CN102543664B - Diode lead forming device - Google Patents
Diode lead forming device Download PDFInfo
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- CN102543664B CN102543664B CN201010618695.1A CN201010618695A CN102543664B CN 102543664 B CN102543664 B CN 102543664B CN 201010618695 A CN201010618695 A CN 201010618695A CN 102543664 B CN102543664 B CN 102543664B
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- bending
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- slide block
- cutting knife
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Abstract
The invention relates to a diode lead forming device. The diode lead forming device comprises a machine table, a lead cutting mechanism, a mold, a collision head, a bending mechanism, a lead conveying mechanism and a pushing mechanism, wherein the lead cutting mechanism, the mold, the collision head, the bending mechanism and the lead conveying mechanism are arranged on the machine table; the mold comprises a front mold and a back mold; the front mold and the back mold clamp a lead; the lead conveying mechanism is arranged on the front side of the lead cutting mechanism; the bending mechanism is arranged between the mold and the lead conveying mechanism; the lead cutting mechanism is arranged between the lead conveying mechanism and the bending mechanism; the collision head aligns to the lead clamped by the molds; and the pushing mechanism is respectively connected with the mold, the lead cutting mechanism, the collision head and the bending mechanism. Compared with the prior art, the diode lead forming device has the advantages of high production efficiency, high precision on the size of a product and the like.
Description
Technical field
The present invention relates to a kind of lead forming device, especially relate to a kind of conducting wire molding device for diode.
Background technology
The main utilizing high power vehicle rectifier diode of diode warp beam lead, the defect such as originally wire product is just can complete by secondary operations, cannot produce in batches, and product size precision is lower.
Summary of the invention
Object of the present invention is exactly to provide in order to overcome the defect of above-mentioned prior art existence the conducting wire molding device for diode that a kind of production efficiency is high, product size precision is high.
Object of the present invention can be achieved through the following technical solutions:
A kind of conducting wire molding device for diode, it is characterized in that, comprise board, tangent mechanism, mould, ram, bending mechanism, wire agency, pushing mechanism, described tangent mechanism, mould, ram, bending mechanism, wire agency is located on board, described mould comprises front mold, rear mold, described front mold, rear mold is clamped wire rod, described wire agency is located at the front side of tangent mechanism, described bending mechanism is located in the middle of mould and wire agency, described tangent mechanism is located in the middle of wire agency and bending mechanism, the wire rod that mould is clamped is aimed in described raming, described pushing mechanism respectively with mould, tangent mechanism, ram, bending mechanism connects,
Described wire agency advances wire rod to enter mould, and pushing mechanism promotes to ram and hits the moulding of line base, and tangent mechanism cuts off line base, simultaneously bending mechanism bending formed product.
Described tangent mechanism comprises cutting knife, through wires hole, cutting knife slide block, and described cutting knife slide block and cutting knife are connected.
Described mould lower end is provided with mould slide block.
Described raming is provided with the slide block of raming.
Described bending mechanism is provided with Bending Slide Block.
Described pushing mechanism comprises motor, main shaft, travelling gear, power transmission shaft, cutting knife cam, translating cam, the cam of raming, bending cam, described driven by motor main shaft rotates, described main shaft drives power transmission shaft to rotate by travelling gear, described power transmission shaft is provided with a plurality of, and each power transmission shaft and translating cam, cutting knife cam, the cam of raming, bending cam connect one to one; Described cutting knife slide block and cutting knife cam are connected, and described mould slide block and translating cam are connected, and the described slide block of raming is connected with the cam of raming, and described Bending Slide Block and bending cam are connected.
Compared with prior art, the product size precision that the present invention produces is high, and emphasis is to enhance productivity, and 20 per minute by original craft, now changes 40 per minute of automatic production into.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is decomposition texture schematic diagram of the present invention;
Fig. 3 is product structure schematic diagram of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is described in detail.
Embodiment
As Fig. 1, Fig. 2, shown in Fig. 3, a kind of conducting wire molding device for diode, comprise board 1, tangent mechanism 2, mould, ram 5, bending mechanism 6, wire agency 9, pushing mechanism, described tangent mechanism 2, mould, ram 5, bending mechanism 6, wire agency 9 is located on board 1, described mould comprises front mold 3, rear mold 4, described front mold 3, rear mold 4 is clamped wire rod, described wire agency 9 is located at the front side of tangent mechanism 2, described bending mechanism 2 is located in the middle of mould and wire agency 9, it is middle with bending mechanism 6 that described tangent mechanism 2 is located at wire agency 9, the wire rod that the described 5 aligning moulds of raming are clamped, described pushing mechanism respectively with mould, tangent mechanism 2, ram 5, bending mechanism 6 connects,
Described wire agency 9 advances wire rod to enter mould, and pushing mechanism promotes to ram 5 strike line base moulding, and tangent mechanism 2 cuts off line base, and bending mechanism 6 bending product 11 lower semisections become J type simultaneously.
