CN104008986A - Wafer expander with high expansion uniformity - Google Patents

Wafer expander with high expansion uniformity Download PDF

Info

Publication number
CN104008986A
CN104008986A CN201410205369.6A CN201410205369A CN104008986A CN 104008986 A CN104008986 A CN 104008986A CN 201410205369 A CN201410205369 A CN 201410205369A CN 104008986 A CN104008986 A CN 104008986A
Authority
CN
China
Prior art keywords
brilliant
expansion
blue film
ring
annex
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410205369.6A
Other languages
Chinese (zh)
Inventor
彭晖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
New Light Sources Re-Invent Industry Center Associating Guangdong Nanhai District Foshan City
Original Assignee
New Light Sources Re-Invent Industry Center Associating Guangdong Nanhai District Foshan City
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New Light Sources Re-Invent Industry Center Associating Guangdong Nanhai District Foshan City filed Critical New Light Sources Re-Invent Industry Center Associating Guangdong Nanhai District Foshan City
Priority to CN201410205369.6A priority Critical patent/CN104008986A/en
Publication of CN104008986A publication Critical patent/CN104008986A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

The invention provides a wafer expander used in the semiconductor industry and the LED industry. A cross blue film is expanded in the direction of two mutually perpendicular chip cutting ways so that the cut wafers stuck to the cross blue film are evenly expanded and chips can be separated. The distances between the adjacent chips are the same, the subsequent measurement and sorting processes occupy less machine identification and positioning time, the requirements of chip-level packaging or wafer-level packaging are met, and the subsequent processes are facilitated.

