CN101679599B - 用于固化环氧化物的催化剂 - Google Patents

用于固化环氧化物的催化剂 Download PDF

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Publication number
CN101679599B
CN101679599B CN200880019866.XA CN200880019866A CN101679599B CN 101679599 B CN101679599 B CN 101679599B CN 200880019866 A CN200880019866 A CN 200880019866A CN 101679599 B CN101679599 B CN 101679599B
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CN
China
Prior art keywords
purposes
epoxy compounds
epoxy
curable composition
composition
Prior art date
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CN200880019866.XA
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English (en)
Chinese (zh)
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CN101679599A (zh
Inventor
L·维滕贝克尔
M·亨尼格森
G·德根
M·马斯
M·德林
U·阿诺尔德
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BASF SE
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BASF SE
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3442—Heterocyclic compounds having nitrogen in the ring having two nitrogen atoms in the ring
    • C08K5/3445—Five-membered rings

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Epoxy Compounds (AREA)
  • Low-Molecular Organic Synthesis Reactions Using Catalysts (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
CN200880019866.XA 2007-06-13 2008-06-09 用于固化环氧化物的催化剂 Active CN101679599B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP07110171 2007-06-13
EP07110171.1 2007-06-13
PCT/EP2008/057140 WO2008152011A1 (de) 2007-06-13 2008-06-09 Katalysator für die härtung von epoxiden

Publications (2)

Publication Number Publication Date
CN101679599A CN101679599A (zh) 2010-03-24
CN101679599B true CN101679599B (zh) 2013-01-09

Family

ID=39722654

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200880019866.XA Active CN101679599B (zh) 2007-06-13 2008-06-09 用于固化环氧化物的催化剂

Country Status (10)

Country Link
US (1) US8247517B2 (cg-RX-API-DMAC7.html)
EP (1) EP2158249B1 (cg-RX-API-DMAC7.html)
JP (1) JP5409612B2 (cg-RX-API-DMAC7.html)
KR (1) KR101438866B1 (cg-RX-API-DMAC7.html)
CN (1) CN101679599B (cg-RX-API-DMAC7.html)
AT (1) ATE484537T1 (cg-RX-API-DMAC7.html)
DE (1) DE502008001542D1 (cg-RX-API-DMAC7.html)
ES (1) ES2354399T3 (cg-RX-API-DMAC7.html)
TW (1) TWI439486B (cg-RX-API-DMAC7.html)
WO (1) WO2008152011A1 (cg-RX-API-DMAC7.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101679607B (zh) 2007-06-12 2012-05-30 巴斯夫欧洲公司 用于固化环氧化物的催化剂
WO2011142855A2 (en) * 2010-02-04 2011-11-17 Drexel University Room temperature ionic liquids and ionic liquid epoxy adducts as initiators for epoxy systems
US20120296012A1 (en) * 2010-02-04 2012-11-22 Drexel University Room temperature ionic liquid-epoxy systems as dispersants and matrix materials for nanocomposites
WO2012136273A1 (de) 2011-04-08 2012-10-11 Basf Se Hyperverzweigte polymere zur modifikation der zähigkeit von anionisch gehärteten epoxidharz-systemen
DE102013008723A1 (de) 2013-05-23 2014-11-27 Deutsche Institute Für Textil- Und Faserforschung Denkendorf Polymerisierbare Reaktionsmischung zur Herstellung von Epoxidharzen und deren Verwendung
EP2933019A1 (en) 2014-04-15 2015-10-21 Henkel AG&Co. KGAA Storage stable heat activated quaternary ammonium catalysts for epoxy cure
JP6985040B2 (ja) * 2017-07-04 2021-12-22 積水化学工業株式会社 熱硬化性樹脂組成物
AU2018440151B2 (en) * 2018-09-07 2024-04-18 Pipefusion Cipp Corporation Curable composition for cured in place pipes
US10696839B2 (en) 2018-09-07 2020-06-30 Pipefusion Cipp Corporation Curable composition for cured in place pipes
WO2025047123A1 (ja) * 2023-08-30 2025-03-06 パナソニックＩｐマネジメント株式会社 放熱樹脂組成物

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3635894A (en) * 1969-11-06 1972-01-18 Ppg Industries Inc Curable epoxy resin compositions containing organoimidazolium salt
DE2416408A1 (de) * 1974-04-04 1975-10-16 Hitachi Chemical Co Ltd Epoxyharz-zusammensetzung und herstellungsverfahren dafuer
US6180696B1 (en) * 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0458502B1 (en) 1990-05-21 2003-06-18 Dow Global Technologies Inc. Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom
DE4110219A1 (de) 1991-03-28 1992-10-01 Huels Troisdorf Verfahren zur herstellung von prepregs mit loesungsmittelfreiem epoxidharz
US5879794A (en) * 1994-08-25 1999-03-09 W. L. Gore & Associates, Inc. Adhesive-filler film composite
US5538756A (en) * 1994-09-23 1996-07-23 W. L. Gore & Associates High capacitance sheet adhesives and process for making the same
JPH08259764A (ja) * 1995-03-03 1996-10-08 W L Gore & Assoc Inc 接着剤、充填材含有ポリマーフィルム複合材料
JP2001316629A (ja) * 2000-05-02 2001-11-16 Nippon Steel Corp 防食塗料組成物および防食被覆鋼材
JP2004217859A (ja) 2003-01-17 2004-08-05 Hitachi Chem Co Ltd 接着シートの製造方法、半導体装置およびその製造方法
JP2004238555A (ja) * 2003-02-07 2004-08-26 Asahi Denka Kogyo Kk 熱硬化型エポキシ樹脂組成物
JP4844130B2 (ja) 2005-02-03 2011-12-28 住友化学株式会社 β−ヒドロキシエーテル類の製造方法
JP2006232882A (ja) * 2005-02-22 2006-09-07 Nitto Denko Corp 粘着剤組成物、粘着シート類および両面粘着テープ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3635894A (en) * 1969-11-06 1972-01-18 Ppg Industries Inc Curable epoxy resin compositions containing organoimidazolium salt
DE2416408A1 (de) * 1974-04-04 1975-10-16 Hitachi Chemical Co Ltd Epoxyharz-zusammensetzung und herstellungsverfahren dafuer
US6180696B1 (en) * 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JP特开2006-241139A 2006.09.14
Yangyang Sun et al.Room temperature stable underfill with novel latent catalyst for wafer level flip-chip packaging applications.《Electronic Components and Technology Conference,2006.Proceedings.56th》.2006,第1905-1910页. *

Also Published As

Publication number Publication date
DE502008001542D1 (de) 2010-11-25
TW200909469A (en) 2009-03-01
KR20100044169A (ko) 2010-04-29
WO2008152011A1 (de) 2008-12-18
US8247517B2 (en) 2012-08-21
JP2010530018A (ja) 2010-09-02
JP5409612B2 (ja) 2014-02-05
ES2354399T3 (es) 2011-03-14
KR101438866B1 (ko) 2014-09-11
WO2008152011A9 (de) 2010-03-18
EP2158249B1 (de) 2010-10-13
US20100184925A1 (en) 2010-07-22
CN101679599A (zh) 2010-03-24
EP2158249A1 (de) 2010-03-03
TWI439486B (zh) 2014-06-01
ATE484537T1 (de) 2010-10-15

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