CN108956625B - Glue path detection method and glue path detection device - Google Patents
Glue path detection method and glue path detection device Download PDFInfo
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- 239000003822 epoxy resin Substances 0.000 description 2
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Abstract
The application provides a glue path detection method and a glue path detection device. The glue path detection method is used for detecting a glue path between a frame and a middle plate of an electronic device, and comprises the following steps: scanning the rubber road and extracting a rubber road scanning track; judging the defects of the scanning track of the glue path, wherein the defects comprise one or more of outer deviation of the glue path, inner deviation of the glue path and glue breakage; and outputting the defect judgment result. The technical scheme of this application helps improving the precision that glues way and detect.
Description
Technical Field
The present disclosure relates to the field of detection technologies, and in particular, to a method and an apparatus for detecting a glue line.
Background
Glue dispensing is a process, also called glue applying, glue spreading, glue pouring, glue dripping and the like, and is to apply, fill and drip glue, oil or other liquid on a product to ensure that the product has the effects of pasting, filling and sealing, insulation, fixation, smooth surface and the like. Aiming at the fact that the glue dispensing of the ultra-narrow frame is already widely applied in the electronic device industry, under the condition that the width of the glue tends to be more and more limited, the requirement on the position consistency of the glue path is higher and higher, and the method generally adopted by the industry is to arrange that a worker randomly checks the position of the glue path by using a magnifying lens according to certain frequency, such as: the detection standard of the method is difficult to quantify, and the glue path position is subjectively judged by the staff, so that the batch badness is easily caused.
Disclosure of Invention
The application provides a glue path detection method for detecting a glue path between a frame and a middle plate of an electronic device, the glue path detection method comprising the following steps:
scanning the rubber road and extracting a rubber road scanning track;
judging the defects of the scanning track of the glue path, wherein the defects comprise one or more of outer deviation of the glue path, inner deviation of the glue path and glue breakage;
and outputting the defect judgment result.
The method for detecting the rubber road comprises the steps of firstly scanning the rubber road to be detected, extracting a scanning track of the rubber road, and then judging defects of the scanning track of the rubber road, wherein the defects comprise one or more of outer deviation of the rubber road, inner deviation of the rubber road and broken rubber; and finally, outputting a defect judgment result. The method comprises the following steps of: at least one of the glue way external deviation, the glue way internal deviation and glue break is judged, so that the quantitative analysis of the point glue way can be realized, and therefore, the technical scheme of the application is favorable for improving the detection precision of the glue way detection.
The application still provides a glue way detection device for glue way is glued to the point that detects between electron device's frame and the medium plate, glue way detection device includes:
the first scanning and extracting module is used for scanning the rubber road and extracting a scanning track of the rubber road;
the judging module is used for judging the defects of the scanning track of the glue path, wherein the defects comprise one or more of outer deviation of the glue path, inner deviation of the glue path and glue breakage;
and the output module is used for outputting the defect judgment result.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1(a) is a schematic flow chart of a glue line detection method according to an embodiment of the present application.
Fig. 1(b) is a schematic structural diagram of an electronic device after dispensing according to an embodiment of the present disclosure.
FIG. 1(c) is a schematic structural view of the AA cross-sectional view in FIG. 1 (b).
Fig. 2 is a partial flowchart of step S100 according to the first embodiment.
Fig. 3(a) is a partial flowchart of step S200 in the first embodiment of the present application.
Fig. 3(b) is a schematic cross-sectional line view according to an embodiment of the present invention.
Fig. 4 is another partial flowchart of step S200 in the first embodiment.
Fig. 5 is a schematic partial flowchart of step S200 according to the first embodiment.
Fig. 6(a) is a schematic partial flow chart of step S200 in the first embodiment.
Fig. 6(b) is a schematic diagram of a track of a to-be-dispensed portion of a frame of an electronic device according to an embodiment of the present application.
Fig. 7 is a schematic structural diagram of a glue path detection device according to an embodiment of the present application.
Fig. 8 is a schematic structural diagram of a first scan extraction module according to an embodiment.
Fig. 9 is a schematic structural diagram of a determining module according to an embodiment.
Fig. 10 is a schematic structural diagram of another determining module in the first embodiment.
Fig. 11 is a schematic structural diagram of another determining module in the first embodiment.
