CN101747587B - 阻燃树脂组合物、半固化片及制备方法、覆铜板及制备方法 - Google Patents
阻燃树脂组合物、半固化片及制备方法、覆铜板及制备方法 Download PDFInfo
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- CN101747587B CN101747587B CN2008101835968A CN200810183596A CN101747587B CN 101747587 B CN101747587 B CN 101747587B CN 2008101835968 A CN2008101835968 A CN 2008101835968A CN 200810183596 A CN200810183596 A CN 200810183596A CN 101747587 B CN101747587 B CN 101747587B
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- 125000001997 phenyl group Chemical class [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
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- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 6
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical class N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 5
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- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 2
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- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
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- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
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- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
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- 239000004902 Softening Agent Substances 0.000 description 1
- KTUFKADDDORSSI-UHFFFAOYSA-N acebutolol hydrochloride Chemical compound Cl.CCCC(=O)NC1=CC=C(OCC(O)CNC(C)C)C(C(C)=O)=C1 KTUFKADDDORSSI-UHFFFAOYSA-N 0.000 description 1
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- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
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- Laminated Bodies (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
项目 | 标准(常态/处理) | 1 | 2 | 3 | 4 |
介电常数 | ≤5.0/≤5.3 | 3.66/4.77 | 3.76/4.53 | 3.33/4.41 | 4.00/4.77 |
介电正切 | ≤0.040/≤0.050 | 0.031/0.035 | 0.033/0.037 | 0.038/0.044 | 0.035/0.036 |
吸水率 | ≤0.75%(处理后) | 0.56 | 0.46 | 0.65 | 0.54 |
耐漏电性 | ≥200V | 200V,51滴 | 200V,52滴 | 200V,54滴 | 200V,52滴 |
游离酚含量 | ≤3.5μg/cm2 | 1.3 | 1.5 | 2.5 | 1.6 |
耐浸焊性 | ≥10sec(处理后) | 32 | 44 | 30 | 40 |
阻燃 | UL94V0 test | V-0 | V-0 | V-0 | V-0 |
项目 | 标准(常态/处理) | 5 | 6 | 7 | 8 |
介电常数 | ≤5.0/≤5.3 | 3.78/4.80 | 3.12/4.46 | 3.66/4.79 | 3.29/4.32 |
介电正切 | ≤0.040/≤0.050 | 0.031/0.036 | 0.033/0.039 | 0.035/0.041 | 0.032/0.036 |
吸水率 | ≤0.75%(处理后) | 0.60 | 0.49 | 0.52 | 0.56 |
耐漏电性 | ≥200V | 200V,52滴 | 200V,56滴 | 200V,53滴 | 200V,53滴 |
游离酚含量 | ≤3.5μg/cm2 | 2.8 | 1.3 | 3.0 | 2.2 |
耐浸焊性 | ≥10sec(处理后) | 28 | 39 | 32 | 27 |
阻燃 | UL94V0 test | V-0 | V-0 | V-0 | V-0 |
Claims (12)
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CN2008101835968A CN101747587B (zh) | 2008-12-18 | 2008-12-18 | 阻燃树脂组合物、半固化片及制备方法、覆铜板及制备方法 |
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CN2008101835968A CN101747587B (zh) | 2008-12-18 | 2008-12-18 | 阻燃树脂组合物、半固化片及制备方法、覆铜板及制备方法 |
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CN101747587A CN101747587A (zh) | 2010-06-23 |
CN101747587B true CN101747587B (zh) | 2012-11-28 |
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108026424B (zh) | 2015-09-15 | 2020-12-08 | 3M创新有限公司 | 粘合剂组合物和由其制造的制品 |
EP3350276A4 (en) | 2015-09-15 | 2019-04-24 | 3M Innovative Properties Company | ADHESIVE COMPOSITION AND ARTICLE MADE THEREFROM |
CN106189067A (zh) * | 2016-08-03 | 2016-12-07 | 广东广山新材料有限公司 | 一种含有碳纤维的预浸料、制备方法及应用 |
CN106433018B (zh) * | 2016-09-13 | 2019-02-19 | 抚州市龙兴电子材料有限公司 | 一种阻燃型纸基覆铜板用胶液、阻燃型纸基覆铜板及其制备方法 |
CN107880252B (zh) * | 2017-11-30 | 2020-04-17 | 西北师范大学 | 一种功能化无机基质固化剂的制备方法 |
CN108530682B (zh) * | 2018-04-02 | 2020-07-03 | 北京工商大学 | 一种磷腈/三嗪双基分子微交联阻燃体系及其阻燃热塑性树脂 |
CN114933779B (zh) * | 2022-04-26 | 2023-03-24 | 建滔(佛冈)积层板有限公司 | 一种用于纸基复合覆铜板的阻燃胶液及其应用 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1242784A (zh) * | 1997-10-15 | 2000-01-26 | 大塚化学株式会社 | 交联苯氧基磷腈化合物、阻燃剂、阻燃性树脂组合物和阻燃性树脂成形体 |
CN101096442A (zh) * | 2007-06-20 | 2008-01-02 | 招远金宝电子有限公司 | 树脂组合物及用于生产环保型高耐浸焊阻燃型纸基覆铜板的方法 |
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2008
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1242784A (zh) * | 1997-10-15 | 2000-01-26 | 大塚化学株式会社 | 交联苯氧基磷腈化合物、阻燃剂、阻燃性树脂组合物和阻燃性树脂成形体 |
CN101096442A (zh) * | 2007-06-20 | 2008-01-02 | 招远金宝电子有限公司 | 树脂组合物及用于生产环保型高耐浸焊阻燃型纸基覆铜板的方法 |
Non-Patent Citations (1)
Title |
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JP特开2004-18602A 2004.01.22 |
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