CN101670487B - 割断用划线的形成方法和装置 - Google Patents

割断用划线的形成方法和装置 Download PDF

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Publication number
CN101670487B
CN101670487B CN200910173186XA CN200910173186A CN101670487B CN 101670487 B CN101670487 B CN 101670487B CN 200910173186X A CN200910173186X A CN 200910173186XA CN 200910173186 A CN200910173186 A CN 200910173186A CN 101670487 B CN101670487 B CN 101670487B
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China
Prior art keywords
substrate
laser beam
cutting
optical axis
preset lines
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Expired - Fee Related
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CN200910173186XA
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English (en)
Chinese (zh)
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CN101670487A (zh
Inventor
松本吉信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
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Omron Corp
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Publication date
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Publication of CN101670487A publication Critical patent/CN101670487A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Dicing (AREA)
CN200910173186XA 2008-09-12 2009-09-14 割断用划线的形成方法和装置 Expired - Fee Related CN101670487B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008234929 2008-09-12
JP234929/08 2008-09-12

Publications (2)

Publication Number Publication Date
CN101670487A CN101670487A (zh) 2010-03-17
CN101670487B true CN101670487B (zh) 2013-01-09

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ID=42018021

Family Applications (1)

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CN200910173186XA Expired - Fee Related CN101670487B (zh) 2008-09-12 2009-09-14 割断用划线的形成方法和装置

Country Status (3)

Country Link
JP (1) JP2010093244A (ja)
KR (1) KR101107859B1 (ja)
CN (1) CN101670487B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9828278B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
US9828277B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Methods for separation of strengthened glass

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5839383B2 (ja) * 2011-03-18 2016-01-06 株式会社ディスコ ウエーハの加工方法
JP5912287B2 (ja) 2011-05-19 2016-04-27 株式会社ディスコ レーザー加工方法およびレーザー加工装置
JP5868193B2 (ja) * 2012-01-24 2016-02-24 株式会社ディスコ ウエーハの加工方法
US10357850B2 (en) 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
US9776906B2 (en) 2014-03-28 2017-10-03 Electro Scientific Industries, Inc. Laser machining strengthened glass

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
CN1481290A (zh) * 2000-12-15 2004-03-10 半导体材料的激光加工
CN101046571A (zh) * 2006-03-28 2007-10-03 三星电子株式会社 切割基板的方法和使用其的基板切割设备
CN101244486A (zh) * 2007-02-13 2008-08-20 富士通株式会社 装置制造方法、激光处理方法以及激光处理设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6562698B2 (en) 1999-06-08 2003-05-13 Kulicke & Soffa Investments, Inc. Dual laser cutting of wafers
JP4422463B2 (ja) * 2003-11-07 2010-02-24 株式会社ディスコ 半導体ウエーハの分割方法
JP2009220142A (ja) 2008-03-17 2009-10-01 Sony Corp レーザー加工装置及びレーザー加工方法
JP2009226725A (ja) * 2008-03-21 2009-10-08 Citizen Finetech Miyota Co Ltd サファイア基板のスクライブ加工方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
CN1481290A (zh) * 2000-12-15 2004-03-10 半导体材料的激光加工
CN101046571A (zh) * 2006-03-28 2007-10-03 三星电子株式会社 切割基板的方法和使用其的基板切割设备
CN101244486A (zh) * 2007-02-13 2008-08-20 富士通株式会社 装置制造方法、激光处理方法以及激光处理设备

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9828278B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
US9828277B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Methods for separation of strengthened glass

Also Published As

Publication number Publication date
CN101670487A (zh) 2010-03-17
JP2010093244A (ja) 2010-04-22
KR101107859B1 (ko) 2012-01-31
KR20100031462A (ko) 2010-03-22

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