Description

The brilliant machine of expansion that expansion uniformity is high
Technical field
The present invention relates to the brilliant machine of expansion that a kind of semicon industry and LED industry are used, wafer is evenly expanded, and the distance between adjacent chips equates, reduces machine resolution and positioning time that follow-up measurement and sorting process take, reach the requirement of wafer level encapsulation, be convenient to follow-up technological process.
Background technology
The Cutting Road (cutting street) of the upper square of wafer (wafer) and rectangular dies is along mutually perpendicular both direction: directions X and Y-direction, directions X is parallel with the flat limit (flat) of wafer.The brilliant machine of existing expansion (wafer expander) is all the radial direction expansion along wafer, therefore, distance between adjacent chips (chip) in same Cutting Road direction is unequal, makes the technique of follow-up measurement and sorting take more machine resolution and positioning time.In addition, wafer-level package (chip scale package) or wafer level encapsulation (wafer level package) require the distance between the chip in same Cutting Road direction substantially the same.Therefore, need the brilliant machine of a kind of expansions, make the distance between the chip of the same Cutting Road direction in the wafer after expanding substantially the same.
Summary of the invention
Primary and foremost purpose of the present invention is to provide the brilliant machine of a kind of expansion, make in the wafer after expansion the distance between chip adjacent in same Cutting Road direction basic identical, the distance along directions X between chip is with identical along the distance of Y-direction, make the technique of follow-up measurement and sorting take less machine resolution and positioning time, meet the requirement of wafer-level package.Second object is to provide the brilliant machine of a kind of expansion, make the distance of wafer between the adjacent chip of directions X after expansion substantially the same, distance between the adjacent chip of Y-direction is substantially the same, the distance along directions X between chip is from different along the distance of Y-direction, therefore, be applicable to rectangular dies, meet the requirement of wafer-level package.The 3rd object is to provide the brilliant machine of a kind of expansion with annex, reaches above-mentioned first and second objects.
The operation principle of the brilliant machine of expansion of the present invention: expand brilliant machine and comprise: frame structure, teleblem structure, press mold structure, ring structure.Teleblem structure is arranged on the inside of frame structure, and vertically back and forth movement, expands the blue film of the cross being placed on it.Press mold structure is arranged on frame structure top, compresses and loosens the blue film of cross.Ring structure is arranged on the top of teleblem structure, and ring structure declines, and the blue film of the cross after expansion is kept to expansion state.It is characterized in that, teleblem structure makes the blue film of cross along the chip cutting road direction expansion of wafer.
The embodiment of the brilliant machine of expansion of the present invention: the surface on the top of teleblem structure is blue film contact-making surface, the blue film of cross is placed on blue film contact-making surface.The plan view shape of the periphery of blue film contact-making surface is square or rectangle, has determined the blue film dimension of cross.An embodiment: teleblem structure comprises a main body.The top end surface of main body is blue film contact-making surface.Blue film contact-making surface overlook be shaped as square or cuboid.An embodiment: teleblem structure comprises the first main body and the second main body.The first main body is arranged on the second main body top.The profile of the second main body is cylinder.The surface on the top of the first main body is blue film contact-making surface, and the plan view shape of the periphery of blue film contact-making surface is square or rectangle.
The embodiment of the brilliant machine of expansion of the present invention: the top of teleblem structure forms boss and expands brilliant ring seating surface.The blue film of cross is placed on the blue film contact-making surface of boss and the end face of the brilliant ring of interior expansion.The plan view shape that is placed on the periphery on the top of expanding the interior expansion crystalline substance ring on brilliant ring seating surface is square or rectangle, has determined that the blue film of cross is along X and Y-direction expansion.An embodiment: teleblem structure comprises a main body.The top of main body forms boss and expands brilliant ring seating surface.An embodiment: teleblem structure comprises the first main body and the second main body.The first main body is arranged on the second main body top.The second main body be shaped as cylinder.The top of the first main body forms boss and expands brilliant ring seating surface.
The embodiment of the brilliant machine of expansion of the present invention: the surface on the top of teleblem structure is blue film contact-making surface.The top of teleblem structure forms expands brilliant annular groove.Expand brilliant annular groove described blue film contact-making surface is divided into 2 parts: interior blue film contact-making surface and outer blue film contact-making surface.The plan view shape of the periphery of outer blue film contact-making surface is square or rectangle, has determined that the blue film of cross is along X and Y-direction expansion.The blue film of cross is placed on interior blue film contact-making surface and outer blue film contact-making surface, makes wafer on the blue film of cross above interior blue film contact-making surface, and the neighboring of wafer surpasses the outer perimeter of interior blue film contact-making surface.The width that expands brilliant annular groove is equal to or greater than the interior thickness sum that expands the thickness of brilliant ring and extend out brilliant ring.The degree of depth that expands brilliant annular groove is equal to or greater than the interior width that expands brilliant ring or extend out brilliant ring.An embodiment: teleblem structure comprises a main body, the top end surface of main body forms and expands brilliant annular groove.An embodiment: teleblem structure comprises the first main body and the second main body.The first main body is arranged on the second main body top.The second main body be shaped as cylinder.The top of the first main body forms expands brilliant annular groove.
The embodiment of the brilliant machine of expansion of the present invention: teleblem structure has heating arrangement.
The operation principle of the brilliant machine of the expansion with annex of the present invention: the top in teleblem structure traditional or the brilliant machine of expansion of the present invention arranges an annex, and the surface on the top of the surface on the top of annex and teleblem structure is at same plane.The surface on the top of annex is blue film contact-making surface, and the plan view shape of the periphery of blue film contact-making surface is square or rectangle, makes the blue film of cross along the chip cutting road direction expansion of wafer, reaches the identical object of distance between adjacent chip.
An embodiment with the brilliant machine of the expansion of annex: the top of teleblem structure forms boss and expands brilliant ring seating surface; The width that expands brilliant ring seating surface is equal to or greater than the interior thickness sum that expands the thickness of brilliant ring and extend out brilliant ring, and the degree of depth that expands brilliant ring seating surface is equal to or greater than the interior width that expands brilliant ring or extend out brilliant ring.
An embodiment with the brilliant machine of the expansion of annex: the top of teleblem structure forms expands brilliant annular groove, the width that expands brilliant annular groove is equal to or greater than the interior thickness sum that expands the thickness of brilliant ring and extend out brilliant ring, and the degree of depth that expands brilliant annular groove is equal to or greater than the interior width that expands brilliant ring.Expand brilliant annular groove blue film contact-making surface is divided into 2 parts: interior blue film contact-making surface and outer blue film contact-making surface.Wafer is above interior blue film contact-making surface.
An embodiment with the brilliant machine of the expansion of annex: the top of the teleblem structure of the brilliant machine of traditional expansion of showing at Fig. 1 a arranges an annex, the periphery of annex be shaped as square or rectangle, make the blue film of cross along X and the expansion of Y both direction, reach the identical object of distance between adjacent chip.
An embodiment with the brilliant machine of the expansion of annex: interior the expansions crystalline substance that the position of the through hole of close the annex of annex forms on annex encircles seating surface.The interior width that expands brilliant ring seating surface on annex is equal to or greater than the interior thickness sum that expands the thickness of brilliant ring and extend out brilliant ring, and the interior degree of depth that expands brilliant ring seating surface on annex is equal to, or greater than the interior width that expands brilliant ring.
An embodiment with the brilliant machine of the expansion of annex: the top of annex forms expands brilliant annular groove, the width that expands brilliant annular groove is equal to or greater than the interior thickness sum that expands the thickness of brilliant ring and extend out brilliant ring, and the degree of depth that expands brilliant annular groove is equal to or greater than the interior width that expands brilliant ring.
