CN101667620A - 一种白光发光二极管 - Google Patents
一种白光发光二极管 Download PDFInfo
- Publication number
- CN101667620A CN101667620A CN200910190308A CN200910190308A CN101667620A CN 101667620 A CN101667620 A CN 101667620A CN 200910190308 A CN200910190308 A CN 200910190308A CN 200910190308 A CN200910190308 A CN 200910190308A CN 101667620 A CN101667620 A CN 101667620A
- Authority
- CN
- China
- Prior art keywords
- light
- emitting diode
- white light
- fluorescent glue
- reflection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003292 glue Substances 0.000 claims abstract description 30
- 238000004020 luminiscence type Methods 0.000 claims description 27
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 2
- 239000000843 powder Substances 0.000 abstract description 2
- 239000000377 silicon dioxide Substances 0.000 abstract description 2
- 230000004936 stimulating effect Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 17
- 229910052751 metal Inorganic materials 0.000 description 17
- 230000004907 flux Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 239000000084 colloidal system Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims (5)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101903086A CN101667620B (zh) | 2009-09-16 | 2009-09-16 | 一种白光发光二极管 |
PCT/CN2010/075826 WO2011032439A1 (zh) | 2009-09-16 | 2010-08-10 | 一种白光发光二极管 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009101903086A CN101667620B (zh) | 2009-09-16 | 2009-09-16 | 一种白光发光二极管 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101667620A true CN101667620A (zh) | 2010-03-10 |
CN101667620B CN101667620B (zh) | 2011-07-27 |
Family
ID=41804137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2009101903086A Active CN101667620B (zh) | 2009-09-16 | 2009-09-16 | 一种白光发光二极管 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN101667620B (zh) |
WO (1) | WO2011032439A1 (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011032439A1 (zh) * | 2009-09-16 | 2011-03-24 | 深圳市聚飞光电股份有限公司 | 一种白光发光二极管 |
CN103107270A (zh) * | 2011-11-09 | 2013-05-15 | 广镓光电股份有限公司 | 发光二极管装置 |
CN103415736A (zh) * | 2010-10-15 | 2013-11-27 | 赤多尼科詹纳斯多夫有限公司 | 具有反射器的led射灯 |
CN103615701A (zh) * | 2013-11-15 | 2014-03-05 | 广东斯科电气股份有限公司 | 一种白光led |
CN104916761A (zh) * | 2015-07-07 | 2015-09-16 | 宏齐光电子(深圳)有限公司 | 一种能够提高smd白光良率的led灯及其制备方法 |
CN105702814A (zh) * | 2016-03-25 | 2016-06-22 | 映瑞光电科技(上海)有限公司 | 一种光电参数测试不合格的白光led芯片重加工的方法 |
CN108037618A (zh) * | 2018-01-02 | 2018-05-15 | 厦门天马微电子有限公司 | 一种背光模组及液晶显示装置 |
CN108666307A (zh) * | 2017-03-28 | 2018-10-16 | 江苏博睿光电有限公司 | 一种csp光源及其制备方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE8713875U1 (zh) * | 1987-10-15 | 1988-02-18 | Siemens Ag, 1000 Berlin Und 8000 Muenchen, De | |
WO2000019547A1 (en) * | 1998-09-25 | 2000-04-06 | Maxim Integrated Products, Inc. | Biconic reflector for collecting radiation from both top and side surfaces of led die |
EP1676076A2 (en) * | 2003-08-29 | 2006-07-05 | Koninklijke Philips Electronics N.V. | Color-mixing lighting system |
CN2697829Y (zh) * | 2004-03-30 | 2005-05-04 | 深圳市蓝科电子有限公司 | 高亮度白光二极管 |
CN2796104Y (zh) * | 2005-04-19 | 2006-07-12 | 王文峰 | 高亮度发光二极管的封装结构 |
KR100616695B1 (ko) * | 2005-10-04 | 2006-08-28 | 삼성전기주식회사 | 고출력 발광 다이오드 패키지 |
