CN101740350A - IC (integrated circuit)-packaged wafer expanding device - Google Patents
IC (integrated circuit)-packaged wafer expanding device Download PDFInfo
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- CN101740350A CN101740350A CN200910213769A CN200910213769A CN101740350A CN 101740350 A CN101740350 A CN 101740350A CN 200910213769 A CN200910213769 A CN 200910213769A CN 200910213769 A CN200910213769 A CN 200910213769A CN 101740350 A CN101740350 A CN 101740350A
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Abstract
The invention relates to an IC (integrated circuit)-packaged wafer expanding device which comprises a wafer box feeding mechanism, a wafer picking mechanism, a wafer expanding mechanism and the like. In the wafer box feeding mechanism, a screw rod rotates and an undercarriage drives a wafer box to descend grid by grid under the driving of a stepping motor; the wafer box stops for a period of time for each one-grid descent so that the wafer picking mechanism can take a wafer from a wafer disc; and when the feeding of one wafer box is finished, a new wafer box is fed sequentially. The wafer picking mechanism is powered by only one electric motor to finish the whole wafer picking, wafer transferring and wafer delivering processes by being matched with the operation of an electric magnet. In the wafer expanding mechanism, the inner ring of a wafer can be pressed into the outer ring with the middle clamped with a rubber film, so that the silicon wafer can be tightened, thereby finishing the operation of tightening the inner ring and the outer ring. The process is powered by a main air cylinder. When the inner ring is pressed into the outer ring and placed in position, a piston rod of the main air cylinder moves upwards sequentially, a serrated knife contacts the tightened rubber film, a serrated tip punctures the rubber film, and a crevasse is torn towards the direction between two teeth, thereby enabling a liner frame to be separated from the expanded wafer. The invention can realize the mechanization and the automation, has high production efficiency, and can ensure the production quality.
Description
Technical field
The present invention is a kind of brilliant the expansion of the wafer finished product of IC manufacture process, with the wafer expanding device that the IC that forms wafer available on the die Bonder encapsulates, belongs to the renovation technique of the wafer expanding device of IC encapsulation.
Background technology
The production of IC element is divided into the preceding operation of chip manufacturing and the back operation of microelectronics Packaging.Preceding operation is polysilicon to be melted to pull out the monocrystalline silicon crystal bar earlier substantially, cuts into the very thin monocrystalline silicon disk of a slice a slice then, i.e. wafer.Through operations such as grinding, polishing, photoetching, on a slice wafer, make the integrated circuit of hundreds thousand of meters.
Back operation is the microelectronics Packaging operation, comprising: bonding die, bonding wire, plastic packaging, test, sorting, mark etc., can produce the IC element of various different sizes and performance at last.Before bonding die, expand crystalline substance to the wafer that preceding operation makes, to form available wafer on the die Bonder.
Silicon wafer, glued membrane and metal liner frame that preceding operation is produced paste and are integral.Silicon wafer is through horizontal and vertical cutting, and silicon wafer is cut into the chip of a grain, pastes and the supporting of lining frame convenient further processing by glued membrane.Expand in the brilliant process, earlier glued membrane is tightened, make the distance between chip and the chip be extended to reasonable request and evenly distribution; Bind round mutually from the two sides of glued membrane with inner ring by the outer ring again, glued membrane is being stretched tight with Internal and external cycle; Cut off glued membrane at last along the outer ring, separate, become the wafer that makes things convenient for back bonding die process operations with the lining frame.The shortcoming that existing wafer expanding device exists is that the feed of outer ring and inner ring, the process of getting sheet and the brilliant process of expansion can not realize mechanization and automation effectively, and production efficiency is low, and quality is difficult to guarantee.
Summary of the invention
The objective of the invention is to consider the problems referred to above and provide a kind of outer ring and inner ring feed, get the process of sheet and expand brilliant process and can realize mechanization and automation, production efficiency height, and can guarantee the wafer expanding device of the IC encapsulation of the quality of production.The present invention is reasonable in design, and is convenient and practical.
