CN101728584B - 形成二次电池的保护电路模块的方法 - Google Patents

形成二次电池的保护电路模块的方法 Download PDF

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CN101728584B
CN101728584B CN2009102091697A CN200910209169A CN101728584B CN 101728584 B CN101728584 B CN 101728584B CN 2009102091697 A CN2009102091697 A CN 2009102091697A CN 200910209169 A CN200910209169 A CN 200910209169A CN 101728584 B CN101728584 B CN 101728584B
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flexible printed
circuit board
printed circuit
protective
main body
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CN101728584A (zh
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金奉永
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Samsung SDI Co Ltd
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Samsung SDI Co Ltd
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    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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Abstract

公开了一种形成二次电池的保护电路模块的方法。该方法包括将裸片型电路器件安装到FPCB。所述电路器件的安装包括通过引线接合将所述电路器件接合至所述FPCB。所述方法可以进一步包括在所述FPCB上形成保护层以覆盖所述电路器件。所述保护层可以通过在所述FPCB上涂覆绝缘树脂来形成。

Description

形成二次电池的保护电路模块的方法
技术领域
本发明涉及二次电池，更具体地说，涉及形成二次电池的保护电路模块的方法。
背景技术
近些年来，由于电子、通信和计算产业的快速发展，便携式电子设备被广泛供销。可再充电二次电池主要用作便携式电子设备的电源。
包括控制充电和放电的保护电路模块(PCM)的二次电池得到广泛使用。最近，将二次电池用作主电源的便携式电子设备正快速地小型化。相应地，用于这种便携式电子设备的二次电池需要进一步小型化。现有的PCM通过将各种电路器件安装在印刷电路板(PCB)上来制造。然而，由于该PCB的厚度至少是0.5mm，所以通过现有的制造方法获得更薄的PCM存在局限性。
发明内容
鉴于上述问题，已经做出本发明，并且本发明提供了一种针对二次电池的薄保护电路模块的制造方法。
本发明还提供了一种针对二次电池的用于安全保护电路器件的薄保护电路模块的制造方法。
上述结构能够完成本发明的上述所有方面。更具体地说，由于上述方法包括将电路器件安装在柔性印刷电路板(在下文中，称为‘FPCB’)上的步骤，因此PCM可以被制得更薄。此外，由于用模制部分来保护电路器件，所以提高了绝缘性并减小了外部冲击对电路的损坏。
在一个实施例中，形成用于电池的多个保护电路模块(PCM)的方法包括：将柔性印刷电路板(FPCB)置于固定表面上，其中所述FPCB包括多个单元图案形成区域，各单元图案形成区域限定一主体和一外部端子；将裸片型芯片电路器件置于所述FPCB的单元图案形成区域的主体上，使得多个PCM能够形成在所述FPCB上；将保护层置于所述FPCB的至少一部分上，以便覆盖形成在所述FPCB上的所述PCM的至少一些元件；并且在所述裸片型芯片电路器件和所述保护层已被置于所述FPCB上之后，将所述FPCB与所述固定表面分离，以便将多个独立的PCM与所述固定表面分离。
在另一实施例中，形成二次电池的保护电路模块的方法包括：将具有主体和至少一个外部端子的至少一个柔性电路板(FPCB)置于固定构件上；将所述保护电路模块(PCM)所必需的采用裸片型芯片形式的一个或多个电路器件置于所述至少一个FPCB的主体上；将内部端子连接到所述至少一个FPCB，其中所述内部端子适于连接到提供电能的裸电池的一个或多个电极上；将保护层置于所述至少一个FPCB的至少一部分上，以便覆盖所述PCM电路器件中的至少一些；并且将具有所述一个或多个电路器件和所述保护层的所述至少一个FPCB与所述固定构件分离。
附图说明
本发明的目的、特征和优点将从下列结合附图的详细描述中更加明显，在附图中：
图1是图示说明根据本发明的实施例的制造二次电池的保护电路模块的方法的流程图；
图2是图示说明如图1所示的固定柔性印刷电路板的步骤的透视图；
图3A是图示说明如图1所示的安装电路器件的步骤的透视图；
图3B是图示说明如图3A所示的在安装期间所安装的芯片的详图；
图4A和4B是图示说明如图1所示的涂敷保护材料的步骤的视图；
图5A和图5B是图示说明如图1所示的去除不必要部分的步骤的视图；和
图6是图示说明如图1所示的分离保护电路模块的步骤的视图。
具体实施方式
在下文中，将参照附图详细描述本发明的实施例。
图1是图示说明根据本明的实施例的制造二次电池的保护电路模块的方法的流程图，并且图2至6是图示说明该方法的各个步骤的透视图。
参见图1，制造二次电池的保护电路模块(PCM)的方法包括：固定柔性印刷电路板(FPCB)(S10)，将电路器件安装到该FPCB(S20)，形成保护层(S30)，从该FPCB中去除不必要的部分(S40)，并且分离该PCM(S50)。
图2是图示说明如图1所示的固定FPCB的步骤(S10)的透视图。参见图2，FPCB 110被固定到固定构件120上。FPCB 110具有多个具有相同构造的单元图案形成区域111。每个单元图案形成区域111包括主体111a和从主体111a延伸出的外部端子112，电路器件被安装到所述主体111a。虽然没有描绘出来，但铜箔引线图案被形成在主体111a中，以电连接各种电路器件，这些电路器件将要安装到主体111a上，并且连接到外部端子112和随后形成的内部端子114。在本发明的实施例中，使用了厚度大约为0.1mm的FPCB，但本发明并不限于此。
固定构件120为平板形状，具有平坦的固定表面121，FPCB 110被贴置于该平台固定表面121。固定表面121具有与FPCB 110的形状近似相同的形状，并且其尺寸等于或大于FPCB 110的尺寸。FPCB 110可以通过诸如粘胶、双面胶带等等之类的各种固定方式固定到固定构件120的固定表面121上。
图3A是图示说明安装电路器件的步骤(S20)的透视图，图3B是图示说明安装裸片(die)型电路器件的详细状态的侧视图。参见图3A，保护电路模块(PCM)所必需的各种电路器件113被安装在FPCB 110的单元图案形成区域111的各主体111a中。虽然没有详细描绘出来，但该PCM中所使用的电路器件113包括控制IC、诸如场效应晶体管(FET)之类的开关器件以及诸如电阻器、电容器等的各种无源元件。在本实施例中，控制IC和开关器件是从晶圆(wafer)上切割的裸片型芯片。当使用裸片型芯片时，能够减小PCM的厚度。这些芯片和该主体的引线图案可以通过如图3B所示的引线接合(wiring bonding)的连接彼此电连接到一起。
参见图3B，芯片113以使芯片113的形成端子的侧面朝上的方式，被安装在FPCB 110上。芯片113的厚度大约0.22mm。芯片113通过形成在FPCB 110上的裸片接合焊盘113连接在FPCB 110上。裸片接合焊盘113a通过在FPCB 110上涂覆粘胶物质而形成。在这个实施例中，环氧树脂、导热树脂或包含导热颗粒的树脂被用作裸片接合焊盘113a以充分地释放从芯片113中生成的热量。裸片接合焊盘具有大约0.03mm的厚度。引线接合焊盘113b被设在在裸片接合焊盘113a的周围以与裸片接合焊盘113a分开。引线接合焊盘113b通过对形成在FPCB 110上的铜箔镀金而形成。引线接合焊盘113b通过引线接合电连接到芯片113的端子。当各条引线113c被连接到形成在芯片113的上侧的端子时，引线113c的上端突出到芯片113上方大约0.1mm。虽然在本实施例中引线113由金制成，但本发明不限于此。引线113可以由具有优良导电性的铜制成。
如图3B图示说明的对裸片型芯片113的安装通过在FPCB 110上形成裸片接合焊盘113a、将芯片113贴置在裸片接合焊盘113a上、并且将芯片113电连接到FPCB 110而形成。
导电板被安装在各主体111a的一侧以形成两个内部端子114。内部端子114从各主体111a中突出。虽然没有描绘出来，但是内部端子114被电连接到提供电能的裸电池的两个电极。虽然没有详细描绘出来，但是内部端子114被电连接到形成在主体111a上的铜箔引线图案。各PCM电路区域111b通过在各单元图案形成区域111中安装电路器件113和两个内部端子114而形成。这样，各PCM电路区域111b包括主体111a、外部端子112和从主体111a向外突出的内部端子114，其中多个电路器件113安装在所述主体111a上，且引线图案也形成在所述主体111a上。
图4A和图4B分别是图示说明如图1所示的形成保护层的步骤(S30)的透视图和侧视图。参见图4A和4B，保护层115形成在FPCB 110上，以覆盖各个PCM电路区域111b的主体111a。电路器件113分别被容纳在保护层115中。保护层115由绝缘物质制成，优选环氧树脂、硅化物或它们的组合。在本实施例中，在保护层的形成过程(S30)中，保护层通过滴下液态环氧树脂或液态硅化物并且对其进行硬化而形成。保护层115的顶部比引线113c的上端高大约0.05mm(参见图3B)。这样，保护层115的顶部从FPCB 110中突出大约0.4mm。因此，由于厚度大约为0.1mm的FPCB 110和保护层115的总厚度大约为0.5mm，根据本发明的实施例的PCM的厚度被显著减小，小于具有厚度大约为0.5mm的PCB的现有PCM的厚度。换句话说，FPCB 110的厚度大约为0.1mm，形成在FPCB 110上的裸片接合焊盘113a厚度大约为0.03mm，安装到裸片接合焊盘113a上的芯片113的厚度大约是0.22mm，引线113c上升到比芯片113大约高0.1mm，并且保护层115顶部比引线113c的顶端提高大约0.05mm。这样，包含FPCB 110和保护层115的总厚度可以变薄为大约0.5mm。保护层115将容纳在其中的部分与外部绝缘并防止引线由于外部震荡而被短路或被断开。
虽然这些附图示出所有的电路器件113被保护层115覆盖，但本发明并限于此。如在图3中图示说明的，仅仅诸如控制IC芯片、开关器件等等的有源元件可以被保护层115覆盖，而诸如电阻器、电容器等等的无源元件可以不被保护层115覆盖。当诸如电阻器、电容器等等的无源元件也被覆盖时，薄保护层115被广泛形成且电路器件可能容易被损坏。因此，当仅仅诸如控制IC芯片、开关器件之类的有源元件被保护层115覆盖时，保护层115的损坏的可能性能够被减小。
图5A和5B分别是图示说明如图1所示的去除不必要部分的步骤(S40)的透视图和侧视图。参见图5A和5B，待去除的不必要部分被从FPCB 110上切割出去(参见图4A)。本发明的这个实施例提及的不必要部分指除了FPCB 110的PCM电路区域111b之外的部分(参见图4A)。各个PCM电路区域111b是基本用作二次电池的PCM的部分。按照场合需要，可以不执行不必要部分的去除(S40)。换句话说，可以在形成保护层(S30)之后直接执行PCM电路区域的分离(S50)。
图6是图示说明如图1所示的PCM电路区域的分离(S50)的透视图。参见图6，在分离PCM电路区域(S50)时，各个PCM电路区域111b与固定构件120分离。各分离的PCM电路区域111b用作二次电池的PCM 130。各PCM 130包括铜箔引线图案形成到且各种电路器件安装到的主体111a、覆盖主体111a并将各种电路器件113容纳于其中的保护层115以及分别从主体111a延伸出来的外部端子112和内部端子114。
虽然以上已经详细描述了本发明的示范性实施例，应该理解的是，这里描述的基本的创造性想法的许多变形或修改，在本领域技术人员看来，仍将落入由所附权利要求所限定的本发明的示范性实施例的精神和范围。

Claims (20)

1.一种形成用于电池的多个保护电路模块的方法，所述方法包括：
将柔性印刷电路板置于固定表面上，其中所述柔性印刷电路板包括多个单元图案形成区域，各单元图案形成区域限定一主体和外部端子；
将一个或多个裸片型芯片电路器件置于所述柔性印刷电路板的单元图案形成区域的主体上，使得多个保护电路模块被形成在所述柔性印刷电路板上；
将保护层置于所述柔性印刷电路板的至少一部分的上方，以便覆盖形成在所述柔性印刷电路板上的多个保护电路模块的至少一些元件；并且
在所述裸片型芯片电路器件和所述保护层已经被置于所述柔性印刷电路板上之后，将所述柔性印刷电路板与所述固定表面分离，以便将多个独立的保护电路模块与所述固定表面分离。
2.根据权利要求1所述的形成用于电池的多个保护电路模块的方法，其中所述柔性印刷电路板通过粘胶或双面胶带固定到所述固定表面。
3.根据权利要求1所述的形成用于电池的多个保护电路模块的方法，其中所述一个或多个裸片型芯片电路器件是有源电路器件，所述有源电路器件裸片接合至所述柔性印刷电路板的主体，使得所述有源电路器件的端子位于远离所述有源电路器件与所述柔性印刷电路板的主体之间的界面的表面上。
4.根据权利要求3所述的形成用于电池的多个保护电路模块的方法，其中所述裸片型芯片电路器件通过在所述柔性印刷电路板上的一个或多个有源电路器件与所述主体之间的界面处涂覆粘胶物质，裸片接合至所述柔性印刷电路板。
5.根据权利要求4所述的形成用于电池的多个保护电路模块的方法，其中所述一个或多个有源电路器件与所述主体之间的界面处的粘胶物质包括导热树脂或包含导热颗粒的树脂。
6.根据权利要求3所述的形成用于电池的多个保护电路模块的方法，进一步包括：
在所述柔性印刷电路板上形成引线接合焊盘，并且
通过引线接合将所述有源电路器件的端子与所述引线接合焊盘电互连。
7.根据权利要求6所述的形成用于电池的多个保护电路模块的方法，其中所述有源电路器件的端子引线接合至所述引线接合焊盘，使得所述引线接合高出所述裸片型芯片电路器件的上表面的距离小于0.1mm。
8.根据权利要求6所述的形成用于电池的多个保护电路模块的方法，其中所述柔性印刷电路板包括铜箔，并且所述引线接合焊盘通过在所述铜箔上镀金来形成。
9.根据权利要求1所述的形成用于电池的多个保护电路模块的方法，进一步包括：将适于连接到提供电能的裸电池的一个或多个电极的一个或多个内部端子连接到所述柔性印刷电路板，使得所述内部端子从所述柔性印刷电路板的主体向外伸出。
10.根据权利要求1所述的形成用于电池的多个保护电路模块的方法，其中将保护层置于所述柔性印刷电路板的至少一部分的上方包括：将所述保护层置于所述柔性印刷电路板的包括有源电路元件的主体的上方。
11.根据权利要求10所述的形成用于电池的多个保护电路模块的方法，其中将保护层置于所述柔性印刷电路板的至少一部分的上方包括：将所述保护层置于所述柔性印刷电路板的上方，使得所述保护层的高度高出所述裸片型芯片电路器件的上表面的距离小于0.15mm。
12.根据权利要求10所述的形成用于电池的多个保护电路模块的方法，其中将保护层置于所述柔性印刷电路板的主体的上方包括：将多个保护层中的各保护层分别置于所述柔性印刷电路板的多个主体中的一个主体的至少一部分的上方。
13.根据权利要求12所述的形成用于电池的多个保护电路模块的方法，其中将多个保扩层中的各保护层分别置于所述柔性印刷电路板的多个主体中的一个主体的至少一部分的上方包括：将所述多个保护层中的各保护层分别布置得使所述柔性印刷电路板的主体的有源电路元件被覆盖并且所述主体的其它电路元件没有被覆盖。
14.根据权利要求1所述的形成用于电池的多个保护电路模块的方法，其中所述保护层包括电绝缘树脂。
15.根据权利要求14所述的形成用于电池的多个保护电路模块的方法，其中将保护层置于所述柔性印刷电路板的至少一部分的上方包括：将液态环氧树脂或液态硅化物布置在所述柔性印刷电路板上，并且对所述液态环氧树脂或所述液态硅化物进行硬化。
16.根据权利要求1所述的形成用于电池的多个保护电路模块的方法，进一步包括：在分离所述柔性印刷电路板与所述固定构件之前，去除所述柔性印刷电路板的一个或多个不必要部分。
17.一种形成二次电池的保护电路模块的方法，所述方法包括：
将具有主体和至少一个外部端子的至少一个柔性印刷电路板置于固定构件上；
将所述保护电路模块所必需的裸片型芯片形式的一个或多个电路器件置于所述至少一个柔性印刷电路板的主体上；
将内部端子连接到所述至少一个柔性印刷电路板上，其中所述内部端子适于连接到提供电能的裸电池的一个或多个电极；
将保护层置于所述至少一个柔性印刷电路板的至少一部分的上方，以便覆盖所述保护电路模块所必需的一个或多个电路器件中的至少一些；并且
将具有所述一个或多个电路器件和所述保护层的所述至少一个柔性印刷电路板与所述固定构件分离。
18.根据权利要求17所述的形成二次电池的保护电路模块的方法，其中所述裸片型芯片形式的一个或多个电路器件包括有源电路器件，所述有源电路器件裸片接合至所述柔性印刷电路板的主体，使得所述有源电路器件的端子位于远离所述有源电路器件与所述柔性印刷电路板的主体之间的界面的表面上。
19.根据权利要求18所述的形成二次电池的保护电路模块的方法，其中所述一个或多个电路器件通过将粘胶物质涂覆在所述柔性印刷电路板上的一个或多个有源电路器件与所述主体之间的界面处，裸片接合至所述柔性印刷电路板。
20.根据权利要求19所述的形成二次电池的保护电路模块的方法，进一步包括：
在所述柔性印刷电路板上形成引线接合焊盘；并且
通过引线接合将所述有源电路器件的端子与所述引线接合焊盘电互连。
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