CN101679599B - 用于固化环氧化物的催化剂 - Google Patents
用于固化环氧化物的催化剂 Download PDFInfo
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- CN101679599B CN101679599B CN200880019866.XA CN200880019866A CN101679599B CN 101679599 B CN101679599 B CN 101679599B CN 200880019866 A CN200880019866 A CN 200880019866A CN 101679599 B CN101679599 B CN 101679599B
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- RTWNYYOXLSILQN-UHFFFAOYSA-N methanediamine Chemical compound NCN RTWNYYOXLSILQN-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- BMLIZLVNXIYGCK-UHFFFAOYSA-N monuron Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C=C1 BMLIZLVNXIYGCK-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 150000002931 p-cresols Chemical class 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920000962 poly(amidoamine) Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 230000003678 scratch resistant effect Effects 0.000 description 1
- 238000007086 side reaction Methods 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- JIVZKJJQOZQXQB-UHFFFAOYSA-N tolazoline Chemical compound C=1C=CC=CC=1CC1=NCCN1 JIVZKJJQOZQXQB-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N tolylenediamine group Chemical group CC1=C(C=C(C=C1)N)N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
- C08K5/3445—Five-membered rings
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP07110171.1 | 2007-06-13 | ||
| EP07110171 | 2007-06-13 | ||
| PCT/EP2008/057140 WO2008152011A1 (de) | 2007-06-13 | 2008-06-09 | Katalysator für die härtung von epoxiden |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101679599A CN101679599A (zh) | 2010-03-24 |
| CN101679599B true CN101679599B (zh) | 2013-01-09 |
Family
ID=39722654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200880019866.XA Active CN101679599B (zh) | 2007-06-13 | 2008-06-09 | 用于固化环氧化物的催化剂 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US8247517B2 (enExample) |
| EP (1) | EP2158249B1 (enExample) |
| JP (1) | JP5409612B2 (enExample) |
| KR (1) | KR101438866B1 (enExample) |
| CN (1) | CN101679599B (enExample) |
| AT (1) | ATE484537T1 (enExample) |
| DE (1) | DE502008001542D1 (enExample) |
| ES (1) | ES2354399T3 (enExample) |
| TW (1) | TWI439486B (enExample) |
| WO (1) | WO2008152011A1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5579059B2 (ja) | 2007-06-12 | 2014-08-27 | ビーエーエスエフ ソシエタス・ヨーロピア | エポキシドの硬化触媒 |
| WO2011142855A2 (en) * | 2010-02-04 | 2011-11-17 | Drexel University | Room temperature ionic liquids and ionic liquid epoxy adducts as initiators for epoxy systems |
| US20120296012A1 (en) * | 2010-02-04 | 2012-11-22 | Drexel University | Room temperature ionic liquid-epoxy systems as dispersants and matrix materials for nanocomposites |
| WO2012136273A1 (de) | 2011-04-08 | 2012-10-11 | Basf Se | Hyperverzweigte polymere zur modifikation der zähigkeit von anionisch gehärteten epoxidharz-systemen |
| DE102013008723A1 (de) | 2013-05-23 | 2014-11-27 | Deutsche Institute Für Textil- Und Faserforschung Denkendorf | Polymerisierbare Reaktionsmischung zur Herstellung von Epoxidharzen und deren Verwendung |
| EP2933019A1 (en) | 2014-04-15 | 2015-10-21 | Henkel AG&Co. KGAA | Storage stable heat activated quaternary ammonium catalysts for epoxy cure |
| JP6985040B2 (ja) * | 2017-07-04 | 2021-12-22 | 積水化学工業株式会社 | 熱硬化性樹脂組成物 |
| US10696839B2 (en) | 2018-09-07 | 2020-06-30 | Pipefusion Cipp Corporation | Curable composition for cured in place pipes |
| EP3847204A1 (en) * | 2018-09-07 | 2021-07-14 | Pipefusion Cipp Corporation | Curable composition for cured in place pipes |
| WO2025047123A1 (ja) * | 2023-08-30 | 2025-03-06 | パナソニックＩｐマネジメント株式会社 | 放熱樹脂組成物 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3635894A (en) * | 1969-11-06 | 1972-01-18 | Ppg Industries Inc | Curable epoxy resin compositions containing organoimidazolium salt |