Fig. 12 is a schematic structural diagram of another determining module in the first embodiment.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive effort based on the embodiments in the present application are within the scope of protection of the present application.
Referring to fig. 1(a), fig. 1(b) and fig. 1(c), fig. 1(a) is a schematic flow chart of a glue line detection method according to an embodiment of the present disclosure. Fig. 1(b) is a schematic structural diagram of an electronic device after dispensing according to an embodiment of the present disclosure. FIG. 1(c) is a schematic structural view of the AA cross-sectional view in FIG. 1 (b). In this embodiment, the glue path detection method is used for detecting a glue path of a glue 4 between a frame 2 and a middle plate 3 of an electronic device 1. Alternatively, the electronic device 1 may be any device having communication and storage functions. For example: the system comprises intelligent equipment with a network function, such as a tablet Computer, a mobile phone, an electronic reader, a remote controller, a Personal Computer (PC), a notebook Computer, vehicle-mounted equipment, a network television, wearable equipment and the like.
Specifically, the glue line detection method includes, but is not limited to, steps S100, S200, and S300, and the steps S100, S200, and S300 are described in detail as follows.
S100: and scanning the rubber road and extracting a rubber road scanning track.
Specifically, in order to connect the frame 2 and the middle plate 3 of the electronic device 1, a glue 4 needs to be filled between the frame 2 and the middle plate 3, so that the connection between the frame 2 and the middle plate 3 is tighter. The colloid 4 is a solid adhesive formed after the liquid colloid is solidified, or a semi-solid and semi-liquid adhesive formed after the liquid colloid is solidified. Optionally, the colloid 4 is epoxy resin crystal glue, and is composed of high-purity epoxy resin, a curing agent and other modifications. The cured product has the characteristics of water resistance, chemical corrosion resistance and glittering and translucent property. The surface of the electronic device 1 can be well protected, the surface gloss and brightness can be increased, and the surface decoration effect is further increased.
Referring to fig. 2, fig. 2 is a partial flowchart illustrating step S100 according to the first embodiment. The step of "S100: scanning the glue path and extracting the glue path scanning track "includes, but is not limited to, steps S110 and S120, and the details about steps S110 and S120 are described below.
S110: and scanning the rubber road by adopting line laser.
The laser is mainly divided into point laser, line laser and surface laser, and the principle of laser ranging is utilized. The spot laser has higher precision but lower sampling frequency. The sampling frequency of the line laser is lower, but the precision is not as good as that of the point laser. The line laser has coordinates in two directions, and can scan the contour by matching with a moving coordinate, while the point laser needs the moving coordinates in two directions, and the scanning is slow and needs to reciprocate. Optionally, the line laser scanning device is a laser two-dimensional scanning sensor ZLDS 200.
S120: and extracting a sampling point at a preset distance, and sequentially connecting all the sampling points according to the sequence to obtain the scanning track of the rubber road.
Specifically, because the line laser two-dimensional scanning sensor is used for extracting sampling points to scan according to a certain sampling frequency during working, a sampling point needs to be extracted at intervals of a preset step length, and then all the sampling points are sequentially connected according to a sequence to obtain a required glue path scanning track. The longer the preset step length is, the shorter the time required by scanning is, and the lower the scanning precision is; the shorter the preset step length is, the longer the time required for scanning is, and the higher the scanning accuracy is. Therefore, in the process of scanning to obtain the glue road scanning track, the time and the scanning precision required by scanning need to be comprehensively considered, and then the preset step length required by scanning needs to be determined.
S200: and judging the defects of the scanning track of the glue path, wherein the defects comprise one or more of outer deviation of the glue path, inner deviation of the glue path and glue breakage.
Specifically, fig. 1(c) is taken as an example to explain in detail. When the glue 4 deviates from the middle plate 3 towards the frame 2, the glue path is considered to be deviated outwards; when the glue body 4 deviates from the frame 2 towards the middle plate 3, the glue path is considered to be deviated inwards; and when the area of the colloid 4 arranged between the middle plate 3 and the frame 2 is smaller than a preset area threshold value, the colloid is considered to be broken.
