CN101675097B - 增强的有机硅树脂膜 - Google Patents
增强的有机硅树脂膜 Download PDFInfo
- Publication number
- CN101675097B CN101675097B CN2008800143281A CN200880014328A CN101675097B CN 101675097 B CN101675097 B CN 101675097B CN 2008800143281 A CN2008800143281 A CN 2008800143281A CN 200880014328 A CN200880014328 A CN 200880014328A CN 101675097 B CN101675097 B CN 101675097B
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- China
- Prior art keywords
- silicone resin
- resin film
- polymer layer
- reinforced silicone
- reinforced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US91513707P | 2007-05-01 | 2007-05-01 | |
| US60/915,137 | 2007-05-01 | ||
| PCT/US2008/060432 WO2008137262A2 (en) | 2007-05-01 | 2008-04-16 | Reinforced silicone resin film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101675097A CN101675097A (zh) | 2010-03-17 |
| CN101675097B true CN101675097B (zh) | 2012-03-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2008800143281A Expired - Fee Related CN101675097B (zh) | 2007-05-01 | 2008-04-16 | 增强的有机硅树脂膜 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20100129625A1 (https=) |
| EP (1) | EP2142589A2 (https=) |
| JP (1) | JP5250025B2 (https=) |
| KR (1) | KR20100017503A (https=) |
| CN (1) | CN101675097B (https=) |
| WO (1) | WO2008137262A2 (https=) |
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| US8912268B2 (en) * | 2005-12-21 | 2014-12-16 | Dow Corning Corporation | Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition |
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| CN103779508B (zh) * | 2014-01-26 | 2015-10-14 | 江苏天楹之光光电科技有限公司 | 一种电致发光二极管的封装方法 |
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2008
- 2008-04-16 JP JP2010506395A patent/JP5250025B2/ja not_active Expired - Fee Related
- 2008-04-16 CN CN2008800143281A patent/CN101675097B/zh not_active Expired - Fee Related
- 2008-04-16 KR KR20097024955A patent/KR20100017503A/ko not_active Abandoned
- 2008-04-16 WO PCT/US2008/060432 patent/WO2008137262A2/en not_active Ceased
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- 2008-04-16 US US12/596,740 patent/US20100129625A1/en not_active Abandoned
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Also Published As
| Publication number | Publication date |
|---|---|
| KR20100017503A (ko) | 2010-02-16 |
| US20100129625A1 (en) | 2010-05-27 |
| JP5250025B2 (ja) | 2013-07-31 |
| JP2010527297A (ja) | 2010-08-12 |
| WO2008137262A2 (en) | 2008-11-13 |
| EP2142589A2 (en) | 2010-01-13 |
| WO2008137262A3 (en) | 2009-09-17 |
| CN101675097A (zh) | 2010-03-17 |
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