The operation principle of the brilliant machine of the expansion with annex of the present invention: the top in teleblem structure traditional or the brilliant machine of expansion of the present invention arranges an annex, and the surface on the top of the surface on the top of annex and teleblem structure is at same plane.An embodiment: the outside on the top of annex forms the brilliant ring seating surface that extends out on an annex, the width that extends out brilliant ring seating surface on annex is equal to or greater than the interior thickness sum that expands the thickness of brilliant ring and extend out brilliant ring, and the degree of depth that extends out brilliant ring seating surface on annex is equal to, or greater than the interior width that expands brilliant ring; The interior plan view shape that expands the periphery on the brilliant top of encircling extending out on brilliant ring seating surface being placed on annex is square or rectangle, makes the blue film of cross along the chip cutting road direction expansion in wafer.
An embodiment with the brilliant machine of the expansion of annex: annex has the heating arrangement that annex is heated.
Item below is all suitable for the embodiment of the brilliant machine of all expansions of the present invention: on the blue film contact-making surface on (1) teleblem structure top, form a mark 200 of using for the flat limit contraposition of wafer.(2) all blue films adopt the blue film of cross; Place wafer at the center position of the blue film of cross, and make the flat limit of wafer parallel with a limit of the blue film of cross; Place the blue film of cross on the blue film contact-making surface on the top of teleblem structure, the flat limit 103 of wafer is aimed at alignment mark 200, makes the blue film of cross along the chip cutting road direction expansion in wafer.(3) size in accompanying drawing is disproportionate.
Accompanying drawing explanation
Fig. 1 a, Fig. 1 b, Fig. 1 c are respectively vertical view and the sectional views that tradition expands the teleblem structure of brilliant machine.
Fig. 2 a and Fig. 2 b are the fundamental diagrams of the brilliant machine of expansion of the present invention.
Fig. 3 a and Fig. 3 b are the fundamental diagrams of the embodiment of the brilliant machine of expansion of the present invention.
Fig. 3 c and Fig. 3 d are respectively the schematic diagrames of embodiment of the teleblem structure of Fig. 3 a.
Fig. 3 e and Fig. 3 f are respectively the vertical views of embodiment of the teleblem structure of Fig. 3 a.
Fig. 4 a and Fig. 4 b are the fundamental diagrams of the embodiment of the brilliant machine of expansion of the present invention.
Fig. 4 c and Fig. 4 d are respectively the schematic diagrames of embodiment of boss of the teleblem structure of Fig. 4 a.
Fig. 4 e and Fig. 4 f are respectively the vertical views of embodiment of boss of the teleblem structure of Fig. 4 a.
Fig. 4 g and Fig. 4 h are respectively the schematic diagrames of embodiment of boss of the teleblem structure of Fig. 4 a.
Fig. 4 i and Fig. 4 j are respectively the vertical views of embodiment of boss of the teleblem structure of Fig. 4 a.
Fig. 5 a and Fig. 5 b are the fundamental diagrams of the embodiment of the brilliant machine of expansion of the present invention.
Fig. 5 c and 5d are respectively the blue film contact-making surface of Fig. 5 a and the schematic diagram that expands the embodiment of brilliant annular groove.
Fig. 5 e and Fig. 5 f are respectively the blue film contact-making surface of Fig. 5 a and the vertical view that expands the embodiment of brilliant annular groove.
Fig. 6 a, Fig. 6 b, Fig. 6 c, Fig. 6 d, Fig. 6 e, Fig. 6 f are respectively the fundamental diagrams of the embodiment of the brilliant machine of the expansion with annex of the present invention.
Fig. 6 g, Fig. 6 i, Fig. 6 k, Fig. 6 n and Fig. 6 h, Fig. 6 j, Fig. 6 m, Fig. 6 p are respectively vertical view and the sectional views of the embodiment of annex.
Fig. 7 a and Fig. 7 b are respectively interior vertical view and the sectional views that expands brilliant ring and extend out brilliant ring.
The implication of the numerical chracter representative in figure is as follows:
10 represent teleblem structure,
10a and 10b represent respectively the first main body and second main body of teleblem structure 10,
11 represent the surperficial blue film contact-making surface of teleblem structure 10,
11a represents the surperficial interior blue film contact-making surface of teleblem structure 10,
11b represents the surperficial outer blue film contact-making surface of teleblem structure 10,
12 represent the brilliant ring of the structural expansion of teleblem seating surface,
12a and 12b represent respectively to expand width and the degree of depth of brilliant ring seating surface,
13 represent boss,
14 represent to expand brilliant annular groove,
14a and 14b represent respectively to expand width and the degree of depth of brilliant annular groove,
15 and 15c represent respectively the periphery of teleblem structure 10 and the first main body,
15a is parallel with the 22He limit 23, limit of the blue film of cross respectively with 15b,
Traditional blue film before 20a and 20b represent respectively expansion and after expansion,
The blue film of cross before 21a and 21b represent respectively expansion and after expansion,
22 represent a limit of the blue film of cross, and limit 22 is parallel with chip cutting road 102,
23 represent another limit vertical with limit 22 of the blue film of cross, and 23Yu Ping limit 103, limit is parallel,
30 representational framework structures,
40 represent press mold structure,
50 represent ring structure,
60 represent annex,
61 represent the brilliant annular groove of expansion of annex,
61a and 61b represent respectively the brilliant ring of the interior expansion seating surface of the brilliant ring seating surface of extending out of annex and annex,
62a and 62b represent respectively the through hole of annex,
63 represent the blue film contact-making surface of annex,
65 represent the periphery of annex,
100 represent wafer,
101 represent the chip cutting road of directions X, and 101Yu Ping limit 103, chip cutting road is parallel,
102 represent the chip cutting road of the Y-direction vertical with directions X,
103 represent the flat limit (flat) of wafer, and 101Yu Ping limit 103, chip cutting road is vertical,
105,105a, 105b, 105c, 105d, 105e represent respectively the chip after blue film expansion,
110 represent paster ring,
120a and 120b represent respectively to extend out brilliant ring and the brilliant ring of interior expansion,
121 and 122 represent respectively to extend out brilliant ring and interior width and the thickness that expands brilliant ring,
123 represent to extend out brilliant ring and the interior thickness sum that expands brilliant ring,
200 alignment marks.
Embodiment
For making object, operation principle, technical scheme and the advantage of embodiment of the present invention clearer, below in conjunction with the accompanying drawing in embodiment of the present invention, technical scheme in embodiment of the present invention is clearly and completely described, obviously, described embodiment is a part of embodiment of the present invention, rather than whole embodiments.Embodiment based in the present invention, those of ordinary skills, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
Fig. 1 a, Fig. 1 b and Fig. 1 c are respectively vertical view and the sectional views of the teleblem structure of the brilliant machine of traditional expansion.The top of cylindrical teleblem structure 10 forms boss 13 and expands brilliant ring seating surface 12, expands brilliant ring seating surface 12 and has width 12a, and the height of boss 13 is 12b.The circular brilliant ring of interior expansion 120b is placed on and expands on brilliant ring seating surface 12, and the interior expansion brilliant ring inner side of 120b and the side of boss 13 are close, and the interior expansion brilliant ring end face of 120b and the blue film contact-making surface 11 of boss 13 are substantially at grade.Blue film 20a is placed on the end face of blue film contact-making surface 11 and the brilliant ring of interior expansion 120b.Wafer 100 is pasted the center at blue film 20a.Wafer 100 has flat limit 103, the chip cutting road 101 of directions X, the chip cutting road 102 of Y-direction.When teleblem structure 10 moves upward, blue film 20a, by interior end face outer ledge jack-up the expansion of expanding brilliant ring 120b of circle, extends out brilliant ring 120a and presses down, and the blue film 20b after expansion is clamped in to interior expansion brilliant ring 120b and extends out between brilliant ring 120a.Blue film 20a is along circular interior radius expansion of expanding brilliant ring 120b, so, not identical along the distance between X chip cutting road 101 and the adjacent chips of Y chip cutting road 102 direction separation, the machine that has increased follow-up measurement and sorting process is differentiated and positioning time, can not do the encapsulation of wafer level.
The object that Fig. 2 a and Fig. 2 b show the brilliant machine of expansion of the present invention: distance separated between adjacent chips is basic identical.Operation principle: only along chip cutting road 101 with the blue film 21a of chip cutting road 102 both directions expansion cross.Technical scheme: (1) adopts the blue film 21a of cross; (2) place wafer 100 at the center position of the blue film 21a of cross, the flat limit 103 of wafer 100 is parallel with the limit 23 of the blue film 21a of cross, and the blue film 21a of cross is placed in teleblem structure, and the flat limit 103 of wafer 100 is aimed at alignment mark 200; (3) determine the blue film of cross dimension teleblem structure 10 blue film contact-making surface 11 (Fig. 3 a) and 11b (Fig. 5 a) or the interior interior plan view shape that expands the periphery (Fig. 6 c) of the brilliant end face encircling that expands the periphery on top of brilliant ring 120b (Fig. 4 b) or the periphery 65 on the top of annex 60 (Fig. 6 a, Fig. 6 b, Fig. 6 d, Fig. 6 e and Fig. 6 f) or be placed on the brilliant ring seating surface of extending out of annex be square or rectangle; Therefore, (4) when teleblem structure 10 rises, the blue film 21a of cross only expands along chip cutting road direction, the adjacent chips of the upper directions X of the blue film 21b of cross after expansion (for example, between chip 105a and chip 105b and between chip 105b and chip 105c) separated distance is basic identical, Y-direction adjacent chips (for example, between chip 105a and chip 105d and between chip 105a and chip 105e) separated distance is basic identical, reduce the machine of follow-up measurement and sorting process and differentiated and positioning time, can directly carry out the encapsulation of wafer level.
