CN106190030A - The ground and cleaned method of frequency chip - Google Patents
The ground and cleaned method of frequency chip Download PDFInfo
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- CN106190030A CN106190030A CN201610549210.5A CN201610549210A CN106190030A CN 106190030 A CN106190030 A CN 106190030A CN 201610549210 A CN201610549210 A CN 201610549210A CN 106190030 A CN106190030 A CN 106190030A
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- China
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- frequency chip
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- water
- cleaned
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- 238000000034 method Methods 0.000 title claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 55
- 238000000227 grinding Methods 0.000 claims abstract description 37
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 54
- 239000000843 powder Substances 0.000 claims description 30
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 23
- 239000002253 acid Substances 0.000 claims description 23
- 239000012530 fluid Substances 0.000 claims description 23
- XFRVVPUIAFSTFO-UHFFFAOYSA-N 1-Tridecanol Chemical compound CCCCCCCCCCCCCO XFRVVPUIAFSTFO-UHFFFAOYSA-N 0.000 claims description 20
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 20
- 125000001246 bromo group Chemical group Br* 0.000 claims description 20
- -1 propargyl ester Chemical class 0.000 claims description 19
- 239000006004 Quartz sand Substances 0.000 claims description 18
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 18
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 18
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 16
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical group [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 15
- 239000003513 alkali Substances 0.000 claims description 14
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 14
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 11
- 239000004593 Epoxy Substances 0.000 claims description 11
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 10
- LXCYSACZTOKNNS-UHFFFAOYSA-N diethoxy(oxo)phosphanium Chemical compound CCO[P+](=O)OCC LXCYSACZTOKNNS-UHFFFAOYSA-N 0.000 claims description 10
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- WOWHHFRSBJGXCM-UHFFFAOYSA-M cetyltrimethylammonium chloride Chemical compound [Cl-].CCCCCCCCCCCCCCCC[N+](C)(C)C WOWHHFRSBJGXCM-UHFFFAOYSA-M 0.000 claims description 9
- BXJPTTGFESFXJU-UHFFFAOYSA-N yttrium(3+);trinitrate Chemical compound [Y+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O BXJPTTGFESFXJU-UHFFFAOYSA-N 0.000 claims description 9
- 239000004408 titanium dioxide Substances 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 claims description 7
- DILRJUIACXKSQE-UHFFFAOYSA-N n',n'-dimethylethane-1,2-diamine Chemical group CN(C)CCN DILRJUIACXKSQE-UHFFFAOYSA-N 0.000 claims description 7
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 claims description 7
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 claims description 7
- DZSVIVLGBJKQAP-UHFFFAOYSA-N 1-(2-methyl-5-propan-2-ylcyclohex-2-en-1-yl)propan-1-one Chemical compound CCC(=O)C1CC(C(C)C)CC=C1C DZSVIVLGBJKQAP-UHFFFAOYSA-N 0.000 claims description 6
- YQGOWXYZDLJBFL-UHFFFAOYSA-N dimethoxysilane Chemical compound CO[SiH2]OC YQGOWXYZDLJBFL-UHFFFAOYSA-N 0.000 claims description 6
- 238000007603 infrared drying Methods 0.000 claims description 6
- 235000012054 meals Nutrition 0.000 claims description 6
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 5
- DBMJMQXJHONAFJ-UHFFFAOYSA-M Sodium laurylsulphate Chemical compound [Na+].CCCCCCCCCCCCOS([O-])(=O)=O DBMJMQXJHONAFJ-UHFFFAOYSA-M 0.000 claims description 5
- 238000010298 pulverizing process Methods 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 5
- 238000002791 soaking Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 4
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims description 2
- 229910021529 ammonia Inorganic materials 0.000 claims description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 2
- 239000002585 base Substances 0.000 claims description 2
- 238000007873 sieving Methods 0.000 claims description 2
- PBBJQDKWYWWATI-UHFFFAOYSA-N cyclohexene ethene Chemical compound C1=CCCCC1.C=C PBBJQDKWYWWATI-UHFFFAOYSA-N 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 12
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 230000002950 deficient Effects 0.000 abstract description 4
- 238000004064 recycling Methods 0.000 abstract description 4
- 239000012670 alkaline solution Substances 0.000 abstract description 3
- 238000002604 ultrasonography Methods 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 7
- 239000004576 sand Substances 0.000 description 5
