZwA world coordinate system (reference coordinate system) O is established in the coordinate conversion module as 0 planewXwYwZw；
Calculating the three-dimensional world coordinate (X) corresponding to the laser point according to the distance measured by the laser point and the number of pulses required by the motor control measuring instrument to reach the pointwi,Ywi,Zwi)；
And after complete conversion is carried out on all the measurement points in the measurement range, establishing complete point cloud containing the target LED chip to be detected.
As a preferred scheme, in step S4, pose correction is performed on the point cloud data set of the LED chip to be detected of the target, specifically:
firstly, according to the complete point cloud (including bottom plate portion) of chip finding projection to ZwThe coordinates of four corner points of a rectangular surface on a plane are 0;
performing relational operation with four corresponding corner point coordinates extracted by an ideal chip to determine a rotation matrix R and a translation matrix T of the target chip within the range of [0,180 ° (the important point is rapid detection of the flatness, so the calculation range of [0,360 °) is not needed, and the calculation range of the flatness is as good as 180 °, and subsequent calculation judgment of the flatness is not influenced);
according to the two matrixes R and T, coordinate transformation is carried out on the complete point cloud of the chip so as to correct the rotational translation offset and also equal to the rotational translation correction (pose correction) on the target LED area;
as a preferable scheme, the segmentation of the LED coating area in step S5 is specifically as follows:
the thickness h of the pure substrate before the coating of the LED chip to be detected in the database corresponds to the thickness Z in the world coordinate systemwZ on the axisw0；
Warp Zw>Zw0After judgment, one LED coating area can be divided, so that each LED coating area can be analyzed independently;
after the previous rotation-translation correction, the dots of each small LED area are reordered and stored (i.e., the dots are arranged in the order of "preceding and following" in the x-axis and the y-axis).
As a preferred scheme, step S6 is to determine whether the LED phosphor paste coating flatness of the LED chip to be inspected meets the standard based on the thickness consistency, the inter-dot connection tightness, and the shape goodness of fit, specifically:
if the coating effect is circular, the rapid detection is as follows:
a) projecting each circular LED coating area point cloud to ZwCalculating the circularity of the plane (0) to judge the conformity of the shape;
b) taking into account the possible data missing phenomenon (e.g. no point data on the corresponding coordinate position) in the point cloud, 0 (Z) is added on the empty data coordinate positionwCoordinate 0);
c) is provided with Zw(i, j) represents (X)w,Yw) Z corresponding to point at (i, j)wAxial coordinates (representing height information), Δ hwRepresenting the sum of the point height differences for each LED coated area, the height uniformity calculation formula is as follows:
where n represents the number of columns and rows occupied by each circular area, j0Denotes the first row, jn-1 denotes the last row, i0(j) Indicates that the jth line corresponds toA list of coordinates, in(j) -1 represents the last column coordinate corresponding to the jth row;
d) the closeness of the connection between points is similar to the calculation of the height consistency, but the difference is that the latter only calculates the height difference, the former calculates the distance value between points, and let P be (i, j, Z)w(i, j)), by Δ dwFor compactness calculation representativeness, the formula is as follows:
if the coating effect is rectangular or square, the rapid detection is as follows:
a) judging the goodness of fit of the shape by calculating the minimum envelope moment;
b) the high consistency calculation is as follows:
c) the compactness is calculated as a representative quantity, and the formula is as follows:
the other purpose of the invention can be achieved by adopting the following technical scheme.
A quick detection system of LED phosphor powder glue coating flatness based on point cloud information belongs to the system and includes:
the laser ranging system is used for calculating the physical distance value from each point in the measuring range to the subsystem, and comprises the following components:
1) the motion control module is used for controlling the hardware equipment of the subsystem to perform high-speed motion ranging;
2) the laser ranging module is used for measuring the physical distance value from the laser point to the subsystem at the position;
3) and the data storage module is used for storing the physical distance values of all the points in the measurement range.
Phosphor powder glue coating roughness analytic system for judge the coating roughness of waiting to examine LED chip, include:
1) the coordinate conversion module is used for converting the physical distance value into a three-dimensional world coordinate value;
2) the region division module is used for dividing the LED fluorescent powder glue coating region in the complete point cloud region of the LED chip to be detected into a block which can be independently processed;
3) and the flatness analysis module is used for calculating three calculation references of each fluorescent powder glue coating area and judging the quality of the flatness.
