CN101708497A - Method for cleaning quartz crystal frequency chip - Google Patents
Method for cleaning quartz crystal frequency chip Download PDFInfo
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- CN101708497A CN101708497A CN200910227990A CN200910227990A CN101708497A CN 101708497 A CN101708497 A CN 101708497A CN 200910227990 A CN200910227990 A CN 200910227990A CN 200910227990 A CN200910227990 A CN 200910227990A CN 101708497 A CN101708497 A CN 101708497A
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- frequency chip
- compressed gas
- crystal frequency
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Abstract
The invention relates to a method for cleaning quartz crystal frequency chip, belonging to cleaning method. An ultrasonic cleaning device is used for performing ultrasonic cleaning to the quartz crystal frequency chip, a compressed gas pipe is arranged below an ultrasonic cleaning basket or tank, compressed gas passes through the open pores on the pipe and the pore gap below the ultrasonic cleaning basket or tank to enter into the ultrasonic cleaning basket or tank. The invention solves such problems as poor operation environment, poor cleaning effect and the like existing in the prior art, and has the advantages of wide application range, good cleaning effect, no pollution to the operation environment and the like.
Description
Affiliated technical field
The invention belongs to cleaning method, be meant a kind of method for cleaning quartz crystal frequency chip especially.
Background technology
Quartz oscillator, resonator are widely used in the various numeric class electronic products, and the market demand is huge.There is significant impact in the cleaning of the used quartz crystal frequency chip of such production to technical target of the product, the following four kinds of cleaning methods of general at present employing:
1, artificial ultrasound is cleaned: according to cleaning process, manually carry out, and hand shaken is cleaned basket in cleaning process, avoid the quartz frequency sheet to assemble.This method efficient is low, hand labor intensity is big, and it is unified that cleaning performance is difficult to reach.
2, semi-automatic ultrasonic cleaning: according to cleaning process, continuous ultrasonic cleaning tank is set, behind the scavenging period that reaches process stipulation, manually quartz crystal frequency chip is transferred to next rinse bath.This method hand labor is emphasized to improve, but produces the wafer clustering phenomena in cleaning process, and the surface of all wafers is fully cleaned.
3, fully-automatic ultrasonic cleans: equipment generally is to use producer to develop voluntarily or develops cooperatively, does not need to intervene midway.This method for strengthening effect, adopts strong current scour wafer in cleaning process, need to consume a large amount of water sources in the production.
4, inorganic acid cleans: adopt hydrochloric acid and hydrogen peroxide to be configured to solution by a certain percentage, carry out under heating condition.This method can produce irritative gas in actual production, and solution seethes with excitement easily under heating condition, jeopardizes the operative employee, needs special labour protection measures.
Therefore under the taking all factors into consideration of aspects such as improving the quality of products, protect Employee Security, environmental protection, economize on resources, need a kind of effective cleaning process badly.
Summary of the invention
The object of the present invention is to provide a kind of environmental protection, energy-conservation method for cleaning quartz crystal frequency chip.
Overall technology design of the present invention is:
Method for cleaning quartz crystal frequency chip, adopt ultrasonic cleaning apparatus that quartz crystal frequency chip is carried out ultrasonic cleaning, below ultrasonic wave cleaning basket or rinse bath the Compressed Gas pipeline is set, Compressed Gas enters ultrasonic wave cleaning basket or rinse bath at interval by the below hole that the perforate on the pipeline, ultrasonic wave clean basket or rinse bath.
Concrete technical conceive of the present invention is:
The source of the gas of Compressed Gas is selected non-pure oxygen gas for use.Wherein comparatively preferably adopt a kind of in air, nitrogen, inert gas, the carbon dioxide.
The feeding of Compressed Gas is spaced apart 0.5-5 second, and the feeding time is 0.5-5 second.
For guaranteeing compressed-air actuated even release, and compressed air piping is easy to make, and the Compressed Gas pipeline is continuous comb or the continuation column tubular construction that parallel interval distributes.The preferred construction mode is that the Compressed Gas pipeline adopts " S " type coil pipe.
Wherein more preferred construction is, the perforate aperture on the Compressed Gas pipeline is 0.1-1mm, and spacing is 20-60mm between the adjacent perforate.
For guaranteeing that compressed air piping is easy to install, the Compressed Gas pipeline places the upper surface of base.
Described ultrasonic cleaning comprises following processing step:
A, employing 201 acid cleaning solution ultrasonic cleaning 1-10 minute, supersonic frequency 28K;
B, employing pure water add spray ultrasonic cleaning 1-10 minute, supersonic frequency 40K;
C, employing 301 basic cleaning solution ultrasonic cleaning 1-10 minute, supersonic frequency 28K;
D, employing pure water add spray ultrasonic cleaning 1-10 minute, supersonic frequency 40K;
E, the ultrasonic cleaning of employing pure water three times, each 1-10 minute, supersonic frequency 150K;
The SH-201 cleaning agent that described 201 acid cleaning solutions adopt Tianjin China Xiang Electron Material Co., Ltd to produce is to prepare at 1: 80 by the volume ratio of SH-201 cleaning agent and pure water; The SH-301 cleaning agent that 301 basic cleaning solution adopt Tianjin China Xiang Electron Material Co., Ltd to produce is to prepare at 1: 160 by the volume ratio of SH-201 cleaning agent and pure water.