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- KFIGICHILYTCJF-UHFFFAOYSA-N n'-methylethane-1,2-diamine Chemical group CNCCN KFIGICHILYTCJF-UHFFFAOYSA-N 0.000 description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000035559 beat frequency Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012805 post-processing Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- AJXBTRZGLDTSST-UHFFFAOYSA-N amino 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)ON AJXBTRZGLDTSST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 238000005461 lubrication Methods 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000008399 tap water Substances 0.000 description 1
- 235000020679 tap water Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B31/00—Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
- B24B31/12—Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
- B24B31/14—Abrading-bodies specially designed for tumbling apparatus, e.g. abrading-balls
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
- C11D1/721—End blocked ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/86—Mixtures of anionic, cationic, and non-ionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/02—Inorganic compounds ; Elemental compounds
- C11D3/04—Water-soluble compounds
- C11D3/06—Phosphates, including polyphosphates
- C11D3/075—Phosphates, including polyphosphates in admixture with ethers of polyoxyalkylenes
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/36—Organic compounds containing phosphorus
- C11D3/362—Phosphates or phosphites
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/37—Polymers
- C11D3/3746—Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C11D3/3757—(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
- C11D1/12—Sulfonic acids or sulfuric acid esters; Salts thereof
- C11D1/28—Sulfonation products derived from fatty acids or their derivatives, e.g. esters, amides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/38—Cationic compounds
- C11D1/62—Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/82—Compounds containing silicon
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Detergent Compositions (AREA)
Abstract
The present invention discloses a kind of ground and cleaned method of frequency chip, most frequency chip surface grinding liquid is removed by the alkaline solution using heating, recycling flowing water ultrasound wave makes the residual lapping liquid of every slice surface shake off completely, effectively clean slice surface, reduce the incidence rate of frequency chip surface scratch；Cut fraction defective declines to a great extent, and falls below less than 0.5%, well below existing 5%.
Description
Technical field
The invention belongs to frequency chip technology of preparing, be specifically related to a kind of ground and cleaned method of frequency chip.
Background technology
Nowadays electronic product function get more and more, this just requires that the precision of crystal oscillator improves constantly, client for
The frequency departure scope of frequency chip is stricter, if frequency departure scope is the biggest after product grinds, the bad of generation is got over
Many.After the slice lapping of existing technique, tap water shower is directly used to make a return journey except the lapping liquid on frequency chip surface remains.Existing processing
The method of technique shower removes lapping liquid, but owing to shower can not be accomplished comprehensive, more or less have partial mill liquid
Residual, after the sand particle flow in lapping liquid to lower operation when fine grinding, meeting forming frequency sheet surface scratch is bad, and the water yield
Control with the time is improper, and the breakage often resulting in section is scrapped, or does not removes the lapping liquid situation on surface；In prior art
The technical problem existed has 2 to select: 1. can not remove the lapping liquid 2. shower water yield completely and the time improper frequency chip caused is damaged.
Section is ground and is dependent on what abrasive sand completed, has typically cut into slices and has needed the abrasive sand through 2-3 road different model to polish.As
The sand in Guo Qian road is mixed in the processing of rear road, even the mulling of trace, will result in slice surface and occurs that cut is bad, have influence on
The precision of consumer product.
Summary of the invention
It is an object of the invention to disclose a kind of ground and cleaned method of frequency chip, use the alkaline solution of heating by major part
Frequency chip surface grinding liquid remove, recycling flowing water ultrasound wave make the residual lapping liquid of every slice surface shake off completely, have
The cleaning slice surface of effect, reduces the incidence rate of frequency chip surface scratch；Cut fraction defective declines to a great extent, fall below 0.5% with
Under, well below existing 5%.