Compared with the prior art, the invention has the following beneficial effects:
the system and the method for rapidly detecting the coating flatness of the LED fluorescent powder adhesive based on the point cloud information are based on a three-dimensional point cloud coordinate set established by laser high-speed moving ranging, rapid detection of the coating flatness of the fluorescent powder adhesive is carried out on an LED chip to be detected on a field working platform, rapid detection errors caused by rotation, translation, scaling and the like can be well avoided by emphatically utilizing rules, and the rapid detection of the coating flatness has good stability and accuracy.
Drawings
FIG. 1 is a schematic flow chart of a method for rapidly detecting the coating flatness of LED fluorescent powder glue of an LED chip to be detected in the embodiment of the invention.
FIG. 2 is a block diagram of a system for rapidly detecting the coating flatness of LED fluorescent powder glue of an LED chip to be detected according to an embodiment of the invention.
Detailed Description
The following description of the embodiments of the present invention is provided in connection with the accompanying drawings and examples, but the invention is not limited thereto.
As shown in fig. 1, the method for rapidly detecting the coating flatness of the LED phosphor paste based on the point cloud information of the present embodiment includes the following steps:
s1, calibrating a laser ranging system (which can be composed of a motion control module, a laser ranging module and a data storage module) to adjust the final installation angle of the point laser generator;
s2, conveying the coated LED chip to be detected to a carrying platform of the system, moving the laser scanning chip at a high speed by the laser ranging system, and finally returning a point distance data set in a measuring range including the chip;
s3, sending the point distance data set to a coating flatness analysis system to be inversely calculated into a point three-dimensional coordinate data set under a world coordinate system;
s4, calculating the rotational and translational offsets of the pose of the LED chip to be detected of the target and the pose of the ideal LED chip to be detected, and correcting the pose of the point cloud data set of the LED chip to be detected of the target;
s5, obtaining complete dense point cloud data of the LED chip to be detected by threshold segmentation, and segmenting each small LED fluorescent powder glue coating area on the chip;
and S6, according to the known shape type of the LED of the chip after the coating process, independently analyzing each small LED fluorescent powder glue coating area on the chip, and judging whether the coating flatness reaches the standard or not by taking the thickness consistency, the connection tightness among points and the shape goodness of fit as the reference.
The calibration described in step S1 is different from the camera calibration in the field of machine vision, and the goal is to make the laser emission direction as perpendicular as possible to the working platform.
The calibration in step S1 can be understood as:
1) the error generated by the edge of the pixel in the process of gradual output can become an obstacle to the high precision of the CCD, so the Li-CCD with higher precision, higher speed and higher sensitivity is used;
2) the triangulation method is adopted in the target object measurement principle;
3) on the Li-CCD, the position of the reflected light moves along with the position change of the target object, and the distance quantity of the target object is measured by rapidly detecting the change;
4) the calibration of the laser ranging system refers to adjusting the installation angle of laser to enable the laser to scan a plurality of positioning points on a carrying platform without any object, and the difference between the returned distance values can be controlled within an error threshold value close to 0.
And step S2, the laser scanning is to place the coated LED chip to be detected on an object carrying platform, the laser ranging system controls the laser to move at high speed, and the space in the measuring range including the chip is measured according to the Z-shaped walking method in order to reduce the resources consumed by the round trip.
Step S3, the extraction of the complete point cloud of the LED chip to be detected specifically comprises the following steps:
1) after calibration, the laser emission direction is perpendicular to the carrying platform, so the carrying platform is taken as ZwA world coordinate system (reference coordinate system) O is established in the coordinate conversion module as 0 planewXwYwZw；
2) Calculating the three-dimensional world coordinate (X) corresponding to the laser point according to the distance measured by the laser point and the number of pulses required by the motor control measuring instrument to reach the pointwi,Ywi,Zwi)；
3) And after complete conversion is carried out on all the measurement points in the measurement range, establishing complete point cloud containing the target LED chip to be detected.
Step S4, pose correction is carried out on the point cloud data set of the LED chip to be detected of the target, and the pose correction specifically comprises the following steps:
1) firstly, according to the complete point cloud (including bottom plate portion) of chip finding projection to ZwThe coordinates of four corner points of a rectangular surface on a plane are 0;
2) performing relational operation with the corresponding four corner point coordinates extracted by the ideal chip to determine a rotation matrix R and a translation matrix T of the target chip within the range of [0,180 ℃;
3) according to the two matrixes R and T, coordinate transformation is carried out on the complete point cloud of the chip so as to correct the rotational translation offset and also equal to the rotational translation correction (pose correction) on the target LED area;
4) the working gravity center of the method is quick detection of the flatness, so that the calculation range of [0,360 DEG ] is not needed, and the calculation range of the flatness reaches 180 DEG, and the subsequent calculation judgment of the flatness is not influenced.