Fig. 3 a and Fig. 3 b show the operation principle of the embodiment of the brilliant machine of expansion of the present invention.Expand brilliant machine and comprise, frame structure 30, teleblem structure 10, press mold structure 40, ring structure 50.Teleblem structure 10 is arranged on the inside of frame structure 30.Press mold structure 40 is arranged on the top of frame structure 30, compresses and loosens the blue film of cross.Ring structure 50 is arranged on the top of teleblem structure 10 and frame structure 30, and after blue film is expanded, ring structure 50 declines, and the blue film 21b of cross that paster ring 110 is pressed in after expansion is upper, and the blue film 21b of cross is bonded on paster ring 110 and keeps expansion state.The surface on the top of teleblem structure 10 is blue film contact-making surfaces 11.The plan view shape of the periphery 15 of blue film contact-making surface 11 determines the direction of the blue film expansion of cross, and the plan view shape of periphery 15 is square (Fig. 3 e) or rectangle (Fig. 3 f), makes the blue film of cross only along mutually perpendicular both direction expansion.
The teleblem structure 10 that Fig. 3 c shows comprises, the first main body 10a and the second main body 10b.The top of the first main body 10a is blue film contact-making surface 11 and alignment mark 200; The periphery 15c of blue film contact-making surface 11 is square or rectangle.The second main body 10b has cylindrical structure.The first main body 10a is arranged on the top of the second main body 10b.The teleblem structure 10 that Fig. 3 d shows only has a hexahedron main body, and its top is the blue film contact-making surface 11 of square or rectangle and alignment mark 200.
The plan view shape of the periphery 15 of blue film contact-making surface 11 (Fig. 3 e) is square, make the blue film of cross along mutually perpendicular X and Y-direction, have the expansion of same degree, therefore, the distance between adjacent chips is identical, and this teleblem structure 10 is applicable to square chip.For example, in Fig. 2 b, distance and the distance between chip 105a and 105e between the distance between the distance between chip 105a and 105b, chip 105b and 105c, chip 105a and 105d are basic identical.The plan view shape of the periphery 15 of blue film contact-making surface 11 (Fig. 3 f) is rectangle, make the blue film of cross be less than the expansion along long side direction along the expansion of the short side direction of rectangle, therefore, identical in unidirectional distance between adjacent chips, but, different from the distance between the chip of other direction, this teleblem structure 10 is applicable to rectangular dies.For example,, in Fig. 2 b, along directions X: chip 105a is identical with the distance between chip 105b and 105c with the distance between 105b.Along Y-direction: chip 105a is identical with the distance between chip 105a and 105e with the distance between 105d.But chip 105a is not identical with the distance between chip 105a and 105d with the distance between 105b.
Fig. 4 a and Fig. 4 b show the operation principle of the embodiment of the brilliant machine of expansion of the present invention.The brilliant machine of expansion that the brilliant machine of expansion that Fig. 4 a shows is shown to Fig. 3 a is similar, difference is: the top of the teleblem structure 10 of Fig. 4 a forms boss 13 and expands brilliant ring seating surface 12, and the plan view shape that expands the periphery 15 (being also the periphery of teleblem structure 10) of brilliant ring seating surface 12 is square (Fig. 4 e) or rectangle (Fig. 4 f).Note: the plan view shape that expands the periphery 15 of brilliant ring seating surface 12 can be also circular (not showing in the drawings), as long as the plan view shape that expands the top periphery of brilliant ring 120b interior is square or rectangle, and expands crystalline substance ring seating surface 12 and can support the brilliant ring of interior expansion 120b.The interior top peripheral shape that expands brilliant ring 120b makes the blue film of cross along X and Y-direction expansion.
The teleblem structure 10 that Fig. 4 c shows only has a main body, and its top has boss 13 and expands brilliant ring seating surface 12, and boss 13 tops are blue film contact-making surface 11 and alignment mark 200.The height of boss 13 is 12b, and the width that expands brilliant ring seating surface 12 is 12a (Fig. 4 e).The teleblem structure that Fig. 4 d shows has the first main body 10a and the second main body 10b.The top of the first main body 10a has square or rectangular boss 13 and expands brilliant ring seating surface 12, and boss 13 tops are blue film contact-making surface 11 and alignment mark 200.The first main body 10a is arranged on the top of the second main body 10b of cylindrical shape.The first main body 10a and the second main body 10b both can manufacture respectively rear assembling also can one-shot forming.The periphery 15c of the expansion brilliant ring periphery 15 of seating surface 12 of Fig. 4 c and the brilliant ring of the expansion of Fig. 4 d seating surface 12 is respectively square or rectangle.Note: expanding the brilliant ring periphery 15 (Fig. 4 c) of seating surface 12 and the plan view shape of periphery 15c (Fig. 4 d) can be also circular (not showing in the drawings).The width 12a that expands brilliant ring seating surface 12 is equal to or greater than the interior thickness sum 123 that expands the thickness of brilliant ring and extend out brilliant ring, and the height 12b of boss 13 is equal to, or greater than the interior width that expands brilliant ring.
The plan view shape of the periphery of the boss 13 that Fig. 4 e shows is identical with the plan view shape of the periphery of teleblem structure, is square.The plan view shape of the periphery of the boss 13 that Fig. 4 f shows is identical with the plan view shape of the periphery of teleblem structure, is all rectangle.Boss 13 has blue film contact-making surface 11.The plan view shape that expands the periphery 15 of brilliant ring seating surface 12 is square (Fig. 4 e) or rectangle (Fig. 4 f).
The teleblem structure 10 that Fig. 4 g shows only has a main body, and the plan view shape of the periphery 15 of main body is square or rectangle.The plan view shape that the top of teleblem structure 10 forms periphery is circular boss 13, and the top of boss 13 has blue film contact-making surface 11 and alignment mark 200.The teleblem structure that Fig. 4 h shows has the first main body 10a and the second main body 10b.The plan view shape of the periphery 15c of the first main body 10a is square or rectangle.The top of the first main body 10a has round boss 13, and boss 13 has blue film contact-making surface 11 and alignment mark 200.The first main body 10a is arranged on the top of the second main body 10b of cylindrical shape.The inner edge of the brilliant ring of the expansion seating surface 12 that Fig. 4 g and Fig. 4 h show is that the plan view shape of circle, periphery 15 or periphery 15c is respectively square or rectangle.
The plan view shape of the periphery of the boss 13 that Fig. 4 i shows is circular.The plan view shape of the periphery 15 of teleblem structure is square.The plan view shape of the periphery of the boss 13 that Fig. 4 j shows is circular, and the plan view shape of the periphery 15 of teleblem structure is rectangle.The boss 13 that Fig. 4 i and Fig. 4 j show has respectively blue film contact-making surface 11 and alignment mark 200.It is that circle, outside are the annular shape of square or rectangle that the brilliant ring of expansion seating surface 12 has inner edge.
Note: the main body 10 of (1) Fig. 4 c and Fig. 4 g can be respectively cylinder, as long as main body 10 can support respectively that the plan view shape of periphery is the brilliant ring of interior expansion of square or rectangle.(2) the first main body 10a of Fig. 4 d and Fig. 4 h can be respectively cylinder, as long as the first main body 10a can support respectively that the plan view shape of periphery is the brilliant ring of interior expansion of square or rectangle.
Fig. 5 a and Fig. 5 b show the operation principle of the embodiment of the brilliant machine of expansion of the present invention.It is similar that the brilliant machine of expansion that Fig. 5 a shows is shown to Fig. 3 a.Difference is: the top of the teleblem structure 10 of Fig. 5 a forms the brilliant annular groove 14 of expansion of width 14a and degree of depth 14b.Expand brilliant annular groove 14 the blue film contact-making surface on teleblem structure 10 tops is divided into two parts: interior blue film contact-making surface 11a and outer blue film contact-making surface 11b.The plan view shape of the periphery 15 of outer blue film contact-making surface 11b (Fig. 5 c) or 15c (Fig. 5 d) is respectively square (Fig. 5 e) or rectangle (Fig. 5 f).The plan view shape of the periphery of interior blue film contact-making surface 11a is circular (Fig. 5 e) or square or rectangle (Fig. 5 f).The minimum dimension of the periphery of interior blue film contact-making surface 11a [diameter (Fig. 5 e) or width (Fig. 5 f)) or the length of side on one side (square is not shown in the drawings)] is greater than the diameter of wafer.The width 14a that expands brilliant annular groove 14 is more than or equal to the interior thickness sum 123 (Fig. 7 b) that expands brilliant ring 120b and extend out brilliant ring 120a, the degree of depth 14b that expands brilliant annular groove 14 is more than or equal to the interior width 121 (Fig. 7 b) that expands brilliant ring 120b, makes interior expansion crystalline substance ring 120b and extend out brilliant ring 120a to put into the brilliant annular groove 14 of expansion.After the blue film 21a expansion of cross, ring structure 50 declines, extending out brilliant ring 120a, be pressed on the blue film 21b of cross, continuation is to pressing down, until be pressed in extending out brilliant ring 120a the bottom surface of expanding brilliant annular groove 14, the blue film 21b of cross after expansion is clipped in and is extended out between brilliant ring 120a and the brilliant ring of interior expansion 120b, to carry out subsequent technique.It is advantageous that, be the embodiment of circular (Fig. 5 e) for the plan view shape of the periphery of interior blue film contact-making surface 11a, can continue to use the existing circular brilliant ring that expands.The width 14a that expands brilliant annular groove 14 is equal to or greater than the interior thickness sum 123 that expands the thickness of brilliant ring and extend out brilliant ring, and the degree of depth 14b that expands brilliant annular groove 14 is equal to, or greater than the interior width that expands brilliant ring