Referring to fig. 3(a) and fig. 3(b), fig. 3(a) is a partial flow chart of step S200 according to an embodiment of the present disclosure. Fig. 3(b) is a schematic cross-sectional line view according to an embodiment of the present invention. In one embodiment, the "S200: the "determining the defect on the glue line scanning track" includes, but is not limited to, steps S210, S220, S230, and S240, and the steps S210, S220, S230, and S240 are described in detail as follows.
S210: and selecting a cross section B of the rubber road, and obtaining a first scanning track S1 according to the cross section B.
Specifically, referring to fig. 1(B) and fig. 1(c), a cross section B of the glue 4 along the cross sectional direction AA is taken, and a trajectory of the cross section B deviating to the direction of the middle plate 3 is the first scanning trajectory S1 of the glue path.
S220: selecting a first point a1 and a second point a2 which are arranged on a first scanning track S1 at intervals, wherein the projection distance of the first point a1 and the second point a2 in the horizontal direction is a preset distance, and the included angle between the connecting line of the first point a1 and the second point a2 and the horizontal direction is a first included angle alpha.
The preset distance is set in advance, the preset distance can be adjusted according to specific scanning precision, and optionally, the preset distance can be 0.2mm, 0.3mm or 0.5 mm.
The horizontal direction is a direction perpendicular to the middle plate 3 in fig. 1(c), i.e., the X direction.
Referring to fig. 1(c) and fig. 3(b), specifically, a first preset interval AR is used to intercept the first scanning trajectory S1, an intersection point of a minimum interval value of the first preset interval AR and the first scanning trajectory S1 is a first point a1, an intersection point of a maximum interval value of the first preset interval and the first scanning trajectory S1 is a second point a2, and an included angle between a line segment formed by the first point a1 and the second point a2 and the horizontal direction is a first included angle α.
S230: and comparing the first included angle alpha with a first preset angle threshold value.
S240: and when the first included angle alpha is larger than the maximum value of the first preset angle threshold value, judging that the glue path is deviated outwards.
Wherein the first preset angle threshold is manually set. For example, the value range of the first preset angle threshold is [ -5000 °,26 ° ], and when the value of the first included angle α is 27 °, the 27 ° is not in the range of [ -5000 °,26 ° ] and the 27 ° > 26 °, so that the glue road at this time has a glue road external deviation. For another example, assuming that the first included angle α is-25 °, since-25 ° is in the range of [ -5000 °,26 ° ], the glue road is considered to be normal, and no outward deviation of the glue road occurs.
Specifically, since the angle of the trajectory line of the glue line deviation must be increased, only the maximum value of the first preset angle threshold needs to be set, and the minimum value is set to be extremely small. In this embodiment, the maximum value of the first preset angle threshold is selected to be 26 °, and the minimum value of the first preset angle threshold is selected to be-5000 °. It is understood that, in other embodiments, the maximum value and the minimum value of the first preset angle threshold may take other values, and the maximum value and the minimum value of the first preset angle threshold may be adaptively adjusted according to the scanning precision.
Referring to fig. 3(b) and fig. 4, fig. 4 is another partial flowchart of step S200 according to the first embodiment. In another embodiment, the "S200: the "determining the defect on the glue line scanning track" further includes, but is not limited to, steps S250 and S260, and the details of steps S250 and S260 are described below.
S250: and comparing the first included angle alpha with a second preset angle threshold value.
S260: and when the first included angle alpha is smaller than the minimum value of the second preset angle threshold value, judging that the glue path has inner deviation.
Wherein the second preset angle threshold is also manually set. For example, the value range of the second preset angle threshold is [ -20 °, 5000 ° ], and when the value of the first included angle α is-24 °, the-24 ° is not in the range of [ -20 °, 5000 ° ] and-24 ° < -20 °, the glue road at this time is deviated from the glue road. For another example, assuming that the first included angle α is 11 °, since 11 ° is in the range of [ -5000 °,26 ° ], the glue road is considered to be normal, and no deviation of the glue road occurs.
Specifically, since the angle of the trajectory line of the inward deviation of the rubber road must be reduced, only the minimum value of the first preset angle threshold needs to be set, and the maximum value is set to be extremely small. In this embodiment, the minimum value of the first predetermined angle threshold is selected to be-20 °, and the maximum value of the first predetermined angle threshold is selected to be 5000 °. It is understood that, in other embodiments, the maximum value and the minimum value of the first preset angle threshold may take other values, and the maximum value and the minimum value of the first preset angle threshold may be adaptively adjusted according to the scanning precision.