To achieve the above object of the invention, the technical solution used in the present invention is: a kind of ground and cleaned method of frequency chip, bag
Include following steps:
(1) frequency chip is put in the first grinding system, carry out grinding for the first time；The frequency chip ground for the first time is inserted first
In cleanout fluid, ultrasonic cleaning 10～15 minutes, obtain the frequency chip after cleaning for the first time；Damage the first grinding system by quartz
Sand, VCH diepoxide, the propargyl ester of the different acid of bromo fourth, N, N-dimethyl-ethylenediamine, ethanol, water form；Described
First cleanout fluid is by isomerous tridecanol polyoxyethylene ether, sodium polyacrylate, disodium hydrogen phosphate, diethyl phosphite, water
Composition；
(2) frequency chip is put in the second grinding system, carry out second time and grind；The frequency chip that second time is ground is inserted second
In cleanout fluid, ultrasonic cleaning 20～25 minutes, obtain the frequency chip after second time is cleaned；Described second grinding system by powder body,
Acrylic acid, double (2,3-epoxy radicals cyclopenta) ether, the propargyl ester of the different acid of bromo fourth, ethanol, water form；Described second cleanout fluid is by 2-
Acrylamide-2-methylpro panesulfonic acid, hexadecyltrimethylammonium chloride, isomerous tridecanol polyoxyethylene ether, N-β-(ammonia second
Base)-γ-aminopropyltriethoxy dimethoxysilane, water composition；Described powder body is by conch meal, Yttrium trinitrate, titanium dioxide sintering, powder
Broken, sieving obtains；
(3) frequency chip after second time being cleaned adds in alkali liquor, takes out and put in water after soaking 3～3.5 minutes, ultrasonic cleaning
10～15 minutes；Finally insert in ethanol and soak 1～2 minute, infrared drying, i.e. complete the ground and cleaned of frequency chip.
In technique scheme, in step (1), the time ground for the first time is 5～8 minutes, is ground to slightly grind for the first time
Mill, mainly refines the surface profile of frequency chip, and according to the grinding system of the present invention, in conjunction with milling time, time length is not
But there is no grinding effect and frequency chip surface may be damaged.
In technique scheme, in step (1), the mean diameter of quartz sand is 500 mesh；Grind for the first time and utilize slightly firmly also
And the quartz sand that particle diameter is slightly larger, the most cost-effective, on the other hand can meet the requirement of rough lapping；Quartz sand, vinyl
Cyclohexene diepoxide, the propargyl ester of the different acid of bromo fourth, N, N-dimethyl-ethylenediamine, ethanol, the mass ratio of water are 8211
20 100；Isomerous tridecanol polyoxyethylene ether, sodium polyacrylate, disodium hydrogen phosphate, diethyl phosphite, the quality of water
Ratio is 2214 100.Suitably assist organic system by design, effectively prevent the rubble sand damage to frequency chip surface
Wound, plays lubrication, and is beneficial to clean for the first time reach preferable effect, because the design of the first cleanout fluid is ground with first
The composition compatibility of mill body system is fine, easily forms entanglement, thus more effectively remove quartz sand between Organic substance.Particularly, clearly
Washed journey uses ultrasonic assistant, and this is the pioneering of the present invention, and ultrasonic frequency is preferably 40Hz, can effective beat frequency
Sheet, accelerates quartz sand and separates with frequency chip, it is to avoid the frequency chip surface damage that quartz sand slowly landing brings.
In technique scheme, in step (2), powder body is sintered by conch meal, Yttrium trinitrate, titanium dioxide, pulverize, is sieved
Arrive；Conch meal that mass ratio is 100 3 28, Yttrium trinitrate, titanium dioxide 650 DEG C are sintered 3 hours, ball mill pulverizing, crosses 5000 mesh
Sieve obtains powder body；Powder body is the softest, but owing to the addition of Yttrium trinitrate has again good abrasiveness, the time of grinding is for the second time
18～22 minutes, second time was ground to fine lapping, and the mainly surface smoothness homogenization to frequency chip, according to the grinding of the present invention
System, can obtain, in conjunction with milling time, the frequency chip that uniform surface degree is the highest, and will not frequency of loss sheet.
