CN106190030A - The ground and cleaned method of frequency chip - Google Patents

The ground and cleaned method of frequency chip Download PDF

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Publication number
CN106190030A
CN106190030A CN201610549210.5A CN201610549210A CN106190030A CN 106190030 A CN106190030 A CN 106190030A CN 201610549210 A CN201610549210 A CN 201610549210A CN 106190030 A CN106190030 A CN 106190030A
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frequency chip
ground
time
water
cleaned
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徐亮
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SUZHOU JING RUI PU TECHNOLOGY Co Ltd
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SUZHOU JING RUI PU TECHNOLOGY Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00Materials not provided for elsewhere
    • C09K3/14Anti-slip materials; Abrasives
    • C09K3/1454Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463Aqueous liquid suspensions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B31/00Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B31/00Machines or devices designed for polishing or abrading surfaces on work by means of tumbling apparatus or other apparatus in which the work and/or the abrasive material is loose; Accessories therefor
    • B24B31/12Accessories; Protective equipment or safety devices; Installations for exhaustion of dust or for sound absorption specially adapted for machines covered by group B24B31/00
    • B24B31/14Abrading-bodies specially designed for tumbling apparatus, e.g. abrading-balls
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66Non-ionic compounds
    • C11D1/72Ethers of polyoxyalkylene glycols
    • C11D1/721End blocked ethers
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/86Mixtures of anionic, cationic, and non-ionic compounds
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/02Inorganic compounds ; Elemental compounds
    • C11D3/04Water-soluble compounds
    • C11D3/06Phosphates, including polyphosphates
    • C11D3/075Phosphates, including polyphosphates in admixture with ethers of polyoxyalkylenes
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/36Organic compounds containing phosphorus
    • C11D3/362Phosphates or phosphites
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16Organic compounds
    • C11D3/37Polymers
    • C11D3/3746Macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
    • C11D3/3757(Co)polymerised carboxylic acids, -anhydrides, -esters in solid and liquid compositions
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/02Anionic compounds
    • C11D1/12Sulfonic acids or sulfuric acid esters; Salts thereof
    • C11D1/28Sulfonation products derived from fatty acids or their derivatives, e.g. esters, amides
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/38Cationic compounds
    • C11D1/62Quaternary ammonium compounds
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D1/00Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
    • C11D1/66Non-ionic compounds
    • C11D1/82Compounds containing silicon
    • CCHEMISTRY; METALLURGY
    • C11ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11DDETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10Objects to be cleaned
    • C11D2111/14Hard surfaces
    • C11D2111/22Electronic devices, e.g. PCBs or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • Mechanical Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Detergent Compositions (AREA)

Abstract

The present invention discloses a kind of ground and cleaned method of frequency chip, most frequency chip surface grinding liquid is removed by the alkaline solution using heating, recycling flowing water ultrasound wave makes the residual lapping liquid of every slice surface shake off completely, effectively clean slice surface, reduce the incidence rate of frequency chip surface scratch;Cut fraction defective declines to a great extent, and falls below less than 0.5%, well below existing 5%.

Description

The ground and cleaned method of frequency chip
Technical field
The invention belongs to frequency chip technology of preparing, be specifically related to a kind of ground and cleaned method of frequency chip.
Background technology
Nowadays electronic product function get more and more, this just requires that the precision of crystal oscillator improves constantly, client for The frequency departure scope of frequency chip is stricter, if frequency departure scope is the biggest after product grinds, the bad of generation is got over Many.After the slice lapping of existing technique, tap water shower is directly used to make a return journey except the lapping liquid on frequency chip surface remains.Existing processing The method of technique shower removes lapping liquid, but owing to shower can not be accomplished comprehensive, more or less have partial mill liquid Residual, after the sand particle flow in lapping liquid to lower operation when fine grinding, meeting forming frequency sheet surface scratch is bad, and the water yield Control with the time is improper, and the breakage often resulting in section is scrapped, or does not removes the lapping liquid situation on surface;In prior art The technical problem existed has 2 to select: 1. can not remove the lapping liquid 2. shower water yield completely and the time improper frequency chip caused is damaged. Section is ground and is dependent on what abrasive sand completed, has typically cut into slices and has needed the abrasive sand through 2-3 road different model to polish.As The sand in Guo Qian road is mixed in the processing of rear road, even the mulling of trace, will result in slice surface and occurs that cut is bad, have influence on The precision of consumer product.