Technical scheme of the present invention is: the wafer expanding device of IC encapsulation of the present invention, include and be arranged on the brilliant mechanism of the expansion of expanding in the brilliant station, it comprises lower clamping ring, connector, last trim ring, the inner ring jacking block, inner ring, the outer ring, cover plate, the lining frame, serrated knife, lever plate, table top, take over a business, little cylinder, rubber ring, pull bar, following table, master cylinder, wherein master cylinder places the bottom of frame, and its piston is connected with following table, following table by pillar and in table top and cushion block with take over a business to be connected, take over a business with the pull bar that places its below to be connected, be equiped with two block pressur plates up and down on the pull bar, rubber ring is installed in up and down between two block pressur plates, and the top board of installing on the pull bar is connected with the circle jacking block that inner ring can be headed in the outer ring by two little push rods, with silicon wafer, glued membrane pastes all-in-one-piece lining frame and is installed in the outside of taking over a business, and the both sides up and down of lining frame are compressed by last trim ring and lower clamping ring respectively, last trim ring is connected with cover plate by connector, one end of lever plate connects with the connector that is connected on the cover board by jointed shaft, the other end of lever plate is connected with the piston rod of little cylinder, cover plate is connected with the table top that is installed in frame, and the outside of taking over a business also is equiped with and can punctures glued membrane, make to finish and expand brilliant wafer and serve as a contrast the serrated knife that frame breaks away from.
Above-mentioned connector is for regulating lining frame and the vertical range of cover plate and the adjusting bolt of levelness after compressing; Above-mentioned cover plate is connected with the table top that is installed in frame with respect to the bolt of the height between the table top by adjusting cover plate.
Two guide pin bushings are housed on the table top in above-mentioned, table top is provided with the guiding guide pillar on the position corresponding to guide pin bushing, middle table top and take over a business between be provided with cushion block.
The side at the brilliant station of above-mentioned expansion also is provided with wafer box feeding mechanism, wafer box feeding mechanism includes film magazine, stepping motor, shaft coupling, undercarriage, ball screw, thin type cylinder, guide rail, spindle drum, two bar cylinders, wherein seasoning has by glued membrane and is fixed on the silicon wafer of lining in the frame in the film magazine, every silicon wafer is inserted in the interior lattice separately of film magazine, and isolate mutually, some film magazine piles are on the undercarriage that moves up and down along line slideway, wherein undercarriage is fixed on the ball screw, ball screw is connected with stepping motor by shaft coupling, ball screw is formed the worm drive pair with the nut that is fixed on frame, the side of undercarriage also is provided with the thin type cylinder that the process of getting sheet from top film magazine top film magazine clamping stagnation can not be descended, and guide rail is provided with and will pushes away two bar cylinders that the sky film magazine is released.
The side of the film magazine of above-mentioned some piles is provided with support, and support and undercarriage constitute the film magazine station.
The side of above-mentioned wafer box feeding mechanism also is provided with gets sheet mechanism, this is got sheet mechanism and includes electric machine support, second motor, belt pulley, cog belt, swivel plate, crank, connecting rod, main shaft, slide block, electromagnet, wherein second motor is fixed on the electric machine support, belt pulley is connected with the output shaft of second motor, cog belt and belt pulley and driven pulley are formed the band transmission, main shaft is connected with the rotating shaft of driven pulley or is coaxial, crank is connected with main shaft, one end of connecting rod is connected with crank, the other end of connecting rod is connected with slide block, slide block is connected with the sheet folder of getting that can put in film magazine clamping silicon wafer and lining frame thereof, swivel plate places the bottom surface of slide block, above-mentioned main shaft supporting is in inner bearing, inner bearing is installed in the inner pedestal, inner pedestal is bearing on the outer bearing, outer bearing is installed on the spindle drum, electric machine support and spindle drum are installed on the substrate by connector, substrate is connected with frame, swivel plate and inner pedestal are installed as one, and be provided with damping mechanism between the end face of swivel plate and the bottom surface of slide block, swivel plate is provided with the location hole of the pin reeve that can make electromagnet.
The damping mechanism that is provided with between the end face of above-mentioned swivel plate and the bottom surface of slide block is a tumbler lock mechanism, include ball and spring, ball and spring are installed in the slide block, when the pin of electromagnet injects the location hole of swivel plate, be installed in ball in the slide block under the effect of spring, 1/3 spheroid of ball enters in the mating holes of guide rail, to the motion generation damping of slide block and guide rail.
The side at the brilliant station of above-mentioned expansion also is provided with the delivery device of outer ring and inner ring, above-mentioned outer ring and inner ring place respectively in outer ring storage circle tube and the inner ring storage circle tube, the tube end of outer ring storage circle tube and inner ring storage circle tube has groove width can be by the groove of outer ring and inner ring, and outer ring in outer ring storage circle tube and the inner ring storage circle tube and inner ring are released the circle tube by corresponding slider-crank mechanism respectively and sent on the relevant position of above-mentioned expansion crystalline substance in standing.