In technique scheme, in step (2), powder body, acrylic acid, double (2,3-epoxy radicals cyclopenta) ether, bromo fourth are different
The propargyl ester of acid, ethanol, the mass ratio of water are 5421 25 100；2-acrylamide-2-methylpro panesulfonic acid, cetyl three
Ammonio methacrylate, isomerous tridecanol polyoxyethylene ether, N-β-(aminoethyl)-γ-aminopropyltriethoxy dimethoxysilane, the matter of water
Amount ratio is 6252 100.Frequency chip grinds abstains from most, in its surface damage, particularly fine-lapping process, once have slight
Damage also cannot be repaired, and the yield of extreme influence frequency chip, the present invention is with acrylic acid-epoxy systems for assisted milling agent, greatly
Disperseed the minimum powder body of particle diameter, be prevented effectively from powder body building-up effect, it is ensured that powder body dispersing uniformity, beneficially frequency chip grinds
Effect；By the second organic design of cleanout fluid, similar structure of drawing in the net can be formed with the Organic substance of the first grinding system, rise
To the effect removing powder body.Particularly, cleaning process uses ultrasonic assistant, and ultrasonic frequency is preferably 40Hz, can be effective
Beat frequency sheet, accelerates powder body and separates with frequency chip, it is to avoid the frequency chip surface damage that quartz sand slowly landing brings；With
Time 40Hz will not to frequency chip vibration much, from without damage frequency chip.
In technique scheme, in step (3), alkali liquor is preferably by potassium hydroxide, lithium bromide, dodecyl sodium sulfate, second
Diamidogen and water composition；Mass ratio is 12 764 100.After second time is cleaned, powder body inorganic matter is substantially from frequency chip table
Emaciated face from, but but frequency chip surface still remains a small amount of far-reaching organic system, can be effective by configuring alkali liquor
Organics removal, room temperature, it is not necessary to the heating operation of prior art, adds lithium bromide, ethylenediamine etc. especially in alkali liquor and becomes
Point, in addition to accelerating the activity of alkali liquor, it is also possible to form the good compatibility with Organic substance, organic disengaging can be accelerated；
In conjunction with ethanol post processing, infrared drying, it is to avoid baking oven for heating is dried the damage to frequency chip, such that it is able to obtain clean smooth
Frequency chip.
The present invention, first under organic cooperation, uses thicker quartz sand to process frequency chip roughing, recycling
Soft powder body carries out fine grinding, can obtain the frequency chip that surface is smooth；Use and add organic cleanout fluid, in conjunction with grinding system
Organic principle can effectively remove the inorganic constituents of grinding system, eventually pass alkali liquor, ethanol post processing obtain surface smooth,
Undamaged frequency chip；Cut fraction defective declines to a great extent, and falls below less than 0.5%, well below existing 5%.
Detailed description of the invention
The ground and cleaned method of one one kinds of frequency chips of embodiment, comprises the following steps:
(1) being put into by frequency chip in the first grinding system, carry out grinding for the first time, the time is 5 minutes；The frequency that will grind for the first time
Rate sheet is inserted in the first cleanout fluid, 40Hz ultrasonic cleaning 10 minutes, obtains the frequency chip after cleaning for the first time；Damage the first grinding
System is the quartz sand of 500 mesh, VCH diepoxide, the propargyl ester of the different acid of bromo fourth, N, N-bis-by mean diameter
Methyl ethylenediamine, ethanol, water form；Described first cleanout fluid is by isomerous tridecanol polyoxyethylene ether, sodium polyacrylate, Shi Ershui
Disodium hydrogen phosphate, diethyl phosphite, water form；Quartz sand, VCH diepoxide, the different acid of bromo fourth are propargyl
Ester, N, N-dimethyl-ethylenediamine, ethanol, the mass ratio of water are 8211 20 100；Isomerous tridecanol polyoxyethylene ether, poly-third
Olefin(e) acid sodium, disodium hydrogen phosphate, diethyl phosphite, the mass ratio of water are 2214 100.
(2) being put into by frequency chip in the second grinding system, carry out second time and grind, the time is 22 minutes；Second time is ground
The frequency chip of mill is inserted in the second cleanout fluid, 40Hz ultrasonic cleaning 20～25 minutes, obtains the frequency chip after second time is cleaned；Institute
State the second grinding system by powder body, acrylic acid, double (2,3-epoxy radicals cyclopenta) ether, the propargyl ester of the different acid of bromo fourth, ethanol, water group
Become；Described second cleanout fluid is by 2-acrylamide-2-methylpro panesulfonic acid, hexadecyltrimethylammonium chloride, isomerous tridecanol
Polyoxyethylene ether, N-β-(aminoethyl)-γ-aminopropyltriethoxy dimethoxysilane, water form；It is 100 3 28 by mass ratio
Conch meal, Yttrium trinitrate, titanium dioxide 650 DEG C sintering 3 hours, ball mill pulverizing, 5000 mesh sieves excessively obtain powder body；Powder body, acrylic acid,
Double (2,3-epoxy radicals cyclopenta) ether, the propargyl ester of the different acid of bromo fourth, ethanol, the mass ratio of water are 5421 25 100；2-third
Acrylamide base-2-methyl propane sulfonic acid, hexadecyltrimethylammonium chloride, isomerous tridecanol polyoxyethylene ether, N-β-(aminoethyl)-
γ-aminopropyltriethoxy dimethoxysilane, the mass ratio of water are 6252 100.