The step S5 is to divide the LED coating area specifically as follows:
1) the thickness h of the pure substrate before the coating of the LED chip to be detected in the database corresponds to the thickness Z in the world coordinate systemwZ on the axisw0；
2) Warp Zw>Zw0After judgment, one LED coating area can be divided, so that each LED coating area can be analyzed independently;
3) after the previous rotation-translation correction, the dots of each small LED area are reordered and stored (i.e., the dots are arranged in the order of "preceding and following" in the x-axis and the y-axis).
Step S6 is based on thickness consistency, connection tightness between points and shape goodness of fit, and whether the LED fluorescent powder glue coating flatness of the LED chip to be detected reaches the standard is judged, which specifically comprises the following steps:
if the coating effect is circular, the rapid detection is as follows:
a) projecting each circular LED coating area point cloud to ZwCalculating the circularity of the plane (0) to judge the conformity of the shape;
b) taking into account the possible data missing phenomenon (e.g. no point data on the corresponding coordinate position) in the point cloud, 0 (Z) is added on the empty data coordinate positionwCoordinate 0);
c) is provided with Zw(i, j) represents (X)w,Yw) Z corresponding to point at (i, j)wAxial coordinates (representing height information), Δ hwRepresenting the sum of the point height differences for each LED coated area, the height uniformity calculation formula is as follows:
where n represents the number of columns and rows occupied by each circular area, j0Denotes the first row, jn-1 denotes the last row, i0(j) Representing the first column coordinate, i, corresponding to the jth rown(j) -1 represents the last column coordinate corresponding to the jth row;
d) the closeness of the connection between points is similar to the calculation of the height consistency, but the difference is that the latter only calculates the height difference, the former calculates the distance value between points, and let P be (i, j, Z)w(i, j)), by Δ dwFor compactness calculation representativeness, the formula is as follows:
if the coating effect is rectangular or square, the rapid detection is as follows:
a) judging the goodness of fit of the shape by calculating the minimum envelope moment;
b) the high consistency calculation is as follows:
c) the compactness is calculated as a representative quantity, and the formula is as follows:
as shown in fig. 2, the system for rapidly detecting the coating flatness of LED phosphor paste based on point cloud information of this embodiment includes a laser ranging subsystem (including a laser ranging module, a motion control module and a data storage module), and a phosphor paste coating flatness analysis system (including a coordinate conversion module, an area segmentation module and a flatness analysis module), wherein:
the laser ranging system is used for calculating the physical distance value from each point in the measuring range to the subsystem, and comprises the following components:
1) the motion control module is used for controlling the hardware equipment of the subsystem to perform high-speed motion ranging;
2) the laser ranging module is used for measuring the physical distance value from the laser point to the subsystem at the position;
3) and the data storage module is used for storing the physical distance values of all the points in the measurement range.
Phosphor powder glue coating roughness analytic system for judge the coating roughness of waiting to examine LED chip, include:
1) the coordinate conversion module is used for converting the physical distance value into a three-dimensional world coordinate value;
2) the region division module is used for dividing the LED fluorescent powder glue coating region in the complete point cloud region of the LED chip to be detected into a block which can be independently processed;
3) and the flatness analysis module is used for calculating three calculation references of each fluorescent powder glue coating area and judging the quality of the flatness.
It will be understood by those skilled in the art that all or part of the steps in the method for implementing the above embodiments may be implemented by using a program to instruct the relevant hardware, and the corresponding program may be stored in a computer-readable storage medium, such as a ROM, a magnetic disk, an optical disk, or the like.
In summary, the system and the method for rapidly detecting the coating flatness of the LED fluorescent powder glue based on the point cloud information perform rapid detection of the coating flatness of the fluorescent powder glue on the LED chip to be detected on the field working platform based on the three-dimensional point cloud coordinate set established by the laser high-speed moving distance measurement, and the rapid detection is performed by mainly utilizing the rule, so that rapid detection errors caused by rotation, translation, scaling and the like can be better avoided, and the rapid detection of the coating flatness has better stability and accuracy.
The above description is only for the preferred embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can substitute or change the technical solution of the present invention and the inventive concept thereof within the scope of the present invention.