Described tangent mechanism 2 comprises cutting knife 8, through wires hole 7, cutting knife slide block, and described cutting knife slide block and cutting knife 8 are connected.Described mould lower end is provided with mould slide block 10.Described raming is provided with the slide block of raming.Described bending mechanism is provided with Bending Slide Block.Described pushing mechanism comprises motor, main shaft, travelling gear, power transmission shaft, cutting knife cam, translating cam, the cam of raming, bending cam, described driven by motor main shaft rotates, described main shaft drives power transmission shaft to rotate by travelling gear, described power transmission shaft is provided with a plurality of, and each power transmission shaft and translating cam, cutting knife cam, the cam of raming, bending cam connect one to one; Described cutting knife slide block and cutting knife cam are connected, and described mould slide block and translating cam are connected, and the described slide block of raming is connected with the cam of raming, and described Bending Slide Block and bending cam are connected.
The present invention, by wire forming machine is improved, changes one-shot forming into by original secondary operations, the operation principle of board 1: wire rod enters mould, and now mould gear operation is to boss, and wire rod is clamped, the 5 strike moulding of simultaneously raming.When cutting knife 8 cuts off wire rod, bending mechanism 6 bends afterbody.Because board is at continuous operation, after product falls down, mould slide block 10 is got back to again low level and is waited for line sending.And ram slide block and Bending Slide Block are all got back to low level, wait for action next time, so just formed the action of a circulation.Often turn around and will produce a product.
Claims (1)
1. a conducting wire molding device for diode, it is characterized in that, comprise board, tangent mechanism, mould, ram, bending mechanism, wire agency, pushing mechanism, described tangent mechanism, mould, ram, bending mechanism, wire agency is located on board, described mould comprises front mold, rear mold, described front mold, rear mold is clamped wire rod, described wire agency is located at the front side of tangent mechanism, described bending mechanism is located in the middle of mould and wire agency, described tangent mechanism is located in the middle of wire agency and bending mechanism, the wire rod that mould is clamped is aimed in described raming, described pushing mechanism respectively with mould, tangent mechanism, ram, bending mechanism connects,
Described wire agency advances wire rod to enter mould, and pushing mechanism promotes to ram and hits the moulding of line base, and tangent mechanism cuts off line base, simultaneously bending mechanism bending formed product;
Described tangent mechanism comprises cutting knife, through wires hole, cutting knife slide block, and described cutting knife slide block and cutting knife are connected;
Described mould lower end is provided with mould slide block;
Described raming is provided with the slide block of raming;
Described bending mechanism is provided with Bending Slide Block;
Described pushing mechanism comprises motor, main shaft, travelling gear, power transmission shaft, cutting knife cam, translating cam, the cam of raming, bending cam, described driven by motor main shaft rotates, described main shaft drives power transmission shaft to rotate by travelling gear, described power transmission shaft is provided with a plurality of, and each power transmission shaft and translating cam, cutting knife cam, the cam of raming, bending cam connect one to one; Described cutting knife slide block and cutting knife cam are connected, and described mould slide block and translating cam are connected, and the described slide block of raming is connected with the cam of raming, and described Bending Slide Block and bending cam are connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010618695.1A CN102543664B (en) | 2010-12-31 | 2010-12-31 | Diode lead forming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010618695.1A CN102543664B (en) | 2010-12-31 | 2010-12-31 | Diode lead forming device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102543664A CN102543664A (en) | 2012-07-04 |
| CN102543664B true CN102543664B (en) | 2014-01-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010618695.1A Active CN102543664B (en) | 2010-12-31 | 2010-12-31 | Diode lead forming device |
Country Status (1)
| Country | Link |
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| CN (1) | CN102543664B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108878087B (en) * | 2018-07-18 | 2020-07-28 | 宁波海泰汽车电子有限公司 | Device for assembling diodes on potentiometer substrate |
| CN109692924B (en) * | 2018-12-29 | 2020-05-22 | 马鞍山秉信光电科技有限公司 | Pin cutting device of diode |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101164844A (en) * | 2006-10-20 | 2008-04-23 | 苏州均华精密机械有限公司 | Integrated circuit punching and cutting forming machine material-receiving system automatic discharging tube machine |
| CN101740350A (en) * | 2009-12-11 | 2010-06-16 | 广东工业大学 | IC (integrated circuit)-packaged wafer expanding device |
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2010
- 2010-12-31 CN CN201010618695.1A patent/CN102543664B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101164844A (en) * | 2006-10-20 | 2008-04-23 | 苏州均华精密机械有限公司 | Integrated circuit punching and cutting forming machine material-receiving system automatic discharging tube machine |
| CN101740350A (en) * | 2009-12-11 | 2010-06-16 | 广东工业大学 | IC (integrated circuit)-packaged wafer expanding device |
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| Publication number | Publication date |
|---|---|
| CN102543664A (en) | 2012-07-04 |
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Effective date of registration: 20170921 Address after: 201108, room 101, A District, 688 West Spring Road, Shanghai, Minhang District Patentee after: Light path new energy material (Shanghai) Co., Ltd. Address before: 201108 No. 688 West Spring Road, Xhenzhuang Industrial Zone, Shanghai, Minhang District Patentee before: Huigao Precise Electronic Industry Co., Ltd. |