(3) will second time clean after frequency chip add in alkali liquor, after soaking 3.5 minutes, taking-up is put in water, ultrasonic clearly
Wash 15 minutes；Finally insert in ethanol and soak 1 minute, infrared drying, i.e. complete the ground and cleaned of frequency chip；Alkali liquor is by mass ratio
It is potassium hydroxide, lithium bromide, dodecyl sodium sulfate, ethylenediamine and the water composition of 12 764 100.
The ground and cleaned method of 21 kinds of frequency chips of embodiment, comprises the following steps:
(1) being put into by frequency chip in the first grinding system, carry out grinding for the first time, the time is 5 minutes；The frequency that will grind for the first time
Rate sheet is inserted in the first cleanout fluid, 40Hz ultrasonic cleaning 10 minutes, obtains the frequency chip after cleaning for the first time；Damage the first grinding
System is the quartz sand of 500 mesh, VCH diepoxide, the propargyl ester of the different acid of bromo fourth, N, N-bis-by mean diameter
Methyl ethylenediamine, ethanol, water form；Described first cleanout fluid is by isomerous tridecanol polyoxyethylene ether, sodium polyacrylate, Shi Ershui
Disodium hydrogen phosphate, diethyl phosphite, water form；Quartz sand, VCH diepoxide, the different acid of bromo fourth are propargyl
Ester, N, N-dimethyl-ethylenediamine, ethanol, the mass ratio of water are 8211 20 100；Isomerous tridecanol polyoxyethylene ether, poly-third
Olefin(e) acid sodium, disodium hydrogen phosphate, diethyl phosphite, the mass ratio of water are 2214 100.
(2) being put into by frequency chip in the second grinding system, carry out second time and grind, the time is 22 minutes；Second time is ground
The frequency chip of mill is inserted in the second cleanout fluid, 40Hz ultrasonic cleaning 20 minutes, obtains the frequency chip after second time is cleaned；Described
Two grinding systems are made up of powder body, acrylic acid, double (2,3-epoxy radicals cyclopenta) ether, the propargyl ester of the different acid of bromo fourth, ethanol, water；
Described second cleanout fluid is by 2-acrylamide-2-methylpro panesulfonic acid, hexadecyltrimethylammonium chloride, isomerous tridecanol polyoxy
Vinyl Ether, N-β-(aminoethyl)-γ-aminopropyltriethoxy dimethoxysilane, water form；It is the shell of 100 3 28 by mass ratio
Powder, Yttrium trinitrate, titanium dioxide 650 DEG C sintering 3 hours, ball mill pulverizing, 5000 mesh sieves excessively obtain powder body；Powder body, acrylic acid, double
(2,3-epoxy radicals cyclopenta) ether, the propargyl ester of the different acid of bromo fourth, ethanol, the mass ratio of water are 5421 25 100；2-propylene
Amide groups-2-methyl propane sulfonic acid, hexadecyltrimethylammonium chloride, isomerous tridecanol polyoxyethylene ether, N-β-(aminoethyl)-
γ-aminopropyltriethoxy dimethoxysilane, the mass ratio of water are 6252 100.
(3) frequency chip after second time being cleaned adds in alkali liquor, takes out and put in water after soaking 3 minutes, ultrasonic cleaning
10 minutes；Finally insert in ethanol and soak 1 minute, infrared drying, i.e. complete the ground and cleaned of frequency chip；Alkali liquor by mass ratio is
Potassium hydroxide, lithium bromide, dodecyl sodium sulfate, ethylenediamine and the water composition of 12 764 100.
