CN101699325A - 光波导用树脂组合物以及使用该组合物的光波导 - Google Patents
光波导用树脂组合物以及使用该组合物的光波导 Download PDFInfo
- Publication number
- CN101699325A CN101699325A CN200910157229A CN200910157229A CN101699325A CN 101699325 A CN101699325 A CN 101699325A CN 200910157229 A CN200910157229 A CN 200910157229A CN 200910157229 A CN200910157229 A CN 200910157229A CN 101699325 A CN101699325 A CN 101699325A
- Authority
- CN
- China
- Prior art keywords
- optical waveguide
- resin composition
- mentioned
- resin
- epoxy compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/122—Basic optical elements, e.g. light-guiding paths
- G02B6/1221—Basic optical elements, e.g. light-guiding paths made from organic materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Epoxy Resins (AREA)
- Optical Integrated Circuits (AREA)
- Polymerisation Methods In General (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008-172397 | 2008-07-01 | ||
JP2008172397 | 2008-07-01 | ||
JP2009136445A JP5357629B2 (ja) | 2008-07-01 | 2009-06-05 | 光導波路用樹脂組成物およびそれを用いた光導波路 |
JP2009-136445 | 2009-06-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101699325A true CN101699325A (zh) | 2010-04-28 |
CN101699325B CN101699325B (zh) | 2012-09-05 |
Family
ID=41171000
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009101572295A Expired - Fee Related CN101699325B (zh) | 2008-07-01 | 2009-07-01 | 光波导用树脂组合物以及使用该组合物的光波导 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7995895B2 (zh) |
EP (1) | EP2141186B1 (zh) |
JP (1) | JP5357629B2 (zh) |
KR (1) | KR101574799B1 (zh) |
CN (1) | CN101699325B (zh) |
AT (1) | ATE494318T1 (zh) |
DE (1) | DE602009000527D1 (zh) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100150506A1 (en) * | 2007-03-30 | 2010-06-17 | Nec Corporation | Polymer optical waveguide forming material, polymer optical waveguide and manufacturing method of polymer optical waveguide |
JP5560846B2 (ja) * | 2010-03-31 | 2014-07-30 | 住友ベークライト株式会社 | 感光性樹脂組成物、光導波路形成用フィルム、光導波路、光配線、光電気混載基板および電子機器 |
KR102215705B1 (ko) | 2017-12-15 | 2021-02-18 | 주식회사 엘지화학 | 웨어러블 디바이스 |
US10543161B1 (en) | 2018-08-24 | 2020-01-28 | L'oreal | Methods for protecting and improving the appearance of skin |
JP7507430B2 (ja) * | 2019-06-10 | 2024-06-28 | パナソニックIpマネジメント株式会社 | 紫外線硬化性樹脂組成物、発光装置の製造方法及び発光装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000356720A (ja) * | 1999-06-16 | 2000-12-26 | Sony Corp | 光導波路用材料並びに光導波路およびその製造方法 |
JP3815605B2 (ja) | 2001-11-15 | 2006-08-30 | 日本化薬株式会社 | 光導波路用樹脂組成物及びその硬化物 |
JP4205368B2 (ja) * | 2002-06-11 | 2009-01-07 | 株式会社Adeka | 光学材料用硬化性組成物 |
JP2005225964A (ja) * | 2004-02-12 | 2005-08-25 | Jsr Corp | 光半導体封止用組成物 |
JP2006013378A (ja) | 2004-06-29 | 2006-01-12 | Tdk Corp | サーミスタ素体形成用樹脂組成物及びサーミスタ |
CN101035855B (zh) * | 2004-10-07 | 2011-06-15 | 日立化成工业株式会社 | 光学材料用树脂组合物、光学材料用树脂薄膜及使用其的光导 |
JP5037348B2 (ja) * | 2005-09-02 | 2012-09-26 | 新日鐵化学株式会社 | エポキシ樹脂組成物 |
JP5344789B2 (ja) * | 2006-12-28 | 2013-11-20 | 新日鉄住金化学株式会社 | 新規エポキシ樹脂、該エポキシ樹脂を必須成分とするエポキシ樹脂組成物及び該エポキシ樹脂を必須成分とする硬化物 |
-
2009
- 2009-06-05 JP JP2009136445A patent/JP5357629B2/ja not_active Expired - Fee Related
- 2009-06-30 KR KR1020090059010A patent/KR101574799B1/ko not_active IP Right Cessation
- 2009-06-30 DE DE602009000527T patent/DE602009000527D1/de active Active
- 2009-06-30 EP EP09164105A patent/EP2141186B1/en not_active Not-in-force
- 2009-06-30 AT AT09164105T patent/ATE494318T1/de not_active IP Right Cessation
- 2009-07-01 CN CN2009101572295A patent/CN101699325B/zh not_active Expired - Fee Related
- 2009-07-01 US US12/496,088 patent/US7995895B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20100003004A1 (en) | 2010-01-07 |
EP2141186A1 (en) | 2010-01-06 |
JP5357629B2 (ja) | 2013-12-04 |
JP2010033029A (ja) | 2010-02-12 |
DE602009000527D1 (de) | 2011-02-17 |
EP2141186B1 (en) | 2011-01-05 |
US7995895B2 (en) | 2011-08-09 |
KR20100003705A (ko) | 2010-01-11 |
CN101699325B (zh) | 2012-09-05 |
ATE494318T1 (de) | 2011-01-15 |
KR101574799B1 (ko) | 2015-12-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: XINRIHUA EPOXY MANUFACTURING CO., LTD. Free format text: FORMER OWNER: TOHTO KASEI CO., LTD. |
|
TA01 | Transfer of patent application right |
Effective date of registration: 20100830 Address after: Osaka Japan Applicant after: Nitto Denko Corp. Co-applicant after: New daily chemical epoxy Manufacturing Co Address before: Osaka Japan Applicant before: Nitto Denko Corp. Co-applicant before: Tohto Kasei Co., Ltd. |
|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee | ||
CP01 | Change in the name or title of a patent holder |
Address after: Osaka Japan Patentee after: Nitto Denko Corp. Patentee after: Nippon Steel Chemical Co. Address before: Osaka Japan Patentee before: Nitto Denko Corp. Patentee before: Nippon Seel Chemical Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120905 Termination date: 20170701 |
|
CF01 | Termination of patent right due to non-payment of annual fee |