The slider-crank mechanism of above-mentioned propelling movement outer ring includes second connecting rod, second crank, outer ring and pushes away girth sheets, wherein an end of second connecting rod is connected with second crank, and the other end of second connecting rod pushes away girth sheets and is connected with the outer ring in the storage circle tube of outer ring being released the circle tube and send into outer ring in the brilliant station of above-mentioned expansion; The slider-crank mechanism that pushes inner ring includes third connecting rod, the 3rd crank, inner ring and pushes away girth sheets, wherein an end of third connecting rod is connected with the 3rd crank, and the other end of third connecting rod pushes away girth sheets and is connected with the inner ring in the inner ring storage circle tube being released the circle tube and send into inner ring in the brilliant station of above-mentioned expansion.
The groove height of above-mentioned outer ring storage circle tube and inner ring storage circle tube equals the thickness of outer ring and inner ring respectively.
The present invention is owing to adopting by wafer box feeding mechanism, getting mechanisms such as sheet mechanism and expansion crystalline substance, make the wafer finished product realize mechanization and automation expansion crystalline substance, form the structure of spendable wafer on the die Bonder, therefore, the degree height of mechanization of the present invention and automation, the production efficiency height, and can guarantee the quality of production.The present invention is that a kind of design is ingenious, function admirable, the wafer expanding device of convenient and practical IC encapsulation.
Description of drawings
Fig. 1 is the brilliant structural scheme of mechanism of expansion of the present invention;
Fig. 2 is wafer box feeding mechanism of the present invention and gets the sheet principle schematic;
Fig. 3 is the sheet mechanism schematic side view of getting of the present invention;
Fig. 4 is the brilliant mechanism of an expansion of the present invention schematic top plan view;
Among Fig. 1: 1. lower clamping ring 2. is regulated on the bolts 3. trim ring 4. inner ring jacking blocks 5. inner rings 6. outer rings 7. cover plates, 8. bolts, 9. lining framves, 10. serrated knife 11. and is shouldered bar plate 12. table tops 13. and take over a business 14. guide pin bushings, 15. cushion blocks, 16. stingy cylinder 17. rubber rings 18. pull bars 19. following tables 20. master cylinders
Among Fig. 2: 213. pairs of bar cylinders of 21. film magazines, 22. stepping motor 23. shaft couplings, 24. undercarriage 25. ball screws, 26. support 27. thin type cylinders, 28. guide rail 29. spindle drums, 210. swivel plate 211. cranks, 212. connecting rods, 214. slide blocks, 215. guide rails
Among Fig. 3: 31. electric machine supports, 32. second motor, 33. belt pulleys, 34. substrates, 35. cog belts, 36. outer bearings, 37. inner bearings, 38. inner pedestals, 29. spindle drums, 210. swivel plates, 211. cranks, 212. connecting rods, 313. main shafts, 214. slide blocks, 315. electromagnet
Among Fig. 4: 21. film magazines 42. are got sheet and are pressed from both sides 212. connecting rods, 313. main shafts, 211. cranks, 46. second connecting rods, 47. second cranks, 48. outer rings and push away girth sheets 49. outer ring tubes 410. inner rings and push away girth sheets 411. third connecting rods 412. the 3rd crank 413. inner ring tubes 414. and expand brilliant station.
Embodiment
Embodiment:
Wafer box feeding mechanism of the present invention and get the sheet principle schematic as shown in Figure 2, silicon wafer is fixed in the lining frame 9 by glued membrane, and seasoning is 21 li of film magazines.Many lattice are arranged in the film magazine 21, and every silicon wafer is inserted in separately the lattice isolates mutually, is protected in transportation and access procedure chips.Film magazine 21 piles are in the film magazine station that support 26 and undercarriage 24 etc. constitute.Undercarriage 24 is by parts such as line slideway, nut and screw mandrel 25 constraints, and under the driving of stepping motor 22, screw mandrel 25 rotations make undercarriage 24 move up and down along line slideway.Each film magazine 21 moves lattice from top to bottom, waits to get after sheet mechanism takes out a slice silicon wafer, moves down lattice again.When film magazine 21 feeds finish, just the lattice from the bottom of a last film magazine 21 begin the feed silicon wafer.Getting the process of sheet from top new film magazine 21, thin type cylinder 27 actions can not descend top film magazine 21 clamping stagnations, and the empty film magazine below stepping motor 22 drives quickly falls on the guide rail 28 of bottom surface, two bar cylinder 213 actions, and push rod is released empty film magazine.After treating that two bar cylinders 213 reset, stepping motor 22 reverses, and undercarriage 24 is lifted holding in the palm top film magazine, and last thin type cylinder 27 resets, and undercarriage 24 is asking new film magazine 21 to continue feeds.