The ground and cleaned method of 31 kinds of frequency chips of embodiment, comprises the following steps:
(1) being put into by frequency chip in the first grinding system, carry out grinding for the first time, the time is 6 minutes；The frequency that will grind for the first time
Rate sheet is inserted in the first cleanout fluid, 40Hz ultrasonic cleaning 12 minutes, obtains the frequency chip after cleaning for the first time；Damage the first grinding
System is the quartz sand of 500 mesh, VCH diepoxide, the propargyl ester of the different acid of bromo fourth, N, N-bis-by mean diameter
Methyl ethylenediamine, ethanol, water form；Described first cleanout fluid is by isomerous tridecanol polyoxyethylene ether, sodium polyacrylate, Shi Ershui
Disodium hydrogen phosphate, diethyl phosphite, water form；Quartz sand, VCH diepoxide, the different acid of bromo fourth are propargyl
Ester, N, N-dimethyl-ethylenediamine, ethanol, the mass ratio of water are 8211 20 100；Isomerous tridecanol polyoxyethylene ether, poly-third
Olefin(e) acid sodium, disodium hydrogen phosphate, diethyl phosphite, the mass ratio of water are 2214 100.
(2) being put into by frequency chip in the second grinding system, carry out second time and grind, the time is 20 minutes；Second time is ground
The frequency chip of mill is inserted in the second cleanout fluid, 40Hz ultrasonic cleaning 24 minutes, obtains the frequency chip after second time is cleaned；Described
Two grinding systems are made up of powder body, acrylic acid, double (2,3-epoxy radicals cyclopenta) ether, the propargyl ester of the different acid of bromo fourth, ethanol, water；
Described second cleanout fluid is by 2-acrylamide-2-methylpro panesulfonic acid, hexadecyltrimethylammonium chloride, isomerous tridecanol polyoxy
Vinyl Ether, N-β-(aminoethyl)-γ-aminopropyltriethoxy dimethoxysilane, water form；It is the shell of 100 3 28 by mass ratio
Powder, Yttrium trinitrate, titanium dioxide 650 DEG C sintering 3 hours, ball mill pulverizing, 5000 mesh sieves excessively obtain powder body；Powder body, acrylic acid, double
(2,3-epoxy radicals cyclopenta) ether, the propargyl ester of the different acid of bromo fourth, ethanol, the mass ratio of water are 5421 25 100；2-propylene
Amide groups-2-methyl propane sulfonic acid, hexadecyltrimethylammonium chloride, isomerous tridecanol polyoxyethylene ether, N-β-(aminoethyl)-
γ-aminopropyltriethoxy dimethoxysilane, the mass ratio of water are 6252 100.
(3) frequency chip after second time being cleaned adds in alkali liquor, takes out and put in water after soaking 3 minutes, ultrasonic cleaning
15 minutes；Finally insert in ethanol and soak 1 minute, infrared drying, i.e. complete the ground and cleaned of frequency chip；Alkali liquor by mass ratio is
Potassium hydroxide, lithium bromide, dodecyl sodium sulfate, ethylenediamine and the water composition of 12 764 100.
The present invention uses the alkaline solution of heating to be removed by most frequency chip surface grinding liquid, and recycling flowing water is ultrasonic
Ripple makes the residual lapping liquid of every slice surface shake off completely, effectively cleans slice surface, reduces frequency chip surface scratch
Incidence rate；Cut fraction defective declines to a great extent, and falls below less than 0.5%, well below existing 5%.
Claims (8)
1. a ground and cleaned method for frequency chip, comprises the following steps:
(1) frequency chip is put in the first grinding system, carry out grinding for the first time；The frequency chip ground for the first time is inserted first
In cleanout fluid, ultrasonic cleaning 10～15 minutes, obtain the frequency chip after cleaning for the first time；Damage the first grinding system by quartz
Sand, VCH diepoxide, the propargyl ester of the different acid of bromo fourth, N, N-dimethyl-ethylenediamine, ethanol, water form；Described
First cleanout fluid is by isomerous tridecanol polyoxyethylene ether, sodium polyacrylate, disodium hydrogen phosphate, diethyl phosphite, water
Composition；
(2) frequency chip is put in the second grinding system, carry out second time and grind；The frequency chip that second time is ground is inserted second
In cleanout fluid, ultrasonic cleaning 20～25 minutes, obtain the frequency chip after second time is cleaned；Described second grinding system by powder body,
Acrylic acid, double (2,3-epoxy radicals cyclopenta) ether, the propargyl ester of the different acid of bromo fourth, ethanol, water form；Described second cleanout fluid is by 2-
Acrylamide-2-methylpro panesulfonic acid, hexadecyltrimethylammonium chloride, isomerous tridecanol polyoxyethylene ether, N-β-(ammonia second
Base)-γ-aminopropyltriethoxy dimethoxysilane, water composition；Described powder body is by conch meal, Yttrium trinitrate, titanium dioxide sintering, powder
Broken, sieving obtains；
(3) frequency chip after second time being cleaned adds in alkali liquor, takes out and put in water after soaking 3～3.5 minutes, ultrasonic cleaning
10～15 minutes；Finally insert in ethanol and soak 1～2 minute, infrared drying, i.e. complete the ground and cleaned of frequency chip.