CN201043719Y (zh) * | 2007-05-18 | 2008-04-02 | 深圳市国冶星光电子有限公司 | 白光二极管 |
CN101320773B (zh) * | 2008-07-11 | 2011-02-09 | 深圳市聚飞光电股份有限公司 | 提高led外量子效率的封装方法及led封装结构 |
CN201289864Y (zh) * | 2008-11-19 | 2009-08-12 | 深圳市聚飞光电有限公司 | 侧面发光二极管 |
CN101667620B (zh) * | 2009-09-16 | 2011-07-27 | 深圳市聚飞光电股份有限公司 | 一种白光发光二极管 |
-
2009
- 2009-09-16 CN CN2009101903086A patent/CN101667620B/zh active Active
-
2010
- 2010-08-10 WO PCT/CN2010/075826 patent/WO2011032439A1/zh active Application Filing
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011032439A1 (zh) * | 2009-09-16 | 2011-03-24 | 深圳市聚飞光电股份有限公司 | 一种白光发光二极管 |
CN103415736A (zh) * | 2010-10-15 | 2013-11-27 | 赤多尼科詹纳斯多夫有限公司 | 具有反射器的led射灯 |
CN103107270A (zh) * | 2011-11-09 | 2013-05-15 | 广镓光电股份有限公司 | 发光二极管装置 |
CN103107270B (zh) * | 2011-11-09 | 2016-08-17 | 广镓光电股份有限公司 | 发光二极管装置 |
CN103615701A (zh) * | 2013-11-15 | 2014-03-05 | 广东斯科电气股份有限公司 | 一种白光led |
CN104916761A (zh) * | 2015-07-07 | 2015-09-16 | 宏齐光电子(深圳)有限公司 | 一种能够提高smd白光良率的led灯及其制备方法 |
CN105702814A (zh) * | 2016-03-25 | 2016-06-22 | 映瑞光电科技(上海)有限公司 | 一种光电参数测试不合格的白光led芯片重加工的方法 |
CN105702814B (zh) * | 2016-03-25 | 2019-01-18 | 映瑞光电科技(上海)有限公司 | 一种光电参数测试不合格的白光led芯片重加工的方法 |
CN108666307A (zh) * | 2017-03-28 | 2018-10-16 | 江苏博睿光电有限公司 | 一种csp光源及其制备方法 |
CN108666307B (zh) * | 2017-03-28 | 2020-07-28 | 江苏博睿光电有限公司 | 一种csp光源及其制备方法 |
CN108037618A (zh) * | 2018-01-02 | 2018-05-15 | 厦门天马微电子有限公司 | 一种背光模组及液晶显示装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2011032439A1 (zh) | 2011-03-24 |
CN101667620B (zh) | 2011-07-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101667620B (zh) | 一种白光发光二极管 | |
KR101395432B1 (ko) | 백색 led 장치 | |
US8039849B2 (en) | LED module | |
CN101487581A (zh) | 发光二极管光源模组 | |
CN102683542A (zh) | Led封装结构 | |
CN104617197A (zh) | 一种显示模组用led发光器件及显示模组 | |
JP2007134606A (ja) | 白色光源 | |
US20140319565A1 (en) | Light emitting diode package | |
JP2012146738A (ja) | Ledモジュール及びledランプ | |
TW200947665A (en) | High color rendering light-emitting diodes | |
CN100483709C (zh) | 发光二极管封装结构 | |
JP2002043625A (ja) | Led装置 | |
CN207781635U (zh) | 一种多层结构的芯片级封装led器件及背光模组 | |
CN204067435U (zh) | 一种发光二极管器件及光源模组及光源模块 | |
CN101353572A (zh) | 波长转换系统 | |
CN202034410U (zh) | 一种提高led发光均匀性的封装结构 | |
JP2006527502A (ja) | 発光素子及び発光素子の蛍光体 | |
CN209389062U (zh) | 一种白光led器件 | |
KR100713226B1 (ko) | 다수의 엘이디를 조합하는 엘이디 램프의 구조 | |
CN213424989U (zh) | 一种基于3030支架的rgb封装体 | |
CN201246684Y (zh) | 一种led照明模块 | |
CN206040693U (zh) | 蓝色发光二极体晶片白光封装装置 | |
CN103137835A (zh) | 增强白光发光二极管演色性的方法 | |
TWI487146B (zh) | 發光二極體照明裝置 | |
CN215118898U (zh) | Led灯珠 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CB03 | Change of inventor or designer information |
Inventor after: Zhang Zhikuan Inventor after: Xing Qibin Inventor after: Sun Pingru Inventor after: Hou Li Inventor before: Xing Qibin Inventor before: Sun Pingru Inventor before: Hou Li |
|
COR | Change of bibliographic data | ||
CB03 | Change of inventor or designer information |
Inventor after: Xing Qibin Inventor after: Sun Pingru Inventor after: Hou Li Inventor before: Zhang Zhikuan Inventor before: Xing Qibin Inventor before: Sun Pingru Inventor before: Hou Li |
|
CB03 | Change of inventor or designer information |