Claims (8)
1. The method for detecting the coating flatness of the LED fluorescent powder adhesive based on point cloud information comprises the following steps:
s1, calibrating the laser ranging system to adjust the final installation angle of the point laser generator and make the laser emission direction as perpendicular to the working platform as possible;
s2, the coated LED chip to be detected is sent to a carrying platform, a laser ranging system moves the laser scanning chip at a high speed, and finally a point distance data set in a measuring range including the chip is returned;
s3, sending the point distance data set to a coating flatness analysis system to be inversely calculated into a point three-dimensional coordinate data set under a world coordinate system;
s4, calculating the rotational and translational offsets of the pose of the LED chip to be detected of the target and the pose of the ideal LED chip to be detected, and correcting the pose of the point cloud data set of the LED chip to be detected of the target;
s5, performing threshold segmentation to obtain complete dense point cloud data of the LED chip to be detected, and segmenting each LED fluorescent powder glue coating area on the chip;
s6, according to the known shape type of the chip LED after the coating process, each small LED fluorescent powder glue coating area is independently analyzed, and whether the coating flatness reaches the standard or not is judged by taking the thickness consistency, the point-to-point connection tightness and the shape goodness of fit as the reference.
2. The method for detecting LED fluorescent powder glue coating flatness based on point cloud information as claimed in claim 1, wherein the step S1 includes: adopting a Li-CCD, wherein the position of reflected light moves along with the position change of a target object on the Li-CCD, and the distance quantity of the target object is measured by detecting the change; the calibration of the laser ranging system refers to adjusting the installation angle of laser to enable the laser to scan a plurality of positioning points on a carrying platform without any object, and the difference between the returned distance values can be controlled within an error threshold value close to 0.
3. The method for detecting LED fluorescent powder glue coating flatness based on point cloud information as claimed in claim 1, wherein the step S2 includes:
and placing the LED chip to be detected of the target coated by the LED fluorescent powder adhesive on a carrying platform, controlling the laser to move at a high speed by a laser ranging system, and ranging the space in a measuring range including the chip according to a zigzag walking method.
4. The method for detecting LED fluorescent powder glue coating flatness based on point cloud information as claimed in claim 1, wherein the step S3 includes:
s3.1 after calibration, the laser emission direction is equal toThe carrier platform being vertical, so that the carrier platform, i.e. ZwSetting a world coordinate system, namely a reference coordinate system O in a coordinate conversion module as 0 planewXwYwZw；
S3.2, calculating the three-dimensional world coordinate (X) corresponding to the measuring point according to the distance measured by the laser point and the number of pulses required by the motor control measuring instrument to reach the measuring pointwi,Ywi,Zwi)；
And S3.3, after complete conversion is carried out on all the measuring points in the measuring range, establishing complete point cloud containing the target LED chip to be detected and the base plate.
5. The method for detecting LED fluorescent powder glue coating flatness based on point cloud information as claimed in claim 1, wherein the step S4 includes:
s4.1 firstly finding a projection to Z according to the complete point cloud of the chipwThe coordinates of four corner points of a rectangular surface on a plane are 0;
s4.2, performing relational operation with the corresponding four corner point coordinates extracted by the ideal chip to determine a rotation matrix R and a translation matrix T of the target chip within the range of [0,180 ℃;
and S4.3, according to the two matrixes R and T, carrying out coordinate transformation on the complete point cloud of the chip to correct the rotational translation offset, namely performing rotational translation correction, namely posture correction on the target LED area.
6. The method for detecting LED fluorescent powder glue coating flatness based on point cloud information as claimed in claim 1, wherein the step S5 includes:
s5.1, the thickness h of the pure substrate before the LED chip to be detected is coated in the database, and the thickness data corresponds to Z in a world coordinate systemwZ on the axisw0；
S5.2 passing through Zw＞Zw0After judgment, the LED fluorescent powder glue coating area can be divided, and each small LED coating area is analyzed independently;
s5.3, after the previous rotation and translation correction, the points of each small LED fluorescent powder glue coating area are reordered and stored, namely the points are arranged in the sequence of' first and later rows by taking the x axis as a row and the y axis as a column.