The teleblem structure 10 that Fig. 5 c shows only has a main body, and the plan view shape of the periphery 15 of main body is square or rectangle.The top of teleblem structure 10 forms expands brilliant annular groove 14, expands brilliant annular groove 14 the blue film contact-making surface on teleblem structure 10 tops is divided into two parts: interior blue film contact-making surface 11a and outer blue film contact-making surface 11b.The teleblem structure that Fig. 5 d shows has the first main body 10a and the second main body 10b.The plan view shape of the periphery 15c of the first main body 10a is square or rectangle.The top of the first main body 10a forms the circular brilliant annular groove 14 that expands, and expands brilliant annular groove 14 the blue film contact-making surface on teleblem structure 10 tops is divided into two parts: interior blue film contact-making surface 11a and outer blue film contact-making surface 11b.The second main body 10b has cylindrical structure.The first main body 10a is arranged on the top of the second main body 10b.Note: the brilliant annular groove 14 of expansion that (1) Fig. 5 c and Fig. 5 d show also can have the annular shape of square or rectangle, annular groove 14 as brilliant in the expansion of Fig. 5 f.(2) the upper alignment mark 200 that forms of blue film contact-making surface 11a in.
Fig. 6 a to Fig. 6 e shows the embodiment of the brilliant machine of the expansion with annex of the present invention.Annex 60 in Fig. 6 a to Fig. 6 e is arranged on the periphery on the top of teleblem structure 10, and teleblem structure 10 drives annex 60 associated movements.The plan view shape of the periphery 65 of annex 60 is square or rectangle, makes the blue film of cross along mutually perpendicular two chip cutting road direction expansions.Wafer 100 is pasted on the blue film of cross.Annex 60 moves upward, and the blue film of cross is by the edge jack-up of the periphery 65 of the square of annex 60 or rectangle, and the blue film of cross is along 2 chip cutting roads 101 and 102 expansions of wafer.
An embodiment: the brilliant machine of traditional expansion that the brilliant machine of expansion that Fig. 6 a shows is shown to Fig. 1 a is similar: difference is: the brilliant machine of expansion of Fig. 6 a comprises the annex 60 (Fig. 6 k and Fig. 6 n) of the periphery on the top that is fixed on teleblem structure 10.The blue film contact-making surface 63 on the top of annex 60 and the blue film contact-making surface 11 of teleblem structure 10 are at same plane.In annex 60, be formed centrally through hole 62a, the diameter of through hole 62a matches with the diameter of teleblem structure 10, makes annex 60 can be fixed on the top of teleblem structure 10.
An embodiment: the brilliant machine of expansion that the brilliant machine of expansion that Fig. 6 a shows is shown to Fig. 4 a is similar: difference is: the periphery 15 of the brilliant ring of the expansion seating surface 12 of (1) Fig. 6 a can be also circular; (2) the brilliant machine of the expansion of Fig. 6 a comprises annex 60 (as shown in Fig. 6 k, Fig. 6 m and Fig. 6 n, Fig. 6 p).In annex 60, be formed centrally through hole 62b, the shape and size of through hole 62b match with the shape and size of the periphery 15 of teleblem structure 10, make annex 60 can be fixed on the top of teleblem structure 10.
An embodiment: the brilliant machine of expansion that the brilliant machine of expansion that Fig. 6 b shows is shown to Fig. 5 a is similar: difference is: the plan view shape of the periphery 15 of the teleblem structure of (1) Fig. 6 b can be also circular; (2) the brilliant machine of the expansion of Fig. 6 b comprises annex 60 (as shown in Fig. 6 k, Fig. 6 m and Fig. 6 n, Fig. 6 p).Be formed on the through hole 62a (Fig. 6 k) at annex 60 center or the shape and size of through hole 62b (Fig. 6 n) match with the shape and size of the periphery 15 of teleblem structure 10, make annex 60 can be fixed on the top of teleblem structure 10.
An embodiment: the brilliant machine of expansion and Fig. 3 a that Fig. 6 c shows show that the brilliant machine of expansion is similar: difference is: the plan view shape of the periphery on the top of the teleblem structure of the brilliant machine of expansion of (1) Fig. 6 c can be circle or square or rectangle; (2) comprise annex 60, be fixed on the periphery on the top of teleblem structure 10.Annex 60 center has through hole 62a (Fig. 6 g) or square or rectangular through-hole 62b, and the diameter of through hole 62a matches with the diameter of teleblem structure 10, makes annex 60 can be fixed on the top of teleblem structure 10.The outside of annex 60 forms the brilliant ring seating surface 61a that extends out on an annex, and the interior crystalline substance ring 120b that expands of square or rectangle is placed on extending out in brilliant ring seating surface 61a on annex.The shape of through hole 62b matches with size with the shape of teleblem structure 10 with size, makes annex 60 can be fixed on the periphery on the top of teleblem structure 10.The width that extends out brilliant ring seating surface 61a on annex is equal to or greater than the interior thickness sum 123 (Fig. 7 b) that expands the thickness of brilliant ring and extend out brilliant ring.
An embodiment: the brilliant machine of expansion that the brilliant machine of expansion that Fig. 6 d shows is shown to Fig. 3 a is similar: difference is: the plan view shape of the periphery on the top of the teleblem structure of the brilliant machine of expansion of (1) Fig. 6 d can be circular; (2) comprise annex 60.Annex 60 is fixed on the periphery on the top of teleblem structure 10.In annex 60, be formed centrally through hole 62a or through hole 62b, the shape and size of through hole 62a or through hole 62b match with the shape and size on the top of teleblem structure 10, make annex 60 can be fixed on the periphery on the top of teleblem structure 10.Near the through hole 62a of annex or the position of through hole 62b, forming the brilliant ring of the interior expansion seating surface 61b on annex.The interior width that expands brilliant ring seating surface 61b on annex is equal to or greater than the interior thickness sum that expands the thickness of brilliant ring and extend out brilliant ring.The interior crystalline substance ring 120b that expands of square or rectangle is placed on the brilliant ring of the expansion seating surface 61b on annex.The blue film of cross is placed on the blue film contact-making surface 11 of teleblem structure 10, interior expansion on the end face (not showing) of brilliant ring 120b and the blue film contact-making surface 63 of annex 60.
An embodiment: the brilliant machine of expansion that the brilliant machine of expansion that Fig. 6 e shows is shown to Fig. 6 d is similar: difference is: do not have on the annex 60 of the brilliant machine of expansion of Fig. 6 e to form the brilliant ring of the interior expansion seating surface 61b as on the annex in Fig. 6 d, expand brilliant annular groove 61 but form on annex 60.Expanding brilliant annular groove 61 can hold the brilliant ring of interior expansion and extend out brilliant ring.
An embodiment: the brilliant machine of expansion that the brilliant machine of expansion that Fig. 6 f shows is shown to Fig. 6 e is similar: difference is: do not expand brilliant annular groove on the annex 60 of the brilliant machine of expansion of Fig. 6 f (as Fig. 6 k, Fig. 6 m, Fig. 6 n, figure p).The teleblem structure of the brilliant machine of expansion that Fig. 6 f shows can be cylinder.
Fig. 6 g and Fig. 6 h show respectively vertical view and the sectional view of an embodiment of annex.The plan view shape of the periphery 65 of annex 60 has square (Fig. 6 g) or rectangle (not showing), and annex 60 has the end face 63 contacting with blue film, and centre has through hole 62a, extends out brilliant ring seating surface 61a.
Fig. 6 i and Fig. 6 j show respectively vertical view and the sectional view of an embodiment of annex.The periphery 65 of annex 60 has square (Fig. 6 i) or rectangle (not showing) shape, the end face 63 contact with blue film, and centre has through hole 62a, and interior the expansions crystalline substance having on the annex of annular encircles seating surface 61b.
Note: the middle part of the annex 60 in (1) Fig. 6 g, Fig. 6 h, Fig. 6 i and Fig. 6 j also can have square or rectangular through-hole to replace through hole 62a; (2) on annex extend out brilliant ring seating surface 61a and the brilliant ring of interior expansion seating surface 61b can be also that square annular or rectangular loop are to replace annular.
Fig. 6 k and Fig. 6 m show respectively vertical view and the sectional view of an embodiment of annex.The periphery 65 of annex 60 has square (not showing) or rectangle (Fig. 6 k) shape, the end face 63 contacting with blue film, the middle through hole 62a that forms.
Fig. 6 n and Fig. 6 p show respectively vertical view and the sectional view of an embodiment of annex.The periphery 65 of annex 60 has square (not showing) or rectangle (Fig. 6 n) shape, the end face 63 contacting with blue film, the middle through hole 62b that forms.
Fig. 7 a and Fig. 7 b show respectively interior vertical view and the sectional view that expands brilliant ring and extend out brilliant ring.Interior expansion crystalline substance encircles 120b and extends out brilliant ring 120a has essentially identical width 121 and essentially identical thickness 122.The interior peripheral radius that expands brilliant ring 120b is basic identical with the internal diameter that extends out brilliant ring 120a, makes interior expansions brilliant ring 120b and extend out brilliant ring 120a to be nested together, interior expand brilliant ring 120b and extend out the brilliant 120a of ring thickness with 123.
Finally it should be noted that: above embodiment only, in order to technical scheme of the present invention to be described, is not intended to limit; Although the present invention is had been described in detail with reference to aforementioned embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned embodiment is modified, or part technical characterictic is wherein equal to replacement; And these modifications or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of each embodiment technical scheme of the present invention.