| DE2416408A1 (de) * | 1974-04-04 | 1975-10-16 | Hitachi Chemical Co Ltd | Epoxyharz-zusammensetzung und herstellungsverfahren dafuer |
| US6180696B1 (en) * | 1997-02-19 | 2001-01-30 | Georgia Tech Research Corporation | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE243227T1 (de) | 1990-05-21 | 2003-07-15 | Dow Global Technologies Inc | Latente katalysatoren, härtungsinhibierte epoxyharzzusammensetzungen und daraus hergestellte laminate |
| DE4110219A1 (de) | 1991-03-28 | 1992-10-01 | Huels Troisdorf | Verfahren zur herstellung von prepregs mit loesungsmittelfreiem epoxidharz |
| US5879794A (en) * | 1994-08-25 | 1999-03-09 | W. L. Gore & Associates, Inc. | Adhesive-filler film composite |
| US5538756A (en) * | 1994-09-23 | 1996-07-23 | W. L. Gore & Associates | High capacitance sheet adhesives and process for making the same |
| JPH08259764A (ja) * | 1995-03-03 | 1996-10-08 | W L Gore & Assoc Inc | 接着剤、充填材含有ポリマーフィルム複合材料 |
| JP2001316629A (ja) * | 2000-05-02 | 2001-11-16 | Nippon Steel Corp | 防食塗料組成物および防食被覆鋼材 |
| JP2004217859A (ja) | 2003-01-17 | 2004-08-05 | Hitachi Chem Co Ltd | 接着シートの製造方法、半導体装置およびその製造方法 |
| JP2004238555A (ja) * | 2003-02-07 | 2004-08-26 | Asahi Denka Kogyo Kk | 熱硬化型エポキシ樹脂組成物 |
| JP4844130B2 (ja) * | 2005-02-03 | 2011-12-28 | 住友化学株式会社 | β−ヒドロキシエーテル類の製造方法 |
| JP2006232882A (ja) * | 2005-02-22 | 2006-09-07 | Nitto Denko Corp | 粘着剤組成物、粘着シート類および両面粘着テープ |
-
2008
- 2008-06-09 JP JP2010511602A patent/JP5409612B2/ja not_active Expired - Fee Related
- 2008-06-09 KR KR1020107000660A patent/KR101438866B1/ko not_active Expired - Fee Related
- 2008-06-09 ES ES08760709T patent/ES2354399T3/es active Active
- 2008-06-09 CN CN200880019866.XA patent/CN101679599B/zh active Active
- 2008-06-09 AT AT08760709T patent/ATE484537T1/de active
- 2008-06-09 DE DE502008001542T patent/DE502008001542D1/de active Active
- 2008-06-09 WO PCT/EP2008/057140 patent/WO2008152011A1/de not_active Ceased
- 2008-06-09 EP EP08760709A patent/EP2158249B1/de active Active
- 2008-06-09 US US12/664,231 patent/US8247517B2/en active Active
- 2008-06-13 TW TW097122340A patent/TWI439486B/zh not_active IP Right Cessation
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3635894A (en) * | 1969-11-06 | 1972-01-18 | Ppg Industries Inc | Curable epoxy resin compositions containing organoimidazolium salt |
| DE2416408A1 (de) * | 1974-04-04 | 1975-10-16 | Hitachi Chemical Co Ltd | Epoxyharz-zusammensetzung und herstellungsverfahren dafuer |
| US6180696B1 (en) * | 1997-02-19 | 2001-01-30 | Georgia Tech Research Corporation | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant |
Non-Patent Citations (2)
| Title |
|---|
| JP特开2006-241139A 2006.09.14 |
| Yangyang Sun et al.Room temperature stable underfill with novel latent catalyst for wafer level flip-chip packaging applications.《Electronic Components and Technology Conference,2006.Proceedings.56th》.2006,第1905-1910页. * |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI439486B (zh) | 2014-06-01 |
| JP2010530018A (ja) | 2010-09-02 |
| WO2008152011A1 (de) | 2008-12-18 |
| ATE484537T1 (de) | 2010-10-15 |
| KR20100044169A (ko) | 2010-04-29 |
| KR101438866B1 (ko) | 2014-09-11 |
| WO2008152011A9 (de) | 2010-03-18 |
| US20100184925A1 (en) | 2010-07-22 |
| JP5409612B2 (ja) | 2014-02-05 |
| EP2158249A1 (de) | 2010-03-03 |
| ES2354399T3 (es) | 2011-03-14 |
| DE502008001542D1 (de) | 2010-11-25 |
| CN101679599A (zh) | 2010-03-24 |
| US8247517B2 (en) | 2012-08-21 |
| EP2158249B1 (de) | 2010-10-13 |
| TW200909469A (en) | 2009-03-01 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |