CN101673053A - 感光性组合物和基板的加工基板的制造方法 - Google Patents

感光性组合物和基板的加工基板的制造方法 Download PDF

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Publication number
CN101673053A
CN101673053A CN200910169157A CN200910169157A CN101673053A CN 101673053 A CN101673053 A CN 101673053A CN 200910169157 A CN200910169157 A CN 200910169157A CN 200910169157 A CN200910169157 A CN 200910169157A CN 101673053 A CN101673053 A CN 101673053A
Authority
CN
China
Prior art keywords
functional group
photosensitive composite
substrate
quality
polymerizable monomer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200910169157A
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English (en)
Chinese (zh)
Inventor
畠山晶
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2009030333A external-priority patent/JP2010093218A/ja
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of CN101673053A publication Critical patent/CN101673053A/zh
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN200910169157A 2008-09-11 2009-09-11 感光性组合物和基板的加工基板的制造方法 Pending CN101673053A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008233545 2008-09-11
JP2008233545 2008-09-11
JP2009030333A JP2010093218A (ja) 2008-09-11 2009-02-12 感光性組成物および基板の加工基板の製造方法。
JP2009030333 2009-02-12

Publications (1)

Publication Number Publication Date
CN101673053A true CN101673053A (zh) 2010-03-17

Family

ID=42020325

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200910169157A Pending CN101673053A (zh) 2008-09-11 2009-09-11 感光性组合物和基板的加工基板的制造方法

Country Status (2)

Country Link
KR (1) KR20100031074A (ko)
CN (1) CN101673053A (ko)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102478508A (zh) * 2010-11-26 2012-05-30 中国蓝星（集团）股份有限公司 一种聚丙烯腈预氧丝氰基残余分数的测试方法
CN104684634A (zh) * 2012-09-28 2015-06-03 富士胶片株式会社 高分子功能性膜及其制造方法
CN107533287A (zh) * 2014-12-10 2018-01-02 约阿内研究有限责任公司 聚合物组合物或预聚物组合物或者包含此类组合物的压花漆及其用途
CN111694218A (zh) * 2014-05-21 2020-09-22 旭化成株式会社 感光性树脂组合物以及电路图案的形成方法
CN112479888A (zh) * 2019-09-11 2021-03-12 铠侠股份有限公司 化合物、聚合物、图案形成材料、图案形成方法及半导体装置的制造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116675889A (zh) * 2023-05-19 2023-09-01 斯迪克新型材料（江苏）有限公司 Mlcc用高表面能低粗糙度离型膜及其制备方法

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102478508A (zh) * 2010-11-26 2012-05-30 中国蓝星（集团）股份有限公司 一种聚丙烯腈预氧丝氰基残余分数的测试方法
CN104684634A (zh) * 2012-09-28 2015-06-03 富士胶片株式会社 高分子功能性膜及其制造方法
CN104684634B (zh) * 2012-09-28 2017-04-26 富士胶片株式会社 高分子功能性膜及其制造方法
US9850147B2 (en) 2012-09-28 2017-12-26 Fujifilm Corporation Functional polymer membrane and method of producing the same
CN111694218B (zh) * 2014-05-21 2023-09-08 旭化成株式会社 感光性树脂组合物以及电路图案的形成方法
CN111694218A (zh) * 2014-05-21 2020-09-22 旭化成株式会社 感光性树脂组合物以及电路图案的形成方法
CN107533287A (zh) * 2014-12-10 2018-01-02 约阿内研究有限责任公司 聚合物组合物或预聚物组合物或者包含此类组合物的压花漆及其用途
CN107533287B (zh) * 2014-12-10 2021-06-01 约阿内研究有限责任公司 聚合物组合物或预聚物组合物或者包含此类组合物的压花漆及其用途
CN112479888A (zh) * 2019-09-11 2021-03-12 铠侠股份有限公司 化合物、聚合物、图案形成材料、图案形成方法及半导体装置的制造方法
US11639402B2 (en) 2019-09-11 2023-05-02 Kioxia Corporation Polymer for pattern forming material
TWI772755B (zh) * 2019-09-11 2022-08-01 日商鎧俠股份有限公司 化合物、聚合物、圖案形成材料、圖案形成方法及半導體裝置之製造方法
US11820840B2 (en) 2019-09-11 2023-11-21 Kioxia Corporation Compound, polymer, pattern forming material, and manufacturing method of semiconductor device
CN112479888B (zh) * 2019-09-11 2023-12-08 铠侠股份有限公司 化合物、聚合物、图案形成材料、图案形成方法及半导体装置的制造方法

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Publication number Publication date
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Application publication date: 20100317