Claims (15)

1. expand a brilliant machine, comprising: frame structure, teleblem structure, press mold structure, ring structure; Described teleblem structure is back and forth movement vertically, the blue film of cross that expansion is placed on it; Described press mold structure is arranged on described frame structure top, compresses and loosens the blue film of cross; Described ring structure is arranged on the top of described teleblem structure, and described ring structure declines, and makes the blue film of cross after expansion keep expansion state; It is characterized in that described teleblem structure makes the blue film of cross along the chip cutting road direction expansion in wafer.
2. according to the brilliant machine of the expansion of claim 1, it is characterized in that, the surface on the top of described teleblem structure is blue film contact-making surface, the blue film of cross is placed on described blue film contact-making surface, the plan view shape of the periphery of described blue film contact-making surface is square or rectangle, makes the blue film of cross along the chip cutting road direction expansion in wafer.
3. according to the brilliant machine of the expansion of claim 2, it is characterized in that, described teleblem structure comprises the first main body and the second main body; Described the first main body is arranged on described the second main body top; The top of described the first main body is blue film contact-making surface, and the plan view shape of the periphery of described blue film contact-making surface is square or rectangle.
4. according to the brilliant machine of the expansion of claim 1, it is characterized in that, the top of described teleblem structure forms boss and expands brilliant ring seating surface, the interior plan view shape that expands the periphery on the brilliant top of encircling being placed on the brilliant ring of described expansion seating surface is square or rectangle, makes the blue film of cross along the chip cutting road direction expansion in wafer.
5. according to the brilliant machine of the expansion of claim 4, it is characterized in that, described teleblem structure comprises the first main body and the second main body; Described the first main body is arranged on described the second main body top; The top of described the first main body forms boss and expands brilliant ring seating surface.
6. according to the brilliant machine of the expansion of claim 1, it is characterized in that, the surface on the top of described teleblem structure is blue film contact-making surface; The top of described teleblem structure forms expands brilliant annular groove; The width of the brilliant annular groove of described expansion is equal to or greater than the interior thickness sum that expands the thickness of brilliant ring and extend out brilliant ring, and the degree of depth of the brilliant annular groove of described expansion is equal to or greater than the interior width that expands brilliant ring or extend out brilliant ring; The brilliant annular groove of described expansion is divided into 2 parts described blue film contact-making surface: interior blue film contact-making surface and outer blue film contact-making surface; The plan view shape of the periphery of described outer blue film contact-making surface is square or rectangle, makes the blue film of cross along the chip cutting road direction expansion in wafer.
7. according to the brilliant machine of the expansion of claim 6, it is characterized in that, described teleblem structure comprises the first main body and the second main body; Described the first main body is arranged on described the second main body top; The top of described the first main body forms expands brilliant annular groove; The brilliant annular groove of described expansion is divided into 2 parts described blue film contact-making surface: interior blue film contact-making surface and outer blue film contact-making surface; The plan view shape of the periphery of described outer blue film contact-making surface is square or rectangle.
8. expand a brilliant machine, it is characterized in that, the brilliant machine of described expansion comprises: frame structure, teleblem structure, press mold structure, ring structure, annex; Described annex is arranged on the periphery on the top of described teleblem structure, and the surface on the top of the surface on the top of described annex and described teleblem structure is at same plane, and described teleblem structure and annex be back and forth movement vertically; Described press mold structure is arranged on described frame structure top, compresses and loosens the blue film of cross; Described ring structure is arranged on the top of described teleblem structure, and after expansion, described ring structure declines, and makes the blue film of cross after expansion keep expansion state; The surface on the top of described annex is blue film contact-making surface, makes the blue film of cross along the chip cutting road direction expansion of wafer.
9. the brilliant machine of expansion according to Claim 8, is characterized in that, the plan view shape of the periphery of the surperficial blue film contact-making surface on the top of described annex is square or rectangle, makes the blue film of cross along the chip cutting road direction expansion of wafer.
10. the brilliant machine of expansion according to Claim 8, is characterized in that, the top of described teleblem structure forms boss and expands brilliant ring seating surface; The described width that expands brilliant ring seating surface is equal to or greater than the interior thickness sum that expands the thickness of brilliant ring and extend out brilliant ring, and the height of described boss is equal to or greater than the interior width that expands brilliant ring or extend out brilliant ring.
The brilliant machine of 11. expansions according to Claim 8, is characterized in that, the top of described teleblem structure forms expands brilliant annular groove; The width of the brilliant annular groove of described expansion is equal to or greater than the interior thickness sum that expands the thickness of brilliant ring and extend out brilliant ring, and the degree of depth of the brilliant annular groove of described expansion is equal to or greater than the interior width that expands brilliant ring; The brilliant annular groove of described expansion is divided into 2 parts described blue film contact-making surface: interior blue film contact-making surface and outer blue film contact-making surface.
The brilliant machine of 12. expansions according to Claim 8, is characterized in that, interior the expansions crystalline substance forming on annex in the position of the through hole of close the described annex of described annex encircles seating surface; The interior width that expands brilliant ring seating surface on described annex is equal to or greater than the interior thickness sum that expands the thickness of brilliant ring and extend out brilliant ring, and the interior degree of depth that expands brilliant ring seating surface on described annex is equal to, or greater than the interior width that expands brilliant ring.
The brilliant machine of 13. expansions according to Claim 8, it is characterized in that, the top of described annex forms the brilliant annular groove of expansion on annex, the width of the brilliant annular groove of expansion on described annex is equal to or greater than the interior thickness sum that expands the thickness of brilliant ring and extend out brilliant ring, and the degree of depth of the brilliant annular groove of expansion on described annex is equal to, or greater than the interior width that expands brilliant ring.
14. 1 kinds are expanded brilliant machine, it is characterized in that, the brilliant machine of described expansion comprises: frame structure, teleblem structure, press mold structure, ring structure, annex; Described annex is arranged on the periphery on the top of described teleblem structure, and the surface on the top of the surface on the top of described annex and described teleblem structure is at same plane, and described teleblem structure and annex be back and forth movement vertically; Described press mold structure is arranged on described frame structure top, compresses and loosens the blue film of cross; Described ring structure is arranged on the top of described teleblem structure, and after expansion, described ring structure declines, and makes the blue film of cross after expansion keep expansion state; The outside on the top of described annex forms the brilliant ring seating surface that extends out on annex, the width that extends out brilliant ring seating surface on described annex is equal to or greater than the interior thickness sum that expands the thickness of brilliant ring and extend out brilliant ring, and the degree of depth that extends out brilliant ring seating surface on described annex is equal to, or greater than the interior width that expands brilliant ring; The interior plan view shape that expands the periphery on the brilliant top of encircling extending out on brilliant ring seating surface being placed on described annex is square or rectangle, makes the blue film of cross along the chip cutting road direction expansion in wafer.
15. according to Claim 8 or the brilliant machine of the expansion of claim 14, it is characterized in that, described annex has heating arrangement.
CN201410205369.6A 2014-05-12 2014-05-12 Wafer expander with high expansion uniformity Pending CN104008986A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410205369.6A CN104008986A (en) 2014-05-12 2014-05-12 Wafer expander with high expansion uniformity