Summary of the invention
It is an object of the invention to disclose a kind of ground and cleaned method of frequency chip, use the alkaline solution of heating by major part Frequency chip surface grinding liquid remove, recycling flowing water ultrasound wave make the residual lapping liquid of every slice surface shake off completely, have The cleaning slice surface of effect, reduces the incidence rate of frequency chip surface scratch;Cut fraction defective declines to a great extent, fall below 0.5% with Under, well below existing 5%.
To achieve the above object of the invention, the technical solution used in the present invention is: a kind of ground and cleaned method of frequency chip, bag Include following steps:
(1) frequency chip is put in the first grinding system, carry out grinding for the first time;The frequency chip ground for the first time is inserted first In cleanout fluid, ultrasonic cleaning 10~15 minutes, obtain the frequency chip after cleaning for the first time;Damage the first grinding system by quartz Sand, VCH diepoxide, the propargyl ester of the different acid of bromo fourth, N, N-dimethyl-ethylenediamine, ethanol, water form;Described First cleanout fluid is by isomerous tridecanol polyoxyethylene ether, sodium polyacrylate, disodium hydrogen phosphate, diethyl phosphite, water Composition;
(2) frequency chip is put in the second grinding system, carry out second time and grind;The frequency chip that second time is ground is inserted second In cleanout fluid, ultrasonic cleaning 20~25 minutes, obtain the frequency chip after second time is cleaned;Described second grinding system by powder body, Acrylic acid, double (2,3-epoxy radicals cyclopenta) ether, the propargyl ester of the different acid of bromo fourth, ethanol, water form;Described second cleanout fluid is by 2- Acrylamide-2-methylpro panesulfonic acid, hexadecyltrimethylammonium chloride, isomerous tridecanol polyoxyethylene ether, N-β-(ammonia second Base)-γ-aminopropyltriethoxy dimethoxysilane, water composition;Described powder body is by conch meal, Yttrium trinitrate, titanium dioxide sintering, powder Broken, sieving obtains;
(3) frequency chip after second time being cleaned adds in alkali liquor, takes out and put in water after soaking 3~3.5 minutes, ultrasonic cleaning 10~15 minutes;Finally insert in ethanol and soak 1~2 minute, infrared drying, i.e. complete the ground and cleaned of frequency chip.
In technique scheme, in step (1), the time ground for the first time is 5~8 minutes, is ground to slightly grind for the first time Mill, mainly refines the surface profile of frequency chip, and according to the grinding system of the present invention, in conjunction with milling time, time length is not But there is no grinding effect and frequency chip surface may be damaged.
In technique scheme, in step (1), the mean diameter of quartz sand is 500 mesh;Grind for the first time and utilize slightly firmly also And the quartz sand that particle diameter is slightly larger, the most cost-effective, on the other hand can meet the requirement of rough lapping;Quartz sand, vinyl Cyclohexene diepoxide, the propargyl ester of the different acid of bromo fourth, N, N-dimethyl-ethylenediamine, ethanol, the mass ratio of water are 8211 20 100;Isomerous tridecanol polyoxyethylene ether, sodium polyacrylate, disodium hydrogen phosphate, diethyl phosphite, the quality of water Ratio is 2214 100.Suitably assist organic system by design, effectively prevent the rubble sand damage to frequency chip surface Wound, plays lubrication, and is beneficial to clean for the first time reach preferable effect, because the design of the first cleanout fluid is ground with first The composition compatibility of mill body system is fine, easily forms entanglement, thus more effectively remove quartz sand between Organic substance.Particularly, clearly Washed journey uses ultrasonic assistant, and this is the pioneering of the present invention, and ultrasonic frequency is preferably 40Hz, can effective beat frequency Sheet, accelerates quartz sand and separates with frequency chip, it is to avoid the frequency chip surface damage that quartz sand slowly landing brings.
In technique scheme, in step (2), powder body is sintered by conch meal, Yttrium trinitrate, titanium dioxide, pulverize, is sieved Arrive;Conch meal that mass ratio is 100 3 28, Yttrium trinitrate, titanium dioxide 650 DEG C are sintered 3 hours, ball mill pulverizing, crosses 5000 mesh Sieve obtains powder body;Powder body is the softest, but owing to the addition of Yttrium trinitrate has again good abrasiveness, the time of grinding is for the second time 18~22 minutes, second time was ground to fine lapping, and the mainly surface smoothness homogenization to frequency chip, according to the grinding of the present invention System, can obtain, in conjunction with milling time, the frequency chip that uniform surface degree is the highest, and will not frequency of loss sheet.
In technique scheme, in step (2), powder body, acrylic acid, double (2,3-epoxy radicals cyclopenta) ether, bromo fourth are different The propargyl ester of acid, ethanol, the mass ratio of water are 5421 25 100;2-acrylamide-2-methylpro panesulfonic acid, cetyl three Ammonio methacrylate, isomerous tridecanol polyoxyethylene ether, N-β-(aminoethyl)-γ-aminopropyltriethoxy dimethoxysilane, the matter of water Amount ratio is 6252 100.Frequency chip grinds abstains from most, in its surface damage, particularly fine-lapping process, once have slight Damage also cannot be repaired, and the yield of extreme influence frequency chip, the present invention is with acrylic acid-epoxy systems for assisted milling agent, greatly Disperseed the minimum powder body of particle diameter, be prevented effectively from powder body building-up effect, it is ensured that powder body dispersing uniformity, beneficially frequency chip grinds Effect;By the second organic design of cleanout fluid, similar structure of drawing in the net can be formed with the Organic substance of the first grinding system, rise To the effect removing powder body.Particularly, cleaning process uses ultrasonic assistant, and ultrasonic frequency is preferably 40Hz, can be effective Beat frequency sheet, accelerates powder body and separates with frequency chip, it is to avoid the frequency chip surface damage that quartz sand slowly landing brings;With Time 40Hz will not to frequency chip vibration much, from without damage frequency chip.
In technique scheme, in step (3), alkali liquor is preferably by potassium hydroxide, lithium bromide, dodecyl sodium sulfate, second Diamidogen and water composition;Mass ratio is 12 764 100.After second time is cleaned, powder body inorganic matter is substantially from frequency chip table Emaciated face from, but but frequency chip surface still remains a small amount of far-reaching organic system, can be effective by configuring alkali liquor Organics removal, room temperature, it is not necessary to the heating operation of prior art, adds lithium bromide, ethylenediamine etc. especially in alkali liquor and becomes Point, in addition to accelerating the activity of alkali liquor, it is also possible to form the good compatibility with Organic substance, organic disengaging can be accelerated; In conjunction with ethanol post processing, infrared drying, it is to avoid baking oven for heating is dried the damage to frequency chip, such that it is able to obtain clean smooth Frequency chip.
The present invention, first under organic cooperation, uses thicker quartz sand to process frequency chip roughing, recycling Soft powder body carries out fine grinding, can obtain the frequency chip that surface is smooth;Use and add organic cleanout fluid, in conjunction with grinding system Organic principle can effectively remove the inorganic constituents of grinding system, eventually pass alkali liquor, ethanol post processing obtain surface smooth, Undamaged frequency chip;Cut fraction defective declines to a great extent, and falls below less than 0.5%, well below existing 5%.
Detailed description of the invention
The ground and cleaned method of one one kinds of frequency chips of embodiment, comprises the following steps:
(1) being put into by frequency chip in the first grinding system, carry out grinding for the first time, the time is 5 minutes;The frequency that will grind for the first time Rate sheet is inserted in the first cleanout fluid, 40Hz ultrasonic cleaning 10 minutes, obtains the frequency chip after cleaning for the first time;Damage the first grinding System is the quartz sand of 500 mesh, VCH diepoxide, the propargyl ester of the different acid of bromo fourth, N, N-bis-by mean diameter Methyl ethylenediamine, ethanol, water form;Described first cleanout fluid is by isomerous tridecanol polyoxyethylene ether, sodium polyacrylate, Shi Ershui Disodium hydrogen phosphate, diethyl phosphite, water form;Quartz sand, VCH diepoxide, the different acid of bromo fourth are propargyl Ester, N, N-dimethyl-ethylenediamine, ethanol, the mass ratio of water are 8211 20 100;Isomerous tridecanol polyoxyethylene ether, poly-third Olefin(e) acid sodium, disodium hydrogen phosphate, diethyl phosphite, the mass ratio of water are 2214 100.
(2) being put into by frequency chip in the second grinding system, carry out second time and grind, the time is 22 minutes;Second time is ground The frequency chip of mill is inserted in the second cleanout fluid, 40Hz ultrasonic cleaning 20~25 minutes, obtains the frequency chip after second time is cleaned;Institute State the second grinding system by powder body, acrylic acid, double (2,3-epoxy radicals cyclopenta) ether, the propargyl ester of the different acid of bromo fourth, ethanol, water group Become;Described second cleanout fluid is by 2-acrylamide-2-methylpro panesulfonic acid, hexadecyltrimethylammonium chloride, isomerous tridecanol Polyoxyethylene ether, N-β-(aminoethyl)-γ-aminopropyltriethoxy dimethoxysilane, water form;It is 100 3 28 by mass ratio Conch meal, Yttrium trinitrate, titanium dioxide 650 DEG C sintering 3 hours, ball mill pulverizing, 5000 mesh sieves excessively obtain powder body;Powder body, acrylic acid, Double (2,3-epoxy radicals cyclopenta) ether, the propargyl ester of the different acid of bromo fourth, ethanol, the mass ratio of water are 5421 25 100;2-third Acrylamide base-2-methyl propane sulfonic acid, hexadecyltrimethylammonium chloride, isomerous tridecanol polyoxyethylene ether, N-β-(aminoethyl)- γ-aminopropyltriethoxy dimethoxysilane, the mass ratio of water are 6252 100.
(3) will second time clean after frequency chip add in alkali liquor, after soaking 3.5 minutes, taking-up is put in water, ultrasonic clearly Wash 15 minutes;Finally insert in ethanol and soak 1 minute, infrared drying, i.e. complete the ground and cleaned of frequency chip;Alkali liquor is by mass ratio It is potassium hydroxide, lithium bromide, dodecyl sodium sulfate, ethylenediamine and the water composition of 12 764 100.
The ground and cleaned method of 21 kinds of frequency chips of embodiment, comprises the following steps:
(1) being put into by frequency chip in the first grinding system, carry out grinding for the first time, the time is 5 minutes;The frequency that will grind for the first time Rate sheet is inserted in the first cleanout fluid, 40Hz ultrasonic cleaning 10 minutes, obtains the frequency chip after cleaning for the first time;Damage the first grinding System is the quartz sand of 500 mesh, VCH diepoxide, the propargyl ester of the different acid of bromo fourth, N, N-bis-by mean diameter Methyl ethylenediamine, ethanol, water form;Described first cleanout fluid is by isomerous tridecanol polyoxyethylene ether, sodium polyacrylate, Shi Ershui Disodium hydrogen phosphate, diethyl phosphite, water form;Quartz sand, VCH diepoxide, the different acid of bromo fourth are propargyl Ester, N, N-dimethyl-ethylenediamine, ethanol, the mass ratio of water are 8211 20 100;Isomerous tridecanol polyoxyethylene ether, poly-third Olefin(e) acid sodium, disodium hydrogen phosphate, diethyl phosphite, the mass ratio of water are 2214 100.
(2) being put into by frequency chip in the second grinding system, carry out second time and grind, the time is 22 minutes;Second time is ground The frequency chip of mill is inserted in the second cleanout fluid, 40Hz ultrasonic cleaning 20 minutes, obtains the frequency chip after second time is cleaned;Described Two grinding systems are made up of powder body, acrylic acid, double (2,3-epoxy radicals cyclopenta) ether, the propargyl ester of the different acid of bromo fourth, ethanol, water; Described second cleanout fluid is by 2-acrylamide-2-methylpro panesulfonic acid, hexadecyltrimethylammonium chloride, isomerous tridecanol polyoxy Vinyl Ether, N-β-(aminoethyl)-γ-aminopropyltriethoxy dimethoxysilane, water form;It is the shell of 100 3 28 by mass ratio Powder, Yttrium trinitrate, titanium dioxide 650 DEG C sintering 3 hours, ball mill pulverizing, 5000 mesh sieves excessively obtain powder body;Powder body, acrylic acid, double (2,3-epoxy radicals cyclopenta) ether, the propargyl ester of the different acid of bromo fourth, ethanol, the mass ratio of water are 5421 25 100;2-propylene Amide groups-2-methyl propane sulfonic acid, hexadecyltrimethylammonium chloride, isomerous tridecanol polyoxyethylene ether, N-β-(aminoethyl)- γ-aminopropyltriethoxy dimethoxysilane, the mass ratio of water are 6252 100.