The power of getting sheet is provided by the main shaft in the spindle drum 29 313, and the power of main shaft 313 comes from second motor 32.Second motor 32 drives crank 211, connecting rod 212 and slide block 214 and finishes the reciprocating motion of slide block 214 along guide rail 215.In the reciprocating motion each time of slide block 214, can drive anchor clamps, a slice silicon wafer is taken out from film magazine 21.The end view of getting sheet mechanism as shown in Figure 3.Inner pedestal 38 and main shaft 313 are housed in the spindle drum 29 among the figure, all can in spindle drum 29, rotate.Main shaft 313 is mounted to one with crank 211, and main shaft 313 can drive crank 211 rotations, realizes that motion is picked up and sent to the orthoscopic of silicon wafer.In like manner, inner pedestal 38 is integral with swivel plate 210 fixed installations, i.e. direct driven rotary plate 210 rotations of inner pedestal 38 energy of rotations, the transmission of silicon wafer 180 degree after realizing taking out.
When the electromagnet 315 among Fig. 3 was not switched on, pin stretched out under the effect of spring and injects in the location hole of swivel plate 210, made swivel plate 210 to rotate.So when motor 32 rotates, can only drive main shaft 313 rotations.Preceding half cycle in one week makes slide block 214 protruding by crank 211 and connecting rod 212, drives the metal liner frame that anchor clamps put in film magazine clamping silicon wafer.Second half slide block drawback movement, the silicon wafer that clamping takes out.After getting the sheet end, electromagnet 315 energisings, pin withdraws from from the location hole of swivel plate 210, make swivel plate 210 under the drive of motor 32, to rotate, be that silicon wafer not only can take out (main shaft rotation) from film magazine 21, and can be along main axis rotation 180 degree (inner pedestal rotations), be delivered to expand brilliant the station before.This moment, the location hole of swivel plate 210 other ends was come near the electromagnet 315, electromagnet 315 outages, and pin stretches out and injects swivel plate 210 is stopped the rotation.Main shaft 313 is rotated further a week, drives slide block 214 reciprocating motions once, silicon wafer is sent to expanded in the brilliant station 414.Electromagnet 315 is switched on again then, and swivel plate 210 is rotatable again, and gets back to initial position.This process is gone round and begun again, and constantly gets sheet, passes sheet and passs sheet.
Between slide block 214 and the guide rail 215 specially designed damping device is arranged, i.e. tumbler lock mechanism.When electromagnet 315 pins inject swivel plate 210 location holes, be installed in ball in the slide block 214 under the effect of spring, 1/3 spheroid enters in the mating holes of guide rail 215, to the motion generation damping of slide block 214 with guide rail 215, and swivel plate 210 has broken away from the clamping stagnation of electromagnet 315 pins this moment, can easily turn round.When swivel plate 210 revolutions put in place, be subjected to the clamping stagnation of electromagnet 315 pins once more, main shaft power makes the bigger motion active force of generation between slide block 214 and the guide rail 215, make the ball that produces damping action withdraw from the mating holes of guide rail, damping state disappears, and slide block 214 continues the reciprocating motion of one-period.
By the cooperation of electromagnet 315 action sequences, can make and get brilliant mechanism and realize only providing power by a motor, finish and get sheet, pass sheet and pass the entire exercise of sheet.
Among Fig. 4 49 and 413 is respectively the storage circle tube of outer ring 6 and inner ring 5.Outer ring 6 and inner ring 5 are put into storage circle tube respectively from top to bottom.The tube end, have groove, the external diameter that groove width equals to enclose, and groove is high in the thickness of circle.All can be pushed the tube and send into and expand brilliant station 414 of going too far by corresponding slider-crank mechanism Internal and external cycle.