Substantive distinguishing features that the present invention is obtained and significant technological progress are:
1, the present invention is because the main means that adopt the Compressed Gas of feeding at interval to separate as frequency chip, technical conceive is ingenious, and means are easy to realize, can be widely used in artificial, semi-automatic, fully-automatic ultrasonic cleaning method, when being applied to the fully-automatic ultrasonic cleaning, will save water resource in a large number; When being applied to semi-automatic ultrasonic cleaning technology, will effectively improve cleaning performance; When being applied to the artificial ultrasound cleaning, will reduce staff labor intensity, improve technology stability;
2, owing to adopt compressed air as the major technique solution, three-waste free pollution in the production process, energy-conserving and environment-protective.
Description of drawings
Fig. 1 is the structural representation of Compressed Gas pipeline of the present invention.
Fig. 2 is the upward view of Fig. 1.
Fig. 3 is the DLD scanning curve figure that utilizes the prepared product of this method.
The specific embodiment
Below in conjunction with accompanying drawing embodiments of the invention are further described, but not as a limitation of the invention, protection scope of the present invention is as the criterion with the content of claim record.
The overall structure of present embodiment as shown, this method for cleaning quartz crystal frequency chip wherein, adopt ultrasonic cleaning apparatus that quartz crystal frequency chip is carried out ultrasonic cleaning, below ultrasonic wave cleaning basket or rinse bath Compressed Gas pipeline 2 is set, Compressed Gas enters ultrasonic wave cleaning basket or rinse bath at interval by the below hole that the perforate on the pipeline 23, ultrasonic wave clean basket or rinse bath.
The source of the gas of Compressed Gas is selected nitrogen for use.
The feeding of Compressed Gas is spaced apart 0.5 second, and the feeding time is 0.5 second.
Compressed Gas pipeline 2 adopts " S " type coil pipe.
Perforate 3 apertures on the Compressed Gas pipeline 2 are 0.1-1mm, and spacing is 20-60mm between the adjacent perforate.
The Compressed Gas pipeline places the upper surface of base 1.
Described ultrasonic cleaning comprises following processing step:
A, employing 201 acid cleaning solution ultrasonic cleaning 1-10 minute, supersonic frequency 28K;
B, employing pure water add spray ultrasonic cleaning 1-10 minute, supersonic frequency 40K;
C, employing 301 basic cleaning solution ultrasonic cleaning 1-10 minute, supersonic frequency 28K;
D, employing pure water add spray ultrasonic cleaning 1-10 minute, supersonic frequency 40K;
E, the ultrasonic cleaning of employing pure water three times, each 1-10 minute, supersonic frequency 150K;
The SH-201 cleaning agent that described 201 acid cleaning solutions adopt Tianjin China Xiang Electron Material Co., Ltd to produce is to prepare at 1: 80 by the volume ratio of SH-201 cleaning agent and pure water; The SH-301 cleaning agent that 301 basic cleaning solution adopt Tianjin China Xiang Electron Material Co., Ltd to produce is to prepare at 1: 160 by the volume ratio of SH-201 cleaning agent and pure water.
Claims (10)
1. method for cleaning quartz crystal frequency chip, adopt ultrasonic cleaning apparatus that quartz crystal frequency chip is carried out ultrasonic cleaning, it is characterized in that below ultrasonic wave cleaning basket or rinse bath Compressed Gas pipeline (2) being set, Compressed Gas enters ultrasonic wave cleaning basket or rinse bath at interval by the below hole that the perforate (3) on the pipeline (2), ultrasonic wave clean basket or rinse bath.
2. method for cleaning quartz crystal frequency chip according to claim 1 is characterized in that the source of the gas of described Compressed Gas is selected non-pure oxygen gas for use.
3. method for cleaning quartz crystal frequency chip according to claim 1, the source of the gas that it is characterized in that described Compressed Gas are selected a kind of in air, nitrogen, inert gas, the carbon dioxide for use.
4. according to each described method for cleaning quartz crystal frequency chip among the claim 1-3, it is characterized in that the feeding of described Compressed Gas is spaced apart 0.5-5 second, the feeding time is 0.5-5 second.
5. method for cleaning quartz crystal frequency chip according to claim 1 is characterized in that continuous comb or continuation column tubular construction that described Compressed Gas pipeline (2) distributes for parallel interval.
6. method for cleaning quartz crystal frequency chip according to claim 1 is characterized in that described Compressed Gas pipeline (2) adopts " S " type coil pipe.
7. method for cleaning quartz crystal frequency chip according to claim 1 is characterized in that perforate (3) aperture on the described Compressed Gas pipeline (2) is 0.1-1mm, and spacing is 20-60mm between the adjacent perforate.