(3) frequency chip after second time being cleaned adds in alkali liquor, takes out and put in water after soaking 3 minutes, ultrasonic cleaning 10 minutes;Finally insert in ethanol and soak 1 minute, infrared drying, i.e. complete the ground and cleaned of frequency chip;Alkali liquor by mass ratio is Potassium hydroxide, lithium bromide, dodecyl sodium sulfate, ethylenediamine and the water composition of 12 764 100.
The ground and cleaned method of 31 kinds of frequency chips of embodiment, comprises the following steps:
(1) being put into by frequency chip in the first grinding system, carry out grinding for the first time, the time is 6 minutes;The frequency that will grind for the first time Rate sheet is inserted in the first cleanout fluid, 40Hz ultrasonic cleaning 12 minutes, obtains the frequency chip after cleaning for the first time;Damage the first grinding System is the quartz sand of 500 mesh, VCH diepoxide, the propargyl ester of the different acid of bromo fourth, N, N-bis-by mean diameter Methyl ethylenediamine, ethanol, water form;Described first cleanout fluid is by isomerous tridecanol polyoxyethylene ether, sodium polyacrylate, Shi Ershui Disodium hydrogen phosphate, diethyl phosphite, water form;Quartz sand, VCH diepoxide, the different acid of bromo fourth are propargyl Ester, N, N-dimethyl-ethylenediamine, ethanol, the mass ratio of water are 8211 20 100;Isomerous tridecanol polyoxyethylene ether, poly-third Olefin(e) acid sodium, disodium hydrogen phosphate, diethyl phosphite, the mass ratio of water are 2214 100.
(2) being put into by frequency chip in the second grinding system, carry out second time and grind, the time is 20 minutes;Second time is ground The frequency chip of mill is inserted in the second cleanout fluid, 40Hz ultrasonic cleaning 24 minutes, obtains the frequency chip after second time is cleaned;Described Two grinding systems are made up of powder body, acrylic acid, double (2,3-epoxy radicals cyclopenta) ether, the propargyl ester of the different acid of bromo fourth, ethanol, water; Described second cleanout fluid is by 2-acrylamide-2-methylpro panesulfonic acid, hexadecyltrimethylammonium chloride, isomerous tridecanol polyoxy Vinyl Ether, N-β-(aminoethyl)-γ-aminopropyltriethoxy dimethoxysilane, water form;It is the shell of 100 3 28 by mass ratio Powder, Yttrium trinitrate, titanium dioxide 650 DEG C sintering 3 hours, ball mill pulverizing, 5000 mesh sieves excessively obtain powder body;Powder body, acrylic acid, double (2,3-epoxy radicals cyclopenta) ether, the propargyl ester of the different acid of bromo fourth, ethanol, the mass ratio of water are 5421 25 100;2-propylene Amide groups-2-methyl propane sulfonic acid, hexadecyltrimethylammonium chloride, isomerous tridecanol polyoxyethylene ether, N-β-(aminoethyl)- γ-aminopropyltriethoxy dimethoxysilane, the mass ratio of water are 6252 100.
(3) frequency chip after second time being cleaned adds in alkali liquor, takes out and put in water after soaking 3 minutes, ultrasonic cleaning 15 minutes;Finally insert in ethanol and soak 1 minute, infrared drying, i.e. complete the ground and cleaned of frequency chip;Alkali liquor by mass ratio is Potassium hydroxide, lithium bromide, dodecyl sodium sulfate, ethylenediamine and the water composition of 12 764 100.
The present invention uses the alkaline solution of heating to be removed by most frequency chip surface grinding liquid, and recycling flowing water is ultrasonic Ripple makes the residual lapping liquid of every slice surface shake off completely, effectively cleans slice surface, reduces frequency chip surface scratch Incidence rate;Cut fraction defective declines to a great extent, and falls below less than 0.5%, well below existing 5%.