The ground and cleaned method of frequency chip the most according to claim 1, it is characterised in that: in step (1), grind for the first time
Time is 5～8 minutes.
The ground and cleaned method of frequency chip the most according to claim 1, it is characterised in that: in step (1), quartz sand average
Particle diameter is 500 mesh.
The ground and cleaned method of frequency chip the most according to claim 1, it is characterised in that: in step (1), quartz sand, ethylene
Cyclohexene diepoxide, the propargyl ester of the different acid of bromo fourth, N, N-dimethyl-ethylenediamine, ethanol, the mass ratio of water are 821
1 20 100；Isomerous tridecanol polyoxyethylene ether, sodium polyacrylate, disodium hydrogen phosphate, diethyl phosphite, the matter of water
Amount ratio is 2214 100.
The ground and cleaned method of frequency chip the most according to claim 1, it is characterised in that: in step (1), ultrasonic frequency is
40Hz。
The ground and cleaned method of frequency chip the most according to claim 1, it is characterised in that:, in step (2), by mass ratio be
The conch meal of 100 3 28, Yttrium trinitrate, titanium dioxide 650 DEG C sinter 3 hours, ball mill pulverizing, cross 5000 mesh sieves and obtain powder body；The
The time that secondary grinds is 18～22 minutes.
The ground and cleaned method of frequency chip the most according to claim 1, it is characterised in that: in step (2), powder body, acrylic acid,
Double (2,3-epoxy radicals cyclopenta) ether, the propargyl ester of the different acid of bromo fourth, ethanol, the mass ratio of water are 5421 25 100；2-third
Acrylamide base-2-methyl propane sulfonic acid, hexadecyltrimethylammonium chloride, isomerous tridecanol polyoxyethylene ether, N-β-(aminoethyl)-
γ-aminopropyltriethoxy dimethoxysilane, the mass ratio of water are 6252 100；Ultrasonic frequency is preferably 40Hz.
The ground and cleaned method of frequency chip the most according to claim 1, it is characterised in that: in step (3), alkali liquor is by mass ratio
It is potassium hydroxide, lithium bromide, dodecyl sodium sulfate, ethylenediamine and the water composition of 12 764 100.
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| CN201610549210.5A CN106190030A (en) | 2016-07-13 | 2016-07-13 | The ground and cleaned method of frequency chip |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101708497A (en) * | 2009-12-11 | 2010-05-19 | 廊坊中电大成电子有限公司 | Method for cleaning quartz crystal frequency chip |
| CN102072614A (en) * | 2010-12-31 | 2011-05-25 | 苏州普锐晶科技有限公司 | Application of suction drying to frequency chip washing and drying engineering |
| CN103701423A (en) * | 2013-11-29 | 2014-04-02 | 铜陵日科电子有限责任公司 | Quartz crystal frequency chip cleaning process |
-
2016
- 2016-07-13 CN CN201610549210.5A patent/CN106190030A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101708497A (en) * | 2009-12-11 | 2010-05-19 | 廊坊中电大成电子有限公司 | Method for cleaning quartz crystal frequency chip |
| CN102072614A (en) * | 2010-12-31 | 2011-05-25 | 苏州普锐晶科技有限公司 | Application of suction drying to frequency chip washing and drying engineering |
| CN103701423A (en) * | 2013-11-29 | 2014-04-02 | 铜陵日科电子有限责任公司 | Quartz crystal frequency chip cleaning process |
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