The inner ring 5 of wafer shown in Figure 1 can be pressed into outer ring 6, and the sandwich glued membrane is tightened silicon wafer, finishes the action of hoop Internal and external cycle.The power of this process is provided by master cylinder 20.The piston rod of master cylinder heads on the following table 19 and moves, and power arrives cushion block 15 and takes over a business 13 by pillar, middle table top.By being contained in following pull bar 18, compressing rubber circle 17 is sent to inner ring jacking block 4 by two little push rods with power again to a certain degree, and inner ring 5 is headed in the outer ring 6 again.The final position of Internal and external cycle can be by the nut of regulating on the bolt 8 by the height and position decision of cover plate, and adjustment cover plate 7 obtains with respect to the height of table top 12.
After inner ring was pressed into the outer ring and puts in place, it is up that the piston rod of master cylinder 20 continues, and takes over a business 13 also uply, and serrated knife 10 contact with the glued membrane of tightening, and glued membrane break in sawtooth Jianzha County, and the cut place tears to two between cog, finally makes lining frame and the wafer disengaging of finishing the expansion crystalline substance.In this process inner ring jacking block 4 can not on move, therefore, rubber ring continues compressive deformation.Adjust the nut of pull bar 18, pressure that can pretension rubber makes Internal and external cycle be pressed onto the position earlier, and serrated knife 10 is just stretched out the cutting glued membrane then.
On the middle table top two guide pin bushings 14 are housed, are subjected to the line constraint of table top 12 upper guide posts, guarantee to expand the kinematic accuracy of brilliant mechanism to top offset.
The lining frame 9 that is supporting silicon wafer is compressed by lower clamping ring 1 and last trim ring 3 after being sent to and expanding brilliant station, and power is provided by stingy cylinder 16.The piston rod of little cylinder is up, acts on the right-hand member of lever plate 11.Lever plate 11 can be along the bearing pin moving on the left side, and the centre has two fore-sets to contact with lower clamping ring 1, the power of little cylinder is transmitted be used to compress the lining frame.
By regulating three bolts 2 among Fig. 1 respectively, can regulate lining frame 9 after compressing apart from the vertical range and the levelness of cover plate 7, the pre-amount of tension that can regulate glued membrane in view of the above, the gap between the chip of brilliant back is expanded in control.Because big more apart from the cover plate distance, the distortion of glued membrane when expanding crystalline substance is big more.The predeformation amount of glued membrane adds that inner ring gets into the fixed deformation amount of outer ring, becomes the brilliant amount of total expansion.
Finishing the useless lining frame that expands after brilliant wafer finished product and the cutting is pushed out respectively from expanding brilliant 414 same directions but the different height of standing.
Claims (10)
1. the wafer expanding device of IC encapsulation, it is characterized in that including being arranged on and expand the brilliant mechanism of the interior expansion in brilliant station (414), it comprises lower clamping ring (1), connector (2), last trim ring (3), inner ring jacking block (4), inner ring (5), outer ring (6), cover plate (7), lining frame (9), serrated knife (10), lever plate (11), table top (12), take over a business (13), little cylinder (16), rubber ring (17), pull bar (18), following table (19), master cylinder (20), wherein master cylinder (20) places the bottom of frame, and its piston is connected with following table (19), following table (19) by pillar and in table top and cushion block (15) with take over a business (13) and be connected, taking over a business (13) is connected with the pull bar (18) that places its below, be equiped with two block pressur plates up and down on the pull bar (18), rubber ring (17) is installed in up and down between two block pressur plates, and the top board that pull bar (18) is gone up installing is connected by two little push rods circle jacking block (4) interior with inner ring (5) being headed into outer ring (6), with silicon wafer, glued membrane pastes the outside that all-in-one-piece lining frame (9) is installed in (13), and the both sides up and down of lining frame (9) are compressed by last trim ring (3) and lower clamping ring (1) respectively, last trim ring (3) is connected with cover plate (7) by connector (2), one end of lever plate (11) is connected with connector on being connected cover plate (7) by jointed shaft, the other end of lever plate (11) is connected with the piston rod of little cylinder (16), cover plate (7) is connected with the table top that is installed in frame (12), and the outside of taking over a business (13) also is equiped with and can punctures glued membrane, make to finish and expand brilliant wafer and serve as a contrast the serrated knife (10) that frame (9) breaks away from.
