KR101438866B1 - 에폭사이드 경화용 촉매 - Google Patents

에폭사이드 경화용 촉매 Download PDF

Info

Publication number
KR101438866B1
KR101438866B1 KR1020107000660A KR20107000660A KR101438866B1 KR 101438866 B1 KR101438866 B1 KR 101438866B1 KR 1020107000660 A KR1020107000660 A KR 1020107000660A KR 20107000660 A KR20107000660 A KR 20107000660A KR 101438866 B1 KR101438866 B1 KR 101438866B1
Authority
KR
South Korea
Prior art keywords
latent catalyst
epoxy compound
composition
curing
catalyst according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020107000660A
Other languages
English (en)
Korean (ko)
Other versions
KR20100044169A (ko
Inventor
라르스 비텐베허
미하엘 헨닝젠
게오르크 데겐
마티아스 마제
만프레트 되링
울리히 아르놀트
Original Assignee
바스프 에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 바스프 에스이 filed Critical 바스프 에스이
Publication of KR20100044169A publication Critical patent/KR20100044169A/ko
Application granted granted Critical
Publication of KR101438866B1 publication Critical patent/KR101438866B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)
  • Epoxy Compounds (AREA)
KR1020107000660A 2007-06-13 2008-06-09 에폭사이드 경화용 촉매 Expired - Fee Related KR101438866B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP07110171.1 2007-06-13
EP07110171 2007-06-13
PCT/EP2008/057140 WO2008152011A1 (de) 2007-06-13 2008-06-09 Katalysator für die härtung von epoxiden

Publications (2)

Publication Number Publication Date
KR20100044169A KR20100044169A (ko) 2010-04-29
KR101438866B1 true KR101438866B1 (ko) 2014-09-11

Family

ID=39722654

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107000660A Expired - Fee Related KR101438866B1 (ko) 2007-06-13 2008-06-09 에폭사이드 경화용 촉매

Country Status (10)

Country Link
US (1) US8247517B2 (enExample)
EP (1) EP2158249B1 (enExample)
JP (1) JP5409612B2 (enExample)
KR (1) KR101438866B1 (enExample)
CN (1) CN101679599B (enExample)
AT (1) ATE484537T1 (enExample)
DE (1) DE502008001542D1 (enExample)
ES (1) ES2354399T3 (enExample)
TW (1) TWI439486B (enExample)
WO (1) WO2008152011A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101438865B1 (ko) 2007-06-12 2014-09-11 바스프 에스이 에폭사이드 경화용 촉매
US20120296012A1 (en) * 2010-02-04 2012-11-22 Drexel University Room temperature ionic liquid-epoxy systems as dispersants and matrix materials for nanocomposites
WO2011142855A2 (en) * 2010-02-04 2011-11-17 Drexel University Room temperature ionic liquids and ionic liquid epoxy adducts as initiators for epoxy systems
WO2012136273A1 (de) 2011-04-08 2012-10-11 Basf Se Hyperverzweigte polymere zur modifikation der zähigkeit von anionisch gehärteten epoxidharz-systemen
DE102013008723A1 (de) 2013-05-23 2014-11-27 Deutsche Institute Für Textil- Und Faserforschung Denkendorf Polymerisierbare Reaktionsmischung zur Herstellung von Epoxidharzen und deren Verwendung
EP2933019A1 (en) 2014-04-15 2015-10-21 Henkel AG&Co. KGAA Storage stable heat activated quaternary ammonium catalysts for epoxy cure
JP6985040B2 (ja) * 2017-07-04 2021-12-22 積水化学工業株式会社 熱硬化性樹脂組成物
CA3111761A1 (en) * 2018-09-07 2020-03-12 Pipefusion Cipp Corporation Curable composition for cured in place pipes
US10696839B2 (en) 2018-09-07 2020-06-30 Pipefusion Cipp Corporation Curable composition for cured in place pipes
WO2025047123A1 (ja) * 2023-08-30 2025-03-06 パナソニックＩｐマネジメント株式会社 放熱樹脂組成物

