CN101719473A - Method for manufacturing epoxy resin plastic package press-in type rectifier diode of automobile - Google Patents
Method for manufacturing epoxy resin plastic package press-in type rectifier diode of automobile Download PDFInfo
- Publication number
- CN101719473A CN101719473A CN200910232568A CN200910232568A CN101719473A CN 101719473 A CN101719473 A CN 101719473A CN 200910232568 A CN200910232568 A CN 200910232568A CN 200910232568 A CN200910232568 A CN 200910232568A CN 101719473 A CN101719473 A CN 101719473A
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- rectifier diode
- automobile
- type rectifier
- press
- epoxy resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Abstract
The invention discloses a method for manufacturing an epoxy resin plastic package press-in type rectifier diode of an automobile. The method comprises the steps of combining materials of the epoxy resin plastic package with a core seat of the rectifier diode together by mold pressing, and directly manufacturing a press-in type rectifier diode of the automobile. By adopting the method, the product has the advantages of good sealing performance, good heat conductivity, high reliability, low cost and simple process, and the method is suitable for the large-scale manufacturing.
Description
Technical field
The present invention relates to the manufacture method of a kind of auto rectifier diode in a kind of automobile current generator rectifier stack, especially relate to a kind of manufacture method of epoxy resin plastic package press-in type rectifier diode of automobile.
Technical background
Press-in type rectifier diode of automobile is the key components and parts of automobile current generator, and by being combined into rectifier stack, the alternating current that generator is produced converts direct current to.Because the avalanche breakdown characteristic of auto rectifier diode, when breaking down, automobile can absorb false voltage during throw load, and the protection adjuster is injury-free.It can puncture immediately when adjuster is out of control, and generator is not generated electricity, and plays the effect of fuse, and main controller is injury-free in the protection car, and serious accident is changed into generic failure.
The manufacture method of existing press-in type rectifier diode of automobile, it all is the method encapsulation auto rectifier diode that adopts liquid " epoxy pouring sealant " (Epoxy Potting Adhesive) embedding, the sealing of the press-in type rectifier diode of automobile of this method manufacturing, thermal conductivity, reliability all are subjected to restriction to a certain degree, and manufacturing cost is higher, is not suitable for manufacturing in enormous quantities.
The step of epoxy pouring sealant encapsulation is as follows:
1. earlier lead-in wire, chip, weld tabs, base are lumped together by soldering group, make the press-in type rectifier diode of automobile core print seat, Fig. 1 is the core print seat structural representation of the press-in type rectifier diode of automobile of the liquid epoxy sealing process of employing manufacturing.
2. put plastic ring on the diode core print seat, Fig. 2 is the core print seat of the press-in type rectifier diode of automobile of the liquid epoxy sealing process of employing manufacturing and the structural representation of plastic ring.
3. pouring in liquid epoxy pouring sealant in plastic ring is made press-in type rectifier diode of automobile, and Fig. 3 is for adopting the press-in type rectifier diode of automobile structural representation of liquid epoxy sealing process manufacturing.
As far back as the seventies in 20th century, semiconductor device is just brought into use the epoxy plastics encapsulation, particularly be accompanied by the development of microelectric technique and microelectronic packaging technology, epoxy-plastic packaging material (Epoxy MoldingCompound) has occupied the market of whole microelectronic packaging material more than 97% with characteristics such as its high reliability, low cost, simple, the suitable large-scale production of manufacturing process.Now, each encapsulation field such as semiconductor device, integrated circuit, consumer electronics, military affairs, aviation have been widely used in.
The time of decades has also been passed through in the development of press-in type rectifier diode of automobile, because its special structural design, so far still adopt liquid epoxy pouring sealant to encapsulate its product, make manufacturing cost corresponding higher, large-scale production is restricted, and product reliability can only maintain on certain level and can't break through.
The reason that does not adopt the epoxy-plastic packaging technology to make press-in type rectifier diode of automobile has a lot, and wherein, product mold process chips is subjected to stress and causes product failure and reliability to reduce is main cause.
Summary of the invention
Technical problem to be solved by this invention provides a kind of low cost, high reliability, is fit to the manufacture method of the press-in type rectifier diode of automobile of large-scale production.
For addressing the above problem, the invention provides a kind of manufacture method of epoxy resin plastic package press-in type rectifier diode of automobile.The manufacture method of epoxy resin plastic package press-in type rectifier diode of automobile of the present invention may further comprise the steps:
1) by once welding integrated ailhead lead-in wire, chip, weld tabs, base are combined, directly made the auto rectifier diode core print seat;
2) wrap up one deck insulation protection glue in the die sites of core print seat;
3) on mould, epoxy-plastic packaging material and auto rectifier diode core print seat are combined, made epoxy resin plastic package press-in type rectifier diode of automobile by mold pressing.
The manufacture method of aforesaid epoxy resin plastic package press-in type rectifier diode of automobile, it is characterized in that: in the step 1) process, the bottom of described core print seat 1 is a base, the bottom of base is a cylinder 5, in the central upper portion position of cylinder 5 are boss 6, and at the arranged outside bowl-type annulus 7 of boss 6, the top of base is chip 4, the integrated ailhead in the top of chip 4 goes between 8, is provided with the groove 9 of annular at the head surface of described ailhead lead-in wire 8.
The manufacture method of aforesaid epoxy resin plastic package press-in type rectifier diode of automobile is characterized in that: adopted the epoxy-plastic packaging material electronic package method to encapsulate in the step 3) process, solid-state epoxy-plastic packaging material and core print seat are combined.