2. the wafer expanding device of IC encapsulation according to claim 1 is characterized in that above-mentioned connector (2) is for regulating the lining frame (9) and the vertical range of cover plate (7) and the adjusting bolt of levelness after compressing; Above-mentioned cover plate (7) is connected with the table top that is installed in frame (12) with respect to the bolt (8) of the height between the table top by adjusting cover plate.
3. the wafer expanding device of IC encapsulation according to claim 1, it is characterized in that on the above-mentioned middle table top two guide pin bushings (14) being housed, table top (12) is provided with the guiding guide pillar on the position corresponding to guide pin bushing (14), middle table top and take over a business to be provided with cushion block (15) between (13).
4. according to the wafer expanding device of each described IC encapsulation of claim 1 to 3, the side that it is characterized in that the brilliant station of above-mentioned expansion (414) also is provided with wafer box feeding mechanism, wafer box feeding mechanism includes film magazine (21), stepping motor (22), shaft coupling (23), undercarriage (24), ball screw (25), thin type cylinder (27), guide rail (28), spindle drum (29), two bar cylinders (213), wherein seasoning has by glued membrane and is fixed on silicon wafer in the lining frame (9) in the film magazine (21), every silicon wafer is inserted in the interior lattice separately of film magazine (21), and isolate mutually, some film magazines (21) pile is on the undercarriage that moves up and down along line slideway (24), wherein undercarriage (24) is fixed on the ball screw (25), ball screw (25) is connected with stepping motor (22) by shaft coupling (23), ball screw (25) is formed the worm drive pair with the nut that is fixed on frame, the side of undercarriage (24) also is provided with the thin type cylinder (27) that the process of getting sheet from top film magazine (21) top film magazine (21) clamping stagnation can not be descended, and guide rail (28) is provided with and will pushes away two bar cylinders (213) that sky film magazine (21) is released.
5. the wafer expanding device of IC encapsulation according to claim 4 is characterized in that the side of the film magazine (21) of above-mentioned some piles is provided with support (26), and support (26) constitutes the film magazine station with undercarriage (24).
6. the wafer expanding device of IC encapsulation according to claim 5, the side that it is characterized in that above-mentioned wafer box feeding mechanism also is provided with gets sheet mechanism, this is got sheet mechanism and includes electric machine support (31), second motor (32), belt pulley (33), cog belt (35), swivel plate (210), crank (211), connecting rod (212), main shaft (313), slide block (214), electromagnet (315), wherein second motor (32) is fixed on the electric machine support (31), belt pulley (33) is connected with the output shaft of second motor (32), cog belt (35) is formed the band transmission with belt pulley (33) and driven pulley, main shaft (313) is connected with the rotating shaft of driven pulley or is coaxial, crank (211) is connected with main shaft (313), one end of connecting rod (212) is connected with crank (211), the other end of connecting rod (212) is connected with slide block (214), slide block (214) is connected with the sheet folder (42) of getting that can put in film magazine (21) clamping silicon wafer and lining frame thereof, swivel plate (210) places the bottom surface of slide block (214), above-mentioned main shaft (313) is bearing in the inner bearing (37), inner bearing (37) is installed in the inner pedestal (38), inner pedestal (38) is bearing on the outer bearing (36), outer bearing (36) is installed on the spindle drum (29), electric machine support (31) and spindle drum (29) are installed on the substrate (34) by connector, substrate (34) is connected with frame, swivel plate (210) is installed as one with inner pedestal (38), and be provided with damping mechanism between the bottom surface of the end face of swivel plate (210) and slide block (214), swivel plate (210) is provided with the location hole of the pin reeve that can make electromagnet (315).
7. the wafer expanding device of IC encapsulation according to claim 6, it is characterized in that the damping mechanism that is provided with between the bottom surface of the end face of above-mentioned swivel plate (210) and slide block (214) is a tumbler lock mechanism, include ball and spring, ball and spring are installed in the slide block (214), when the pin of electromagnet (315) injects the location hole of swivel plate (210), be installed in ball in the slide block (214) under the effect of spring, 1/3 spheroid of ball enters in the mating holes of guide rail (215), to the motion generation damping of slide block (214) with guide rail (215).