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3635894A (en) 1969-11-06 1972-01-18 Ppg Industries Inc Curable epoxy resin compositions containing organoimidazolium salt
WO1998037134A1 (en) 1997-02-19 1998-08-27 Georgia Tech Research Corporation Low-cost high-performance no-flow underfills for flip-chip applications

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2416408C3 (de) * 1974-04-04 1978-08-17 Hitachi Chemical Co., Ltd. Wärmehärtbare Gemische auf der Basis eines Epoxyharzes und einer komplexen Imidazoliumsalzverbindung und ihr Herstellungsverfahren
EP0458502B1 (en) 1990-05-21 2003-06-18 Dow Global Technologies Inc. Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom
DE4110219A1 (de) 1991-03-28 1992-10-01 Huels Troisdorf Verfahren zur herstellung von prepregs mit loesungsmittelfreiem epoxidharz
US5879794A (en) * 1994-08-25 1999-03-09 W. L. Gore & Associates, Inc. Adhesive-filler film composite
US5538756A (en) * 1994-09-23 1996-07-23 W. L. Gore & Associates High capacitance sheet adhesives and process for making the same
JPH08259764A (ja) * 1995-03-03 1996-10-08 W L Gore & Assoc Inc 接着剤、充填材含有ポリマーフィルム複合材料
JP2001316629A (ja) * 2000-05-02 2001-11-16 Nippon Steel Corp 防食塗料組成物および防食被覆鋼材
JP2004217859A (ja) 2003-01-17 2004-08-05 Hitachi Chem Co Ltd 接着シートの製造方法、半導体装置およびその製造方法
JP2004238555A (ja) * 2003-02-07 2004-08-26 Asahi Denka Kogyo Kk 熱硬化型エポキシ樹脂組成物
JP4844130B2 (ja) * 2005-02-03 2011-12-28 住友化学株式会社 β−ヒドロキシエーテル類の製造方法
JP2006232882A (ja) * 2005-02-22 2006-09-07 Nitto Denko Corp 粘着剤組成物、粘着シート類および両面粘着テープ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3635894A (en) 1969-11-06 1972-01-18 Ppg Industries Inc Curable epoxy resin compositions containing organoimidazolium salt
WO1998037134A1 (en) 1997-02-19 1998-08-27 Georgia Tech Research Corporation Low-cost high-performance no-flow underfills for flip-chip applications

Also Published As

Publication number Publication date
TWI439486B (zh) 2014-06-01
KR20100044169A (ko) 2010-04-29
JP5409612B2 (ja) 2014-02-05
US20100184925A1 (en) 2010-07-22
ES2354399T3 (es) 2011-03-14
EP2158249A1 (de) 2010-03-03
ATE484537T1 (de) 2010-10-15
TW200909469A (en) 2009-03-01
US8247517B2 (en) 2012-08-21
DE502008001542D1 (de) 2010-11-25
EP2158249B1 (de) 2010-10-13
CN101679599A (zh) 2010-03-24
CN101679599B (zh) 2013-01-09
WO2008152011A1 (de) 2008-12-18
WO2008152011A9 (de) 2010-03-18
JP2010530018A (ja) 2010-09-02

Similar Documents

Publication Publication Date Title
KR101438867B1 (ko) 에폭사이드 경화용 촉매
KR101438863B1 (ko) 에폭시드 경화용 촉매
KR101438866B1 (ko) 에폭사이드 경화용 촉매
KR101438865B1 (ko) 에폭사이드 경화용 촉매
KR102205915B1 (ko) 섬유-매트릭스 반마감 생성물용 에폭시드 수지 조성물
KR20190132247A (ko) 신속-경화 에폭시 시스템
KR20190132249A (ko) 신속-경화 에폭시 시스템
JP2022145636A (ja) 水性エポキシ硬化剤
CN102648229A (zh) 基于二乙烯基芳烃氧化物的加合物
TW200911866A (en) Catalyst for curing epoxides

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20170902

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20170902

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000