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410205369.6A CN104008986A (en) 2014-05-12 2014-05-12 Wafer expander with high expansion uniformity

Publications (1)

Publication Number Publication Date
CN104008986A true CN104008986A (en) 2014-08-27

Family

ID=51369597

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410205369.6A Pending CN104008986A (en) 2014-05-12 2014-05-12 Wafer expander with high expansion uniformity

Country Status (1)

Country Link
CN (1) CN104008986A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104600010A (en) * 2015-01-22 2015-05-06 佛山市南海区联合广东新光源产业创新中心 Top film structure of wafer expander
JP2016081977A (en) * 2014-10-10 2016-05-16 リンテック株式会社 Adhesive sheet for separation
JP2016081973A (en) * 2014-10-10 2016-05-16 リンテック株式会社 Separation device and separation method
CN108122814A (en) * 2017-10-27 2018-06-05 江西乾照光电有限公司 The sorting transfer method of LED core particle in a kind of LED chip
CN108511375A (en) * 2018-05-29 2018-09-07 李涵 A kind of brilliant device of semiconductor crystal wafer expansion
CN108597989A (en) * 2018-05-29 2018-09-28 李涵 A kind of brilliant technique of semiconductor crystal wafer expansion
CN109524343A (en) * 2018-12-25 2019-03-26 杭州小橙工业设计有限公司 A kind of LED light system of processing
CN109530162A (en) * 2018-12-27 2019-03-29 杭州小橙工业设计有限公司 A kind of LED system of processing
CN110783224A (en) * 2018-07-24 2020-02-11 先进装配系统有限责任两合公司 Assembling component carriers using offset information between structural features formed on opposite sides of a reference component
CN112509949A (en) * 2020-12-18 2021-03-16 深圳市思坦科技有限公司 One-way film expanding machine and film expanding method
CN112967999A (en) * 2020-09-27 2021-06-15 苏州苏纳光电有限公司 Preparation method for semiconductor chip film expansion
CN116631905A (en) * 2023-05-06 2023-08-22 深圳市博辉特科技有限公司 Crystal expanding equipment and crystal expanding method
CN116825685A (en) * 2023-08-31 2023-09-29 常州铭赛机器人科技股份有限公司 Automatic opening and closing structure and automatic opening and closing method for wafer expanding mechanism