8. the wafer expanding device of IC encapsulation according to claim 7, it is characterized in that the side at the brilliant station of above-mentioned expansion (414) also is provided with the delivery device of outer ring (6) and inner ring (5), above-mentioned outer ring (6) and inner ring (5) place respectively in outer ring storage circle tube (49) and the inner ring storage circle tube (413), the tube end of outer ring storage circle tube (49) and inner ring storage circle tube (413), have the groove that groove width can pass through outer ring (6) and inner ring (5), and outer ring (6) in outer ring storage circle tube (49) and the inner ring storage circle tube (413) and inner ring (5) enclose tin and send into above-mentioned expansion crystalline substance respectively and stand on the relevant position in (414) by corresponding slider-crank mechanism release.
9. the wafer expanding device of IC encapsulation according to claim 8, the slider-crank mechanism that it is characterized in that above-mentioned propelling movement outer ring (6) includes second connecting rod (46), second crank (47), outer ring and pushes away girth sheets (48), wherein an end of second connecting rod (46) is connected with second crank (47), and the other end of second connecting rod (46) pushes away girth sheets (48) and is connected with the outer ring (6) in the outer ring storage circle tube (49) being released the circle tube and send into outer ring in the brilliant station of above-mentioned expansion (414); The slider-crank mechanism that pushes inner ring (5) includes third connecting rod (411), the 3rd crank (412), inner ring and pushes away girth sheets (410), wherein an end of third connecting rod (411) is connected with the 3rd crank (412), and the other end of third connecting rod (411) pushes away girth sheets (410) and is connected with the inner ring (5) in the inner ring storage circle tube (413) being released the circle tube and send into inner ring in the brilliant station of above-mentioned expansion (414).
10. the wafer expanding device of IC encapsulation according to claim 9 is characterized in that the groove height of above-mentioned outer ring storage circle tube (49) and inner ring storage circle tube (413) equals the thickness of outer ring (6) and inner ring (5) respectively.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910213769A CN101740350A (en) | 2009-12-11 | 2009-12-11 | IC (integrated circuit)-packaged wafer expanding device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910213769A CN101740350A (en) | 2009-12-11 | 2009-12-11 | IC (integrated circuit)-packaged wafer expanding device |
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| CN101740350A true CN101740350A (en) | 2010-06-16 |
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| CN104008986A (en) * | 2014-05-12 | 2014-08-27 | 佛山市南海区联合广东新光源产业创新中心 | Wafer expander with high expansion uniformity |
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| CN109368239A (en) * | 2018-11-29 | 2019-02-22 | 芜湖益盈鼎裕自动化设备有限公司 | A kind of full-automatic expansion film outer ring feeding mechanism |
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| CN102543664B (en) * | 2010-12-31 | 2014-01-29 | 上海慧高精密电子工业有限公司 | Diode lead forming device |
| CN102543664A (en) * | 2010-12-31 | 2012-07-04 | 上海慧高精密电子工业有限公司 | Diode lead forming device |
| CN102826368A (en) * | 2012-08-01 | 2012-12-19 | 无锡市福曼科技有限公司 | Pneumatic rotating table |
| CN104008986A (en) * | 2014-05-12 | 2014-08-27 | 佛山市南海区联合广东新光源产业创新中心 | Wafer expander with high expansion uniformity |
| CN106971967A (en) * | 2017-04-25 | 2017-07-21 | 中山英达思迅智能科技有限公司 | Brilliant machine and its technological process are expanded in a kind of intelligent management and control |
| CN108933094B (en) * | 2017-05-29 | 2023-03-28 | 琳得科株式会社 | Separation device and separation method |
| CN108933094A (en) * | 2017-05-29 | 2018-12-04 | 琳得科株式会社 | Separator and separation method |
| CN108328299A (en) * | 2018-02-28 | 2018-07-27 | 福州大学 | A kind of crank block pusher and its working method |
| CN108328299B (en) * | 2018-02-28 | 2023-08-04 | 福州大学 | Crank slider pushing device and working method thereof |
| CN108511375A (en) * | 2018-05-29 | 2018-09-07 | 李涵 | A kind of brilliant device of semiconductor crystal wafer expansion |
| CN108511375B (en) * | 2018-05-29 | 2020-10-09 | 江苏爱矽半导体科技有限公司 | Semiconductor wafer expander |
| CN109368239A (en) * | 2018-11-29 | 2019-02-22 | 芜湖益盈鼎裕自动化设备有限公司 | A kind of full-automatic expansion film outer ring feeding mechanism |
| CN111633853A (en) * | 2020-06-15 | 2020-09-08 | 李海波 | Optical crystal material manufacturing process |
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Open date: 20100616 |