7. The method for detecting LED fluorescent powder glue coating flatness based on point cloud information as claimed in claim 1, wherein the step S6 includes:
s6.1 if the circular coating effect is achieved, the rapid detection is as follows:
projecting each circular LED coating area point cloud to ZwCalculating the circularity of the plane (0) to judge the conformity of the shape;
considering the data missing phenomenon possibly existing in the point cloud, wherein the data missing comprises the condition that no point data exists on the corresponding coordinate position, 0 is supplemented on the empty data coordinate position, namely ZwCoordinate 0; zwThe axis coordinate represents height information, and is set as Zw(i, j) represents (X)w,Yw) Z corresponding to point at (i, j)wAxial coordinates, (i, j) are coordinate points,. DELTA.hwAnd representing the sum of the point height difference values of each small LED fluorescent powder glue coating area, and then calculating the height consistency according to the following formula:
where n represents the number of columns and rows occupied by each circular area, j0Denotes the first row, jn-1 denotes the last row, i0(j) Representing the first column coordinate, i, corresponding to the jth rown(j) -1 represents the last column coordinate corresponding to the jth row;
the closeness of the connection between points is similar to the calculation of the height consistency, but the difference is that the latter only calculates the height difference, the former calculates the distance value between points, and let P be (i, j, Z)w(i, j)) is falling on (X)w,Yw) World coordinates corresponding to the measurement point at (i, j), in Δ dwFor compactness calculation representativeness, the formula is as follows:
s6.2 if the coating effect is rectangular or square, the quick detection is as follows:
judging the goodness of fit of the shape by calculating the minimum envelope moment;
the high consistency calculation is as follows:
wherein
Showing that each measurement point is compared with all points in the range of the nine-square grid taking the measurement point as the center;
the compactness is calculated as a representative quantity, and the formula is as follows:
wherein
Indicating that each measurement point is to be compared to all points within the grid of squared figures centered on it.
8. A point cloud information-based LED fluorescent powder glue coating flatness rapid detection system for realizing the detection method of any one of claims 1 to 7 is characterized by comprising the following steps:
the laser ranging system is used for calculating a physical distance value from each point in a measuring range to the laser ranging system, and comprises:
1) the motion control module is used for controlling the hardware equipment of the laser ranging system to perform high-speed motion ranging;
2) the laser ranging module is used for measuring a physical distance value from a laser point to the laser ranging system under the position of a target object;
3) the data storage module is used for storing physical distance values of all points in the measurement range;
phosphor powder glue coating roughness analytic system for judge the coating roughness of waiting to examine LED chip, include:
1) the coordinate conversion module is used for converting the physical distance value into a three-dimensional world coordinate value;
2) the region division module is used for dividing the LED fluorescent powder glue coating region in the complete point cloud region of the LED chip to be detected into a block which can be independently processed;
3) and the flatness analysis module is used for calculating three calculation references of each fluorescent powder glue coating area and judging the quality of the flatness.
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| CN117291896A (en) * | 2023-10-09 | 2023-12-26 | 深圳市正东明光电子有限公司 | Verification method and device for white light LED fluorescent powder coating |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0448232A (en) * | 1990-06-18 | 1992-02-18 | Rikagaku Kenkyusho | Measuring method for contact surface pressure distribution |
| CN102969308A (en) * | 2012-11-20 | 2013-03-13 | 彩虹奥特姆（湖北）光电有限公司 | LED (light-emitting diode) lamp structure and packaging method thereof |
| CN103134785A (en) * | 2013-02-07 | 2013-06-05 | 华南理工大学 | Fluorescent powder coating surface defect detecting system and method based on machine vision |
| CN103681983A (en) * | 2013-06-17 | 2014-03-26 | 深圳市绎立锐光科技开发有限公司 | Method for coating fluorescent powder layer on light emitting element and air injection device |
| CN105300325A (en) * | 2015-11-11 | 2016-02-03 | 海信集团有限公司 | Flatness detection method for fluorescent wheel in laser light source and device thereof |
-
2017
- 2017-09-01 CN CN201710775680.8A patent/CN107607064B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0448232A (en) * | 1990-06-18 | 1992-02-18 | Rikagaku Kenkyusho | Measuring method for contact surface pressure distribution |
| CN102969308A (en) * | 2012-11-20 | 2013-03-13 | 彩虹奥特姆（湖北）光电有限公司 | LED (light-emitting diode) lamp structure and packaging method thereof |
| CN103134785A (en) * | 2013-02-07 | 2013-06-05 | 华南理工大学 | Fluorescent powder coating surface defect detecting system and method based on machine vision |
| CN103681983A (en) * | 2013-06-17 | 2014-03-26 | 深圳市绎立锐光科技开发有限公司 | Method for coating fluorescent powder layer on light emitting element and air injection device |
| CN105300325A (en) * | 2015-11-11 | 2016-02-03 | 海信集团有限公司 | Flatness detection method for fluorescent wheel in laser light source and device thereof |
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