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101740350A (en) * 2009-12-11 2010-06-16 广东工业大学 IC (integrated circuit)-packaged wafer expanding device
JP2010206136A (en) * 2009-03-06 2010-09-16 Disco Abrasive Syst Ltd Work dividing device
CN102714188A (en) * 2010-01-22 2012-10-03 三洋电机株式会社 Semiconductor module manufacturing method
JP2013026544A (en) * 2011-07-25 2013-02-04 Disco Abrasive Syst Ltd Wafer extension device
CN103400779A (en) * 2013-07-09 2013-11-20 程君 Manufacturing method of semiconductor display panel
CN204204809U (en) * 2014-05-12 2015-03-11 佛山市南海区联合广东新光源产业创新中心 The brilliant machine of the expansion that expansion uniformity is high

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010206136A (en) * 2009-03-06 2010-09-16 Disco Abrasive Syst Ltd Work dividing device
CN101740350A (en) * 2009-12-11 2010-06-16 广东工业大学 IC (integrated circuit)-packaged wafer expanding device
CN102714188A (en) * 2010-01-22 2012-10-03 三洋电机株式会社 Semiconductor module manufacturing method
JP2013026544A (en) * 2011-07-25 2013-02-04 Disco Abrasive Syst Ltd Wafer extension device
CN103400779A (en) * 2013-07-09 2013-11-20 程君 Manufacturing method of semiconductor display panel
CN204204809U (en) * 2014-05-12 2015-03-11 佛山市南海区联合广东新光源产业创新中心 The brilliant machine of the expansion that expansion uniformity is high

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016081977A (en) * 2014-10-10 2016-05-16 リンテック株式会社 Adhesive sheet for separation
JP2016081973A (en) * 2014-10-10 2016-05-16 リンテック株式会社 Separation device and separation method
CN104600010A (en) * 2015-01-22 2015-05-06 佛山市南海区联合广东新光源产业创新中心 Top film structure of wafer expander
CN108122814A (en) * 2017-10-27 2018-06-05 江西乾照光电有限公司 The sorting transfer method of LED core particle in a kind of LED chip
CN108511375A (en) * 2018-05-29 2018-09-07 李涵 A kind of brilliant device of semiconductor crystal wafer expansion
CN108597989A (en) * 2018-05-29 2018-09-28 李涵 A kind of brilliant technique of semiconductor crystal wafer expansion
CN108597989B (en) * 2018-05-29 2020-12-22 阜阳市恒祥生产力促进有限公司 Semiconductor wafer crystal expansion process
CN108511375B (en) * 2018-05-29 2020-10-09 江苏爱矽半导体科技有限公司 Semiconductor wafer expander
CN110783224A (en) * 2018-07-24 2020-02-11 先进装配系统有限责任两合公司 Assembling component carriers using offset information between structural features formed on opposite sides of a reference component
CN110783224B (en) * 2018-07-24 2024-04-02 先进装配系统有限责任两合公司 Assembling component carriers using offset information between structural features formed on opposite sides of a reference component
CN109524343A (en) * 2018-12-25 2019-03-26 杭州小橙工业设计有限公司 A kind of LED light system of processing
CN109530162B (en) * 2018-12-27 2020-08-14 杭州小橙工业设计有限公司 LED processing system
CN109530162A (en) * 2018-12-27 2019-03-29 杭州小橙工业设计有限公司 A kind of LED system of processing
CN112967999A (en) * 2020-09-27 2021-06-15 苏州苏纳光电有限公司 Preparation method for semiconductor chip film expansion
CN112509949A (en) * 2020-12-18 2021-03-16 深圳市思坦科技有限公司 One-way film expanding machine and film expanding method
CN116631905A (en) * 2023-05-06 2023-08-22 深圳市博辉特科技有限公司 Crystal expanding equipment and crystal expanding method
CN116631905B (en) * 2023-05-06 2024-06-14 深圳市博辉特科技有限公司 Crystal expanding equipment and crystal expanding method
CN116825685A (en) * 2023-08-31 2023-09-29 常州铭赛机器人科技股份有限公司 Automatic opening and closing structure and automatic opening and closing method for wafer expanding mechanism
CN116825685B (en) * 2023-08-31 2023-11-07 常州铭赛机器人科技股份有限公司 Automatic opening and closing structure and automatic opening and closing method for wafer expanding mechanism

Similar Documents

Publication Publication Date Title
CN104008986A (en) Wafer expander with high expansion uniformity
CN107851604A (en) Vacuum suction component and vacuum suction method
US11835363B2 (en) Optical module and method of making the same
CN105414349A (en) Cylindrical drawn part production and machining equipment
CN204204809U (en) The brilliant machine of the expansion that expansion uniformity is high
US9653660B1 (en) Chip scale LED packaging method
CN203565661U (en) Forming die of double-row flat packaging chip pins
CN204136258U (en) A kind of cutting machine jig
CN206976387U (en) A kind of graphical sapphire substrate
JP2016047628A (en) Breaking device and dividing method of brittle material substrate in breaking device
CN101900842B (en) Mold core and manufacturing method of micro-optical lens array
CN103746208A (en) Contact elastic piece and high-precision manufacturing method thereof
CN204545071U (en) A kind of solar energy inner bag pore hemmer and the solar energy inner bag made
CN104766829B (en) Semiconductor device
CN103165404A (en) Expanding device and method for manufacturing components
CN104201131B (en) The method that assessment polysilicon gate oxide layer lacks defect
TWI640486B (en) Glass forming mold
CN207265023U (en) Chip carrier
CN203764790U (en) Machining mould for large-aperture thin-walled rotary ring with flaring bottom and necking top
CN104600010A (en) Top film structure of wafer expander
CN204204904U (en) Expand epitaxial
CN103323927A (en) Integrated lens module
CN204171165U (en) Folded material pneumatics mould
CN204079474U (en) Bonding wafer, device wafers and bonding structure
CN203610483U (en) T-shape iron hole drawing die

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140827