Referring to fig. 3(b) and fig. 5, fig. 5 is a partial flowchart of step S200 according to the first embodiment. In yet another embodiment, the "S200: the "determining the defect on the glue line scanning track" further includes, but is not limited to, steps S270 and S280, and the details of steps S270 and S280 are described below.
S270: and when the first included angle alpha is positioned between the minimum value and the maximum value of the first preset angle threshold value, judging that the glue path does not have outward deviation.
S280: and when the first included angle alpha is positioned between the minimum value and the maximum value of the second preset angle threshold value, judging that the glue path has no inner deviation.
Referring to fig. 1(c) and fig. 6(a), fig. 6(a) is a partial flowchart of step S200 according to the first embodiment. In yet another embodiment, the "S200: the "determining the defect on the glue line scanning track" further includes, but is not limited to, steps S201, S202, S203, and S204, and the steps S201, S202, S203, and S204 are described in detail as follows.
S201: the dispensing locus of the frame 2 is scanned, and a dispensing locus S3 of the frame 2 is extracted (see fig. 6 (b)).
Specifically, the dispensing part of the frame 2 that has not been subjected to the dispensing process is scanned, that is, the empty frame 2 is scanned, and the dispensing trajectory S3 of the frame 2 is extracted (see fig. 6 (b)).
Optionally, the part of the frame 2 to be dispensed is scanned by line laser.
The laser is mainly divided into point laser, line laser and surface laser, and the principle of laser ranging is utilized. The spot laser has higher precision but lower sampling frequency. The sampling frequency of the line laser is lower, but the precision is not as good as that of the point laser. The line laser has coordinates in two directions, and can scan the contour by matching with a moving coordinate, while the point laser needs the moving coordinates in two directions, and the scanning is slow and needs to reciprocate. Optionally, the line laser scanning device is a laser two-dimensional scanning sensor ZLDS 200.
Optionally, one sampling point is extracted at preset intervals, and all the sampling points are sequentially connected according to the sequence to obtain a locus S3 to be dispensed of the portion to be dispensed.
Specifically, because the line laser two-dimensional scanning sensor extracts the sampling points for scanning according to a certain sampling frequency during operation, one sampling point needs to be extracted at intervals of a preset step length, and then all the sampling points are sequentially connected according to a sequence to obtain the dispensing locus S3 of the dispensing part. The longer the preset step length is, the shorter the time required by scanning is, and the lower the scanning precision is; the shorter the preset step length is, the longer the time required for scanning is, and the higher the scanning accuracy is. Therefore, in the process of scanning to obtain the dispensing locus S3 of the dispensing location, it is necessary to comprehensively consider the time and the scanning accuracy required by the scanning, and then determine the preset step length required by the scanning.
S202: and selecting a cross section C of the glue path after glue dispensing, and obtaining a second scanning track S2 according to the cross section C. Referring to fig. 1(c) and fig. 6(b), fig. 6(b) is a schematic diagram of a track of a dispensing portion of a frame of an electronic device according to an embodiment of the present disclosure.
S203: and calculating the area P enclosed by the locus S3 of the to-be-dispensed glue and the locus S2 of the second scanning track in the vertical direction.
The vertical direction is a direction perpendicular to the middle plate 3 in fig. 1(c), i.e., the Y direction.
S204: and when the area P is positioned at a preset area threshold value, judging that the glue break does not occur in the glue path, otherwise, judging that the glue break occurs in the glue path.
Wherein, the preset area threshold is also manually set. For example, the value range of the preset area threshold is [200, 50000], and when the value of the area P is 87, the 87 is not in the range of [200, 50000] and 87 is less than 200, so that the glue circuit is broken. For another example, assuming that the area P is 1814, since 1814 is in the range of [200, 50000], the glue path is considered to be normal, and no glue break occurs.
Specifically, the bad glue breaking can not be judged by using the angle because no glue path profile exists or the glue path profile only has a small part, and the method for calculating the area is adopted. The detection standard of glue breaking is realized by adjusting the maximum value and the minimum value of a preset area threshold value, a detection position and the size of a detection area. The effective area of disconnected glue diminishes certainly, consequently only need set up the minimum of predetermineeing the area threshold value, predetermine the maximum value of area threshold value set up to very big can. In this embodiment, the minimum value of the preset area threshold is 200, and the maximum value of the preset area threshold is 50000. It is understood that, in other embodiments, the maximum value and the minimum value of the preset area threshold may also take other values, and the maximum value and the minimum value of the preset area threshold may be adaptively adjusted according to the scanning precision.