The beneficial effect that the present invention reached:
The manufacture method of epoxy resin plastic package press-in type rectifier diode of automobile disclosed by the invention, the epoxy resin plastic package press-in type rectifier diode of automobile that utilizes special-purpose encapsulating mould to make, its sealing, thermal conductivity is good, reliability is high, cost is low, technology is simple, be fit to extensive manufacturing.And reliability index is the automobile current generator key technical index in when design.
Description of drawings
Fig. 1 is the core print seat structural representation of the press-in type rectifier diode of automobile of the liquid epoxy sealing process of employing manufacturing;
Fig. 2 is the core print seat of the press-in type rectifier diode of automobile of the liquid epoxy sealing process of employing manufacturing and the structural representation of plastic ring;
Fig. 3 is for adopting the press-in type rectifier diode of automobile structural representation of liquid epoxy sealing process manufacturing;
Fig. 4 is the core print seat structural representation of the press-in type rectifier diode of automobile of the solid-state epoxy-plastic packaging process of employing manufacturing;
Fig. 5 is the core print seat and the insulation protection plastic structure schematic diagram of the press-in type rectifier diode of automobile of the solid-state epoxy-plastic packaging process of employing manufacturing;
Fig. 6 is for adopting the press-in type rectifier diode of automobile structural representation of solid-state epoxy-plastic packaging process manufacturing.
Embodiment
The present invention is further illustrated below in conjunction with accompanying drawing.
The manufacture method of epoxy resin plastic package press-in type rectifier diode of automobile of the present invention may further comprise the steps:
1) by once welding integrated ailhead lead-in wire, chip, weld tabs, base are combined, directly made auto rectifier diode core print seat 1;
2) die sites parcel one deck insulation protection glue 2 on core print seat 1;
3) on particular manufacturing craft, adopted epoxy-plastic packaging material Electronic Packaging technology epoxy-plastic packaging material 3 and auto rectifier diode core print seat 1 to be combined, made epoxy resin plastic package press-in type rectifier diode of automobile by mold pressing.
Utilizing the structure of the auto rectifier diode of the inventive method manufacturing is different with the press-in type rectifier diode of automobile structure that adopts the manufacturing of liquid epoxy sealing process, Fig. 3 is for adopting the press-in type rectifier diode of automobile structural representation of liquid epoxy sealing process manufacturing, and diode comprises core print seat 1, plastic ring 12, epoxy pouring sealant 13.
Fig. 6 is for adopting the press-in type rectifier diode of automobile structural representation of solid-state epoxy-plastic packaging process manufacturing, the bottom of described core print seat 1 is a base, the bottom of base is a cylinder 5, in the central upper portion position of cylinder 5 are boss 6, arranged outside bowl-type annulus 7 at boss 6, the top of base is chip 4, and the integrated ailhead in the top of chip 4 goes between 8, is provided with the groove 9 of annular at the head surface of described ailhead lead-in wire 8.Die sites parcel one deck insulation protection glue 2, epoxy-plastic packaging material 3 bags are carried out cylinder in core print seat 15 or more, ailhead and are gone between 8 lead-in wire with the lower part on core print seat 1.
Below disclose the present invention with preferred embodiment, so it is not in order to restriction the present invention, and all employings are equal to replaces or technical scheme that the equivalent transformation mode is obtained, all drops within protection scope of the present invention.
Claims (3)
1. the manufacture method of an epoxy resin plastic package press-in type rectifier diode of automobile is characterized in that: may further comprise the steps:
1) by once welding integrated ailhead lead-in wire, chip, weld tabs, base are combined, made press-in type rectifier diode of automobile core print seat (1);
2) go up parcel one deck insulation protection glue (2) at core print seat (1);
3) on mould, solid-state epoxy-plastic packaging material (3) and core print seat (1) are combined and made epoxy resin plastic package press-in type rectifier diode of automobile by mold pressing.
2. the manufacture method of epoxy resin plastic package press-in type rectifier diode of automobile according to claim 1, it is characterized in that: in the step 3) process, adopt the epoxy-plastic packaging material electronic package method to encapsulate, solid-state epoxy-plastic packaging material (3) and core print seat (1) are combined.
3. the manufacture method of epoxy resin plastic package press-in type rectifier diode of automobile according to claim 1, it is characterized in that: in the step 1) process, the bottom of described core print seat (1) is a base, the bottom of base is cylinder (5), in the central upper portion position of cylinder (5) is a boss (6), arranged outside bowl-type annulus (7) at boss (6), the top of base is chip (4), the integrated ailhead in the top of chip (4) goes between (8), is provided with the groove 9 of annular at the head surface of described ailhead lead-in wire (8).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910232568A CN101719473A (en) | 2009-12-07 | 2009-12-07 | Method for manufacturing epoxy resin plastic package press-in type rectifier diode of automobile |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910232568A CN101719473A (en) | 2009-12-07 | 2009-12-07 | Method for manufacturing epoxy resin plastic package press-in type rectifier diode of automobile |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101719473A true CN101719473A (en) | 2010-06-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910232568A Pending CN101719473A (en) | 2009-12-07 | 2009-12-07 | Method for manufacturing epoxy resin plastic package press-in type rectifier diode of automobile |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109273370A (en) * | 2018-08-16 | 2019-01-25 | 江苏云意电气股份有限公司 | Automobile current generator rectifier diode chip packaging method |
-
2009
- 2009-12-07 CN CN200910232568A patent/CN101719473A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109273370A (en) * | 2018-08-16 | 2019-01-25 | 江苏云意电气股份有限公司 | Automobile current generator rectifier diode chip packaging method |
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Open date: 20100602 |