Claims (8)

1. a ground and cleaned method for frequency chip, comprises the following steps:
(1) frequency chip is put in the first grinding system, carry out grinding for the first time;The frequency chip ground for the first time is inserted first In cleanout fluid, ultrasonic cleaning 10~15 minutes, obtain the frequency chip after cleaning for the first time;Damage the first grinding system by quartz Sand, VCH diepoxide, the propargyl ester of the different acid of bromo fourth, N, N-dimethyl-ethylenediamine, ethanol, water form;Described First cleanout fluid is by isomerous tridecanol polyoxyethylene ether, sodium polyacrylate, disodium hydrogen phosphate, diethyl phosphite, water Composition;
(2) frequency chip is put in the second grinding system, carry out second time and grind;The frequency chip that second time is ground is inserted second In cleanout fluid, ultrasonic cleaning 20~25 minutes, obtain the frequency chip after second time is cleaned;Described second grinding system by powder body, Acrylic acid, double (2,3-epoxy radicals cyclopenta) ether, the propargyl ester of the different acid of bromo fourth, ethanol, water form;Described second cleanout fluid is by 2- Acrylamide-2-methylpro panesulfonic acid, hexadecyltrimethylammonium chloride, isomerous tridecanol polyoxyethylene ether, N-β-(ammonia second Base)-γ-aminopropyltriethoxy dimethoxysilane, water composition;Described powder body is by conch meal, Yttrium trinitrate, titanium dioxide sintering, powder Broken, sieving obtains;
(3) frequency chip after second time being cleaned adds in alkali liquor, takes out and put in water after soaking 3~3.5 minutes, ultrasonic cleaning 10~15 minutes;Finally insert in ethanol and soak 1~2 minute, infrared drying, i.e. complete the ground and cleaned of frequency chip.
The ground and cleaned method of frequency chip the most according to claim 1, it is characterised in that: in step (1), grind for the first time Time is 5~8 minutes.
The ground and cleaned method of frequency chip the most according to claim 1, it is characterised in that: in step (1), quartz sand average Particle diameter is 500 mesh.
The ground and cleaned method of frequency chip the most according to claim 1, it is characterised in that: in step (1), quartz sand, ethylene Cyclohexene diepoxide, the propargyl ester of the different acid of bromo fourth, N, N-dimethyl-ethylenediamine, ethanol, the mass ratio of water are 821 1 20 100;Isomerous tridecanol polyoxyethylene ether, sodium polyacrylate, disodium hydrogen phosphate, diethyl phosphite, the matter of water Amount ratio is 2214 100.
The ground and cleaned method of frequency chip the most according to claim 1, it is characterised in that: in step (1), ultrasonic frequency is 40Hz。
The ground and cleaned method of frequency chip the most according to claim 1, it is characterised in that:, in step (2), by mass ratio be The conch meal of 100 3 28, Yttrium trinitrate, titanium dioxide 650 DEG C sinter 3 hours, ball mill pulverizing, cross 5000 mesh sieves and obtain powder body;The The time that secondary grinds is 18~22 minutes.
The ground and cleaned method of frequency chip the most according to claim 1, it is characterised in that: in step (2), powder body, acrylic acid, Double (2,3-epoxy radicals cyclopenta) ether, the propargyl ester of the different acid of bromo fourth, ethanol, the mass ratio of water are 5421 25 100;2-third Acrylamide base-2-methyl propane sulfonic acid, hexadecyltrimethylammonium chloride, isomerous tridecanol polyoxyethylene ether, N-β-(aminoethyl)- γ-aminopropyltriethoxy dimethoxysilane, the mass ratio of water are 6252 100;Ultrasonic frequency is preferably 40Hz.
The ground and cleaned method of frequency chip the most according to claim 1, it is characterised in that: in step (3), alkali liquor is by mass ratio It is potassium hydroxide, lithium bromide, dodecyl sodium sulfate, ethylenediamine and the water composition of 12 764 100.
CN201610549210.5A 2016-07-13 2016-07-13 The ground and cleaned method of frequency chip Pending CN106190030A (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101708497A (en) * 2009-12-11 2010-05-19 廊坊中电大成电子有限公司 Method for cleaning quartz crystal frequency chip
CN102072614A (en) * 2010-12-31 2011-05-25 苏州普锐晶科技有限公司 Application of suction drying to frequency chip washing and drying engineering
CN103701423A (en) * 2013-11-29 2014-04-02 铜陵日科电子有限责任公司 Quartz crystal frequency chip cleaning process

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101708497A (en) * 2009-12-11 2010-05-19 廊坊中电大成电子有限公司 Method for cleaning quartz crystal frequency chip
CN102072614A (en) * 2010-12-31 2011-05-25 苏州普锐晶科技有限公司 Application of suction drying to frequency chip washing and drying engineering
CN103701423A (en) * 2013-11-29 2014-04-02 铜陵日科电子有限责任公司 Quartz crystal frequency chip cleaning process

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