S300: and outputting the defect judgment result.
Referring to fig. 1(b), fig. 1(c) and fig. 7 together, fig. 7 is a schematic structural diagram of a glue path detecting device according to an embodiment of the present disclosure. In this embodiment, the glue path detecting device 10 is used for detecting a glue path between the frame 2 and the middle plate 3 of the electronic device 1, the glue path detecting device 10 includes, but is not limited to, the first scan extracting module 110, the determining module 200, and the output module 300, and the description of the first scan extracting module 110, the determining module 200, and the output module 300 is as follows. The first scan extraction module 110, the judgment module 200 and the output module 300 are fixed in the operating system of the adhesive path detection device 10 in the form of software programs or firmware (firmware), or may be separately installed in the memory 400 of the adhesive path detection device 10, and the processor 500 of the adhesive path detection device 10 controls the execution of each functional module. Each module is described in detail below.
The first scanning and extracting module 110 is configured to scan the adhesive path and extract a scanning track of the adhesive path.
Referring to fig. 8, fig. 8 is a schematic structural diagram of a first scan extraction module according to an embodiment. In one embodiment, the first scan extraction module 110 includes, but is not limited to, a first scan module 111 and a first extraction module 112, and the details of the first scan module 111 and the first extraction module 112 are described below.
The first scanning module 111 is configured to scan the glue road with a line laser.
The first extraction module 112 is configured to extract one sampling point at every preset distance, and sequentially connect all the sampling points in sequence to obtain the rubber road scanning track.
The judging module 200 is configured to judge a defect of the glue path scanning track, where the defect includes one or more of an outer deviation of the glue path, an inner deviation of the glue path, and a glue failure.
Referring to fig. 9, fig. 9 is a schematic structural diagram of a determining module according to an embodiment. In one embodiment, the determining module 200 includes, but is not limited to, a first selecting module 210, a second selecting module 220, a first comparing module 230, and a first determining sub-module 240, and the first selecting module 210, the second selecting module 220, the first comparing module 230, and the first determining sub-module 240 are described in detail below.
The first selecting module 210 is configured to select a cross section of the glue road, and obtain a first scanning track according to the cross section.
The second selecting module 220 is configured to select a first point and a second point which are arranged on the first scanning track at intervals, a distance between the first point and the second point projected in the horizontal direction is a preset distance, and an included angle between a connecting line of the first point and the second point and the horizontal direction is a first included angle.
A first comparing module 230, configured to compare the first included angle with a first preset angle threshold.
And the first judging submodule 240 is configured to judge that the glue path is out-of-range when the first included angle is greater than the maximum value of the first preset angle threshold.
Referring to fig. 10, fig. 10 is a schematic structural diagram of another determining module according to the first embodiment. In another embodiment, the determining module 200 includes, but is not limited to, a second comparing module 250 and a second determining sub-module 260, and the details of the second comparing module 250 and the second determining sub-module 260 are described below.
A second comparing module 250, configured to compare the first included angle with a second preset angle threshold.
And the second judging submodule 260 is configured to judge that the glue path has an inner deviation when the first included angle is smaller than the minimum value of the second preset angle threshold.
Referring to fig. 11, fig. 11 is a schematic structural diagram of another determining module according to the first embodiment. In yet another embodiment, the determination module 200 includes, but is not limited to, a third determination sub-module 270 and a fourth determination sub-module 280, and the details of the third determination sub-module 270 and the fourth determination sub-module 280 are described below.
And a third determining submodule 270, configured to determine that the glue line has no outward deviation when the first included angle is located between the minimum value and the maximum value of the first preset angle threshold.
And the fourth judging submodule 280 is configured to judge that the glue path has no inner deviation when the first included angle is between the minimum value and the maximum value of the second preset angle threshold.
Referring to fig. 12, fig. 12 is a schematic structural diagram of another determining module according to the first embodiment. In yet another embodiment, the determining module 200 includes, but is not limited to, the second scan extracting module 201, the third selecting module 202, the calculating module 203 and the fifth determining sub-module 204, and the details of the second scan extracting module 201, the third selecting module 202, the calculating module 203 and the fifth determining sub-module 204 are described below.