8. according to claim 1,5,6,7 described method for cleaning quartz crystal frequency chip, it is characterized in that described Compressed Gas pipeline places the upper surface of base (1).
9. method for cleaning quartz crystal frequency chip according to claim 1 is characterized in that described ultrasonic cleaning comprises following processing step:
A, employing 201 acid cleaning solution ultrasonic cleaning 1-10 minute, supersonic frequency 28K;
B, employing pure water add spray ultrasonic cleaning 1-10 minute, supersonic frequency 40K;
C, employing 301 basic cleaning solution ultrasonic cleaning 1-10 minute, supersonic frequency 28K;
D, employing pure water add spray ultrasonic cleaning 1-10 minute, supersonic frequency 40K;
E, the ultrasonic cleaning of employing pure water three times, each 1-10 minute, supersonic frequency 150K;
10. method for cleaning quartz crystal frequency chip according to claim 1, it is characterized in that the SH-201 cleaning agent that described 201 acid cleaning solutions adopt Tianjin China Xiang Electron Material Co., Ltd to produce, is to prepare at 1: 80 by the volume ratio of SH-201 cleaning agent and pure water; The SH-301 cleaning agent that 301 basic cleaning solution adopt Tianjin China Xiang Electron Material Co., Ltd to produce is to prepare at 1: 160 by the volume ratio of SH-201 cleaning agent and pure water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910227990A CN101708497A (en) | 2009-12-11 | 2009-12-11 | Method for cleaning quartz crystal frequency chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910227990A CN101708497A (en) | 2009-12-11 | 2009-12-11 | Method for cleaning quartz crystal frequency chip |
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| CN101708497A true CN101708497A (en) | 2010-05-19 |
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| CN200910227990A Pending CN101708497A (en) | 2009-12-11 | 2009-12-11 | Method for cleaning quartz crystal frequency chip |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102172587A (en) * | 2011-03-02 | 2011-09-07 | 天津源天晟光伏设备有限公司 | Method for cleaning quartz crystal product after curing and before encapsulating |
| CN106087066A (en) * | 2016-06-15 | 2016-11-09 | 廊坊中电熊猫晶体科技有限公司 | A kind of method improving quartz crystal slice surface roughness |
| CN106190030A (en) * | 2016-07-13 | 2016-12-07 | 苏州普锐晶科技有限公司 | The ground and cleaned method of frequency chip |
| CN106180057A (en) * | 2016-07-13 | 2016-12-07 | 苏州普锐晶科技有限公司 | Frequency chip cleaning method based on ultrasound wave |
| CN106877833A (en) * | 2016-12-29 | 2017-06-20 | 北京晨晶电子有限公司 | A kind of processing method of quartz-crystal resonator |
| CN109647783A (en) * | 2018-12-25 | 2019-04-19 | 北京无线电计量测试研究所 | A kind of cleaning method and automatic flushing device of quartz wafer |
| CN111900947A (en) * | 2020-07-16 | 2020-11-06 | 顾丽旺 | Fine adjustment device for mounting quartz crystal frequency chip |
| CN114247699A (en) * | 2021-12-13 | 2022-03-29 | 安徽光智科技有限公司 | Ultrasonic demoulding method for crystal oscillation plate |
-
2009
- 2009-12-11 CN CN200910227990A patent/CN101708497A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102172587A (en) * | 2011-03-02 | 2011-09-07 | 天津源天晟光伏设备有限公司 | Method for cleaning quartz crystal product after curing and before encapsulating |
| CN106087066A (en) * | 2016-06-15 | 2016-11-09 | 廊坊中电熊猫晶体科技有限公司 | A kind of method improving quartz crystal slice surface roughness |
| CN106190030A (en) * | 2016-07-13 | 2016-12-07 | 苏州普锐晶科技有限公司 | The ground and cleaned method of frequency chip |
| CN106180057A (en) * | 2016-07-13 | 2016-12-07 | 苏州普锐晶科技有限公司 | Frequency chip cleaning method based on ultrasound wave |
| CN106877833A (en) * | 2016-12-29 | 2017-06-20 | 北京晨晶电子有限公司 | A kind of processing method of quartz-crystal resonator |
| CN106877833B (en) * | 2016-12-29 | 2020-04-14 | 北京晨晶电子有限公司 | Processing method of quartz crystal resonator |
| CN109647783A (en) * | 2018-12-25 | 2019-04-19 | 北京无线电计量测试研究所 | A kind of cleaning method and automatic flushing device of quartz wafer |
| CN111900947A (en) * | 2020-07-16 | 2020-11-06 | 顾丽旺 | Fine adjustment device for mounting quartz crystal frequency chip |
| CN111900947B (en) * | 2020-07-16 | 2021-04-02 | 深圳扬兴科技有限公司 | Fine adjustment device for mounting quartz crystal frequency chip |
| CN114247699A (en) * | 2021-12-13 | 2022-03-29 | 安徽光智科技有限公司 | Ultrasonic demoulding method for crystal oscillation plate |
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Open date: 20100519 |