The second scanning and extracting module 201 is configured to scan a to-be-dispensed portion of the frame and extract a to-be-dispensed trajectory of the frame.
And a third selecting module 202, configured to select a cross section of the dispensed glue path, and obtain a second scanning track according to the cross section.
The calculating module 203 is configured to calculate an area enclosed by the to-be-dispensed trajectory and the second scanning trajectory in the vertical direction.
And the fifth judging submodule 204 is configured to judge that the glue line has no glue break when the area of the region is within a preset area threshold, and otherwise, judge that the glue line has a glue break.
The output module 300 is configured to output a defect judgment result.
It will be understood by those skilled in the art that all or part of the steps in the methods of the embodiments described above may be implemented by hardware instructions, and the programs may also be stored in a computer-readable storage medium, which includes Read-Only Memory (ROM), Random Access Memory (RAM), Programmable Read-Only Memory (PROM), Erasable Programmable Read-Only Memory (EPROM), One-time Programmable Read-Only Memory (OTPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM), Compact Disc Read-Only Memory (CD-ROM), or other disk memories, A tape memory, or any other medium readable by a computer that can be used to carry or store data.
The foregoing detailed description of the embodiments of the present application has been presented to illustrate the principles and implementations of the present application, and the above description of the embodiments is only provided to help understand the method and the core concept of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (8)
1. A glue path detection method is used for detecting a glue path between a frame and a middle plate of an electronic device, and is characterized by comprising the following steps:
scanning the rubber road and extracting a rubber road scanning track;
and judging the defects of the scanning track of the glue path, wherein the defects comprise one or more of glue path external deviation, glue path internal deviation and glue breaking, and the method comprises the following steps: selecting a cross section of the rubber road, and obtaining a first scanning track according to the cross section; intercepting the first scanning track by adopting a first preset interval, wherein the intersection point of the minimum interval value of the first preset interval and the first scanning track is a first point, the intersection point of the maximum interval value of the first preset interval and the first scanning track is a second point, the projection distance of the first point and the second point in the horizontal direction is a preset distance, and the included angle between the connecting line of the first point and the second point and the horizontal direction is a first included angle; comparing the first included angle with a first preset angle threshold value; when the first included angle is larger than the maximum value of the first preset angle threshold value, judging that the glue path is deviated outwards; comparing the first included angle with a second preset angle threshold value, and judging that the glue path has an inner deviation when the first included angle is smaller than the minimum value of the second preset angle threshold value; when the area of the glue arranged between the middle plate and the frame is smaller than a preset area threshold value, judging that the glue is broken in the glue path;
and outputting the defect judgment result.
2. The method for detecting a glue line according to claim 1, wherein the scanning the glue line and extracting the glue line scanning trajectory comprises:
scanning the rubber road by adopting line laser;
and extracting a sampling point at a preset distance, and sequentially connecting all the sampling points according to the sequence to obtain the scanning track of the rubber road.
3. The method for detecting a glue line according to claim 1, wherein the step of determining the defect of the glue line scanning track further comprises:
when the first included angle is located between the minimum value and the maximum value of the first preset angle threshold value, judging that the glue path does not deviate outwards;
and when the first included angle is positioned between the minimum value and the maximum value of the second preset angle threshold value, judging that the glue path has no inner deviation.
4. The method for detecting a glue line according to claim 1, wherein the step of determining the defect of the glue line scanning track further comprises:
scanning a part to be subjected to glue dispensing of the frame, and extracting a track to be subjected to glue dispensing of the frame;
selecting a cross section of the glue path subjected to glue dispensing, and obtaining a second scanning track according to the cross section;
calculating the area of a region surrounded by the locus to be dispensed and the second scanning locus in the vertical direction;
and when the area of the area is positioned at a preset area threshold value, judging that the glue of the glue path is not broken, otherwise, judging that the glue of the glue path is broken.
5. The utility model provides a glue way detection device for detect the glue way of gluing of point between electron device's frame and the medium plate, its characterized in that, glue way detection device includes:
the first scanning and extracting module is used for scanning the rubber road and extracting a scanning track of the rubber road;
the judging module is used for judging the defects of the scanning track of the glue path, the defects comprise one or more of outer deviation of the glue path, inner deviation of the glue path and glue breakage,
wherein, the judging module comprises:
the first selecting module is used for selecting the cross section of the rubber road and obtaining a first scanning track according to the cross section;
the second selection module is used for selecting a first point and a second point which are arranged at intervals on a first scanning track, and specifically comprises the steps of intercepting the first scanning track by adopting a first preset interval, wherein the intersection point of the minimum interval value of the first preset interval and the first scanning track is a first point, the intersection point of the maximum interval value of the first preset interval and the first scanning track is a second point, the projection distance of the first point and the second point in the horizontal direction is a preset distance, and the included angle between the connecting line of the first point and the second point and the horizontal direction is a first included angle;
the first comparison module is used for comparing the first included angle with a first preset angle threshold value;
the first judgment submodule is used for judging that the glue path has the outward deviation when the first included angle is larger than the maximum value of the first preset angle threshold value, comparing the first included angle with a second preset angle threshold value, and judging that the glue path has the inward deviation when the first included angle is smaller than the minimum value of the second preset angle threshold value; when the area of the glue arranged between the middle plate and the frame is smaller than a preset area threshold value, judging that the glue is broken in the glue path;
and the output module is used for outputting the defect judgment result.
6. The adhesive tape dispenser according to claim 5, wherein said first scanning module comprises:
the first scanning module is used for scanning the rubber road by adopting line laser;
and the first extraction module is used for extracting a sampling point at a preset distance, and sequentially connecting all the sampling points according to the sequence to obtain the rubber road scanning track.
7. The glue line detection device of claim 6, wherein the determination module further comprises:
the third judgment submodule is used for judging that the glue path does not have outward deviation when the first included angle is between the minimum value and the maximum value of the first preset angle threshold value;
and the fourth judgment submodule is used for judging that the glue path has no inner deviation when the first included angle is between the minimum value and the maximum value of the second preset angle threshold value.
8. The glue line detection device of claim 5, wherein the determination module further comprises:
the second scanning and extracting module is used for scanning the positions, to be subjected to glue dispensing, of the frame and extracting tracks, to be subjected to glue dispensing, of the frame;
the third selecting module is used for selecting the cross section of the glue path after glue dispensing and obtaining a second scanning track according to the cross section;
the calculation module is used for calculating the area of a region surrounded by the locus to be dispensed and the second scanning locus in the vertical direction;
and the fifth judgment submodule is used for judging that the glue circuit is not broken when the area of the area is positioned at a preset area threshold value, and otherwise, judging that the glue circuit is broken.
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| CN111272081B (en) * | 2020-01-19 | 2022-09-30 | 苏州玻色智能科技有限公司 | Mobile phone shell glue line online detection method |
| CN111324261B (en) * | 2020-01-20 | 2021-01-19 | 北京无限光场科技有限公司 | Intercepting method and device of target object, electronic equipment and storage medium |
| CN111337500B (en) * | 2020-02-24 | 2023-01-24 | Oppo广东移动通信有限公司 | Dispensing control method, display module and electronic equipment |
| CN112344879B (en) * | 2020-09-29 | 2022-03-25 | 联想(北京)有限公司 | Method, device and equipment for detecting glue road |
| CN112381781B (en) * | 2020-11-11 | 2021-10-01 | 征图智能科技(江苏)有限公司 | Glue road defect detection method based on 3D point cloud |
| CN113686867A (en) * | 2021-07-15 | 2021-11-23 | 昆山丘钛微电子科技股份有限公司 | Dispensing quality detection method and device, medium and camera focusing machine |
| CN114061765A (en) * | 2021-10-29 | 2022-02-18 | 歌尔股份有限公司 | Device glue path detection method, control device and glue dispensing device |
| CN114252414A (en) * | 2021-11-29 | 2022-03-29 | 歌尔股份有限公司 | Device and method for inspecting rubber road state |
| CN114152621A (en) * | 2021-11-30 | 2022-03-08 | 联想(北京)有限公司 | Processing method, processing device and processing system |
| CN114494241B (en) * | 2022-02-18 | 2023-05-26 | 工游记工业科技(深圳)有限公司 | Method, device and equipment for detecting rubber path defects |
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